FUJITSU SEMICONDUCTOR
DATA SHEET
DS706-00007-1v0-E
32-bit ARMTM CortexTM-M3 based Microcontroller
FM3 MB9B100 Series
MB9BF104N/R, F105N/R, F106N/R
DESCRIPTION
The MB9B100 Series are a highly integrated 32-bit microcontroller that target for high-performance and
cost-sensitive embedded control applications.
The MB9B100 Series are based on the ARM Cortex-M3 Processor and on-chip Flash memory and SRAM,
and peripheral functions, including Motor Control Timers, ADCs and Communication Interfaces (UART,
SIO, I2C, LIN).
Note: ARM and Cortex-M3 are the trademarks of ARM Limited in the EU and other countries.
Copyright2010-2011 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
2011.1
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r2.1
MB9B100 Series
FEATURES
32-bit ARM Cortex-M3 Core
・ Processor version: r2p0
・ Up to 80MHz Frequency Operation
・ Memory Protection Unit (MPU): improve the reliability of an embedded system
・ Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) and 48
peripheral interrupts and 16 priority levels
・ 24-bit System timer (Sys Tick): System timer for OS task management
On-chip Memories
[Flash memory]
・ Up to 512 Kbyte
・ Read cycle: 0wait-cycle@up to 60MHz, 2wait-cycle* above
*: Instruction pre-fetch buffer is included. So when CPU access continuously, it becomes 0wait-cycle
・ Security function for code protection
[SRAM]
MB9B100 Series contain a total of up to 64Kbyte on-chip SRAM memories. This is composed of two
independent SRAM for CPU and DMA Controller can process simultaneously.
・ Up to 32 Kbyte SRAM for high-performance CPU
・ Up to 32 Kbyte SRAM for CPU/DMA Controller
External Bus Interface
・ Supports SRAM, NOR& NAND Flash device
・ Up to 8 chip selects
・ 8/16-bit Data width
・ Up to 25-bit Address bit
Multi-function Serial Interface (Max. 8channels)
・ 4 channels with 16-byte FIFO (ch.4-ch.7), 4 channels without FIFO (ch.0-ch.3)
・ Operation mode is selectable from the followings for each channel.
・ UART
・ CSIO
・ LIN
・ I 2C
[UART]
・ Full-duplex double buffer
・ Selection with or without parity supported
・ Built-in dedicated baud rate generator
・ External clock available as a serial clock
・ Hardware Flow control : Automatically control the transmission by CTS/RTS (only ch.4)
・ Various error detect functions available (parity errors, framing errors, and overrun errors)
[CSIO]
・ Full-duplex double buffer
・ Built-in dedicated baud rate generator
・ Overrun error detect function available
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
[LIN]
・ LIN protocol Rev.2.1 supported
・ Full-duplex double buffer
・ Master/Slave mode supported
・ LIN break field generate (can be changed 13-16bit length)
・ LIN break delimiter generate (can be changed 1-4bit length)
・ Various error detect functions available (parity errors, framing errors, and overrun errors)
[I2C]
・ Standard mode (Max.100kbps) / High-speed mode (Max.400Kbps) supported
DMA Controller (8channels)
DMA Controller has an independent bus for CPU, so CPU and DMA Controller can process simultaneously.
・ 8 independently configured and operated channels
・ Transfer can be started by software or request from the built-in peripherals
・ Transfer address area: 32bit(4Gbyte)
・ Transfer mode: Block transfer/Burst transfer/Demand transfer
・ Transfer data type: byte/half-word/word
・ Transfer block count: 1 to 16
・ Number of transfers: 1 to 65536
A/D Converter (Max. 16channels)
[12-bit A/D Converter]
・ Successive Approximation Register type
・ Built-in 3unit
・ Conversion time: 1.0μs@5V
・ Priority conversion available (priority at 2levels)
・ Scanning conversion mode
・ Built-in FIFO for conversion data storage (for SCAN conversion: 16steps, for Priority conversion:
4steps)
Base Timer (Max. 8channels)
Operation mode is selectable from the followings for each channel.
・ 16-bit PWM timer
・ 16-bit PPG timer
・ 16/32-bit reload timer
・ 16/32-bit PWC timer
General Purpose I/O Port
MB9B100 series can use its pins as I/O ports when they are not used for external bus or peripherals.
Moreover, the port relocate function is built in. It can set which I/O port the peripheral function can be
allocated.
・ Capable of pull-up control per pin
・ Capable of reading pin level directly
・ Built-in the port relocate function
・ Up to 100 fast I/O Ports@120pin Package
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MB9B100 Series
Multi-function Timer (Max. 2unit)
The Multi-function timer is composed of the following blocks.
・ 16-bit free-run timer × 3ch/unit
・ Input capture × 4ch/unit
・ Output compare × 6ch/unit
・ A/D activating compare × 3ch/unit
・ Waveform generator × 3ch/unit
・ 16-bit PPG timer × 3ch/unit
The following function can be used to achieve the motor control.
・ PWM signal output function
・ DC chopper waveform output function
・ Dead time function
・ Input capture function
・ A/D convertor activate function
・ DTIF (Motor emergency stop) interrupt function
Quadrature Position/Revolution Counter (QPRC) (Max. 2unit)
The Quadrature Position/Revolution Counter (QPRC) is used to measure the position of the position
encoder. Moreover, it is possible to use up/down counter.
・ The detection edge of the three external event input pins AIN, BIN and ZIN is configurable.
・ 16-bit position counter
・ 16-bit revolution counter
・ Two 16-bit compare registers
Dual Timer (Two 32/16bit Down Counter)
The Dual Timer consists of two programmable 32/16-bit down counters.
Operation mode is selectable from the followings for each channel.
・ Free-running
・ Periodic (=Reload)
・ One-shot
Watch Counter
The Watch counter is used for wake up from power saving mode.
・ Interval timer: up to 64s(Max.)@ Sub Clock : 32.768kHz
External Interrupt Controller Unit
・ Up to 16 external vectors
・ Include one non-maskable interrupt(NMI)
Watch dog Timer (2channels)
A watchdog timer can generate interrupts or a reset when a time-out value is reached.
MB9B100 series consists of two different watchdogs, a "Hardware" watchdog and a "Software" watchdog.
"Hardware" watchdog timer is clocked by low speed CR oscillator. Therefore,”Hardware" watchdog is
active in any power saving mode except STOP.
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
CRC (Cyclic Redundancy Check) Accelerator
The CRC accelerator helps a verify data transmission or storage integrity.
CCITT CRC16 and IEEE-802.3 CRC32 are supported.
・ CCITT CRC16 Generator Polynomial: 0x1021
・ IEEE-802.3 CRC32 Generator Polynomial: 0x04C11DB7
Clock and Reset
[Clocks]
Five clock sources (2 ext. osc, 2 CR osc, and PLL) that are dynamically selectable.
・ Main Clock
・ Sub Clock
・ High-speed CR Clock
・ Low-speed CR Clock
・ PLL Clock
: 4 to 48MHz
: 32.768kHz
: 4MHz
: 100kHz
[Resets]
Reset requests from INITX pins, Power on reset, Software reset, watchdog timers reset, low voltage
detector reset and clock supervisor reset.
Clock Super Visor (CSV)
Clocks generated by CR oscillators are used to supervise abnormality of the external clocks.
・ External OSC clock failure (clock stop) is detected, reset is asserted.
・ External OSC frequency anomaly is detected, interrupt or reset is asserted.
Low Voltage Detector (LVD)
MB9B100 Series include 2-stage monitoring of voltage on the VCC. When the voltage falls below the
voltage has been set, Low Voltage Detector generates an interrupt or reset.
・ LVD1: error reporting via interrupt
・ LVD2: auto-reset operation
Low Power Mode
Three power saving modes supported.
・ SLEEP
・ TIMER
・ STOP
Debug
・ Serial Wire JTAG Debug Port (SWJ-DP)
・ Embedded Trace Macrocells (ETM) provide comprehensive debug and trace facilities.
・ Trace Port Interface Unit (TPIU) for bridging to a Trace Port Analyzer.
Power Supply
Two Power Supplies
・ VCC = 2.7V to 5.5V: Correspond to the wide range voltage.
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MB9B100 Series
PRODUCT LINEUP
Memory size
Product device
MB9BF104N/R
MB9BF105N/R
MB9BF106N/R
256Kbyte
32Kbyte
384Kbyte
48Kbyte
512Kbyte
64Kbyte
On-chip Flash
On-chip RAM
Function
Product device
MB9BF104N
MB9BF105N
MB9BF106N
Pin count
MB9BF104R
MB9BF105R
MB9BF106R
100
120
Cortex-M3
80MHz
2.7V to 5.5V
8ch
CPU
Freq.
Power supply voltage range
DMAC
External Bus Interface
MF Serial Interface
(UART/CSIO/LIN/I2C)
Base Timer
(PWC/Reload timer/PWM/PPG)
A/D
activation 3ch
compare
Input
4ch
capture
MF- Free-run
3ch
Timer timer
Output
6ch
compare
Waveform
3ch
generator
PPG
3ch
QPRC
Dual Timer
Watch Counter
CRC Accelerator
Watchdog timer
External Interrupts
I/O ports
12 bit A/D converter
CSV (Clock Super Visor)
LVD (Low Voltage Detector)
Internal
High-speed
OSC
Low-speed
Debug Function
Addr:25bit (Max.)
Data:8/16 bit
CS:5(Max.)
Support:SRAM, NOR Flash
Addr:25bit (Max.)
Data:8/16 bit
CS:8(Max.)
Support:SRAM, NOR & NAND Flash
8ch (Max.)
8ch (Max.)
2 units (Max.)
2ch (Max.)
1 unit
1 unit
Yes
1ch(SW) + 1ch(HW)
16pins (Max.)+ NMI × 1
80pins (Max.)
100pins (Max.)
16ch (3 units)
Yes
2ch
4MHz (± 2%)
100kHz (Typ)
SWJ-DP/TPIU/ETM
Note: All signals of the peripheral function in each product cannot be allocated by limiting the pins of package.
It is necessary to use the port relocate function of the General I/O port according to your function use.
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
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MB9B100 Series
PACKAGES
Product name
Package
LQFP:
LQFP:
BGA:
FPT-100P-M20*/M23
FPT-120P-M21
BGA-112P-M04
MB9BF104N
MB9BF105N
MB9BF106N
MB9BF104R
MB9BF105R
MB9BF106R
-
: Supported
* : ES product only
Note : Refer to "PACKAGE DIMENSIONS" for detailed information on each package.
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MB9B100 Series
PIN ASSIGNMENT
FPT-100P-M20/M23
(TOP VIEW)
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
FPT-120P-M21
(TOP VIEW)
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
9
r2.0
MB9B100 Series
BGA-112P-M04
<Note>
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
10
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
PIN DESCRIPTION
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Pin no.
