MOTOROLA MC145170DT1 Pll frequency synthesizer with serial interface cmo Datasheet

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by MC145170–1/D
SEMICONDUCTOR TECHNICAL DATA
Advance Information
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P SUFFIX
PLASTIC DIP
CASE 648
16
CMOS
1
The new MC145170–1 is pin–for–pin compatible with the MC145170. A
comparison of the two parts is shown in the table below. The MC145170–1 is
recommended for new designs.
The MC145170–1 is a single–chip synthesizer capable of direct usage in the
MF, HF, and VHF bands. A special architecture makes this PLL the easiest to
program in the industry. Either a bit– or byte–oriented format may be used. Due
to the patented BitGrabber registers, no address/steering bits are required for
random access of the three registers. Thus, tuning can be accomplished via a
2–byte serial transfer to the 16–bit N register.
The device features fully programmable R and N counters, an amplifier at the
fin pin, on–chip support of an external crystal, a programmable reference
output, and both single– and double–ended phase detectors with linear transfer
functions (no dead zones). A configuration (C) register allows the part to be
configured to meet various applications. A patented feature allows the C
register to shut off unused outputs, thereby minimizing noise and interference.
In order to reduce lock times and prevent erroneous data from being loaded
into the counters, a patented jam–load feature is included. Whenever a new
divide ratio is loaded into the N register, both the N and R counters are
jam–loaded with their respective values and begin counting down together. The
phase detectors are also initialized during the jam load.
• Operating Voltage Range: 2.5 to 5.5 V
• Maximum Operating Frequency:
185 MHz @ Vin = 500 mV p–p, 4.5 V Minimum Supply
100 MHz @ Vin = 500 mV p–p, 3.0 V Minimum Supply
• Operating Supply Current: 0.6 mA @ 3 V, 30 MHz
1.5 mA @ 3 V, 100 MHz
3.0 mA @ 5 V, 50 MHz
5.8 mA @ 5 V, 185 MHz
• Operating Temperature Range: – 40 to 85°C
• R Counter Division Range: 1 and 5 to 32,767
• N Counter Division Range: 40 to 65,535
• Direct Interface to Motorola SPI and National MICROWIRE Serial Data
Ports
• Chip Complexity: 4800 FETs or 1200 Equivalent Gates
• See Application Note AN1207/D
D SUFFIX
SOG PACKAGE
CASE 751B
16
1
DT SUFFIX
TSSOP
CASE 948C
16
1
ORDERING INFORMATION
MC145170P1 Plastic DIP
MC145170D1 SOG Package
MC145170DT1 TSSOP
PIN ASSIGNMENT
OSCin
1
16
VDD
OSCout
REFout
2
15
φV
3
14
φR
fin
4
13
PDout
Din
5
12
VSS
ENB
6
11
LD
CLK
7
10
fV
Dout
8
9
fR
COMPARISION OF THE PLL FREQUENCY SYNTHESIZERS
Parameter
MC145170–1
MC145170
1.2 µm CMOS
1.5 µm CMOS
Maximum Frequency with 5 V ± 10% Supply, fin
185 MHz
160 MHz
Maximum Frequency with 5 V ± 10% Supply, OSCin
25 MHz
20 MHz
Maximum Supply Voltage
5.5 V
6.0 V
Maximum Input Capacitance, fin
7 pF
5 pF
Technology
This document contains information on a new product. Specifications and information herein are subject to change without notice.
BitGrabber is a trademark of Motorola Inc. MICROWIRE is a trademark of National Semiconductor Corp.
REV 1
3/96

Motorola, Inc. 1996
MOTOROLA
MC145170–1
1
BLOCK DIAGRAM
1
OSCin
OSCout
9
fR CONTROL
15–STAGE R COUNTER
OSC
2
fR
15
4–STAGE
REFERENCE
DIVIDER
3
REFout
3
BitGrabber R REGISTER
15 BITS
11
LOCK DETECTOR
AND CONTROL
LD
7
CLK
SHIFT
REGISTER
AND
CONTROL
LOGIC
5
Din
8
Dout
16
BitGrabber C REGISTER
8 BITS
PHASE/FREQUENCY
DETECTOR A AND CONTROL
13
PDout
POR
ENB
PHASE/FREQUENCY
DETECTOR B AND CONTROL
6
14
15
BitGrabber N REGISTER
16 BITS
16
fin 4
INPUT
AMP
10
fV CONTROL
16–STAGE N COUNTER
φR
φV
fV
PIN 16 = VDD
PIN 12 = VSS
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Parameter
Symbol
VDD
Unit
– 0.5 to + 5.5
V
Vin
DC Input Voltage
– 0.5 to VDD + 0.5
V
Vout
DC Output Voltage
– 0.5 to VDD + 0.5
V
DC Input Current, per Pin
± 10
mA
Iout
DC Output Current, per Pin
± 20
mA
IDD
DC Supply Current, VDD and VSS Pins
± 30
mA
PD
Power Dissipation, per Package
Tstg
Storage Temperature
Iin
TL
DC Supply Voltage
Value
Lead Temperature, 1 mm from Case
for 10 seconds
300
mW
– 65 to + 150
°C
260
°C
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of
any voltage higher than maximum rated voltages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either VSS
or VDD). Unused outputs must be left open.
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
tables or Pin Descriptions section.
