NLX2G08 Dual 2-Input AND Gate The NLX2G08 is an advanced high-speed dual 2-input CMOS AND gate in ultra-small footprint. The NLX2G08 input structures provide protection when voltages up to 7.0 volts are applied, regardless of the supply voltage. Features • • • • • • • www.onsemi.com High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C 24 mA Balanced Output Sink and Source Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input Pins These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 7 B1 6 A1 Y2 5 1 B1 VCC 8 2 7 MARKING DIAGRAMS 1 8 Y2 1 Y1 2 B2 3 A2 3 GND 6 4 5 AD MG G UDFN8 1.45 x 1.0 CASE 517BZ 1 UDFN8 1.6 x 1.0 CASE 517BY 1 XM VCC Y1 GND 4 8 1 UQFN8 MU SUFFIX CASE 523AN UDFN8 1.95 x 1.0 CASE 517CA B2 A2 XX M G XM XM 1 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) Figure 1. Pinouts IEEE/IEC A1 B1 & ORDERING INFORMATION Y1 A2 B2 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Y2 PIN ASSIGNMENT Figure 2. Logic Symbol Pin Function (UQFN8) Function (ULLGA/ UDFN) 1 Y1 A1 FUNCTION TABLE Y = AB Inputs Output 2 B2 B1 A B Y 3 A2 Y2 L L L 4 GND GND L H L 5 Y2 A2 H L L 6 B1 B2 H H H 7 A1 Y1 8 VCC VCC H = HIGH Logic Level L = LOW Logic Level © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 7 1 Publication Order Number: NLX2G08/D NLX2G08 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage *0.5 to +7.0 V VIN DC Input Voltage *0.5 to +7.0 V *0.5 to VCC + 0.5 V VIN < GND *50 mA VOUT < GND *50 mA VOUT Parameter DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TBD °C TJ Junction Temperature Under Bias TBD °C qJA Thermal Resistance (Note 1) TBD °C/W PD Power Dissipation in Still Air at 85°C TBD mW MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) TBD TBD N/A V $500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Power DC Supply Voltage VIN Digital Input Voltage (Note 6) Output Voltage VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Operating Data Retention Only VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.3 V $0.3 V VCC = 5.0 V $0.5 V Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 VCC V −55 +125 °C 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. www.onsemi.com 2 NLX2G08 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VIH High−Level Input Voltage Condition VCC (V) 1.65 2.3 to 5.5 VIL Low−Level Input Voltage Min Typ High−Level Output Voltage VIN = VIH or VIL, IOH = −100 mA VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOL Low−Level Output Voltage VIN = VIH or VIL, IOL = 100 mA Min Max 0.75 x VCC 0.7 x VCC 0.25 x VCC 0.3 x VCC 2.3 to 5.5 VOH Max 0.75 x VCC 0.7 x VCC 1.65 TA = −555C to +1255C TA 3 855C TA = 255C Min Max 0.75 x VCC 0.7 x VCC 0.25 x VCC 0.3 x VCC VCC − 0.1 VCC VCC − 0.1 VCC − 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.5 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 1.65 to 5.5 V 0.25 x VCC 0.3 x VCC 1.65 to 5.5 Unit V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 V VIN = VIH or VIL IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current 0 ≤ VIN ≤ 5.5 V 0 to 5.5 $0.1 $1.0 $1.0 mA IOFF Power−Off Input Leakage Current VIN = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current 0 ≤ VIN ≤ 5.5 V 5.5 1.0 10 10 mA IIN 0.08 0.20 0.22 0.28 0.38 0.42 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns VCC Symbol tPLH tPHL Parameter Propagation Delay Input A to Output TA 3 855C TA = 255C TA = −555C to +1255C (V) Test Condition Min Typ Max Min Max Min Max Unit 1.65 to 1.95 RL = 1 MW, CL = 15 pF 2.0 5.7 10.5 2.0 11.0 2.0 11.2 ns 2.3 to 2.7 RL = 1 MW, CL = 15 pF 1.2 3.5 5.8 1.2 6.2 1.2 6.3 3.0 to 3.6 RL = 1 MW, CL = 15 pF 0.8 2.6 3.9 0.8 4.3 0.8 4.7 RL = 500 W, CL = 50 pF 3.2 4.8 5.2 RL = 1 MW, CL = 15 pF 1.9 3.1 3.3 RL = 500 W, CL = 50 pF 2.5 3.7 4.0 4.5 to 5.5 5.3 0.5 4.0 4.3 CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 7) 3.3 5.5 10 MHz, VIN = 0V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. www.onsemi.com 3 NLX2G08 VCC VCC A and B 50% 50% GND tPLH tPHL RL Y CL 50% VCC A 1−MHz square input wave is recommended for propagation delay tests. PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† UQFN8 (Pb−Free) 3000 / Tape & Reel NLX2G08DMUTCG* UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2G08DMUTWG* UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2G08EMUTCG UDFN8, 1.6 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2G08FMUTCG UDFN8, 1.45 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device NLX2G08MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These device differ only in tape and reel pin 1 orientation. www.onsemi.com 4 NLX2G08 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLX2G08 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 8X 0.22 L 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C 1 PKG OUTLINE NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 0.35 PITCH NLX2G08 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 1 PKG OUTLINE NLX2G08 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ MOLD CMPD EXPOSED Cu E A1 A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C (0.15) (0.10) SIDE VIEW C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 SOLDERING FOOTPRINT* DETAIL A OPTIONAL CONSTRUCTION 1.70 0.50 PITCH 8X L3 8X L 1 e 5 3 0.35 1 DETAIL A 1.70 7 8 8X b 0.10 C A B BOTTOM VIEW 0.05 C 7X 0.25 NOTE 3 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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