LQFP-100 BGA-112 LQFP-120
1
B1
1
2
C1
2
3
C2
3
4
B3
4
5
D1
5
6
D2
6
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin name
VCC
P50
INT00_0
AIN0_2
SIN3_1
RTO10_0
(PPG10_0)
MDATA0
P51
INT01_0
BIN0_2
SOT3_1
(SDA3_1)
RTO11_0
(PPG10_0)
MDATA1
P52
INT02_0
ZIN0_2
SCK3_1
(SCL3_1)
RTO12_0
(PPG12_0)
MDATA2
P53
SIN6_0
TIOA1_2
INT07_2
RTO13_0
(PPG12_0)
MDATA3
P54
SOT6_0
(SDA6_0)
TIOB1_2
RTO14_0
(PPG14_0)
MDATA4
I/O circuit
type
Pin state
type
-
E
H
E
H
E
H
E
H
E
I
11
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
I/O circuit
type
Pin state
type
E
I
E
H
9
MCSX7
P57
SOT1_0
(SDA1_0)
E
I
10
MNALE
P58
SCK1_0
(SCL1_0)
E
I
E
H
E
I
E
I
E
H
Pin name
P55
SCK6_0
(SCL6_0)
7
D3
7
ADTG_1
RTO15_0
(PPG14_0)
MDATA5
P56
SIN1_0
(120pin only)
8
D5
8
INT08_2
DTTI1X_0
-
-
-
-
-
-
-
-
-
-
11
12
13
MNCLE
P59
SIN7_0
INT09_2
MNWEX
P5A
SOT7_0
(SDA7_0)
MNREX
P5B
SCK7_0
(SCL7_0)
P30
AIN0_0
9
E1
14
TIOB0_1
INT03_2
MDATA6
12
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
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MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
10
E2
15
11
E3
16
12
E4
17
13
F1
18
14
F2
19
15
F3
20
16
G1
21
17
G2
22
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin name
P31
BIN0_0
TIOB1_1
SCK6_1
(SCL6_1)
INT04_2
MDATA7
P32
ZIN0_0
TIOB2_1
SOT6_1
(SDA6_1)
INT05_2
MDQM0
P33
INT04_0
TIOB3_1
SIN6_1
ADTG_6
MDQM1
P34
FRCK0_0
TIOB4_1
MAD24
P35
IC03_0
TIOB5_1
INT08_1
MAD23
P36
IC02_0
SIN5_2
INT09_1
MCSX3
P37
IC01_0
SOT5_2
(SDA5_2)
INT10_1
MCSX2
P38
IC00_0
SCK5_2
(SCL5_2)
INT11_1
I/O circuit
type
Pin state
type
E
H
E
H
E
H
E
I
E
H
E
H
E
H
E
H
13
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
18
F4
23
19
G3
24
-
B2
-
20
H1
25
21
H2
26
22
G4
27
23
H3
28
24
J2
29
25
26
L1
J1
30
31
27
J4
32
28
L5
33
14
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin name
P39
DTTI0X_0
ADTG_2
P3A
RTO00_0
(PPG00_0)
TIOA0_1
VSS
P3B
RTO01_0
(PPG00_0)
TIOA1_1
P3C
RTO02_0
(PPG02_0)
TIOA2_1
P3D
RTO03_0
(PPG02_0)
TIOA3_1
P3E
RTO04_0
(PPG04_0)
TIOA4_1
P3F
RTO05_0
(PPG04_0)
TIOA5_1
VSS
VCC
P40
TIOA0_0
RTO10_1
(PPG10_1)
INT12_1
MAD22
P41
TIOA1_0
RTO11_1
(PPG10_1)
INT13_1
MAD21
I/O circuit
type
Pin state
type
E
I
G
I
-
G
I
G
I
G
I
G
I
G
I
-
G
H
G
H
DS706-00007-1v0-E
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
29
K5
34
30
J5
35
-
K2
J3
H4
-
31
H5
36
Pin name
P42
TIOA2_0
RTO12_1
(PPG12_1)
MAD20
P43
TIOA3_0
RTO13_1
(PPG12_1)
ADTG_7
MAD19
VSS
VSS
VSS
P44
TIOA4_0
RTO14_1
(PPG14_1)
I/O circuit
type
Pin state
type
G
I
G
I
-
G
I
G
I
MAD18
P45
TIOA5_0
32
L6
37
33
34
35
L2
L4
K1
38
39
40
36
L3
41
37
K3
42
38
K4
43
39
K6
44
RTO15_1
(PPG14_1)
MAD17
C
VSS
VCC
P46
X0A
P47
X1A
INITX
P48
DTTI1X_1
INT14_1
D
M
D
N
B
C
E
H
E
I
SIN3_2
MAD16
P49
TIOB0_0
IC10_1
40
J6
45
AIN0_1
SOT3_2
(SDA3_2)
MAD15
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
15
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
Pin name
I/O circuit
type
Pin state
type
E
I
E
I
E
I
E
I
E
I
E
I
E
H
E
H
P4A
TIOB1_0
IC11_1
41
L7
46
BIN0_1
SCK3_2
(SCL3_2)
42
K7
47
43
H6
48
MAD14
P4B
TIOB2_0
IC12_1
ZIN0_1
MAD13
P4C
TIOB3_0
IC13_1
SCK7_1
(SCL7_1)
AIN1_2
MAD12
P4D
TIOB4_0
FRCK1_1
44
J7
49
SOT7_1
(SDA7_1)
BIN1_2
MAD11
P4E
TIOB5_0
45
K8
50
INT06_2
SIN7_1
ZIN1_2
-
-
51
-
-
52
MAD10
P70
TIOA4_2
P71
INT13_2
TIOB4_2
-
-
53
P72
SIN2_0
INT14_2
16
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
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MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
-
-
54
Pin name
P73
SOT2_0
(SDA2_0)
I/O circuit
type
Pin state
type
E
H
INT15_2
-
-
55
P74
SCK2_0
(SCL2_0)
E
I
46
K9
56
MD1
C
D
47
L8
57
MD0
C
D
48
L9
58
X0
A
A
49
L10
59
X1
A
B
50
L11
60
VSS
-
51
K11
61
VCC
-
52
J11
62
P10
AN00
F
K
F
L
P11
53
J10
63
AN01
SIN1_1
INT02_1
-
K10
-
VSS
-
-
J9
-
VSS
-
54
55
56
J8
H10
H9
64
65
66
P12
AN02
SOT1_1
(SDA1_1)
MAD09
P13
AN03
SCK1_1
(SCL1_1)
MAD08
P14
AN04
SIN0_1
F
K
F
K
F
L
F
K
INT03_1
57
H7
67
MCSX1
P15
AN05
SOT0_1
(SDA0_1)
MCSX0
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r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
58
59
G10
G9
68
69
Pin name
P16
AN06
SCK0_1
(SCL0_1)
MOEX
P17
AN07
SIN2_2
I/O circuit
type
Pin state
type
F
K
F
L
INT04_1
60
61
62
H11
F11
G11
70
71
72
63
G8
73
64
F10
74
65
F9
75
-
H8
-
66
E11
76
67
E10
77
18
FUJITSU SEMICONDUCTOR CONFIDENTIAL
MWEX
AVCC
AVRH
AVSS
P18
AN08
SOT2_2
(SDA2_2)
MDATA8
P19
AN09
SCK2_2
(SCL2_2)
MDATA9
P1A
AN10
SIN4_1
INT05_1
IC00_1
MDATA10
VSS
P1B
AN11
SOT4_1
(SDA4_1)
IC01_1
MDATA11
P1C
AN12
SCK4_1
(SCL4_1)
IC02_1
MDATA12
-
F
K
F
K
F
L
-
F
K
F
K
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MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
68
F8
78
69
E9
79
70
D11
80
-
-
81
-
-
82
-
-
83
-
-
84
-
B10
C9
-
-
-
85
Pin name
P1D
AN13
CTS4_1
IC03_1
MDATA13
P1E
AN14
RTS4_1
DTTI0X_1
MDATA14
P1F
AN15
ADTG_5
FRCK0_1
MDATA15
P28
ADTG_4
RTO05_1
(PPG04_1)
MCSX6
P27
INT02_2
RTO04_1
(PPG04_1)
MCSX5
P26
SCK2_1
(SCL2_1)
RTO03_1
(PPG02_1)
MCSX4
P25
SOT2_1
(SDA2_1)
RTO02_1
(PPG02_1)
VSS
VSS
P24
SIN2_1
INT01_2
I/O circuit
type
Pin state
type
F
K
F
K
F
K
E
I
E
H
E
I
E
I
-
E
H
RTO01_1
(PPG00_1)
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
19
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
71
D10
86
Pin name
P23
SCK0_0
(SCL0_0)
TIOA7_1
I/O circuit
type
Pin state
type
E
I
E
I
E
H
E
H
RTO00_1
(PPG00_1)
72
E8
87
P22
SOT0_0
(SDA0_0)
TIOB7_1
ZIN1_1
73
C11
88
P21
SIN0_0
INT06_1
BIN1_1
74
C10
89
75
76
A11
A10
90
91
77
A9
92
78
B9
93
79
B11
94
80
A8
95
81
B8
96
82
C8
97
-
D8
-
20
FUJITSU SEMICONDUCTOR CONFIDENTIAL
P20
INT05_0
CROUT
AIN1_1
VSS
VCC
P00
TRSTX
P01
TCK
SWCLK
P02
TDI
P03
TMS
SWDIO
P04
TDO
SWO
P05
TRACED0
TIOA5_2
SIN4_2
INT00_1
VSS
E
E
E
E
E
E
E
E
E
E
E
F
-
DS706-00007-1v0-E
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
83
D9
98
Pin name
P06
TRACED1
TIOB5_2
SOT4_2
(SDA4_2)
I/O circuit
type
Pin state
type
E
F
E
G
E
G
E
G
E
H
E
I
E
I
E
I
INT01_1
84
A7
99
P07
TRACED2
ADTG_0
SCK4_2
(SCL4_2)
85
B7
100
P08
TRACED3
TIOA0_2
CTS4_2
86
C7
101
P09
TRACECLK
TIOB0_2
RTS4_2
P0A
SIN4_0
87
D7
102
INT00_2
FRCK1_0
88
A6
103
MAD07
P0B
SOT4_0
(SDA4_0)
TIOB6_1
IC10_0
89
B6
104
90
C6
105
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
MAD06
P0C
SCK4_0
(SCL4_0)
TIOA6_1
IC11_0
MAD05
P0D
RTS4_0
TIOA3_2
IC12_0
MAD04
21
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
91
A5
106
-
D4
C3
-
92
B5
107
-
-
108
-
-
109
-
-
110
-
-
111
-
-
112
93
D6
113
94
C5
114
95
B4
115
22
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin name
P0E
CTS4_0
TIOB3_2
IC13_0
MAD03
VSS
VSS
P0F
NMIX
MAD02
P68
SCK3_0
(SCL3_0)
TIOB7_2
INT12_2
P67
SOT3_0
(SDA3_0)
TIOA7_2
P66
SIN3_0
ADTG_8
INT11_2
P65
TIOB7_0
SCK5_1
(SCL5_1)
P64
TIOA7_0
SOT5_1
(SDA5_1)
INT10_2
P63
INT03_0
SIN5_1
MAD01
P62
SCK5_0
(SCL5_0)
ADTG_3
MAD00
P61
SOT5_0
(SDA5_0)
TIOB2_2
I/O circuit
type
Pin state
type
E
I
E
J
E
H
E
I
E
H
E
I
E
H
E
H
E
I
E
I
DS706-00007-1v0-E
r2.0
MB9B100 Series
Pin no.
LQFP-100 BGA-112 LQFP-120
96
C4
116
97
98
99
100
A4
A3
A2
A1
117
118
119
120
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin name
P60
SIN5_0
TIOA2_2
INT15_1
VCC
P80
P81
VSS
I/O circuit
type
Pin state
type
E
H
H
H
O
O
-
23
r2.0
MB9B100 Series
SIGNAL DESCRIPTION
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
ADC
ADTG_0
ADTG_1
ADTG_2
ADTG_3
ADTG_4
ADTG_5
ADTG_6
ADTG_7
ADTG_8
AN00
AN01
AN02
AN03
AN04
AN05
AN06
AN07
AN08
AN09
AN10
AN11
AN12
AN13
AN14
AN15
TIOA0_0
TIOA0_1
TIOA0_2
TIOB0_0
TIOB0_1
TIOB0_2
TIOA1_0
TIOA1_1
TIOA1_2
TIOB1_0
TIOB1_1
TIOB1_2
TIOA2_0
TIOA2_1
TIOA2_2
TIOB2_0
TIOB2_1
TIOB2_2
Base Timer
0
Base Timer
1
Base Timer
2
Function
A/D converter external trigger input pin.
A/D converter analog input pin.
ANxx describes ADC ch.xx.
Base timer ch.0 TIOA pin.
Base timer ch.0 TIOB pin.
Base timer ch.1 TIOA pin.
Base timer ch.1 TIOB pin.
Base timer ch.2 TIOA pin.
Base timer ch.2 TIOB pin.
24
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
84
7
18
94
70
12
30
52
53
54
55
56
57
58
59
63
64
65
66
67
68
69
70
27
19
85
40
9
86
28
20
5
41
10
6
29
21
96
42
11
95
A7
D3
F4
C5
D11
E4
J5
J11
J10
J8
H10
H9
H7
G10
G9
G8
F10
F9
E11
E10
F8
E9
D11
J4
G3
B7
J6
E1
C7
L5
H1
D1
L7
E2
D2
K5
H2
C4
K7
E3
B4
99
7
23
114
81
80
17
35
110
62
63
64
65
66
67
68
69
73
74
75
76
77
78
79
80
32
24
100
45
14
101
33
25
5
46
15
6
34
26
116
47
16
115
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Base Timer
3
TIOA3_0
TIOA3_1
TIOA3_2
TIOB3_0
TIOB3_1
TIOB3_2
TIOA4_0
TIOA4_1
TIOA4_2
TIOB4_0
TIOB4_1
TIOB4_2
TIOA5_0
TIOA5_1
TIOA5_2
TIOB5_0
TIOB5_1
TIOB5_2
TIOA6_1
TIOB6_1
TIOA7_0
TIOA7_1
TIOA7_2
TIOB7_0
TIOB7_1
TIOB7_2
Base Timer
4
Base Timer
5
Base Timer
6
Base Timer
7
Function
Base timer ch.3 TIOA pin.
Base timer ch.3 TIOB pin.
Base timer ch.4 TIOA pin.
Base timer ch.4 TIOB pin.
Base timer ch.5 TIOA pin.
Base timer ch.5 TIOB pin.
Base timer ch.6 TIOA pin.
Base timer ch.6 TIOB pin.
Base timer ch.7 TIOA pin.
Base timer ch.7 TIOB pin.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
30
22
90
43
12
91
31
23
44
13
32
24
82
45
14
83
89
88
71
72
-
J5
G4
C6
H6
E4
A5
H5
H3
J7
F1
L6
J2
C8
K8
F2
D9
B6
A6
D10
E8
-
35
27
105
48
17
106
36
28
51
49
18
52
37
29
97
50
19
98
104
103
112
86
109
111
87
108
25
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Debugger
SWCLK
SWDIO
SWO
TCK
TDI
TDO
TMS
TRACECLK
TRACED0
TRACED1
TRACED2
TRACED3
TRSTX
MAD00
MAD01
MAD02
MAD03
MAD04
MAD05
MAD06
MAD07
MAD08
MAD09
MAD10
MAD11
MAD12
MAD13
MAD14
MAD15
MAD16
MAD17
MAD18
MAD19
MAD20
MAD21
MAD22
MAD23
MAD24
MCSX0
MCSX1
MCSX2
MCSX3
MCSX4
MCSX5
MCSX6
MCSX7
External
Bus
Function
Serial wire debug interface clock input.
Serial wire debug interface data input / output.
Serial wire viewer output.
J-TAG test clock input.
J-TAG test data input.
J-TAG debug data output.
J-TAG test mode state input/output.
Trace CLK output of ETM.
Trace data output of ETM.
J-TAG test reset Input.
External bus interface address bus.
External bus interface chip select output pin.
26
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
78
80
81
78
79
81
80
86
82
83
84
85
77
94
93
92
91
90
89
88
87
55
54
45
44
43
42
41
40
39
32
31
30
29
28
27
14
13
57
56
16
15
8
B9
A8
B8
B9
B11
B8
A8
C7
C8
D9
A7
B7
A9
C5
D6
B5
A5
C6
B6
A6
D7
H10
J8
K8
J7
H6
K7
L7
J6
K6
L6
H5
J5
K5
L5
J4
F2
F1
H7
H9
G1
F3
D5
93
95
96
93
94
96
95
101
97
98
99
100
92
114
113
107
106
105
104
103
102
65
64
50
49
48
47
46
45
44
37
36
35
34
33
32
19
18
67
66
21
20
83
82
81
8
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
External
Bus
MDATA0
MDATA1
MDATA2
MDATA3
MDATA4
MDATA5
MDATA6
MDATA7
MDATA8
MDATA9
MDATA10
MDATA11
MDATA12
MDATA13
MDATA14
MDATA15
MDQM0
MDQM1
MNALE
MNCLE
MNREX
MNWEX
MOEX
MWEX
Function
External bus interface data bus.
External bus interface byte mask signal output.
External bus interface ALE signal to control NAND
Flash output pin.
External bus interface CLE signal to control NAND
Flash output pin.
External bus interface read enable signal to control
NAND Flash.
External bus interface write enable signal to control
NAND Flash.
External bus interface read enable signal for SRAM.
External bus interface write enable signal for SRAM.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
2
3
4
5
6
7
9
10
63
64
65
66
67
68
69
70
11
12
C1
C2
B3
D1
D2
D3
E1
E2
G8
F10
F9
E11
E10
F8
E9
D11
E3
E4
2
3
4
5
6
7
14
15
73
74
75
76
77
78
79
80
16
17
-
-
9
-
-
10
-
-
12
-
-
11
58
59
G10
G9
68
69
27
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
External
Interrupt
INT00_0
INT00_1
INT00_2
INT01_0
INT01_1
INT01_2
INT02_0
INT02_1
INT02_2
INT03_0
INT03_1
INT03_2
INT04_0
INT04_1
INT04_2
INT05_0
INT05_1
INT05_2
INT06_1
INT06_2
INT07_2
INT08_1
INT08_2
INT09_1
INT09_2
INT10_1
INT10_2
INT11_1
INT11_2
INT12_1
INT12_2
INT13_1
INT13_2
INT14_1
INT14_2
INT15_1
INT15_2
NMIX
Function
External interrupt request 00 input pin.
External interrupt request 01 input pin.
External interrupt request 02 input pin.
External interrupt request 03 input pin.
External interrupt request 04 input pin.
External interrupt request 05 input pin.
External interrupt request 06 input pin.
External interrupt request 07 input pin.
External interrupt request 08 input pin.
External interrupt request 09 input pin.
External interrupt request 10 input pin.
External interrupt request 11 input pin.