MC145170–1
2
MOTOROLA
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS, TA = – 40 to + 85°C)
Symbol
VDD
Parameter
Test Condition
Power Supply Voltage Range
VDD
V
Guaranteed
Limit
Unit
—
2.5 to 5.5
V
VIL
Maximum Low–Level Input Voltage*
(Din, CLK, ENB, fin)
dc Coupling to fin
2.5
4.5
5.5
0.50
1.35
1.65
V
VIH
Minimum High–Level Input Voltage*
(Din, CLK, ENB, fin)
dc Coupling to fin
2.5
4.5
5.5
2.00
3.15
3.85
V
2.5
5.5
0.15
0.20
V
VHys
Minimum Hysteresis Voltage (CLK, ENB)
VOL
Maximum Low–Level Output Voltage
(Any Output)
Iout = 20 µA
2.5
5.5
0.1
0.1
V
VOH
Minimum High–Level Output Voltage
(Any Output)
Iout = – 20 µA
2.5
5.5
2.4
5.4
V
IOL
Minimum Low–Level Output Current
(PDout, REFout, fR, fV, LD, φR, φV)
Vout = 0.3 V
Vout = 0.4 V
Vout = 0.5 V
2.5
4.5
5.5
0.12
0.36
0.36
mA
IOH
Minimum High–Level Output Current
(PDout, REFout, fR, fV, LD, φR, φV)
Vout = 2.2 V
Vout = 4.1 V
Vout = 5.0 V
2.5
4.5
5.5
– 0.12
– 0.36
– 0.36
mA
IOL
Minimum Low–Level Output Current
(Dout)
Vout = 0.4 V
4.5
1.6
mA
IOH
Minimum High–Level Output Current
(Dout)
Vout = 4.1 V
4.5
– 1.6
mA
Iin
Maximum Input Leakage Current
(Din, CLK, ENB, OSCin)
Vin = VDD or VSS
5.5
± 1.0
µA
Iin
Maximum Input Current
(fin)
Vin = VDD or VSS
5.5
± 120
µA
Maximum Output Leakage Current (PDout)
Vin = VDD or VSS,
Output in High–Impedance State
5.5
± 100
nA
5.5
±5
µA
IOZ
(Dout)
IDD
Maximum Quiescent Supply Current
Vin = VDD or VSS; Outputs Open;
Excluding fin Amp Input Current Component
5.5
100
µA
Idd
Maximum Operating Supply Current
fin = 500 mV p–p;
OSCin = 1 MHz @ 1 V p–p;
LD, fR, fV, REFout = Inactive and No Connect;
OSCout, φV, φR, PDout = No Connect;
Din, ENB, CLK = VDD or VSS
—
**
mA
* When dc coupling to the OSCin pin is used, the pin must be driven rail–to–rail. In this case, OSCout should be floated.
** The nominal values at 3 V are 0.6 mA @ 30 MHz, and 1.5 mA @ 100 MHz. The nominal values at 5 V are 3.0 mA @ 50 MHz, and 5.8 mA
@ 185 MHz. These are not guaranteed limits.
MOTOROLA
MC145170–1
3
AC INTERFACE CHARACTERISTICS ( TA = – 40 to + 85°C, CL = 50 pF, Input tr = tf = 10 ns unless otherwise indicated)
Parameter
Symbol
fclk
Serial Data Clock Frequency (Note: Refer to Clock tw Below)
Figure
No.
VDD
V
Guaranteed
Limit
1
2.5
4.5
5.5
dc to 3.0
dc to 4.0
dc to 4.0
MHz
Unit
tPLH, tPHL
Maximum Propagation Delay, CLK to Dout
1, 5
2.5
4.5
5.5
150
85
85
ns
tPLZ, tPHZ
Maximum Disable Time, Dout Active to High Impedance
2, 6
2.5
4.5
5.5
300
200
200
ns
tPZL, tPZH
Access Time, Dout High Impedance to Active
2, 6
2.5
4.5
5.5
0 to 200
0 to 100
0 to 100
ns
tTLH, tTHL
Maximum Output Transition Time, Dout
CL = 50 pF
1, 5
2.5
4.5
5.5
150
50
50
ns
CL = 200 pF
1, 5
2.5
4.5
5.5
900
150
150
ns
Maximum Input Capacitance – Din, ENB, CLK
—
10
pF
Maximum Output Capacitance – Dout
—
10
pF
Figure
No.
VDD
V
Guaranteed
Limit
Unit
Minimum Setup and Hold Times, Din vs CLK
3
2.5
4.5
5.5
55
40
40
ns
Minimum Setup, Hold, and Recovery Times, ENB vs CLK
4
2.5
4.5
5.5
135
100
100
ns
Minimum Inactive–High Pulse Width, ENB
4
2.5
4.5
5.5
400
300
300
ns
Minimum Pulse Width, CLK
1
2.5
4.5
5.5
166
125
125
ns
Maximum Input Rise and Fall Times, CLK
1
2.5
4.5
5.5
100
100
100
µs
Cin
Cout
TIMING REQUIREMENTS ( TA = – 40 to + 85°C, Input tr = tf = 10 ns unless otherwise indicated)
Parameter
Symbol
tsu, th
tsu, th, trec
tw(H)
tw
tr, tf
MC145170–1
4
MOTOROLA
SWITCHING WAVEFORMS
tf
tr
VDD
90%
CLK 50%
10%
VSS
VSS
tw
tPZL
tw
1/fclk
tPLH
Dout
ENB
VDD
50%
Dout
tPLZ
HIGH
IMPEDANCE
50%
10%
tPHL
tPZH
90%
50%
10%
Dout
tTLH
VDD
tPHZ
VSS
90%
50%
HIGH
IMPEDANCE
tTHL
Figure 1.
Figure 2.
tw(H)
VDD
VALID
VDD
ENB
50%
50%
Din
VSS
tsu
th
VDD
50%
CLK
VSS
50%
FIRST
CLK
LAST
CLK
VSS
Figure 4.
TEST POINT
TEST POINT
7.5 kΩ
CL *
* Includes all probe and fixture capacitance.
Figure 5. Test Circuit
MOTOROLA
trec
VDD
CLK
Figure 3.
DEVICE
UNDER
TEST
VSS
th
tsu
DEVICE
UNDER
TEST
CL *
CONNECT TO VDD
WHEN TESTING tPLZ
AND tPZL. CONNECT TO
VSS WHEN TESTING
tPHZ AND tPZH.
* Includes all probe and fixture capacitance.
Figure 6. Test Circuit
MC145170–1
5
LOOP SPECIFICATIONS ( TA = – 40 to + 85°C)
Symbol
Guaranteed Range
Min
Max
Unit
Input Frequency, fin
Vin ≥ 500 mV p–p Sine Wave,
N Counter Set to Divide Ratio
Such that fV ≤ 2 MHz
7
2.5
3.0
4.5
5.5
5*
5*
25*
45*
TBD
100
185
185
MHz
f
Input Frequency, OSCin
Externally Driven with ac–Coupled
Signal
Vin ≥ 1 V p–p Sine Wave,
OSCout = No Connect,
R Counter Set to Divide Ratio
Such that fR ≤ 2 MHz
8
2.5
3.0
4.5
5.5
1*
1*
1*
1*
12
14
25
25
MHz
Crystal Frequency, OSCin and OSCout
C1 ≤ 30 pF
C2 ≤ 30 pF
Includes Stray Capacitance
9
2.5
3.0
4.5
5.5
2
2
2
2
12
12
15
15
MHz
fout
Output Frequency, REFout
CL = 30 pF
10, 12
2.5
4.5
5.5
dc
dc
dc
TBD
10
10
MHz
f
Operating Frequency of the
Phase Detectors
2.5
4.5
5.5
dc
dc
dc
TBD
2
2
MHz
tw
tTLH,
tTHL
Cin
Test Condition
VDD
V
f
fXTAL
Parameter
Figure
No.
