Dual Conductor, High Current Power Inductors HALOGEN HF Pb FREE Flat-Pac™ FPT705 Series Applications • Designed specifically for use with Picor® Cool-Power® ZVS-Buck Regulator Family (Picor part number Series PI33xx and PI34xx) Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant Description Packaging • Halogen free, lead free, RoHS compliant • Supplied in tape-and reel packaging, 1400 parts per 13” diameter reel • 125°C maximum total operating temperature • 8.0 x 7.1 x 5.35mm maximum surface mount package • Ferrite core material • Dual conductor, two-turn construction • Inductance range from 150nH to 300nH Product Specifications Part Number6 FPT705-150-R FPT705-170-R FPT705-190-R FPT705-200-R FPT705-230-R FPT705-270-R FPT705-300-R OCL1 ±10% (nH) 150 170 190 200 230 270 300 FLL2 min. (nH) 135 153 171 180 207 243 270 1. Open Circuit Inductance (OCL) test parameters: 100kHz, 0.1Vrms, 0.0Adc @ 25°C (Pins 1-3, short 2-4). 2. Full Load Inductance (FLL) test parameters: 100kHz, 0.1Vrms, Isat1 @ 25°C (Pins 1-3, short 2-4). 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat-generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 0812 BU-SB12618 Page 1 of 6 Irms3 (Amps) 13 Isat4 @ 25°C (Amps) 35 31 28 25 23 19 17 DCR5 (mΩ) @ 20°C 0.65 ± 0.15 4. Isat1: Peak current for approximately 2% rolloff at +25℃. 5. DCR Tested from Pins (1-2) and (3-4) @ 20°C. 6. Part Number Definition: FPT705-xxx-R FPT705 = Product code and size xxx= Inductance value in nH “-R” Suffix = RoHS compliant Data Sheet: 4451 Dimensions - mm Top View Bottom View Side View Recommended Pad Layout Schematic 5.35 All soldering surfaces to be coplanar within 0.10 millimeters. Part Marking: • FPT705 (Product code and size) • xxx = (Inductance=(Inductance value in nH) • wwllyy= Date Code, R= Revision level DCR is measured between points "A" and point "B" Packaging Information - mm 5.55 Section A-A Direction of Feed Supplied in tape and reel packaging, 1400 parts on a 13” diameter reel. 0812 BU-SB12618 Page 2 of 6 Data Sheet: 4451 Inductance Characteristics FPT705-150-R 11 0 % 100% 90% % of OCL 80% 70% 60% 50% 40% 30% 0 5 10 15 20 25 30 35 40 45 50 55 60 65 Idc (Amps) FPT705-170-R 11 0 % 100% 90% % of OCL 80% 70% 60% 50% 40% 30% 0 5 10 15 20 25 30 35 Idc (Amps) 0812 BU-SB12618 Page 3 of 6 Data Sheet: 4451 40 45 50 55 Inductance Characteristics FPT705-190-R 11 0 % 100% 90% % of OCL 80% 70% 60% 50% 40% 30% 0 5 10 15 20 25 30 35 40 45 50 Idc (Amps) FPT705-200-R & -230-R 11 0 % 100% 90% % of OCL 80% 70% 60% 50% F P T705-200-R 40% 30% F P T705-230-R 0 5 10 15 20 25 30 Idc (Amps) 0812 BU-SB12618 Page 4 of 6 Data Sheet: 4451 35 40 45 50 Inductance Characteristics FPT705-270-R & -300-R 11 0 % 100% 90% % of OCL 80% 70% 60% 50% F P T705-270-R 40% 30% F P T705-300-R 0 5 10 15 20 25 Idc (Amps) 0812 BU-SB12618 Page 5 of 6 Data Sheet: 4451 30 35 40 Solder Reflow Profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 <350 235°C 220°C Volume mm3 _350 > 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25°C ts Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2012 Cooper Bussmann w w w. c o o p e r b u s s m a n n . c o m 0812 BU-SB12618 Page 6 of 6 Data Sheet: 4451