External interrupt request 12 input pin.
External interrupt request 13 input pin.
External interrupt request 14 input pin.
External interrupt request 15 input pin.
Non-Maskable Interrupt input.
28
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
2
82
87
3
83
4
53
93
56
9
12
59
10
74
65
11
73
45
5
14
8
15
16
17
27
28
39
96
92
C1
C8
D7
C2
D9
B3
J10
D6
H9
E1
E4
G9
E2
C10
F9
E3
C11
K8
D1
F2
D5
F3
G1
G2
J4
L5
K6
C4
B5
2
97
102
3
98
85
4
63
82
113
66
14
17
69
15
89
75
16
88
50
5
19
8
20
11
21
112
22
110
32
108
33
52
44
53
116
54
107
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
GPIO
P00
P01
P02
P03
P04
P05
P06
P07
P08
P09
P0A
P0B
P0C
P0D
P0E
P0F
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P1A
P1B
P1C
P1D
P1E
P1F
P20
P21
P22
P23
P24
P25
P26
P27
P28
Function
General-purpose I/O port 0.
General-purpose I/O port 1.
General-purpose I/O port 2.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
52
53
54
55
56
57
58
59
63
64
65
66
67
68
69
70
74
73
72
71
-
A9
B9
B11
A8
B8
C8
D9
A7
B7
C7
D7
A6
B6
C6
A5
B5
J11
J10
J8
H10
H9
H7
G10
G9
G8
F10
F9
E11
E10
F8
E9
D11
C10
C11
E8
D10
-
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
62
63
64
65
66
67
68
69
73
74
75
76
77
78
79
80
89
88
87
86
85
84
83
82
81
29
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
GPIO
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P3A
P3B
P3C
P3D
P3E
P3F
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P4A
P4B
P4C
P4D
P4E
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P5A
P5B
Function
General-purpose I/O port 3.
General-purpose I/O port 4.
General-purpose I/O port 5.
30
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
27
28
29
30
31
32
36
37
39
40
41
42
43
44
45
2
3
4
5
6
7
8
-
E1
E2
E3
E4
F1
F2
F3
G1
G2
F4
G3
H1
H2
G4
H3
J2
J4
L5
K5
J5
H5
L6
L3
K3
K6
J6
L7
K7
H6
J7
K8
C1
C2
B3
D1
D2
D3
D5
-
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
32
33
34
35
36
37
41
42
44
45
46
47
48
49
50
2
3
4
5
6
7
8
9
10
11
12
13
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
GPIO
P60
P61
P62
P63
P64
P65
P66
P67
P68
P70
P71
P72
P73
P74
P80
P81
SIN0_0
SIN0_1
Multi
Function
Serial
0
SOT0_0
(SDA0_0)
SOT0_1
(SDA0_1)
SCK0_0
(SCL0_0)
Multi
Function
Serial
1
SCK0_1
(SCL0_1)
SIN1_0
SIN1_1
SOT1_0
(SDA1_0)
SOT1_1
(SDA1_1)
SCK1_0
(SCL1_0)
SCK1_1
(SCL1_1)
Function
General-purpose I/O port 6.
General-purpose I/O port 7.
General-purpose I/O port 8.
Multifunction serial interface ch.0 input pin.
Multifunction serial interface ch.0 output pin.
This pin operates as SOT0 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA0
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.0 clock I/O pin.
This pin operates as SCK0 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL0
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.1 input pin.
Multifunction serial interface ch.1 output pin.
This pin operates as SOT1 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA1
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.1 clock I/O pin.
This pin operates as SCK1 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL1
when it is used in an I2C (operation mode 4).
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
96
95
94
93
98
99
73
56
C4
B4
C5
D6
A3
A2
C11
H9
116
115
114
113
112
111
110
109
108
51
52
53
54
55
118
119
88
66
72
E8
87
57
H7
67
71
D10
86
58
G10
68
53
J10
8
63
-
-
9
54
J8
64
-
-
10
55
H10
65
31
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Multi
Function
Serial
2
SIN2_0
SIN2_1
SIN2_2
SOT2_0
(SDA2_0)
SOT2_1
(SDA2_1)
SOT2_2
(SDA2_2)
SCK2_0
(SCL2_0)
SCK2_1
(SCL2_1)
SCK2_2
(SCL2_2)
SIN3_0
SIN3_1
SIN3_2
SOT3_0
(SDA3_0)
SOT3_1
(SDA3_1)
SOT3_2
(SDA3_2)
SCK3_0
(SCL3_0)
SCK3_1
(SCL3_1)
SCK3_2
(SCL3_2)
Multi
Function
Serial
3
Function
Multifunction serial interface ch.2 input pin.
Multifunction serial interface ch.2 output pin.
This pin operates as SOT2 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA2
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.2 clock I/O pin.
This pin operates as SCK2 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL2
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.3 input pin.
Multifunction serial interface ch.3 output pin.
This pin operates as SOT3 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA3
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.3 clock I/O pin.
This pin operates as SCK3 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL3
when it is used in an I2C (operation mode 4).
32
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
59
G9
53
85
69
-
-
54
-
-
84
63
G8
73
-
-
55
-
-
83
64
F10
74
2
39
C1
K6
110
2
44
-
-
109
3
C2
3
40
J6
45
-
-
108
4
B3
4
41
L7
46
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Multi
Function
Serial
4
SIN4_0
SIN4_1
SIN4_2
SOT4_0
(SDA4_0)
SOT4_1
(SDA4_1)
SOT4_2
(SDA4_2)
SCK4_0
(SCL4_0)
SCK4_1
(SCL4_1)
SCK4_2
(SCL4_2)
RTS4_0
RTS4_1
RTS4_2
CTS4_0
CTS4_1
CTS4_2
SIN5_0
SIN5_1
SIN5_2
SOT5_0
(SDA5_0)
SOT5_1
(SDA5_1)
SOT5_2
(SDA5_2)
SCK5_0
(SCL5_0)
SCK5_1
(SCL5_1)
SCK5_2
(SCL5_2)
Multi
Function
Serial
5
Function
Multifunction serial interface ch.4 input pin.
Multifunction serial interface ch.4 output pin.
This pin operates as SOT4 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA4
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.4 clock I/O pin.
This pin operates as SCK4 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL4
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.4 RTS output pin.
Multifunction serial interface ch.4 CTS input pin.
Multifunction serial interface ch.5 input pin.
Multifunction serial interface ch.5 output pin.
This pin operates as SOT5 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA5
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.5 clock I/O pin.
This pin operates as SCK5 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL5
when it is used in an I2C (operation mode 4).
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
87
65
82
D7
F9
C8
102
75
97
88
A6
103
66
E11
76
83
D9
98
89
B6
104
67
E10
77
84
A7
99
90
69
86
91
68
85
96
93
15
C6
E9
C7
A5
F8
B7
C4
D6
F3
105
79
101
106
78
100
116
113
20
95
B4
115
-
-
112
16
G1
21
94
C5
114
-
-
111
17
G2
22
33
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Multi
Function
Serial
6
SIN6_0
SIN6_1
SOT6_0
(SDA6_0)
SOT6_1
(SDA6_1)
SCK6_0
(SCL6_0)
SCK6_1
(SCL6_1)
SIN7_0
SIN7_1
Multi
Function
Serial
7
SOT7_0
(SDA7_0)
SOT7_1
(SDA7_1)
SCK7_0
(SCL7_0)
SCK7_1
(SCL7_1)
Function
Multifunction serial interface ch.6 input pin.
Multifunction serial interface ch.6 output pin.
This pin operates as SOT6 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA6
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.6 clock I/O pin.
This pin operates as SCK6 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL6
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.7 input pin.
Multifunction serial interface ch.7 output pin.
This pin operates as SOT7 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SDA7
when it is used in an I2C (operation mode 4).
Multifunction serial interface ch.7 clock I/O pin.
This pin operates as SCK7 when it is used in a
UART/CSIO (operation modes 0 to 2) and as SCL7
when it is used in an I2C (operation mode 4).
34
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
5
12
D1
E4
5
17
6
D2
6
11
E3
16
7
D3
7
10
E2
15
45
K8
11
50
-
-
12
44
J7
49
-
-
13
43
H6
48
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Multi
Function
Timer
0
DTTI0X_0
DTTI0X_1
FRCK0_0
FRCK0_1
IC00_0
IC00_1
IC01_0
IC01_1
IC02_0
IC02_1
IC03_0
IC03_1
RTO00_0
(PPG00_0)
RTO00_1
(PPG00_1)
RTO01_0
(PPG00_0)
RTO01_1
(PPG00_1)
RTO02_0
(PPG02_0)
RTO02_1
(PPG02_1)
RTO03_0
(PPG02_0)
RTO03_1
(PPG02_1)
RTO04_0
(PPG04_0)
RTO04_1
(PPG04_1)
RTO05_0
(PPG04_0)
RTO05_1
(PPG04_1)
Function
Input signal controlling wave form generator outputs
RTO00 to RTO05 of multi-function timer 0.
Pin No.
LQFP- BGA- LQFP100 112 120
18
69
13
70
17
65
16
66
15
67
14
68
F4
E9
F1
D11
G2
F9
G1
E11
F3
E10
F2
F8
23
79
18
80
22
75
21
76
20
77
19
78
19
G3
24
71
D10
86
Wave form generator output of multi-function timer 0.
This pin operates as PPG00 when it is used in PPG 0
output modes.
20
H1
25
-
-
85
Wave form generator output of multi-function timer 0.
This pin operates as PPG02 when it is used in PPG 0
output modes.
21
H2
26
-
-
84
Wave form generator output of multi-function timer 0.
This pin operates as PPG02 when it is used in PPG 0
output modes.
22
G4
27
-
-
83
Wave form generator output of multi-function timer 0.
This pin operates as PPG04 when it is used in PPG 0
output modes.
23
H3
28
-
-
82
Wave form generator output of multi-function timer 0.
This pin operates as PPG04 when it is used in PPG 0
output modes.
24
J2
29
-
-
81
16-bit free-run timer ch.0 external clock input pin.
16-bit input capture ch.0 input pin of multi-function
timer 0.
ICxx desicribes chanel number.
Wave form generator output of multi-function timer 0.
This pin operates as PPG00 when it is used in PPG 0
output modes.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
35
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Multi
Function
Timer
1
DTTI1X_0
DTTI1X_1
FRCK1_0
FRCK1_1
IC10_0
IC10_1
IC11_0
IC11_1
IC12_0
IC12_1
IC13_0
IC13_1
RTO10_0
(PPG10_0)
RTO10_1
(PPG10_1)
RTO11_0
(PPG10_0)
RTO11_1
(PPG10_1)
RTO12_0
(PPG12_0)
RTO12_1
(PPG12_1)
RTO13_0
(PPG12_0)
RTO13_1
(PPG12_1)
RTO14_0
(PPG14_0)
RTO14_1
(PPG14_1)
RTO15_0
(PPG14_0)
RTO15_1
(PPG14_1)
Function
Input signal controlling wave form generator outputs
RTO10 to RTO15 of multi-function timer 1.
16-bit free-run timer ch.1 external clock input pin.
16-bit input capture ch.0 input pin of multi-function
timer 1.
ICxx desicribes chanel number.
Wave form generator output of multi-function timer 1.
This pin operates as PPG10 when it is used in PPG 1
output modes.
Wave form generator output of multi-function timer 1.
This pin operates as PPG10 when it is used in PPG 1
output modes.
Wave form generator output of multi-function timer 1.
This pin operates as PPG12 when it is used in PPG 1
output modes.
Wave form generator output of multi-function timer 1.
This pin operates as PPG12 when it is used in PPG 1
output modes.
Wave form generator output of multi-function timer 1.
This pin operates as PPG14 when it is used in PPG 1
output modes.
Wave form generator output of multi-function timer 1.
This pin operates as PPG14 when it is used in PPG 1
output modes.
36
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Pin No.
LQFP- BGA- LQFP100 112 120
8
39
87
44
88
40
89
41
90
42
91
43
D5
K6
D7
J7
A6
J6
B6
L7
C6
K7
A5
H6
8
44
102
49
103
45
104
46
105
47
106
48
2
C1
2
27
J4
32
3
C2
3
28
L5
33
4
B3
4
29
K5
34
5
D1
5
30
J5
35
6
D2
6
31
H5
36
7
D3
7
32
L6
37
DS706-00007-1v0-E
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Quadrature
Position/
Revolution
Counter
0
AIN0_0
AIN0_1
Function
QPRC ch.0 AIN input pin.
AIN0_2
BIN0_0
BIN0_1
QPRC ch.0 BIN input pin.
BIN0_2
ZIN0_0
ZIN0_1
Quadrature
Position/
Revolution
Counter
1
QPRC ch.0 ZIN input pin.
Pin No.
LQFP- BGA- LQFP100 112 120
9
E1
14
40
J6
45
2
C1
2
10
E2
15
41
L7
46
3
11
C2
E3
3
16
42
K7
47
ZIN0_2
4
B3
4
AIN1_1
74
C10
89
43
H6
48
73
44
C11
J7
88
49
72
E8
87
45
K8
50
AIN1_2
BIN1_1
BIN1_2
ZIN1_1
ZIN1_2
QPRC ch.1 AIN input pin.
QPRC ch.1 BIN input pin.
QPRC ch.1 ZIN input pin.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
37
r2.0
MB9B100 Series
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated
port number. For these pins, there are multiple pins that provide the same function for the same channel.
Use the extended port function register (EPFR) to select the pin.
Module
Pin name
Function
RESET
Mode
INITX
External Reset Input. A reset is valid when INITX=L.
Mode 0 pin.
During normal operation, MD0=L must be input.
During serial programming to flash memory, MD0=H
must be input.
Mode 1 pin. Input must always be at the "L" level.
Power Pin.
Power Pin.
Power pin.
Power pin.
Power pin.
Power pin.
GND Pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
GND pin.
Main clock (oscillation) input pin.
Sub clock (oscillation) input pin.
Main clock (oscillation) I/O pin.
Sub clock (oscillation) I/O pin.
Internal CR-osc clock output port.
A/D converter analog power pin.
A/D converter analog reference voltage input pin.
MD0
POWER
GND
CLOCK
ADC
POWER
ADC
GND
C-pin
MD1
VCC
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
X0
X0A
X1
X1A
CROUT
AVCC
AVRH
AVSS
C
Pin No.
LQFP- BGA- LQFP100 112 120
38
K4
43
47
L8
57
46
1
26
35
51
76
97
25
34
50
75
100
48
36
49
37
74
60
61
K9
B1
J1
K1
K11
A10
A4
B2
L1
K2
J3
H4
L4
L11
K10
J9
H8
B10
C9
A11
D8
D4
C3
A1
L9
L3
L10
K3
C10
H11
F11
56
1
31
40
61
91
117
30
39
60
90
120
58
41
59
42
89
70
71
A/D converter GND pin.
62
G11
72
Power stabilization capacity pin.