Output Pulse Width, φR, φV, and LD
fR in Phase with fV
CL = 50 pF
11, 12
2.5
4.5
5.5
TBD
20
16
TBD
100
90
ns
Output Transition Times,
φR, φV, LD, fR, and fV
CL = 50 pF
11, 12
2.5
4.5
5.5
—
—
—
TBD
65
60
ns
Input Capacitance
fin
—
—
—
7
pF
OSCin
—
—
—
7
* If lower frequency is desired, use wave shaping or higher amplitude sinusoidal signal in ac–coupled case. Also, see Figure 22 for dc decoupling.
MC145170–1
6
MOTOROLA
100 pF
SINE WAVE
GENERATOR
fin
TEST
POINT
fV
OSCin
10 MΩ
Vin
MC145170–1
Vin
0.01 µF
SINE WAVE
GENERATOR
MC145170–1
OSCout
50 Ω
50 Ω*
VSS
VDD
TEST
POINT
fR
VSS
V+
VDD
V+
* Characteristic impedance
Figure 7. Test Circuit
Figure 8. Test Circuit
OSCin
C1
MC145170–1
REFout
C2
OSCout
VSS VDD
TEST
POINT
V+
1/f REFout
REFout
Figure 9. Test Circuit
50%
Figure 10. Switching Waveform
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
tw
OUTPUT
50%
90%
10%
tTHL
Figure 11. Switching Waveform
MOTOROLA
tTLH
CL *
* Includes all probe and
fixture capacitance.
Figure 12. Test Circuit
MC145170–1
7
PIN DESCRIPTIONS
DIGITAL INTERFACE PINS
Din
Serial Data Input (Pin 5)
The bit stream begins with the most significant bit (MSB)
and is shifted in on the low–to–high transition of CLK. The bit
pattern is 1 byte (8 bits) long to access the C or configuration
register, 2 bytes (16 bits) to access the N register, or 3 bytes
(24 bits) to access the R register. Additionally, the R register
can be accessed with a 15–bit transfer (see Table 1). An optional pattern which resets the device is shown in Figure 13.
The values in the C, N, and R registers do not change during
shifting because the transfer of data to the registers is controlled by ENB.
The bit stream needs neither address nor steering bits due
to the innovative BitGrabber registers. Therefore, all bits in
the stream are available to be data for the three registers.
Random access of any register is provided (i.e., the registers
may be accessed in any sequence). Data is retained in the
registers over a supply range of 2.5 to 5.5 V. The formats are
shown in Figures 13, 14, 15, and 16.
Din typically switches near 50% of VDD to maximize noise
immunity. This input can be directly interfaced to CMOS devices with outputs guaranteed to switch near rail–to–rail.
When interfacing to NMOS or TTL devices, either a level
shifter (MC74HC14A, MC14504B) or pull–up resistor of 1 to
10 kΩ must be used. Parameters to consider when sizing the
resistor are worst–case IOL of the driving device, maximum
tolerable power consumption, and maximum data rate.
Table 1. Register Access
(MSBs are shifted in first, C0, N0, and R0 are the LSBs)
Number
of Clocks
Accessed
Register
4+5
8
16
15 or 24
Other Values ≤ 32
Values > 32
(Reset)
C Register
N Register
R Register
None
See Figures
24 — 31
Bit
Nomenclature
C7, C6, C5, . . ., C0
N15, N14, N13, . . ., N0
R14, R13, R12, . . ., R0
CLK
Serial Data Clock Input (Pin 7)
Low–to–high transitions on Clock shift bits available at Din,
while high–to–low transitions shift bits from Dout. The chip’s
16–1/2–stage shift register is static, allowing clock rates
down to dc in a continuous or intermittent mode.
Four clock cycles followed by five clock cycles are needed
to reset the device; this is optional. Eight clock cycles are required to access the C register. Sixteen clock cycles are
needed for the N register. Either 15 or 24 cycles can be used
to access the R register (see Table 1 and Figures 13, 14, 15,
and 16). For cascaded devices, see Figures 24 — 31.
CLK typically switches near 50% of V DD and has a
Schmitt–triggered input buffer. Slow CLK rise and fall times
are allowed. See the last paragraph of Din for more information.
MC145170–1
8
NOTE
To guarantee proper operation of the power–on
reset (POR) circuit, the CLK pin must be held at
the potential of either the VSS or VDD pin during
power up. That is, the CLK input should not be
floated or toggled while the VDD pin is ramping
from 0 to at least 2.5 V. If control of the CLK pin is
not practical during power up, the initialization sequence shown in Figure 13 must be used.
ENB
Active–Low Enable Input (Pin 6)
This pin is used to activate the serial interface to allow the
transfer of data to/from the device. When ENB is in an inactive high state, shifting is inhibited, Dout is forced to the high–
impedance state, and the port is held in the initialized state.
To transfer data to the device, ENB (which must start inactive
high) is taken low, a serial transfer is made via Din and CLK,
and ENB is taken back high. The low–to–high transition on
ENB transfers data to the C, N, or R register depending on
the data stream length per Table 1.
NOTE
Transitions on ENB must not be attempted while
CLK is high. This puts the device out of synchronization with the microcontroller. Resynchronization occurs when ENB is high and CLK is low.
This input is also Schmitt–triggered and switches near
50% of VDD, thereby minimizing the chance of loading erroneous data into the registers. See the last paragraph of Din
for more information.
Dout
Three–State Serial Data Output (Pin 8)
Data is transferred out of the 16–1/2–stage shift register
through Dout on the high–to–low transition of CLK. This output is a No Connect, unless used in one of the manners discussed below.
