CYStech Electronics Corp. TO-252AB 1A Low Dropout Positive Voltage Regulator Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 1/8 TO-252AA LM1117-XXXJ3 Adj/G Features O I Adj/G O I Description Adjustable or Fixed Output ●Output Current of 1A ●Low Dropout, 1.4V max at 1A Output Current ●Good Noise Rejection ●Output Current Limiting ●Built-in Thermal Shutdown ●Fast Transient Response The LM1117 series of positive adjustable and fixed regulators are designed to provide 1A with high efficiency. All internal circuitry is designed to operate down to 1.4V input to output differential. The product is specifically designed to provide wellregulated supply for low-voltage IC application such as high-speed bus termination and low current 3.3V logic supply, and other applications such as VGA cards. ● Applications High Efficiency Linear Regulators ● Post Regulators for Switching Supplies ● Adjustable Power Supply ● Typical Application Data Fixed Voltage Regulator VIN>4.75V + 3 TAB OUT IN VOUT=3.3V 2 GND 1 C1 10μF, Tan. + C2 10μF, Tan. Min Notes: 1)C1 needed if device is far from filter capacitors 2)C2 minimum value required for stability Adjustable Voltage Regulator VIN>4.75V + 3 C1 TAB OUT IN ADJ 1 VOUT=3.45V 2 R1 133Ω,1% 10μF, Tan. VOUT=VREF×(1+R2/R1)+IADJ×R2 Notes: 1)C1 needed if device is far from filter capacitors 2)C2 minimum value required for stability LM1117-XXXJ3 + R2 232Ω, 1% C2 10μF, Tan. Min CYStek Product Specification CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 2/8 Package Information Pin 1 2 3 Name ADJ/GND OUTPUT INPUT TO-252 Absolute Maximum Ratings Symbol PD VIN TOPR TSTG TMJ Parameter Power Dissipation Input Voltage Operating Junction Temperature Range Storage Temperature Maximum Junction Temperature Maximum 1050 -0.3 ~ +15 0 ~ +125 -65 ~ +150 150 Units mW V ℃ ℃ ℃ Device Selection Guide Device LM1117-ADJ LM1117-1.5 LM1117-1.8 LM1117-2.5 LM1117-3.3 LM1117-5.0 Output Voltage Adjustable 1.5V 1.8V 2.5V 3.3V 5.0V Block Diagram LM1117-XXXJ3 CYStek Product Specification Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 3/8 CYStech Electronics Corp. Electrical Characteristics @ IO=10mA,TJ=25℃, unless otherwise specified Parameter Reference voltage Device Test Conditions Min Typ Max Units Adj version VIN-VOUT=1.5V 1.225 1.250 1.275 3.0V≤VIN≤12V 3.3V≤VIN≤12V 4.0V≤VIN≤12V 4.8V≤VIN≤12V 6.5V≤VIN≤12V VOUT+1.5V≤VIN≤12V VIN=3.3V, Vadj=0, 10mA≤IO≤1A LM1117-1.5 VIN=3.0V, 0mA≤IO≤1A LM1117-1.8 VIN=3.3V, 0mA≤IO≤1A 1.470 1.764 2.450 3.235 4.900 - 1.500 1.800 2.500 3.300 5.000 12 1.530 1.836 2.550 3.365 5.100 0.2 1 15 V V V V V % % mV - 15 18 LM1117-2.5 VIN=4.0V, 0mA≤IO≤1A LM1117-3.3 VIN=5.0V, 0mA≤IO≤1A LM1117-5.0 VIN=8.0V, 0mA≤IO≤1A - 20 25 mV mV - 26 33 mV - 40 50 mV Dropout Voltage (VIN-VOUT) Current Limit All version IO=1A (ΔVOUT=1%VOUT) - 1.3 1.4 V All version VIN-VOUT=5V 1.1 - - A Minimum Load Current Adj version VIN=5V - 5 10 mA Adjust Pin Current Quiescent Current Adj version VIN=12V, IO=10mA Fixed version VIN=12V, IO=0mA - 50 - 100 12 μA mA - 0.008 0.04 %/W 60 70 - dB - 0.5 - % - 117 - ℃/W - 15 - ℃/W Output Voltage Line Regulation Load Regulation (Note 