33
L2
38
38
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
I/O CIRCUIT TYPE
Type
Circuit
Remarks
A
X1
Clock input
・ Oscillation feedback resistor
: Approximately 1MΩ
・ With Standby mode control
X0
Standby mode control
B
・ CMOS level hysteresis input
・ pull-up resistor
: Approximately 50kΩ
Pull-up resistor
CMOS level
hysteresis input
C
・ CMOS level input
・ With high-voltage control for
flash memory test
Control pin
Mode input
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
39
r2.0
MB9B100 Series
Type
Circuit
Remarks
D
・ It is possible to select the low
speed oscillation / GPIO
function.
P-ch
X1A
P-ch
Digital output
N-ch
Digital output
R
Pull-up resistor control
Digital input
Standby mode control
Clock input
When the low speed oscillation
is selected.
・ Oscillation feedback resistor
: Approximately 20MΩ
・ With Standby mode control
When the GPIO is selected.
・ CMOS level output.
・ CMOS level hysteresis input
・ With pull-up resistor control
・ With standby mode control
・ pull-up resistor
: Approximately 50kΩ
・ IOH=-4mA, IOL=4mA
Standby mode control
Digital input
Standby mode control
R
X0A
P-ch
P-ch
Digital output
N-ch
Digital output
Pull-up resistor control
40
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
Type
Circuit
Remarks
E
P-ch
P-ch
N-ch
Digital output
・ CMOS level output
・ CMOS level hysteresis input
・ With pull-up resistor control
・ With standby mode control
・ pull-up resistor
: Approximately 50kΩ
・ IOH=-4mA, IOL=4mA
Digital output
Pull-up resistor control
Digital input
Standby mode control
F
P-ch
P-ch
Digital output
N-ch
Digital output
・ CMOS level output
・ CMOS level hysteresis input
・ With input control
・ Analog input
・ With pull-up resistor control
・ With standby mode control
・ pull-up resistor
: Approximately 50kΩ
・ IOH=-4mA, IOL=4mA
Pull-up resistor control
Digital input
Standby mode control
Analog input
Input control
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
41
r2.0
MB9B100 Series
Type
Circuit
Remarks
G
P-ch
P-ch
N-ch
・ CMOS level output
・ CMOS level hysteresis input
・ With pull-up resistor control
・ With standby mode control
・ pull-up resistor
: Approximately 50kΩ
・ IOH=-12mA, IOL=12mA
Digital output
Digital output
Pull-up resistor control
Digital input
Standby mode control
H
・ CMOS level output
・ CMOS level hysteresis input
・ With standby mode control
P-ch
N-ch
Digital output
Digital output
Digital input
Standby mode control
42
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
PRECAUTIONS FOR HANDLING THE DEVICES
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your FUJITSU semiconductor devices.
Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
・ Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
・ Recommended Operating Conditions
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the
data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
・ Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to
power supply and input/output functions.
1. Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device. Try
to prevent such overvoltage or over-current conditions at the design stage.
2. Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage the
device.
Therefore, avoid this type of connection.
3. Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation.
Such pins should be connected through an appropriate resistance to a power supply pin or ground
pin.
・ Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate.
When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor
structures) may be formed, causing large current levels in excess of several hundred mA to flow
continuously at the power supply pin. This condition is called latch-up.
Note:
The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening,
do the following:
(a) Be sure that voltages applied to pins do not exceed the absolute maximum ratings.
This should include attention to abnormal noise, surge levels, etc.
(b) Be sure that abnormal current flows do not occur during the power-on sequence.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
43
r2.0
MB9B100 Series
・ Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and
standards in the design of products.
・ Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions.
・ Precautions Related to Usage of Devices
FUJITSU semiconductor devices are intended for use in standard applications (computers, office
automation and other office equipment, industrial, communications, and measurement equipment,
personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property
damage, or where extremely high levels of reliability are demanded (such as aerospace
systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical
devices for life support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be responsible for damages
arising from such use without prior approval.
44
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU's recommended conditions. For detailed
information about mount conditions, contact your FUJITSU sales representative.
・ Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods:
direct soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder.
In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the
absolute ratings for storage temperature. Mounting processes should conform to FUJITSU
recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces
can lead to contact deterioration after long periods. For this reason it is recommended that the surface
treatment of socket contacts and IC leads be verified before mounting.
・ Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads
are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch
results in increased susceptibility to open connections caused by deformed pins, or shorting due to
solder bridges.
You must use appropriate mounting techniques. FUJITSU recommends the solder reflow method, and
has established a ranking of mounting conditions for each product. Users are advised to mount packages
in accordance with FUJITSU ranking of recommended conditions.
・ Lead-Free Packaging
Note:
When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
・ Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental
conditions will cause absorption of moisture. During mounting, the application of heat to a package that
has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to
crack. To prevent, do the following:
・ Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product.
Store products in locations where temperature changes are slight.
・ Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at
temperatures between 5 C and 30 C When you open Dry Package that recommends humidity 40%
to 70% relative humidity.
・ When necessary, FUJITSU packages semiconductor devices in highly moisture-resistant aluminum
laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags
for storage.
・ Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
・ Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the
FUJITSU recommended conditions for baking.
Condition:+125 C/24 h
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
45
r2.0
MB9B100 Series
・ Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must
take the following precautions:
・ Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus
for ion generation may be needed to remove electricity.
・ Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
・ Eliminate static body electricity by the use of rings or bracelets connected to ground through high
resistance (on the level of 1 M). Wearing of conductive clothing and shoes, use of conductive
floor mats and other measures to minimize shock loads is recommended.
・ Ground all fixtures and instruments, or protect with anti-static measures.
・ Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.
・ Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
1. Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If
high humidity levels are anticipated, consider anti-humidity processing.
2. Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal
operation.
In such cases, use anti-static measures or processing to prevent discharges.
3. Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
4. Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation.
Users should provide shielding as appropriate.
5. Smoke, Flame
Note:
Plastic molded devices are flammable, and therefore should not be used near combustible
substances.
If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of FUJITSU products in other special environmental conditions should
consult with FUJITSU sales representatives.
Please check the latest handling precautions at the following URL.
http://edevice.fujitsu.com/fj/handling-e.pdf
46
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
HANDLING DEVICES
Power supply pins
In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected
within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be
connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels,
to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the
total output current rating.
Moreover, connect the current supply source with the VCC and VSS pins of this device at low impedance.
It is also advisable that a ceramic capacitor of approximately 0.1 µF be connected as a bypass capacitor
between VCC and VSS near this device.
Crystal oscillator circuit
Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit
board so that X0/X1, X0A/X1A pins, the crystal oscillator (or ceramic oscillator), and the bypass capacitor
to ground are located as close to the device as possible.
It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins
are surrounded by ground plane as this is expected to produce stable operation.
Using an external clock
When using an external clock, the clock signal should be input to the X0,X0A pin only and the X1,X1A pin
should be kept open.
・Example of Using an External Clock
Device
X0(X0A)
Open
X1(X1A)
Handling when using Multi function serial pin as I2C pin
If it is using multi function serial pin as I2C pins, P-ch transistor of digital output is always disable.
However, I2C pins need to keep the electrical characteristic like other pins and not to connect to external I2C
bus system with power OFF.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
47
r2.0
MB9B100 Series
C Pin
As this series includes an internal regulator, always connect a bypass capacitor of approximately 4.7 µF to
the C pin for use by the regulator.
C
Device
4.7μF
VSS
GND
Mode pins (MD0, MD1)
Connect the MD pin (MD0, MD1) directly to VCC or VSS pins. Design the printed circuit board such that
the pull-up/down resistance stays low, as well as the distance between the mode pins and VCC pins or VSS
pins is as short as possible and the connection impedance is low, when the pins are pulled-up/down such as
for switching the pin level and rewriting the Flash memory data. It is because of preventing the device
erroneously switching to test mode due to noise.
Notes on power-on
Turn power on/off in the following order or at the same time.
If not using the A/D converter, connect AVCC =VCC and AVSS = VSS.
Turning on : VCC AVCC AVRH
Turning off : AVRH AVCC VCC
Serial Communication
There is a possibility to receive wrong data due to the noise or other causes on the serial communication.
Therefore, design a printed circuit board so as to avoid noise.
Consider the case of receiving wrong data due to noise, perform error detection such as by applying a
checksum of data at the end. If an error is detected, restransmit the data.
Differences in features among the products with different memory sizes and
between FLASH products and MASK products
The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and
oscillation characteristics among the products with different memory sizes and between FLASH products
and MASK products are different because chip layout and memory structures are different.
If you are switching to use a different product of the same series, please make sure to evaluate the electric
characteristics.
48
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
BLOCK DIAGRAM
MB9BF104/105/106
TRSTX,TCK
TDI,TMS
TDO
TRACED[3:0],
TRACECLK
SWJ-DP
ETM
TPIU
ROM
Table
Code RAM
16/24/32
Kbyte
Cortex-M3 Core I
@80MHz(Max.)
D
Multi-layer AHB (Max.80MHz)
MPU NVIC
Flash I/F
Sys
AHB-APB Bridge:
APB0(Max.40MHz)
Dual-Timer
WatchDog Timer
(Software)
Clock Reset
Generator
INITX
WatchDog Timer
(Hardware)
Security
On-Chip
SRAM
16/24/32
Kbyte
DMAC
8ch
CSV
X1
X0A
X1A
Main
Osc
Sub.
Osc
AHB-AHB
Bridge
RST
CLK
X0
On-Chip
Flash
256/384/512
Kbyte
PLL
CR
4MHz
CR
100KHz
MAD[24:0]
AVCC,
AVSS,AVRH
AN[15:0]
A/D Converter x3
External Bus IF
MCSX[7:0],
MOEX,MWEX,
MNALE,
MNCLE
MNWEX,
MNREX,
MDQM[1:0]
12bit A/D Converter
12bit A/D Converter
Regurator Ctrl
12bit A/D Converter
Base Timer
16-bit 8ch
/32-bit 4ch
TIOB[7:0]
AIN[1:0]
QPRC
2ch
BIN[1:0]
ZIN[1:0]
A/D Activation
Compare
3ch
IC0[3:0]
IC1[3:0]
16-bit Input Capture
4ch
FRCK[1:0]
16-bit FreeRun Timer
3ch
Power On
Reset
AHB-APB Bridge : APB2 ( Max.40MHz)
TIOA[7:0]
AHB-APB Bridge : APB1 (Max.40MHz)
ADTG[8:0]
MDATA[15:0]
16-bit Output
Compare
6ch
Waveform
Generator
3ch
DTTI[1:0]X
RTO0[5:0]
RTO1[5:0]
Regurator +
LVD
VCC,VSS
C
CRC
Accelerator
Watch Counter
External Interrupt
Controller
16-pin + NMI
INT[15:0]
NMIX
MODE-Ctrl
GPIO
MD[1:0]
PIN-Function-Ctrl
・
・
Px[x:0],
SCK[7:0]
SIN[7:0]
SOT[7:0]
Multi Serial IF
8ch
(with FIFO ch.4～7)
CTS4
RTS4
*HW flow control(ch.4)
Multi Function Timer x2
On-Chip Flash
Code SRAM
On-Chip SRAM
Regurator +
LVD
P0[F:0],
P1[F:0],
16-bit PPG
3ch
Product device
IRQ-Monitor
MB9BF104
MB9BF105
MB9BF106
256Kbyte
16Kbyte
16Kbyte
384Kbyte
24Kbyte
24Kbyte
512Kbyte
32Kbyte
32Kbyte
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
49
r2.0
MB9B100 Series
MEMORY MAP
MB9B100 Series Memory Map(1)
Peripherals Area
0x41FF_FFFF
Reserved
0xFFFF_FFFF
0xE010_0000
0xE000_0000
Reserved
0x4006_4000
Cortex-M3 Private
Peripherals
0x4006_3000
0x4006_2000
0x4006_1000
0x4006_0000
Reserved
Reserved
Reserved
DMAC
Reserved
0x4005_0000
Reserved
External Device Area
0x4004_0000
0x4003_F000
EXT-bus I/F
Reserved
0x4003_B000
0x6000_0000
Reserved
0x4400_0000
32Mbyte
Bit band alias
0x4200_0000
Peripherals
0x4000_0000
Reserved
0x2400_0000
0x2200_0000
32Mbyte
Bit band alias
0x2000_0000
0x1FF8_0000
Please refer to
the next page for
the memory size
details.
On Chip SRAM
Code SRAM
Reserved
0x0010_2000
0x0010_0000
0x4003_2000
0x4003_1000
0x4003_0000
0x4002_F000
0x4002_E000
Security/CR Trim
Watch Counter
CRC
MFS
Reserved
Reserved
LVD
Reserved
GPIO
Reserved
Int-Req. Read
EXTI
Reserved
CR Trim
Reserved
0x4002_8000
Reserved
0x2008_0000
0x4003_A000
0x4003_9000
0x4003_8000
0x4003_7000
0x4003_6000
0x4003_5000
0x4003_4000
0x4003_3000
0x4002_7000
0x4002_6000
0x4002_5000
0x4002_4000
A/DC
QPRC
Base Timer
PPG
Reserved
0x4002_2000
0x4002_1000
0x4002_0000
MFT unit1
MFT unit0
Reserved
FLASH
0x4001_6000
0x4001_5000
Dual Timer
Reserved
0x0000_0000
0x4001_3000
0x4001_2000
0x4001_1000
0x4001_0000
SW WDT
HW WDT
Clock/Reset
Reserved
0x4000_1000
0x4000_0000
50
FUJITSU SEMICONDUCTOR CONFIDENTIAL
FLASH I/F
DS706-00007-1v0-E
r2.0
MB9B100 Series
MB9B100 Series Memory Map(2)
0x2008_0000
0x2008_0000
Reserved
0x2008_0000
Reserved
Reserved
0x2000_8000
On Chip SRAM
32kbyte
0x2000_6000
On Chip SRAM
24kbyte
0x2000_0000
0x2000_0000
0x2000_0000
Code SRAM
32Kbyte
0x2000_4000
Code SRAM
24kbyte
0x1FFF_C000
On Chip SRAM
16kbyte
Code SRAM
16kbyte
0x1FFF_A000
0x1FFF_8000
0x0010_2000
0x0010_1000
0x0010_0000
CR triming
Security
Reserved
Reserved
Reserved
0x0010_2000
0x0010_1000
0x0010_0000
CR triming
Security
0x0010_2000
0x0010_1000
0x0010_0000
CR triming
Security
Reserved
Reserved
Reserved
0x0008_0000
0x0006_0000
FLASH 512Kbyte
0x0004_0000
FLASH 384Kbyte
FLASH 256Kbyte
0x0000_0000
0x0000_0000
MB9BF106N/R
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
0x0000_0000
MB9BF105N/R
MB9BF104N/R
51
r2.0
MB9B100 Series
Peripheral Address Map
Start address
End address
Bus
0x4000_0000
0x4000_0FFF
0x4000_1000
0x4000_FFFF
0x4001_0000
0x4001_0FFF
Clock/Reset Control
0x4001_1000
0x4001_1FFF
Hardware Watchdog timer
0x4001_2000
0x4001_2FFF
0x4001_3000
0x4001_4FFF
0x4001_5000
0x4001_5FFF
Dual-Timer
0x4001_6000
0x4001_FFFF
Reserved
0x4002_0000
0x4002_0FFF
Multi-function timer unit0
0x4002_1000
0x4002_1FFF
Multi-function timer unit1
0x4002_2000
0x4002_3FFF
Reserved
AHB
APB0
Peripherals
Flash I/F register
Reserved
Software Watchdog timer
Reserved
0x4002_4000
0x4002_4FFF
PPG
0x4002_5000
0x4002_5FFF
Base Timer
0x4002_6000
0x4002_6FFF
0x4002_7000
0x4002_7FFF
A/D Converter
0x4002_8000
0x4002_DFFF
Reserved
0x4002_E000
0x4002_EFFF
Internal CR trimming
0x4002_F000
0x4002_FFFF
Reserved
0x4003_0000
0x4003_0FFF
External Interrupt Controller
0x4003_1000
0x4003_1FFF
Interrupt Request Batch-Read Function
0x4003_2000
0x4003_2FFF
Reserved
0x4003_3000
0x4003_3FFF
GPIO
0x4003_4000
0x4003_4FFF
Reserved
0x4003_5000
0x4003_5FFF
Low Voltage Detector
0x4003_6000
0x4003_6FFF
0x4003_7000
0x4003_7FFF
Reserved
0x4003_8000
0x4003_8FFF
Multi-function serial Interface
0x4003_9000
0x4003_9FFF
CRC
0x4003_A000
0x4003_AFFF
Watch Counter
0x4003_B000
0x4003_EFFF
Reserved
0x4003_F000
0x4003_FFFF
External Memory interface
0x4004_0000
0x4004_FFFF
Reserved
0x4005_0000
0x4005_FFFF
Reserved
0x4006_0000
0x4006_0FFF
APB1
APB2
Quadrature Position/Revolution Counter
Reserved
DMAC register
AHB
0x4006_1000
0x4006_1FFF
0x4006_2000
0x4006_2FFF
Reserved
0x4006_3000
0x4006_3FFF
Reserved
0x4006_4000
0x41FF_FFFF
Reserved
52
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Reserved
DS706-00007-1v0-E
r2.0
MB9B100 Series
PIN STATUS IN EACH CPU STATE
The terms used for pin status have the following meanings.