Dout could be fed back to an MCU/MPU to perform a wrap–
around test of serial data. This could be part of a system
check conducted at power up to test the integrity of the system’s processor, PC board traces, solder joints, etc.
The pin could be monitored at an in–line QA test during
board manufacturing.
Finally, D out facilitates troubleshooting a system and permits cascading devices.
REFERENCE PINS
OSCin /OSCout
Reference Oscillator Input/Output (Pins 1, 2)
These pins form a reference oscillator when connected to
terminals of an external parallel–resonant crystal. Frequency–setting capacitors of appropriate values as recommended by the crystal supplier are connected from each pin
to ground (up to a maximum of 30 pF each, including stray
capacitance). An external feedback resistor of 1 to 15 MΩ is
connected directly across the pins to ensure linear operation
of the amplifier. The required connections for the components are shown in Figure 9.
MOTOROLA
If desired, an external clock source can be ac coupled to
OSCin. A 0.01 µF coupling capacitor is used for measurement purposes and is the minimum size recommended for
applications. An external feedback resistor of approximately
10 MΩ is required across the OSC in and OSC out pins in
the ac–coupled case (see Figure 8). OSCout is an internal
node on the device and should not be used to drive any loads
(i.e., OSC out is unbuffered). However, the buffered REF out
is available to drive external loads.
The external signal level must be at least 1 V p–p; the
maximum frequencies are given in the Loop Specifications
table. These maximum frequencies apply for R Counter
divide ratios as indicated in the table. For very small ratios,
the maximum frequency is limited to the divide ratio times
2 MHz. (Reason: the phase/frequency detectors are limited
to a maximum input frequency of 2 MHz.)
If an external source is available which swings rail–to–rail
(VDD to VSS), then dc coupling can be used. In the dc–
coupled case, no external feedback resistor is needed.
OSCout must be a No Connect to avoid loading an internal
node on the device, as noted above. For frequencies below
1 MHz, dc coupling must be used. The R counter is a static
counter and may be operated down to dc. However, wave
shaping by a CMOS buffer may be required to ensure fast
rise and fall times into the OSCin pin. See Figure 22.
Each rising edge on the OSCin pin causes the R counter to
decrement by one.
REFout
Reference Frequency Output (Pin 3)
This output is the buffered output of the crystal–generated
reference frequency or externally provided reference source.
This output may be enabled, disabled, or scaled via bits in
the C register (see Figure 14).
REF out can be used to drive a microprocessor clock input,
thereby saving a crystal. Upon power up, the on–chip
power–on–initialize circuit forces REF out to the OSC in
divided–by–8 mode.
REFout is capable of operation to 10 MHz; see the Loop
Specifications table. Therefore, divide values for the reference divider are restricted to two or higher for OSCin frequencies above 10 MHz.
If unused, the pin should be floated and should be disabled
via the C register to minimize dynamic power consumption
and electromagnetic interference (EMI).
COUNTER OUTPUT PINS
fR
R Counter Output (Pin 9)
This signal is the buffered output of the 15–stage R counter. fR can be enabled or disabled via the C register (patented). The output is disabled (static low logic level) upon
power up. If unused, the output should be left disabled and
unconnected to minimize interference with external circuitry.
The fR signal can be used to verify the R counter’s divide
ratio. This ratio extends from 5 to 32,767 and is determined
by the binary value loaded into the R register. Also, direct
access to the phase detector via the OSCin pin is allowed by
choosing a divide value of 1 (see Figure 15). The maximum
frequency which the phase detectors operate is 2 MHz.
Therefore, the frequency of fR must not exceed 2 MHz.
When activated, the fR signal appears as normally low and
pulses high.
MOTOROLA
fV
N Counter Output (Pin 10)
This signal is the buffered output of the 16–stage N counter. fV can be enabled or disabled via the C register (patented). The output is disabled (static low logic level) upon
power up. If unused, the output should be left disabled and
unconnected to minimize interference with external circuitry.
The fV signal can be used to verify the N counter’s divide
ratio. This ratio extends from 40 to 65,535 and is determined
by the binary value loaded into the N register. The maximum
frequency which the phase detectors operate is 2 MHz.
Therefore, the frequency of fV must not exceed 2 MHz.
When activated, the fV signal appears as normally low and
pulses high.
LOOP PINS
fin
Frequency Input (Pin 4)
This pin is a frequency input from the VCO. This pin feeds
the on–chip amplifier which drives the N counter. This signal
is normally sourced from an external voltage–controlled oscillator (VCO), and is ac–coupled into fin. A 100 pF coupling
capacitor is used for measurement purposes and is the minimum size recommended for applications (see Figure 7). The
frequency capability of this input is dependent on the supply
voltage as listed in the Loop Specifications table. For small
divide ratios, the maximum frequency is limited to the divide
ratio times 2 MHz. (Reason: the phase/frequency detectors
are limited to a maximum frequency of 2 MHz.)
For signals which swing from at least the VIL to VIH levels
listed in the Electrical Characteristics table, dc coupling
may be used. Also, for low frequency signals (less than the
minimum frequencies shown in the Loop Specifications
table), dc coupling is a requirement. The N counter is a static
counter and may be operated down to dc. However, wave
shaping by a CMOS buffer may be required to ensure fast
rise and fall times into the fin pin. See Figure 22.
Each rising edge on the fin pin causes the N counter to
decrement by 1.
PDout
Single–Ended Phase/Frequency Detector Output
(Pin 13)
This is a three–state output for use as a loop error signal
when combined with an external low–pass filter. Through use
of a Motorola patented technique, the detector’s dead zone
has been eliminated. Therefore, the phase/frequency detector is characterized by a linear transfer function. The operation of the phase/frequency detector is described below and
is shown in Figure 17.
POL bit (C7) in the C register = low (see Figure 14)
Frequency of fV > fR or Phase of fV Leading f R: negative
pulses from high impedance
Frequency of fV < fR or Phase of fV Lagging fR: positive
pulses from high impedance
Frequency and Phase of fV = fR: essentially high–impe–
dance state; voltage at pin determined by loop filter
POL bit (C7) = high
Frequency of fV > fR or Phase of fV Leading fR: positive
pulses from high impedance
Frequency of fV < fR or Phase of fV Lagging f R: negative
pulses from high impedance
Frequency and Phase of fV = fR: essentially high–impe–
dance state; voltage at pin determined by loop filter
MC145170–1
9
These outputs can be enabled, disabled, and interchanged via the C register (patented).