1, 2) LM1117-1.5 LM1117-1.8 LM1117-2.5 LM1117-3.3 LM1117-5.0 All version LM1117-ADJ Thermal Regulation All version TA=25℃, 30ms pulse Ripple Rejection All version f=120Hz, VIN=VOUT+3V, IO= 1A, COUT=25μF tantalum Temperature Stability All version IO= 10mA Thermal Resistance, Junction to Ambient( No heat sink, no air flow) All version Thermal Resistance, Junction to Case All version Control Circuitry/ Power transistor V Note : 1.See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead 1/18” from the package. 2. Line and load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the difference in input and output and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. Moisture Sensitivity Level : conform to JEDEC level 3 Recommended Storage Condition: Temperature : ≤ 30 °C Humidity : ≤ 60% RH LM1117-XXXJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 4/8 Characteristic Curves LM1117-XXXJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 5/8 Reel Dimension Carrier Tape Dimension LM1117-XXXJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 6/8 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. LM1117-XXXJ3 CYStek Product Specification Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 7/8 CYStech Electronics Corp. TO-252AB Dimension Marking: 4 Device Name Date Code 3-Lead TO-252AB Plastic Surface Mount Package CYStek Package Code: J3 1117□□□ □□□□ 1.5V→-15 1.8V→-18 2.5V→-25 3.3V→-33 5.0V→-50 ADJ→blank Style: Pin 1.Vin 2.Ground 3.Vout 4.Ground *: Typical Inches Min. Max. 0.087 0.094 0.000 0.005 0.053 0.065 0.020 0.028 0.028 0.035 0.017 0.023 0.017 0.023 0.250 0.262 0.205 0.213 0.213 0.224 DIM A A1 B b b1 C C1 D D1 E Millimeters Min. Max. 2.200 2.400 0.000 0.127 1.350 1.650 0.500 0.700 0.700 0.900 0.430 0.580 0.430 0.580 6.350 6.650 5.200 5.400 5.400 5.700 DIM e e1 H K L L1 L2 L3 P V Inches Min. Max. *0.091 0.177 0.185 0.118 REF 0.197 REF 0.374 0.390 0.100 0.114 0.055 0.070 0.024 0.035 0.028 REF 0.209 REF Millimeters Min. Max. *2.300 4.500 4.700 3.000 REF 5.000 REF 9.500 9.900 2.550 2.900 1.400 1.780 0.600 0.900 0.700 REF 5.300 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 LM1117-XXXJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 8/8 TO-252AA Dimension Marking: 4 Device Name Date Code 1117□□□ □□□□ 1 3-Lead TO-252AA Plastic Surface Mount Package CYStek Package Code: J3 Inches Min. Max. 0.087 0.094 0.000 0.005 0.039 0.048 0.026 0.034 0.026 0.034 0.018 0.023 0.018 0.023 0.256 0.264 0.201 0.215 0.236 0.244 DIM A A1 B b b1 C C1 D D1 E Millimeters Min. Max. 2.200 2.400 0.000 0.127 0.990 1.210 0.660 0.860 0.660 0.860 0.460 0.580 0.460 0.580 6.500 6.700 5.100 5.460 6.000 6.200 1.5V→-15 1.8V→-18 2.5V→-25 3.3V→-33 5.0V→-50 ADJ→ blank 2 3 Style: Pin 1.Vin 2.Ground 3.Vout 4.Vin DIM e e1 H K L L1 L2 L3 P V Inches Min. Max. 0.086 0.094 0.172 0.188 0.163 REF 0.190 REF 0.386 0.409 0.114 REF 0.055 0.067 0.024 0.039 0.026 REF 0.211 REF Millimeters Min. Max. 2.186 2.386 4.372 4.772 4.140 REF 4.830 REF 9.800 10.400 2.900 REF 1.400 1.700 0.600 1.000 0.650 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. LM1117-XXXJ3 CYStek Product Specification