・ INITX=0
This is the period when the INITX pin is the "L" level.
・ INITX=1
This is the period when the INITX pin is the "H" level.
・ SPL=0
This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is
set to "0".
・ SPL=1
This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is
set to "1".
・ Input enabled
Indicates that the input function can be used.
・ Internal input fixed at "0"
This is the status that the input function cannot be used. Internal input is fixed at "L".
・ Hi-Z
Indicates that the output drive transistor is disabled and the pin is put in the Hi-Z state.
・ Setting disabled
Indicates that the setting is disabled.
・ Maintain previous state
Maintains the state that was immediately prior to entering the current mode.
If a built-in peripheral function is operating, the output follows the peripheral function.
If the pin is being used as a port, that output is maintained.
・ Analog input is enabled
Indicates that the analog input is enabled.
・ Trace output
Indicates that the trace function can be used.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
53
r2.0
MB9B100 Series
LIST OF PIN STATUS
Pin status
type
A
B
C
D
E
F
Device
Run mode or
Power-on reset
Timer mode or sleep mode
INITX input
internal reset sleep mode
or low voltage
state
state
state
state
detection state
Function group Power supply
Power supply
Power supply stable
Power supply stable
unstable
stable
INITX=0
INITX=1
INITX=1
INITX=1
SPL=0
SPL=1
Input enabled
Input
Input
Input
Input
Input
Main crystal
enabled
enabled
enabled
enabled
enabled
oscillator input
pin
Maintain
Maintain
Maintain
H output/
H output/
H output/
Main crystal
previous
previous
previous
Internal
Internal
Internal input
oscillator output
state/
state/
state/
input fixed
input fixed
fixed at "0"/
pin
H output at
H output at
H output at
at "0"
at "0"
or Input
oscillation
oscillation
oscillation
enabled
stop (*1)/
stop (*1)/
stop (*1)/
Internal
Internal
Internal
input fixed
input fixed
input fixed
at "0"
at "0"
at "0"
Pull-up/
Pull-up/
Pull-up/
Pull-up/
INITX input pin
Pull-up/ Input
Pull-up/
Input
Input
Input
Input
enabled
Input
enabled
enabled
enabled
enabled
enabled
Mode input pin
Input enabled
Input
Input
Input
Input
Input
enabled
enabled
enabled
enabled
enabled
Maintain
Pull-up/
Maintain
JTAG
Hi-Z
Pull-up/
Maintain
previous
Input
previous
selected
Input
previous
state
enabled
state
enabled
state
Output
GPIO
Setting
Setting
Setting
Hi-Z/
selected
disabled
disabled
disabled
Internal
input fixed
at "0"
Maintain
Maintain
Setting
Setting
Setting
Trace selected
Trace output
previous
previous
disabled
disabled
disabled
Maintain
External interrupt
state
state
previous
enabled selected
state
Hi-Z/
Hi-Z/
Hi-Z
Hi-Z/
GPIO
Internal
Input
Input
selected, or other
input fixed
enabled
enabled
than above
at "0"
resource selected
54
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
Pin status
type
G
H
I
J
Device
Run mode or
Power-on reset
Timer mode or sleep mode
INITX input
internal reset sleep mode
or low voltage
state
state
state
state
detection state
Function group Power supply
Power supply
Power supply stable
Power supply stable
unstable
stable
INITX=0
INITX=1
INITX=1
INITX=1
SPL=0
SPL=1
Maintain
Maintain
Trace selected
Setting
Setting
Setting
Trace output
previous
previous
disabled
disabled
disabled
state
state
Hi-Z/
Hi-Z/
Hi-Z
Hi-Z/
GPIO selected,
Internal
Input
Input
or other than
input fixed
enabled
enabled
above resource
at "0"
selected
Maintain
Maintain
External interrupt
Setting
Setting
Setting
Maintain
previous
previous
enabled selected
disabled
disabled
disabled
previous
state
state
state
Hi-Z/
Hi-Z/
Hi-Z
Hi-Z/
GPIO selected,
Internal
Input
Input
or other than
input fixed
enabled
enabled
above resource
at "0"
selected
Output
Maintain
Maintain
Hi-Z/
GPIO selected,
Hi-Z
Hi-Z/
Hi-Z/
previous
previous
Input
resource selected
Input
Internal
state
state
enabled
enabled
input fixed
at "0"
Maintain
Maintain
NMIX selected
Setting
Setting
Setting
Maintain
previous
previous
disabled
disabled
disabled
previous
state
state
state
Hi-Z/
Hi-Z/
Hi-Z
Hi-Z/
GPIO selected,
Internal
Input
Input
or other than
input fixed
enabled
enabled
above resource
at "0"
selected
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
55
r2.0
MB9B100 Series
Pin status
type
K
L
M
Device
Run mode or
Power-on reset
Timer mode or sleep mode
INITX input
internal reset sleep mode
or low voltage
state
state
state
state
detection state
Function group Power supply
Power supply
Power supply stable
Power supply stable
unstable
stable
INITX=0
INITX=1
INITX=1
INITX=1
SPL=0
SPL=1
Hi-Z/
Hi-Z/
Hi-Z/
Hi-Z/
Analog input
Hi-Z
Hi-Z/
Internal
Internal
Internal
Internal
selected
Internal
input fixed
input fixed
input fixed
input fixed
input fixed
at "0"/
at "0"/
at "0"/
at "0"/
at "0"/
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
Hi-Z/
Maintain
Setting
Setting
Setting
Maintain
GPIO selected,
Internal
previous
disabled
disabled
disabled
previous
or other than
input fixed
state
state
above resource
at "0"
selected
Maintain
Maintain
External interrupt
Setting
Setting
Setting
Maintain
previous
previous
enabled selected
disabled
disabled
disabled
previous
state
state
state
Hi-Z/
Hi-Z/
Hi-Z/
Hi-Z/
Analog input
Hi-Z
Hi-Z/
Internal
Internal
Internal
Internal
selected
Internal
input fixed
input fixed
input fixed
input fixed
input fixed
at "0"/
at "0"/
at "0"/
at "0"/
at "0"/
Analog
Analog
Analog
Analog
Analog
input
input
input
input
input
enabled
enabled
enabled
enabled
enabled
Hi-Z/
Maintain
Setting
Setting
Setting
Maintain
GPIO selected,
Internal
previous
disabled
disabled
disabled
previous
or other than
input fixed
state
state
above resource
at "0"
selected
Output
Maintain
GPIO selected
Setting
Setting
Setting
Maintain
Hi-Z/
previous
disabled
disabled
disabled
previous
Internal
state
state
input fixed
at "0"
Input
Input
Input
Input
Sub crystal
Input
Input
enabled
enabled
enabled
enabled
oscillator input
enabled
enabled
pin
56
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
Pin status
type
N
O
Device
Run mode
Power-on reset
Timer mode or sleep mode
INITX input
internal reset or sleep
or low voltage
state
state
state
mode state
detection state
Power
Function group Power supply
supply
Power supply stable
Power supply stable
unstable
stable
INITX=0
INITX=1
INITX=1
INITX=1
SPL=0
SPL=1
Maintain
Output
GPIO selected
Setting
Setting
Setting
Maintain
previous state
Hi-Z/
disabled
disabled
disabled
previous
Internal input
state
fixed at "0"
Maintain
Maintain
Maintain
Hi-Z/
Hi-Z/
Hi-Z/
Sub crystal
previous
previous
previous
Internal
Internal
Internal input
oscillator output
state/ Hi-Z at
state/ Hi-Z at
state
input fixed
input fixed
fixed at "0"
pin
oscillation
oscillation
at "0"
at "0"
stop (*2)/
stop (*2)/
Internal input Internal input
fixed at "0"
fixed at "0"
Maintain
Output
Maintain
Hi-Z/
GPIO selected
Hi-Z
Hi-Z/
previous state Hi-Z/ Internal
previous
Input
Input
input fixed at
state
enabled
enabled
"0"
*1 : Oscillation is stopped at sub timer, sub CR timer mode, and stop mode.
*2 : Oscillation is stopped at stop mode.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
57
r2.0
MB9B100 Series
ELECTRICAL CHARACTERISTICS
This section describes the electrical characteristics of MB9B100 series.
Absolute Maximum Ratings / Recommended Operating Conditions
The following tables show the absolute maximum ratings and recommended operating conditions.
1. Absolute Maximum Ratings
(Vss = AVss = 0.0V)
Parameter
Symbol
Rating
Min
Max
Vcc
AVcc
AVRH
Vss - 0.5
Vss - 0.5
Vss - 0.5
Input voltage
VI
Vss - 0.5
Analog pin input voltage
VIA
Vss - 0.5
Output voltage
VO
Vss - 0.5
"L" level maximum output current *3
IOL
-
IOLAV
-
∑IOL
∑IOLAV
-
IOH
-
IOHAV
-
Vss + 6.5
Vss + 6.5
Vss + 6.5
Vcc + 0.5
( 6.5V)
AVcc + 0.5
( 6.5V)
Vcc + 0.5
( 6.5V)
10
20
4
12
100
50
- 10
- 20
-4
- 12
- 100
- 50
800
+ 150
Power supply voltage*1
Analog power supply voltage *2
Analog reference voltage *2
"L" level average output current *4
"L" level total maximum output current
"L" level total average output current *5
"H" level maximum output current *3
"H" level average output current *4
Unit
Remarks
V
V
V
V
V
V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mW
C
4mA type
12mA type
4mA type
12mA type
4mA type
12mA type
4mA type
12mA type
"H" level total maximum output current
∑IOH
"H" level total average output current *5
∑IOHAV
Power consumption
PD
Storage temperature
TSTG
- 55
*1 : Vcc must not drop below Vss - 0.5V.
*2 : Be careful not to exceed Vcc + 0.5 V, for example, when the power is turned on.
*3 : The maximum output current is the peak value for a single pin.
*4 : The average output is the average current for a single pin over a period of 100 ms.
*5 : The total average output current is the average current for all pins over a period of 100 ms.
<WARNING>
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,
etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
58
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
2. Recommended Operating Conditions
(Vss = AVss = 0.0V)
Parameter
Power supply voltage
Analog power supply voltage
Analog reference voltage
Operating
Temperature
FPT-120P-M21
FPT-100P-M20
FPT-100P-M23
BGA-112P-M04
Symbol
Conditions
Vcc
AVcc
AVRH
When
mounted on
four-layer
PCB
When
mounted on
double-sided
single-layer
PCB
Ta
Value
Min
Max
Unit
Remarks
2.7
2.7
AVss
5.5
5.5
AVcc
V
V
V
- 40
+ 85
C
- 40
+ 85
C
Icc 100mA
- 40
+ 70
C
Icc > 100mA
AVcc = Vcc
<WARNING>
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure. No warranty is made
with respect to uses, operating conditions, or combinations not represented on the data sheet. Users
considering application outside the listed conditions are advised to contact their representatives beforehand.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
59
r2.1
MB9B100 Series
DC Characteristics
The following tables show the DC characteristics.
1. Current rating
(Vcc = AVcc = 2.7V to 5.5V, Vss = AVss = 0V Ta = - 40C to + 85C)
Pin
Parameter Symbol
name
Conditions
Min
Value
Typ Max
Unit
96
118
mA
-
76
94
mA
-
66
82
mA
-
52
65
mA
Normal operation
(built-in
high-speed CR)
-
6.0
9.2
mA
Normal operation
(sub oscillation)
-
0.2
2.24
mA
Normal operation
(built-in
low-speed CR)
-
0.3
2.36
mA
-
43
54
mA
-
3.5
6.2
mA
Peripheral : 4MHz
*1, *2
-
0.15
2.18
mA
Peripheral : 32kHz
*1
-
0.22
2.27
mA
Peripheral : 100kHz
*1
Icc
Vcc
Iccs
CPU : 80MHz,
Peripheral : 40MHz,
FLASH 2Wait
FRWTR.RWT = 10
FSYNDN.SD = 000 *1
CPU : 60MHz,
Peripheral : 30MHz,
FLASH 0Wait
FRWTR.RWT = 00
FSYNDN.SD = 000 *1
CPU : 80MHz,
Peripheral : 40MHz,
FLASH 5Wait
FRWTR.RWT = 10
FSYNDN.SD = 011 *1
CPU : 60MHz,
Peripheral : 30MHz,
FLASH 3Wait
FRWTR.RWT = 00
FSYNDN.SD = 011 *1
CPU/ Peripheral :
4MHz *1, *2
FLASH 0Wait
FRWTR.RWT = 00
FSYNDN.SD = 000
CPU/ Peripheral :
32kHz
FLASH 0Wait
FRWTR.RWT = 00
FSYNDN.SD = 000 *1
CPU/ Peripheral :
100kHz
FLASH 0Wait
FRWTR.RWT = 00
FSYNDN.SD = 000 *1
Peripheral : 40MHz
*1
-
Normal operation
(PLL)
Power
supply
current
Remarks
SLEEP operation
(PLL)
SLEEP operation
(built-in
high-speed CR)
SLEEP operation
(sub oscillation)
SLEEP operation
(built in
low-speed CR)
60
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
(Continued)
Parameter Symbol
Pin
name
ICCH
Conditions
Value
Typ Max
Unit
-
50
200
μA
-
-
2
mA
-
110
300
μA
-
-
2.2
mA
-
2
10
μA
STOP mode
Power
supply
current
ICCT
Min
Vcc
Timer mode
(sub oscillation)
Low voltage
detection
At operation
circuit (LVD)
ICCLVD
power supply
current
*1:When all ports are fixed.