This output can be enabled, disabled, and inverted via the
C register. If desired, PDout can be forced to the high–impe–
dance state by utilization of the disable feature in the C register (patented).
LD
Lock Detector Output (Pin 11)
φR and φV
Double–Ended Phase/Frequency Detector Outputs
(Pins 14, 15)
This output is essentially at a high level with narrow low–
going pulses when the loop is locked (fR and fV of the same
phase and frequency). The output pulses low when fV and fR
are out of phase or different frequencies (see Figure 17).
This output can be enabled and disabled via the C register
(patented). Upon power up, on–chip initialization circuitry
disables LD to a static low logic level to prevent a false “lock”
signal. If unused, LD should be disabled and left open.
These outputs can be combined externally to generate a
loop error signal. Through use of a Motorola patented technique, the detector’s dead zone has been eliminated. Therefore, the phase/frequency detector is characterized by a
linear transfer function. The operation of the phase/frequency detector is described below and is shown in Figure 17.
POL bit (C7) in the C register = low (see Figure 14)
Frequency of fV > fR or Phase of fV Leading fR: φV = negative pulses, φR = essentially high
Frequency of fV < fR or Phase of fV Lagging fR: φV = essentially high, φR = negative pulses
Frequency and Phase of fV = fR: φV and φR remain essentially high, except for a small minimum time period when both
pulse low in phase
POL bit (C7) = high
Frequency of fV > fR or Phase of fV Leading fR: φR = negative pulses, φV = essentially high
Frequency of fV < fR or Phase of fV Lagging fR: φR = essentially high, φV = negative pulses
Frequency and Phase of fV = fR: φV and φR remain essentially high, except for a small minimum time period when both
pulse low in phase
POWER SUPPLY
VDD
Most Positive Supply Potential (Pin 16)
This pin may range from + 2.5 to 5.5 V with respect to VSS.
For optimum performance, VDD should be bypassed to
VSS using low–inductance capacitor(s) mounted very close
to the device. Lead lengths on the capacitor(s) should be
minimized. (The very fast switching speed of the device
causes current spikes on the power leads.)
VSS
Most Negative Supply Potential (Pin 12)
This pin is usually ground. For measurement purposes,
the VSS pin is tied to a ground plane.
POWER
UP
ENB
CLK
1
2
3
4
1
2
3
4
5
Din
ZEROES
DON’T
CARES
ZEROES
ONE ZERO
DON’T CARES
NOTE: This initialization sequence must be used immediately after power up if control of the CLK pin is not possible. That
is, if CLK (pin 7) toggles or floats upon power up, use the above sequence to reset the device.
Also, use this sequence if power is momentarily interrupted such that the supply voltage to the device is reduced
to below 2.5 V, but not down to 0 V (for example, the supply drops down to 1 V). This is necessary because the
on–chip power–on reset is only activated when the supply ramps up from 0 V.
Figure 13. Reset Sequence
MC145170–1
10
MOTOROLA
ENB
1
CLK
2
3
4
5
6
7
MSB
Din
C7
8
*
LSB
C6
C5
C4
C3
C2
C1
C0
* At this point, the new byte is transferred to the C register and stored. No other registers
are affected.
C7 — POL:
Selects the output polarity of the phase/frequency detectors. When set high, this bit inverts
PDout and interchanges the φR function with φV as depicted in Figure 17. Also see the phase
detector output pin descriptions for more information. This bit is cleared low at power up.
C6 — PDA/B:
Selects which phase/frequency detector is to be used. When set high, enables the output of
phase/frequency detector A (PDout) and disables phase/frequency detector B by forcing φR
and φV to the static high state. When cleared low, phase/frequency detector B is enabled (φR
and φV) and phase/frequency detector A is disabled with PDout forced to the high–impedance
state. This bit is cleared low at power up.
C5 — LDE:
Enables the lock detector output when set high. When the bit is cleared low, the LD output is
forced to a static low level. This bit is cleared low at power up.
C4 – C2, OSC2 – OSC0: Reference output controls which determine the REFout characteristics as shown below. Upon
power up, the bits are initialized such that OSCin /8 is selected.
C4
C3
C2
0
0
0
dc (Static Low)
0
0
1
OSCin
0
1
0
OSCin /2
0
1
1
OSCin /4
1
0
0
OSCin /8
1
0
1
OSCin /16
1
1
0
OSCin /8
1
1
1
OSCin /16
REFout Frequency
C1 — fVE:
Enables the fV output when set high. When cleared low, the fV output is forced to a static low
level. The bit is cleared low upon power up.
C0 — fRE:
Enables the fR output when set high. When cleared low, the fR output is forced to a static low
level. The bit is cleared low upon power up.
Figure 14. C Register Access and Format (8 Clock Cycles are Used)
MOTOROLA
MC145170–1
11
CLK
ENB
MSB
1
X
2
X
3
X
4
X
5
X
6
X
7
X
8
X
9
R14
10
R13
11
R12
12
R11
13
R10
14
R9
15
R8
16
R7
17
R6
18
R5
19
R4
20
R3
21
R2
22
R1
23
LSB
24
*
MC145170–1
12
X
CLK
ENB
MSB
1
DON’T CARE BITS
2
3
4
R10
5
R9
6
R8
7
SEE BELOW
R7
8
R6
9
R5
10
R4
SEE BELOW
11
R3
12
R2
13
R1
14
LSB
SEE BELOW
15
*
SEE BELOW
Din
OCTAL VALUE
R14
0
0
0
0
0
0
0
0
.
.
.
F
F
0
0
0
0
0
0
0
0
.
.
.
F
F
0
0
0
0
0
0
0
0
.
.
.
7
7
0
1
2
3
4
5
6
7
.
.
.
E
F
R0
DECIMAL EQUIVALENT
R COUNTER = ÷32,766
R COUNTER = ÷32,767
NOT ALLOWED
R COUNTER = ÷1 (DIRECT ACCESS TO REFERENCE SIDE OF PHASE/FREQUENCY DETECTOR)
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
R COUNTER = ÷5
R COUNTER = ÷6
R COUNTER = ÷7
HEXADECIMAL VALUE
R11
R12
R13
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
* At this point, the new data is transferred to the R register and stored. No other registers are affected.
Din
R0
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
Figure 15. R Register Access and Formats (Either 24 or 15 Clock Cycles Can Be Used)
MOTOROLA
ENB
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
MSB
Din
N15
16
*
LSB
N14
N13
N12
N11
N10
N9
N8
N7
N6
N5
N4
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
3
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
2
2
2
2
2
2
5
6
7
8
9
A
B
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
N COUNTER =
N COUNTER =
N COUNTER =
N COUNTER =
÷
÷
÷
÷
40
41
42
43
F
F
F
F
F
F
E
F
N COUNTER =
N COUNTER =
÷
÷
65,534
65,535
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
⋅⋅
⋅
N3
N2
N1
N0
DECIMAL EQUIVALENT
HEXADECIMAL VALUE
* At this point, the two new bytes are transferred to the N register and stored. No other registers are affected. In addition, the N and
R counters are jam–loaded and begin counting down together.
Figure 16. N Register Access and Format (16 Clock Cycles Are Used)
fR
REFERENCE
OSCin ÷ R
VH
VL
fV
FEEDBACK
(fin ÷ N)
PDout
VH
VL
*
VH
HIGH IMPEDANCE
φR
VL
VH
VL
φV
VH
VL
VH
LD
VL
VH = High voltage level
VL = Low voltage level
*At this point, when both fR and fV are in phase, both the sinking and sourcing output FETs are turned on for a very short interval.
NOTE: The PDout generates error pulses during out–of–lock conditions. When locked in phase and frequency, the output is high
impedance and the voltage at that pin is determined by the low–pass filter capacitor. PDout, φR, and φV are shown with the
polarity bit (POL) = low; see Figure 14 for POL.
Figure 17. Phase/Frequency Detectors and Lock Detector Output Waveforms
MOTOROLA
MC145170–1
13
DESIGN CONSIDERATIONS
CRYSTAL OSCILLATOR CONSIDERATIONS
The following options may be considered to provide a reference frequency to Motorola’s CMOS frequency synthesizers.
Use of a Hybrid Crystal Oscillator
Commercially available temperature–compensated crystal
oscillators (TCXOs) or crystal–controlled data clock oscillators provide very stable reference frequencies. An oscillator
capable of CMOS logic levels at the output may be direct or
dc coupled to OSCin. If the oscillator does not have CMOS
logic levels on the outputs, capacitive or ac coupling to
OSCin may be used (see Figure 8).
For additional information about TCXOs and data clock
oscillators, please consult the latest version of the eem Electronic Engineers Master Catalog, the Gold Book, or similar
publications.
by the crystal manufacturer represents the maximum stress
that the crystal can withstand without damage or excessive
shift in operating frequency. R1 in Figure 18 limits the drive
level. The use of R1 is not necessary in most cases.
To verify that the maximum dc supply voltage does not
cause the crystal to be overdriven, monitor the output frequency at the REFout pin (OSCout is not used because loading impacts the oscillator). The frequency should increase
very slightly as the dc supply voltage is increased. An overdriven crystal decreases in frequency or becomes unstable
with an increase in supply voltage. The operating supply voltage must be reduced or R1 must be increased in value if the
overdriven condition exists. The user should note that the oscillator start–up time is proportional to the value of R1.
Through the process of supplying crystals for use with
CMOS inverters, many crystal manufacturers have developed expertise in CMOS oscillator design with crystals. Discussions with such manufacturers can prove very helpful
(see Table 2).
Design an Off–Chip Reference
FREQUENCY
SYNTHESIZER
The user may design an off–chip crystal oscillator using
discrete transistors or ICs specifically developed for crystal
oscillator applications, such as the MC12061 MECL device.
The reference signal from the MECL device is ac coupled to
OSCin (see Figure 18). For large amplitude signals (standard
CMOS logic levels), dc coupling is used.
OSCin
R1*
Use of the On–Chip Oscillator Circuitry
The on–chip amplifier (a digital inverter) along with an appropriate crystal may be used to provide a reference source
frequency. A fundamental mode crystal, parallel resonant at
the desired operating frequency, should be connected as
shown in Figure 18.
The crystal should be specified for a loading capacitance
(CL) which does not exceed 20 pF when used at the highest
operating frequencies listed in the Loop Specifications
table. Larger CL values are possible for lower frequencies.
Assuming R1 = 0 Ω, the shunt load capacitance (CL) presented across the crystal can be estimated to be:
CinCout
C1 • C2
CL =
+ Ca + Cstray +
Cin + Cout
C1 + C2
where
Cin = 5 pF (see Figure 19)
Cout = 6 pF (see Figure 19)
Ca = 1 pF (see Figure 19)
C1 and C2 =external capacitors (see Figure 18)
Cstray = the total equivalent external circuit stray capaci–
tance appearing across the crystal terminals
The oscillator can be “trimmed” on–frequency by making a
portion or all of C1 variable. The crystal and associated components must be located as close as possible to the OSCin
and OSCout pins to minimize distortion, stray capacitance,
stray inductance, and startup stabilization time. Circuit stray
capacitance can also be handled by adding the appropriate
stray value to the values for Cin and Cout. For this approach,
the term Cstray becomes 0 in the above expression for CL.
Power is dissipated in the effective series resistance of the
crystal, Re, in Figure 20. The maximum drive level specified
MC145170–1
14
OSCout
Rf
C1
C2
* May be needed in certain cases. See text.
Figure 18. Pierce Crystal Oscillator Circuit
Ca
OSCin
OSCout
Cin
Cout
Cstray
Figure 19. Parasitic Capacitances of the Amplifier
and Cstray
1
2
CS
LS
RS
1
2
CO
1
Re
Xe
2
NOTE: Values are supplied by crystal manufacturer
(parallel resonant crystal).
Figure 20. Equivalent Crystal Networks
MOTOROLA
RECOMMENDED READING
Technical Note TN–24, Statek Corp.
Technical Note TN–7, Statek Corp.
E. Hafner, “The Piezoelectric Crystal Unit–Definitions and
Method of Measurement”, Proc. IEEE, Vol. 57, No. 2, Feb.
1969.
D. Kemper, L. Rosine, “Quartz Crystals for Frequency
Control”, Electro–Technology, June 1969.