*2: When setting it to 4MHz by trimming.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Remarks
Ta = + 25C,
When LVD is off
*1
Ta = + 85C,
When LVD is off
*1
Ta = + 25C,
When LVD is off
*1
Ta = + 85C,
When LVD is off
*1
for occurrence of
interrupt
61
r2.1
MB9B100 Series
2. Pin Characteristics
(Vcc = AVcc = 2.7V to 5.5V, Vss = AVss = 0V Ta = - 40C to + 85C)
Parameter Symbol Pin name
"H" level
input
voltage
(hysteresis
input)
"L" level input
voltage
(hysteresis
input)
"H" level
output voltage
"L" level
output voltage
Input leak
current
Pull-up
resistance
value
Input
capacitance
Conditions
Value
Min Typ Max
Unit
VIHS
CMOS
hysteresis
input pin,
MD0,1
-
Vcc
× 0.8
-
Vcc
+ 0.3
V
VILS
CMOS
hysteresis
input pin,
MD0,1
-
Vss
- 0.3
-
Vcc
× 0.2
V
Vcc
- 0.5
-
Vcc
V
Vcc
- 0.5
-
Vcc
V
Vcc
- 0.4
-
Vcc
V
Vss
-
0.4
V
Vss
-
0.4
V
Vss
-
0.4
V
-
-5
-
5
μA
Vcc 4.5 V
25
50
100
Vcc 4.5 V
30
80
200
-
-
5
15
VOH
VOL
Vcc 4.5 V
IOH = - 4mA
4mA type
Vcc < 4.5 V
IOH = - 2mA
Vcc 4.5 V
IOH = - 12mA
12mA type
Vcc 4.5 V
IOH = - 8mA
Vcc 4.5 V
IOH = - 25.3mA
P80, P81
Vcc < 4.5 V
IOH = - 13.4mA
Vcc 4.5 V
IOL = 4mA
4mA type
Vcc < 4.5 V
IOL = 2mA
Vcc 4.5 V
IOL = 12mA
12mA type
Vcc 4.5 V
IOL = 8mA
Vcc 4.5 V
IOL = 19.7mA
P80, P81
Vcc < 4.5 V
IOL = 11.9mA
IIL
-
RPU
Pull-up pin
CIN
Other than
Vcc, Vss,
AVcc, AVss,
AVRH
62
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Remarks
kΩ
pF
DS706-00007-1v0-E
r2.1
MB9B100 Series
AC Characteristics
The following tables show the AC characteristics.
(1) Main Clock Input Characteristics
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Input frequency
FCH
Input clock cycle
tCYLH
Input clock pulse
width
Input clock rise
time and fall time
Internal operating
clock
frequency
Internal operating
clock
cycle time
Value
Min
Max
Pin
Conditions
name
X0
X1
-
Unit
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
PWH/tCYLH
PWL/tCYLH
4
4
4
4
20.83
50
48
20
48
20
250
250
MHz
45
55
%
-
-
5
ns
MHz
ns
tCF
tCR
FCC
-
-
-
80
MHz
FCP0
-
-
-
40
MHz
FCP1
-
-
-
40
MHz
FCP2
-
-
-
40
MHz
tCYCC
-
-
12.5
-
ns
tCYCP0
-
-
25
-
ns
tCYCP1
-
-
25
-
ns
tCYCP2
-
-
25
-
ns
Remarks
When crystal oscillator
is connected
When using external
clock
When using external
clock
When using external
clock
When using external
clock
CPU/AHB bus clock
Peripheral bus clock 0
(APB0)
Peripheral bus clock 1
(APB1)
Peripheral bus clock 1
(APB2)
CPU/AHB bus clock
Peripheral bus clock 0
(APB0)
Peripheral bus clock 1
(APB1)
Peripheral bus clock 1
(APB2)
tCYLH
X0
0.8×Vcc
0.8×Vcc
0.8×Vcc
0.2×Vcc
PW H
P WL
tCF
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
0.2×Vcc
tCR
63
r2.1
MB9B100 Series
(2) Sub Clock Input Characteristics
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Input frequency
Symbol
Min
Value
Typ
Max
-
-
32.768
-
kHz
-
32
-
100
kHz
Pin
Conditions
name
Unit
FCL
X0A
X1A
Input clock cycle
tCYLL
-
10
-
31.25
μs
Input clock pulse
width
-
PWH/tCYLL
PWL/tCYLL
45
-
55
%
Remarks
When crystal
oscillator is
connected
When using
external clock
When using
external clock
When using
external clock
tCYLL
X0A
0.8×Vcc
0.8×Vcc
0.8×Vcc
0.2×Vcc
PW H
0.2×Vcc
P WL
(3) Built-in CR Oscillation Characteristics
・ Built-in high-speed CR
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Conditions
Ta = + 25C
Clock frequency
FCRH
Ta =
0C to + 70C
Ta =
- 40C to + 85C
Ta =
- 40C to + 85C
Min
Value
Typ
Max
3.92
4
4.08
3.84
4
4.16
3.8
4
4.2
3
4
5
Unit
Remarks
When trimming
MHz When trimming
When not trimming
・ Built-in low-speed CR
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Clock frequency
Symbol
Conditions
FCRL
-
64
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Min
Value
Typ
Max
50
100
150
Unit
Remarks
kHz
DS706-00007-1v0-E
r2.1
MB9B100 Series
(4) Operating Conditions of PLL
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Value
Unit
Min Typ Max
Remarks
PLL oscillation stabilization wait time
μs
tLOCK 100
(LOCK UP time)*
PLL input clock frequency
fPLLI
4
30
MHz
PLL multiple rate
4
30 multiple
PLL macro oscillation clock frequency
fPLLO
60
120 MHz
*: Time from when the PLL starts operating until the oscillation stabilizes.
(5) Reset Input Characteristics
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Reset input time
tINITX
Value
Pin
Conditions
name
Min
Max
INITX
500
-
-
Unit Remarks
ns
(6) Power-on Reset Timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Power supply rising time
Power supply shut down time
Tr
Toff
Pin
name
Vcc
Tr
Value
Unit
Min
Max
0
-
ms
1
-
ms
Remarks
Toff
2.7V
Vcc
0.2V
0.2V
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
0.2V
65
r2.1
MB9B100 Series
(7) External Bus Timing
・ Asynchronous SRAM Mode
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Pin name
MOEX
MOEX
tOEW
Min pulse width
MOEX
MOEX
tOEL - AV
MAD24 to 00
Address delay time
MOEX
MOEX
tOEH - AX
MAD24 to 00
Address delay time
MOEX
MOEX
tOEL - CSL
MCSX
MCSX delay time
MOEX
MOEX
tOEH - CSH
MCSX
MCSX delay time
Data set up
MOEX
tDS - OE
MDATA15 to 0
MOEX time
MOEX
MOEX
tDH - OE
MDATA15 to 0
Data hold time
MCSX
MCSX
tCSL - WEL
MWEX
MWEX delay time
MCSX
MWEX
tWEH - CSH
MWEX
MCSX delay time
MWEX
Address
tAV - WEL
MAD24 to 00
MWEX delay time
MWEX
MWEX
tWEH - AX
MAD24 to 00
Address delay time
MWEX
MWEX
t
MDQM delay time WEL - DQML MDQM0 to 1
MWEX
MWEX
tWEH - DQMH
MDQM0
to 1
MDQM delay time
MWEX
MWEX
tWEW
Min pulse width
MWEX
MWEX
tWEL - DV
MDATA15 to 0
Data delay time
MWEX
MWEX
tWEH - DX
MDATA15 to 0
Data delay time
Note: When the external load capacitance = 50pF.
66
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Conditions
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Value
Unit Remarks
Min
Max
THCLK×1 - 3
-
0
0
0
0
10
20
10
20
0
10
ns
0
10
ns
20
38
-
ns
0
-
ns
THCLK×1 - 5
THCLK×1 - 10
THCLK×1 - 5
THCLK×1 - 10
THCLK×1 - 5
THCLK×1 - 15
THCLK×1 - 5
THCLK×1 - 15
0
0
0
0
5
10
5
10
THCLK×1 - 3
-
-5
-15
THCLK×1 - 5
THCLK×1 - 15
5
15
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DS706-00007-1v0-E
r2.1
MB9B100 Series
(Continued)
S RAM read
tCY C
H C LK
V OH
V OH
tO E H-CS H
tOE L- CSL
M C SX 0 t o 7
VO H
VO L
tOE L- AV
tO EH- AX
VO H
VO L
MAD 24 to 00
V OH
V OL
tO EW
MO E X
V OH
VO L
tDS- O E
V IH
M D ATA 15 to 0
tDH-O E
V IH
R ea d
V IL
V IL
S RA M w rite
t CY C
H C LK
t W E H-CS H
tCS L-W EL
MC S X 0 to 7
VO H
VO L
tAV-W EL
M AD 24 to 00
tW E H-A X
V OH
V OL
VO H
VO L
t W E H-DQ M H
tW EL- DQ M L
M D QM 0 to 1
VO H
V OL
t W EW
MW EX
V OL
V OH
tW EH- DX
t W EL -DV
M D ATA 15 to 0
V OH
V OL
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
W rite
V OH
V OL
67
r2.1
MB9B100 Series
・ NAND FLASH mode
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Pin name
MNREX
MNREX
tNREW
Min pulse width
Data set up
MNREX
tDS - NRE
MDATA15 to 0
MNREX tiime
MNREX
MNREX
tDH - NRE
MDATA15 to 0
Data hold time
MNALE
MNALE
t
MNWEX
MNWEX delay time ALEH - NWEL
MNALE
MNWEX
tNWEH - ALEL
MNWEX
MNALE delay time
MNCLE
MNCLE
t
MNWEX
MNWEX delay time CLEH - NWEL
MNCLE
MNWEX
tNWEH - CLEL
MNWEX
MNCLE delay time
MNWEX
MNWEX
tNWEW
Min pulse width
MNWEX
MNWEX
tNWEL - DV
MDATA15 to 0
Data delay time
MNWEX
MNWEX
tNWEH - DX
MDATA15 to 0
Data delay time
Note: when the external load capacitance = 50pF.
68
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Conditions
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Value
Min
Max
THCLK×1 - 3
-
20
38
0
0
THCLK×1 - 5
THCLK×1 - 15
THCLK×1 - 5
THCLK×1 - 15
THCLK×1 - 5
THCLK×1 - 15
THCLK×1 - 5
THCLK×1 - 15
-
THCLK×1 - 3
-
-5
-15
THCLK×1 - 5
THCLK×1 - 15
+5
+15
-
Unit Remarks
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DS706-00007-1v0-E
r2.1
MB9B100 Series
(Continued)
N AN D F LAS H read
tCY C
H C LK
V OH
V OH
t NREW
MN R EX
V OH
VO L
tDS- NRE
V IH
MD ATA15 to 0
tDH-NR E
V IH
Rea d
V IL
V IL
N AN D F LAS H wr ite
t CYC
H C LK
t NW EH - AL EL
t A LE H-NW EL
V OH
V OL
MN A LE
t NW EH- CLEL
t CLE H -NW E L
V OH
V OL
M N C LE
t NW EW
MN W E X
V OH
V OL
t NW E H-DX
t NW EL -D V
MD ATA 15 to 0
V OH
V OL
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
W rite
V OH
V OL
69
r2.1
MB9B100 Series
(8) Base Timer Input Timing
・ Timer input timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Input pulse width
Symbol
Pin name
Conditions
tTIWH
tTIWL
TIOAn/TIOBn
(when using as
ECK,TIN)
-
Min
Max
2tCYCP
-
Unit Remarks
ns
tTIWL
tTIWH
ECK
Value
VIHS
VIHS
VILS
TIN
VILS
・ Trigger input timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Input pulse width
Symbol
Pin name
Conditions
tTRGH
tTRGL
TIOAn/TIOBn
(when using as
TGIN)
-
VIHS
Min
Max
2tCYCP
-
Unit Remarks
ns
tTRGL
tTRGH
TGIN
Value
VIHS
VILS
70
FUJITSU SEMICONDUCTOR CONFIDENTIAL
VILS
DS706-00007-1v0-E
r2.1
MB9B100 Series
(9) UART Timing
・ Synchronous serial (SPI = 0, SCINV = 0)
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Serial clock cycle time
SCK SOT delay time
SIN SCK setup time
SCK SIN hold time
Symbol
Pin
Conditions
name
tSCYC
SCKx
SCKx
tSLOVI
SOTx Internal shift
clock
SCKx
tIVSHI
operation
SINx
SCKx
tSHIXI
SINx
Serial clock "L" pulse width
tSLSH
SCKx
Serial clock "H" pulse width
tSHSL
SCKx
Vcc 4.5V
Min
Max
tSLOVE
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Unit
4tcycp
-
4tcycp
-
ns
-30
+30
- 20
+ 20
ns
50
-
30
-
ns
0
-
0
-
ns
-
ns
-
ns
-
30
ns
10
-
ns
20
-
ns
-
5
5
ns
ns
2tcycp 10
tcycp +
10
-
SCKx
50
External shift
SOTx
clock
SCKx
operation
tIVSHE
10
SIN SCK setup time
SINx
SCKx
tSHIXE
20
SCK SIN hold time
SINx
SCK fall time
tF
SCKx
5
SCK rise time
tR
SCKx
5
Notes: ・The above characteristics apply to CLK synchronous mode.
・tCYCP indicates the peripheral clock cycle time.
・These characteristics only guarantee the same relocate port number.
For example, the combination of SCLKx_0 and SOTx_1 is not guaranteed.
・When the external load capacitance = 50pF.
SCK SOT delay time
Vcc 4.5V
Min
Max
2tcycp 10
tcycp +
10
71
r2.1
MB9B100 Series
t SCY C
VO H
S CK
VOL
t SL OV I
V OH
SOT
V OL
tIV SH I
tSH IXI
VI H
V IH
VI L
V IL
S IN
M S b it = 0
tS LSH
tSH SL
V IH
V IH
SCK
VIL
VI L
t R
t F
t SLOVE
V OH
SOT
V OL
tIV SH E
tSH IXE
VI H
V IH
VI L
V IL
S IN
M S b it = 1
72
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
・ Synchronous serial(SPI = 0, SCINV = 1)
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Serial clock cycle time
SCK SOT delay time
SIN SCK setup time
SCK SIN hold time
Symbol
Pin
Conditions
name
tSCYC
SCKx
SCKx
tSHOVI
SOTx Internal shift
clock
SCKx
tIVSLI
operation
SINx
SCKx
tSLIXI
SINx
Serial clock "L" pulse width
tSLSH
SCKx
Serial clock "H" pulse width
tSHSL
SCKx
Vcc 4.5V
Min
Max
tSHOVE
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Unit
4tcycp
-
4tcycp
-
ns
-30
+30
- 20
+ 20
ns
50
-
30
-
ns
0
-
0
-
ns
-
ns
-
ns
-
30
ns
10
-
ns
20
-
ns
-
5
5
ns
ns
2tcycp
- 10
tcycp +
10
-
SCKx
50
External shift
SOTx
clock
SCKx
operation
tIVSLE
10
SIN SCK setup time
SINx
SCKx
tSLIXE
20
SCK SIN hold time
SINx
SCK fall time
tF
SCKx
5
SCK rise time
tR
SCKx
5
Notes: ・The above characteristics apply to CLK synchronous mode.
・tCYCP indicates the peripheral clock cycle time.
・These characteristics only guarantee the same relocate port number.
For example, the combination of SCLKx_0 and SOTx_1 is not guaranteed.
・When the external load capacitance = 50pF.
SCK SOT delay time
Vcc 4.5V
Min
Max
2tcycp 10
tcycp +
10
73
r2.1
MB9B100 Series
tSC YC
VO H
S C K
VOL
t SHO VI
VOH
S O T
VOL
t IVS LI
tS LIX I
VIH
VIH
VIL
VIL
S IN
M S b it = 0
tS HSL
tSL SH
VIH
S C K
VI H
V IL
V IL
VI L
tF
tR
tSH OV E
V OH
S O T
tIV SL E
t SLI XE
S IN
M S b it= 1
74
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
・ Synchronous serial(SPI = 1, SCINV = 0)
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Serial clock cycle time
SCK SOT delay time
SIN SCK setup time
SCK SIN hold time
SOT SCK delay time
Symbol
Pin
Conditions
name
tSCYC
SCKx
SCKx
tSHOVI
SOTx
SCKx Internal shift
tIVSLI
clock
SINx
operation
SCKx
tSLIXI
SINx
SCKx
tSOVLI
SOTx
Serial clock "L" pulse width
tSLSH
SCKx
Serial clock "H" pulse width
tSHSL
SCKx
Vcc 4.5V
Min
Max
tSHOVE
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Unit
4tcycp
-
4tcycp
-
ns
-30
+30
- 20
+ 20
ns
50
-
30
-
ns
0
-
0
-
ns
-
ns
-
ns
-
ns
-
30
ns
10
-
ns
20
-
ns
-
5
5
ns
ns
2tcycp
- 30
2tcycp
- 10
tcycp +
10
-
SCKx
50
External shift
SOTx
clock
SCKx
operation
tIVSLE
10
SIN SCK setup time
SINx
SCKx
tSLIXE
20
SCK SIN hold time
SINx
SCK fall time
tF
SCKx
5
SCK rise time
tR
SCKx
5
Notes: ・The above characteristics apply to CLK synchronous mode.
・tCYCP indicates the peripheral clock cycle time.
・These characteristics only guarantees the same relocate port number.
For example, the combination of SCLKx_0 and SOTx_1 is not guaranteed.
・When the external load capacitance = 50pF.
SCK SOT delay time
Vcc 4.5V
Min
Max
2tcycp 30
2tcycp 10
tcycp +
10
75
r2.1
MB9B100 Series
tSCYC
VOH
SCK
VOL
VOL
tSHOVI
tSOVLI
SOT
VOH
VOH
VOL
VOL
tIVSLI
SIN
tSLIXI
VIH
VIH
VIL
VIL
MS bit=0
tSLSH
tSHSL
VIH
VIH
SCK
VIL
VIL
ｔF
tR
*2
SOT
VIL
tSHOVE
VOH
V OH
VO L
VOL
tIVSLE
SIN
VIH
tSLIXE
VIH
VIH
VIL
VIL
*2 : Changes when writing to TDR register
MS bit=1
76
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
・ Synchronous serial(SPI = 1, SCINV = 1)
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Pin
Conditions
name
Vcc 4.5V
Min
Max
Vcc 4.5V
Min
Max
Unit
Serial clock cycle time
tSCYC
SCKx
4tcycp
-
4tcycp
-
ns
SCK SOT delay time
tSLOVI
SCKx
SOTx
-30
+30
- 20
+ 20
ns
50
-
30
-
ns
0
-
0
-
ns
-
ns
-
ns
-
ns
-
30
ns
10
-
ns
20
-
ns
-
5
5
ns
ns
SIN SCK setup time
SCK SIN hold time
SOT SCK delay time
SCKx Internal shift
clock
SINx
operation
SCKx
tSHIXI
SINx
SCKx
tSOVHI
SOTx
tIVSHI
Serial clock "L" pulse width
tSLSH
SCKx
Serial clock "H" pulse width
tSHSL
SCKx
2tcycp
- 30
2tcycp
- 10
tcycp +
10
-
SCKx
50
External shift
SOTx
clock
SCKx
operation
tIVSHE
10
SIN SCK setup time
SINx
SCKx
tSHIXE
20
SCK SIN hold time
SINx
SCK fall time
tF
SCKx
5
SCK rise time
tR
SCKx
5
Notes: ・The above characteristics apply to CLK synchronous mode.
・tCYCP indicates the peripheral clock cycle time.
・These characteristics only guarantee the same relocate port number.
For example, the combination of SCLKx_0 and SOTx_1 is not guaranteed.
・When the external load capacitance = 50pF.
SCK SOT delay time
tSLOVE
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
2tcycp 30
2tcycp 10
tcycp +
10
77
r2.1
MB9B100 Series
tSCYC
VOH
SCK
VOH
VOL
tSOV HI
I
t SLOVI
VOH
VOL
SOT
VOH
VOL
tSHIXI
tIVSHI
VIH
VIL
SIN
VIH
VIL
MS bit=0
tR
tS HSL
VIH
SCK
tF
tSLSH
VIH
VIL
I
t SLOVE
VOH
VOL
SOT
VOH
VOL
tI VSHE
tSHIXE
VIH
VIL
SIN
VIH
VIL
MS bit =1
・ External clock(EXT = 1) : asynchronous only
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Serial clock "L" pulse width
Serial clock "H" pulse width
SCK fall time
SCK rise time
Symbol Conditions
tSLSH
tSHSL
tF
tR
CL = 50pF
tR
SCK
VIL
tSHSL
VIH
78
FUJITSU SEMICONDUCTOR CONFIDENTIAL
Min
Max
tcycp + 10
tcycp + 10
-
5
5
ns
ns
ns
ns
tF
tSLSH
VIH
VIL
Unit Remarks
VIL
VIH
DS706-00007-1v0-E
r2.1
MB9B100 Series
(10) External input timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Pin name
Conditions
Value
Unit
Min
Max
ADTG
FRCKx
Input pulse width
tINH
tINL
-
2tCYCP *1
-
ns
-
2tCYCP *1
-
ns
ICxx
DTTIxX
2tCYCP + 100 *1 INT00 to INT15,
NMIX
500 *2
*1 : tCYCP indicates the peripheral clock cycle time except stop when in stop mode.
*2 : When in stop mode, in timer mode.
tINH
VILS
ns
ns
Remarks
A/D converter
trigger input
Free-run timer input
clock
Input capture
Wave form
generator
External interrupt
NMI
tINL
VILS
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
VIHS
VIHS
79
r2.1
MB9B100 Series
(11) Quadrature Position/Revolution Counter timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
Value
Conditions
Min
AIN pin "H" width
tAHL
AIN pin "L" width
tALL
BIN pin "H" width
tBHL
BIN pin "L" width
tBLL
BIN rise time from
PC_Mode2 or
tAUBU
AIN pin "H" level
PC_Mode3
AIN fall time from
PC_Mode2 or
tBUAD
BIN pin "H" level
PC_Mode3
BIN fall time from
PC_Mode2 or
tADBD
AIN pin "L" level
PC_Mode3
AIN rise time from
PC_Mode2 or
tBDAU
BIN pin "L" level
PC_Mode3
AIN rise time from
PC_Mode2 or
2tCYCP *
tBUAU
BIN pin "H" level
PC_Mode3
BIN fall time from
PC_Mode2 or
tAUBD
AIN pin "H" level
PC_Mode3
AIN fall time from
PC_Mode2 or
tBDAD
BIN pin "L" level
PC_Mode3
BIN rise time from
PC_Mode2 or
tADBU
AIN pin "L" level
PC_Mode3
ZIN pin "H" width
tZHL
QCR:CGSC="0"
ZIN pin "L" width
tZLL
QCR:CGSC="0"
AIN/BIN rise and fall time
tZABE
QCR:CGSC="1"
from determined ZIN level
Determined ZIN level from
tABEZ
QCR:CGSC="1"
AIN/BIN rise and fall time
* : tCYCP indicates the peripheral clock cycle time except stop when in stop mode.
Max
-
Unit
ns
tALL
tAHL
AIN
tAUBU
tBUAD
tADBD
tBDAU
BIN
tBHL
tBLL
80
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
tBLL
tBHL
BIN
tBUAU
tAUBD
tBDAD
tADBU
AIN
tAHL
tALL
tZHL
ZIN
tZLL
ZIN
tABEZ
tZABE
AIN/BIN
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
81
r2.1
MB9B100 Series
(12) I2C timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol
SCL clock frequency
(Repeated) START condition
hold time
SDA SCL
SCLclock "L" width
SCLclock "H" width
(Repeated) START setup time
SCL SDA
Data hold time
SCL SDA
Data setup time
SDA SCL
STOP condition setup time
SCL SDA
Bus free time between
"STOP condition" and
"START condition"
fSCL
0
100
0
400
kHz
tHDSTA
4.0
-
0.6
-
μs
tLOW
tHIGH
4.7
4.0
-
1.3
0.6
-
μs
μs
4.7
-
0.6
-
μs
0
3.45
(*2)
0
0.9
(*3)
μs
tSUDAT
250
-
100
-
ns
tSUSTO
4.0
-
0.6
-
μs
tBUF
4.7
-
1.3
-
μs
tSUSTA
tHDDAT
Conditions
Typical High-speed
mode
mode
Unit Remarks
Min Max Min Max
CL = 50pF,
R = (Vp/IOL)
(*1)
2 tCYCP
2 tCYCP
ns
(*4)
(*4)
*1 : R and C represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively. Vp
indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current.
*2 : The maximum tHDDAT must satisfy that it doesn't extend at least "L" period (tLOW) of device's SCL
signal.
*3 : A high-speed mode I2C bus device can be used on a standard mode I2C bus system as long as the device
satisfies the requirement of "tSUDAT ≥ 250 ns".
*4 : tCYCP is the peripheral clock cycle time. To use I2C, set the peripheral bus clock at 8 MHz or more.
Noise filter
tSP
-
SDA
tSUDAT
tSUSTA
tBUF
tLOW
SCL
tHDSTA
tHDDAT
tHIGH
82
FUJITSU SEMICONDUCTOR CONFIDENTIAL
tHDSTA
tSP
tSUSTO
DS706-00007-1v0-E
r2.1
MB9B100 Series
(13) ETM timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Value
Unit
Min Max
Symbol
Pin name
Conditions
tETMH
TRACECLK
TRACED3 - 0
Vcc 4.5V
2
9
Vcc 4.5V
2
15
Data hold
Remarks
ns
Note: When the external load capacitance = 50pF.
tC YC
HC LK
VOH
tE T M H
T R A C E D 3 -0
V OH
VOL
TRA C E CLK
tE T M H
VOH
VOH
VOL
VOL
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
83
r2.1
MB9B100 Series
(14) JTAG timing
(Vcc = 2.7V to 5.5V, Vss = 0V Ta = - 40C to + 85C)
Parameter
Symbol Pin name
TCK
TMS,TDI
TCK
TMS,TDI hold time
tJTAGH
TMS,TDI
TCK
TDO delay time
tJTAGD
TDO
Note: When the external load capacitance = 50pF.
TMS,TDI setup
time
TCK
tJTAGS
Value
Min
Max
Conditions
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Vcc 4.5V
Unit
15
-
ns
15
-
ns
-
25
45
ns
Remarks
VOH
VOL
t JTA G S
T M S /TM I
t JTA G H
VO H
VO H
VO L
VOL
tJ T A G D
TDO
VOH
VOL
84
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
12bit A/D Converter
This chapter shows the electrical characteristics for the A/D converter.
1. Electrical characteristics for the A/D converter.
(Vcc = AVcc = 2.7V to 5.5V, Vss = AVss = 0V Ta = - 40C to + 85C)
Parameter
Resolution
Linearity error
Differential linearity
error
Zero transition voltage
Full transition voltage
Conversion time
Sampling time
Compare clock cycle *3
State transition time to
operation permission
Power supply current
(analog + digital)
Reference power supply
current
(between AVRH to
AVSS)
Pin
name
Min
-
- 4.5
-
12
+ 4.5
bit
LSB
-
-2.5
-
+ 2.5
LSB
- 20
-
+ 20
mV
- 20
-
+ 20
mV
1.0 (*1)
*2
*2
55.5
166.7
-
-
μs
-
10000
ns
Tstt
2.5
-
-
μs
AVCC
-
2.3
0.1
3.6
2
-
2.2
3.0
-
0.03
0.6
μA When XSTB is 0 (3unit)
14.5
pF
AN0
to AN15
AN0
to AN15
Ts
Tcck
Value
Typ
Max
AVRH
Analog input capacity
Cin
-
-
Analog input resistance
Rin
-
-
Interchannel disparity
Analog port input
current
0.93
2.04
4
Unit
ns
Remarks
AVRH = 2.7V to 5.5V
AVcc 4.5V
AVcc 4.5V
AVcc < 4.5V
AVcc 4.5V
AVcc < 4.5V
mA A/D 1unit operation
μA When XSTB is 0 (3unit)
A/D 1unit operation
mA
AVRH=5.5V
kΩ
AVcc 4.5V
AVcc < 4.5V
LSB
AN0
5
μA
to AN15
AN0
Analog input voltage
AVSS
AVRH
V
to AN15
Reference voltage
AVRH
AVSS
AVCC
V
*1: Conversion time is the value of sampling time(Ts) + compare time(Tc).
The condition of the minimum conversion time is when HCLK=72MHz, the value of sampling time: 0.222μs,
the value of sampling time: 778ns (AVcc 4.5V)
Ensure that it satisfies the value of sampling time(Ts) and compare clock cycle (Tcck).