P. J. Ottowitz, “A Guide to Crystal Selection”, Electronic
Design, May 1966.
D. Babin, “Designing Crystal Oscillators”, Machine Design,
March 7, 1985.
D. Babin, “Guidelines for Crystal Oscillator Design”,
Machine Design, April 25, 1985.
Table 2. Partial List of Crystal Manufacturers
Name
United States Crystal Corp.
Crystek Crystal
Statek Corp.
Fox Electronics
Address
3605 McCart Ave., Ft. Worth, TX 76110
2351 Crystal Dr., Ft. Myers, FL 33907
512 N. Main St., Orange, CA 92668
5570 Enterprise Parkway, Ft. Myers, FL 33905
Phone
(817) 921–3013
(813) 936–2109
(714) 639–7810
(813) 693–0099
NOTE: Motorola cannot recommend one supplier over another and in no way suggests that this is a complete
listing of crystal manufacturers.
MOTOROLA
MC145170–1
15
PHASE–LOCKED LOOP — LOW PASS FILTER DESIGN
(A)
PDout
VCO
ωn =
R1
ζ =
C
F(s) =
(B)
PDout
VCO
ωn =
R1
R2
Kφ KVCO
NR1C
Nωn
2KφKVCO
1
R1sC + 1
Kφ KVCO
NC(R1 + R2)
N
Ǔ
ζ = 0.5 ωn ǒ R2C +
KφKVCO
C
F(s) =
R2sC + 1
(R1 + R2)sC + 1
R2
(C)
φR
R1
ωn =
C
–
φV
+
A
VCO
R1
R2
ζ =
Kφ KVCO
NCR1
ωnR2C
2
ASSUMING GAIN A IS VERY LARGE, THEN:
C
F(s) =
R2sC + 1
R1sC
NOTE:
For (C), R1 is frequently split into two series resistors; each resistor is equal to R1 divided by 2. A capacitor CC is then placed from the
midpoint to ground to further filter the error pulses. The value of CC should be such that the corner frequency of this network does not
significantly affect ωn.
DEFINITIONS:
N = Total Division Ratio in Feedback Loop
Kφ (Phase Detector Gain) = VDD / 4π V/radian for PDout
Kφ (Phase Detector Gain) = VDD / 2π V/radian for φV and φR
KVCO (VCO Gain) =
2π∆fVCO
∆VVCO
For a nominal design starting point, the user might consider a damping factor ζ ≈ 0.7 and a natural loop frequency ωn ≈ (2πfR/50) where
fR is the frequency at the phase detector input. Larger ωn values result in faster loop lock times and, for similar sideband filtering, higher
fR–related VCO sidebands.
RECOMMENDED READING:
Gardner, Floyd M., Phaselock Techniques (second edition). New York, Wiley–Interscience, 1979.
Manassewitsch, Vadim, Frequency Synthesizers: Theory and Design (second edition). New York, Wiley–Interscience, 1980.
Blanchard, Alain, Phase–Locked Loops: Application to Coherent Receiver Design. New York, Wiley–Interscience, 1976.
Egan, William F., Frequency Synthesis by Phase Lock. New York, Wiley–Interscience, 1981.
Rohde, Ulrich L., Digital PLL Frequency Synthesizers Theory and Design. Englewood Cliffs, NJ, Prentice–Hall, 1983.
Berlin, Howard M., Design of Phase–Locked Loop Circuits, with Experiments. Indianapolis, Howard W. Sams and Co., 1978.
Kinley, Harold, The PLL Synthesizer Cookbook. Blue Ridge Summit, PA, Tab Books, 1980.
Seidman, Arthur H., Integrated Circuits Applications Handbook, Chapter 17, pp. 538–586. New York, John Wiley & Sons.
Fadrhons, Jan, “Design and Analyze PLLs on a Programmable Calculator,” EDN. March 5, 1980.
AN535, Phase–Locked Loop Design Fundamentals, Motorola Semiconductor Products, Inc., 1970.
AR254, Phase–Locked Loop Design Articles, Motorola Semiconductor Products, Inc., Reprinted with permission from Electronic Design,
1987.
AN1207, The MC145170 in Basic HF and VHF Oscillators, Motorola Semiconductor Products, Inc., 1992.
MC145170–1
16
MOTOROLA
VHF OUTPUT
BUFFER
VHF VCO
LOW–PASS FILTER
V+
2
3
V+
4
5
6
7
MCU
OPTIONAL
8
THRESHOLD
DETECTOR
OPTIONAL
OSCin
VDD
16
OSCout
φV
15
REFout
φR
14
fin
Din
MC145170–1
1
PDout
VSS
ENB
LD
CLK
fV
Dout
fR
13
OPTIONAL
LOOP ERROR
SIGNALS
(NOTE 1)
12
11
10
9
INTEGRATOR
(NOTE 4)
NOTES:
1. The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked
Loop — Low–Pass Filter Design page for additional information. The φR and φV outputs
swing rail–to–rail. Therefore, the user should be careful not to exceed the common mode
input range of the op amp used in the combiner/loop filter.
2. For optimum performance, bypass the VDD pin to VSS (GND) with one or more low–inductance capacitors.
3. The R counter is programmed for a divide value = OSCin/fR. Typically, fR is the tuning resolution required for the VCO. Also, the VCO frequency divided by fR = N, where N is the divide
value of the N counter.
4. May be an R–C low–pass filter.
Figure 21. Example Application
MOTOROLA
MC145170–1
17
V+
VDD
A
C
MC74HC14A
B
OSCout
OSCin
NO CONNECT
MC145170–1
D
fin
VSS
NOTE: The signals at Points A and B may be low–frequency sinusoidal
or square waves with slow edge rates or noisy signal edges. At
Points C and D, the signals are cleaned up, have sharp edge
rates, and rail–to–rail signal swings. With signals as described at
Points C and D, the MC145170–1 is guaranteed to operate down
to a frequency as low as dc.