For setting of sampling time and compare clock cycle, see chapter "12-bit A/D Converter" in "Peripheral
Manual".
*2: A necessary sampling time changes by external impedance.
Ensure that it set the sampling time to satisfy (Equation 1)
*3: Compare time (Tc) is the value of (Equation 2)
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
85
r2.1
MB9B100 Series
(Continued)
Analog signal
source
Rext
AN0 to AN15
Analog input pin
comparator
Rin
Cin
(Equation 1) Ts ( Rin + Rext ) × Cin × 9
Ts : Sampling time
Rin : input resistance of A/D = 0.93kΩ 4.5 AVCC 5.5
input resistance of A/D = 2.04kΩ 2.7 AVCC < 4.5
Cin : input capacity of A/D = 14.5pF 2.7 AVCC 5.5
Rext : Output impedance of external circuit
(Equation 2) Tc = Tcck × 14
Tc : Compare time
Tcck : Comrare clock cycle
86
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
・Definition of 12-bit A/D Converter Terms
・ Resolution
・ Linearity error
: Analog variation that is recognized by an A/D converter.
: Deviation of the line between the zero-transition point
(0b0000000000000b000000000001) and the full-scale transition point
(0b1111111111100b111111111111) from the actual conversion
characteristics.
・ Differential linearity error : Deviation from the ideal value of the input voltage that is required to change
the output code by 1 LSB.
Linearity error
0xFFF
Actual conversion
characteristics
0xFFE
Actual conversion
characteristics
0x(N+1)
{1 LSB(N-1) + VOT}
VFST
VNT
0x004
(Actuallymeasured
value)
(Actually-measured
value)
0x003
Digital output
Digital output
0xFFD
Differential linearity error
Actual conversion
characteristics
Ideal characteristics
0x002
0x001
0xN
Ideal characteristics
VNT
Actual conversion characteristics
AVRH
AVss
AVRH
Analog input
Linearity error of digital output N =
Analog input
VNT - {1LSB × (N - 1) + VOT}
1LSB
Differential linearity error of digital output N =
:
:
:
:
V(N + 1) T - VNT
1LSB
[LSB]
- 1 [LSB]
VFST - VOT
4094
1LSB =
N
VOT
VFST
VNT
(Actually-measured
value)
(Actually-measured
value)
0x(N-2)
VOT (Actually-measured value)
AVss
V(N+1)T
0x(N-1)
A/D converter digital output value.
Voltage at which the digital output changes from 0x000 to 0x001.
Voltage at which the digital output changes from 0xFFE to 0xFFF.
Voltage at which the digital output changes from 0x(N − 1) to 0xN.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
87
r2.1
MB9B100 Series
Low voltage detection characteristics
1. Low voltage detection reset
(Ta = - 40C to + 85C)
Parameter
Detected voltage
Released voltage
Symbol Conditions
VDL
VDH
-
Min
Value
Typ Max
2.20
2.30
2.40
2.50
Unit
2.60
2.70
V
V
Remarks
When voltage drops
When voltage rises
2. Interrupt of low voltage detection
(Ta = - 40C to + 85C)
Parameter
Symbol Conditions
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
VDL
VDH
VDL
VDH
VDL
VDH
VDL
VDH
VDL
VDH
VDL
VDH
VDL
VDH
VDL
VDH
LVD stabilization
wait time
TLVDW
SVHI = 0000
SVHI = 0001
SVHI = 0010
SVHI = 0011
SVHI = 0100
SVHI = 0111
SVHI = 1000
SVHI = 1001
Min
Value
Typ Max
Unit
2.58
2.67
2.76
2.85
2.94
3.04
3.31
3.40
3.40
3.50
3.68
3.77
3.77
3.86
3.86
3.96
2.8
2.9
3.0
3.1
3.2
3.3
3.6
3.7
3.7
3.8
4.0
4.1
4.1
4.2
4.2
4.3
3.02
3.13
3.24
3.34
3.45
3.56
3.88
3.99
3.99
4.10
4.32
4.42
4.42
4.53
4.53
4.64
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
-
-
2040 ×
tcycp *
μs
-
Remarks
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
* : tCYCP indicates the peripheral clock cycle time.
Voltage
Vcc
VDH
VDL
dV
dt
Time
88
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
Flash Memory Write/Erase Characteristics
(Vcc = 2.7V to 5.5V, Ta = - 40C to + 85C)
Parameter
Sector erase
time
Large Sector
Small Sector
Min
-
Value
Typ
Max
0.6
3.1
0.3
1.6
Value
s
Half word (16 bit)
write time
-
25
400
μs
Chip erase time
-
7.2
37.6
s
Remarks
Excludes write time prior to internal
erase
Not including system-level overhead
time.
Excludes write time prior to internal
erase
Erase/write cycles and data hold time
Erase/write cycles
(cycle)
Data hold time
(year)
1,000
20 *
Remarks
10,000
10 *
100,000
5*
*: This value comes from the technology qualification (using Arrhenius equation to translate high temperature
measurements into normalized value at + 85C) .
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
89
r2.1
MB9B100 Series
EXAMPLE OF CHARACTERISTIC
Power supply current (PLL run mode, PLL sleep mode)
Iccs sleep operation(PLL) temperature characteristics
Vcc:5.5V, Peripheral:40MHｚ
Icc normal operation(PLL) temperature characteristics
Vcc:5.5V, CPU:80MHｚ, Peripheral:40MHｚ,FLASH 2Wait
60
120
100
Power supply current [mA]
Power supply current [mA]
110
90
80
70
60
50
40
30
20
50
40
30
20
10
10
0
-40 -30 -20 -10
0
0
10
20
30
40
50
60
70
-40 -30 -20 -10
80
0
10
20
30
40
50
60
70
80
Temperature Ta[℃]
Temperature Ta[℃]
Power supply current (Sub run mode)
Icc normal operation(sub oscillation) temperature
characteristics(semi-log) Vcc:5.5V, CPU/Peripheral:32KHz
Icc normal operation(sub oscillation) temperature
characteristics Vcc:5.5V, CPU/Peripheral:32KHz
1000
500
Power supply current [μA] (log)
Power supply current [μA]
450
400
350
300
250
200
150
100
100
10
50
1
0
-40 -30 -20 -10
0
10
20
30
40
Temperature Ta[℃]
50
60
70
-40 -30 -20 -10
80
0
10
20
30
40
50
60
70
80
70
80
Temperature Ta[℃]
Power supply current (Sub sleep mode)
Iccs sleep operation(sub oscillation) temperature
characteristics(semi-log) Vcc:5.5V, Peripheral:32KHz
Iccs sleep operation(sub oscillation) temperature
characteristics Vcc:5.5V, Peripheral:32KHz
1000
500
Power supply current [μA] (log)
Power supply current [μA]
450
400
350
300
250
200
150
100
100
10
50
1
0
-40 -30 -20 -10
0
10
20
30
40
Temperature Ta[℃]
50
60
70
80
90
FUJITSU SEMICONDUCTOR CONFIDENTIAL
-40 -30 -20 -10
0
10
20
30
40
50
60
Temperature Ta[℃]
DS706-00007-1v0-E
r2.1
MB9B100 Series
Power supply current (Sub timer mode)
ICCT timer mode(sub oscillation) temperature
characteristics(semi-log) Vcc:5.5V, LVD is Off
ICCT timer mode(sub oscillation) temperature characteristics
Vcc:5.5V, LVD is Off
1000
500
Power supply current [μA] (log)
Power supply current [μA]
450
400
350
300
250
200
150
100
100
10
50
1
0
-40 -30 -20 -10
0
10
20
30
40
Temperature Ta[℃]
50
60
70
-40 -30 -20 -10
80
0
10
20
30
40
50
60
70
80
70
80
Temperature Ta[℃]
Power supply current (Stop mode)
ICCH stop mode (sub oscillation) temperature
characteristics(semi-log) Vcc:5.5V, LVD is Off
ICCH stop mode (sub oscillation) temperature characteristics
Vcc:5.5V, LVD is Off
1000
500
Power supply current [μA] (log)
Power supply current [μA]
450
400
350
300
250
200
150
100
100
10
50
1
0
-40 -30 -20 -10
0
10
20
30
40
Temperature Ta[℃]
50
60
70
80
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
-40 -30 -20 -10
0
10
20
30
40
50
60
Temperature Ta[℃]
91
r2.1
MB9B100 Series
ORDERING INFORMATION
Part number
Package
MB9BF104NPMC
Plastic・LQFP(0.5mm pitch),100-pin
(FPT-100P-M20*/M23)
MB9BF105NPMC
Plastic・LQFP(0.5mm pitch),100-pin
(FPT-100P-M20*/M23)
MB9BF106NPMC
Plastic・LQFP(0.5mm pitch),100-pin
(FPT-100P-M20*/M23)
MB9BF104RPMC
Plastic・LQFP(0.5mm pitch),120-pin
(FPT-120P-M21)
MB9BF105RPMC
Plastic・LQFP(0.5mm pitch),120-pin
(FPT-120P-M21)
MB9BF106RPMC
Plastic・LQFP(0.5mm pitch),120-pin
(FPT-120P-M21)
MB9BF104NBGL
Plastic・PFBGA(0.8mm pitch),112-pin
(BGA-112P-M04)
MB9BF105NBGL
Plastic・PFBGA(0.8mm pitch),112-pin
(BGA-112P-M04)
MB9BF106NBGL
Plastic・PFBGA(0.8mm pitch),112-pin
(BGA-112P-M04)
* : ES product only
92
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.1
MB9B100 Series
PACKAGE DIMENSIONS
100-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
14.0 mm × 14.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm Max
Weight
0.65 g
Code
(Reference)
P-LFQFP100-14×14-0.50
(FPT-100P-M20)
100-pin plastic LQFP
(FPT-100P-M20)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
16.00±0.20(.630±.008)SQ
*14.00±0.10(.551±.004)SQ
75
51
76
50
0.08(.003)
Details of "A" part
+0.20
26
100
"A"
1
25
0.50(.020)
C
+.008
1.50 –0.10 .059 –.004
(Mounting height)
INDEX
0.20 ±0.05
(.008 ±.002)
0.08(.003) M
0.145±0.055
(.006 ±.002)
2005 -2010 FUJITSU SEMICONDUCTOR LIMITED F100031S-c-3-5
0°~8°
0.50 ±0.20
(.020 ±.008)
0.60 ±0.15
(.024 ±.006)
0.10 ±0.10
(.004 ±.004)
(Stand off)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
93
r2.0
MB9B100 Series
(Continued)
100-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
14.00 mm × 14.00 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.65 g
(FPT-100P-M23)
100-pin plastic LQFP
(FPT-100P-M23)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
16.00±0.20(.630±.008)SQ
*14.00±0.10(.551±.004)SQ
75
51
76
50
0.08(.003)
Details of "A" part
1.50 +0.20
- 0.10
(.059+.008
-.004)
(Mounting height)
INDEX
100
26
"A"
1
C
0.60±0.15
(.024±.006)
25
0.50(.020)
0.22±0.05
(.009±.002)
0.08(.003) M
0°~8°
0.50±0.20
(.020±.008)
0.10±0.10
(.004±.004)
(Stand off)
0.25(.010)
0.145±0.055
(.006±.002)
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
94
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
(Continued)
120-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
16.0 × 16.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.88 g
Code
(Reference)
P-LFQFP120-16×16-0.50
(FPT-120P-M21)
120-pin plastic LQFP
(FPT-120P-M21)
Note 1) * : These dimensions do not include resin protrusion.
Resin protrusion is +0.25(.010) MAX(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
18.00±0.20(.709±.008)SQ
* 16.00
+0.40
–0.10
.630
+.016
–.004
SQ
90
61
91
60
0.08(.003)
Details of "A" part
1.50
.059
+0.20
–0.10
+.008
–.004
(Mounting height)
INDEX
0~8°
120
LEAD No.
31
1
30
0.50(.020)
C
"A"
0.22±0.05
(.009±.002)
0.08(.003) M
0.145
.006
2002-2010 FUJITSU SEMICONDUCTOR LIMITED F120033S-c-4-7
+0.05
–0.03
+.002
–.001
0.60±0.15
(.024±.006)
0.10±0.05
(.004±.002)
(Stand off)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
95
r2.0
MB9B100 Series
(Continued)
112-ball plastic PFBGA
Ball pitch
0.80 mm
Package width ×
package length
10.00 × 10.00 mm
Lead shape
Soldering ball
Sealing method
Plastic mold
Ball size
Ф 0.45 mm
Mounting height
1.45 mm Max.
Weight
0.22 g
(BGA-112P-M04)
112-ball plastic PFBGA
(BGA-112P-M04)
10.00±0.10(.394±.004)
0.20(.008) S B
0.80(.031)
REF
B
11
10
9
8
7
6
5
4
3
2
0.80(.031)
REF
A
10.00±0.10
(.394±.004)
1
L K J H G F
(INDEX AREA)
0.35±0.10
(.014±.004)
(Stand off)
0.20(.008) S A
1.25±0.20
(.049±.008)
(Seated height)
ED C B A
INDEX
112-Ф0.45±010
(112-Ф0.18±.004)
Ф0.08(.003)M S A B
S
0.10(.004) S
C
2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
96
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
MAJOR CHANGES IN THIS EDITION
Page
Section
Change Results
-
All
Added package : LQFP100(FPT-100P-M23).
64
ELECTRICAL
CHARACTERISTICS
AC Characteristics
(3) Built-in CR Oscillation
Characteristics
Changed the value of "・Built-in high-speed CR".
(TBD Fixed value)
85
12bit A/D Converter
Changed the value and remarks of Tcck, AVCC, AVRH.
90, 91
EXAMPLE OF
CHARACTERISTIC
Added a new section.
92
ORDERING INFORMATION
Added a new section.
In the previous revision, the number at the upper-right of the page is DS706-00007-0v01-E.
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
97
r2.1
MB9B100 Series
98
FUJITSU SEMICONDUCTOR CONFIDENTIAL
DS706-00007-1v0-E
r2.0
MB9B100 Series
DS706-00007-1v0-E
FUJITSU SEMICONDUCTOR CONFIDENTIAL
99
r2.0
FUJITSU SEMICONDUCTOR LIMITED
Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome,
Kohoku-ku Yokohama Kanagawa 222-0033, Japan
Tel: +81-45-415-5858
http://jp.fujitsu.com/fsl/en/
For further information please contact:
North and South America
FUJITSU SEMICONDUCTOR AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://us.fujitsu.com/micro/
Asia Pacific
FUJITSU SEMICONDUCTOR ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fujitsu.com/sg/services/micro/semiconductor/
Europe
FUJITSU SEMICONDUCTOR EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/semiconductor/
FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-3688 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fss/
Korea
FUJITSU SEMICONDUCTOR KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fsp/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does
not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any
third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right
by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or
other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect
to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in
nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in
weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations
of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department