Figure 22. Low Frequency Operation Using dc Coupling
MC145170–1
18
MOTOROLA
fin (PIN 4)
SOG PACKAGE
1
2
3
4
Marker
Frequency
(MHz)
Resistance
(Ω)
Reactance
(Ω)
Capacitance
(pF)
1
2
3
4
5
100
150
185
2390
39.2
25.8
42.6
– 5900
– 347
– 237
– 180
5.39
4.58
4.48
4.79
Figure 23. Input Impedance at fin — Series Format (R + jX)
(5 MHz to 185 MHz)
DEVICE #1
MC145170–1
Din
CLK
ENB
DEVICE #2
MC145170–1
Dout
Din
CLK
ENB
Dout
33 kΩ
NOTE 1
CMOS
MCU
OPTIONAL
NOTES:
1. The 33 kΩ resistor is needed to prevent the Din pin from floating. (The Dout pin is a three–state output.)
2. See related Figures 25, 26, and 27.
Figure 24. Cascading Two MC145170–1 Devices
MOTOROLA
MC145170–1
19
MC145170–1
20
Figure 25. Accessing the C Registers of Two
Cascaded MC145170–1 Devices
CLK
ENB
CLK
ENB
X
1
X
2
7
X
8
X
9
X
10
15
X
16
C7
17
18
23
24
25
X
26
31
X
32
33
C6
34
39
40
*
D in
C0
X
X
1
X
2
8
X
9
X
10
25
26
27
30
R9
31
39
40
X
41
42
44
*At this point, the new data is transferred to the C registers of both devices and stored. No other registers are affected.
C REGISTER BITS OF DEVICE #2
IN FIGURE 24
C6
45
C0
48
49
50
55
C REGISTER BITS OF DEVICE #1
IN FIGURE 24
C7
56
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
*
D in
R1
R REGISTER BITS OF DEVICE #2
IN FIGURE 24
R13
R0
R14
*At this point, the new data is transferred to the R registers of both devices and stored. No other registers are affected.
R14
R7
R6
R REGISTER BITS OF DEVICE #1
IN FIGURE 24
R11
R0
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
Figure 26. Accessing the R Registers of Two
Cascaded MC145170–1 Devices
MOTOROLA
MOTOROLA
CLK
ENB
X
1
X
2
8
X
9
X
10
15
X
16
17
23
24
25
31
32
33
39
40
41
47
48
*
N15
N7
N REGISTER BITS OF DEVICE #2
IN FIGURE 24
N8
N0
N15
*At this point, the new data is transferred to the N registers of both devices and stored. No other registers are affected.
D in
N7
N REGISTER BITS OF DEVICE #1
IN FIGURE 24
N8
N0
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
Figure 27. Accessing the N Registers of Two Cascaded MC145170–1 Devices
MC145170–1
21
V+
VPD
DEVICE #1
MC145170–1
Din
CLK
ENB
VDD
VDD VCC
Dout
Din
DEVICE #2
NOTE 2
CLK
ENB
VPD
OUTPUT A
(Dout)
33 kΩ
NOTE 1
CMOS
MCU
OPTIONAL
NOTES:
1. The 33 kΩ resistor is needed to prevent the Din pin from floating. (The Dout pin is a three–state output.)
2. This PLL Frequency Synthesizer may be a MC145190, MC145191, MC145192, MC145200, or MC145201.
3. See related Figures 29, 30, and 31.
Figure 28. Cascading Two Different Device Types
MC145170–1
22
MOTOROLA
MOTOROLA
Figure 29. Accessing the C Registers of Two
Different Device Types
CLK
ENB
CLK
ENB
X
1
X
2
7
X
8
X
9
X
10
15
X
16
C7
17
18
23
24
25
X
26
31
X
32
33
C6
34
39
40
*
C0
C REGISTER BITS OF DEVICE #2
IN FIGURE 28
C6
X
X
1
X
2
16
17
18
20
21
22
30
31
32
39
40
41
*At this point, the new data is transferred to the C registers of both devices and stored. No other registers are affected.
D in
42
43
C0
46
47
48
55
C REGISTER BITS OF DEVICE #1
IN FIGURE 28
C7
56
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
*
A23
A22
A18
A9
A REGISTER BITS OF DEVICE #2
IN FIGURE 28
A19
A8
A0
X
R14
R13
R9
R8
R REGISTER BITS OF DEVICE #1
IN FIGURE 28
*At this point, the new data is transferred to the A register of Device #2 and R register of Device #1 and stored. No other registers are affected.
D in
R0
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
Figure 30. Accessing the A and R Registers of
Two Different Device Types
MC145170–1
23
MC145170–1
24
CLK
ENB
X
1
X
2
8
X
9
X
10
15
X
16
17
23
24
25
31
32
33
39
40
41
47
48
*
R15
R7
R REGISTER BITS OF DEVICE #2
IN FIGURE 28
R8
R0
N15
N7
N REGISTER BITS OF DEVICE #1
IN FIGURE 28
N8
*At this point, the new data is transferred to the R register of Device #2 and N register of Device #1 and stored. No other registers are affected.
D in
N0
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
Figure 31. Accessing the R and N Registers
of Two Different Device Types
MOTOROLA
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP (DUAL–IN–LINE PACKAGE)
CASE 648–08
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
D SUFFIX
SOG (SMALL–OUTLINE GULL–WING) PACKAGE
CASE 751B–05
–A–
16
9
1
8
–B–
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8 PL
0.25 (0.010)
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
MOTOROLA
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC145170–1
25
DT SUFFIX
TSSOP (THIN SHRUNK SMALL–OUTLINE PACKAGE)
CASE 948C–03
A
-P-
16x
K
REF
0.200 (0.008)
16
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –U–.
T
9
B
L
PIN 1
IDENTIFICATION
1
8
-U-
C
0.100 (0.004)
-T-
M
D
H
G
SEATING
PLANE
A
K
J1
K1
M
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
–––
5.10
4.30
4.50
–––
1.20
0.05
0.25
0.45
0.55
0.65 BSC
0.22
0.23
0.09
0.24
0.09
0.18
0.16
0.32
0.16
0.26
6.30
6.50
0°
10°
INCHES
MIN
MAX
–––
0.200
0.169
0.177
–––
0047
0.002
0.010
0.018
0.022
0.026 BSC
0.009
0.010
0.004
0.009
0.004
0.007
0.006
0.013
0.006
0.010
0.248
0.256
0°
10 °
J
A
SECTION A–A
MC145170–1
26
F
MOTOROLA
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447
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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MOTOROLA
◊
*MC145170-1/D*
MC145170–1/D
MC145170–1
27