ON MC10H125FNR2G Quad meclâ toâ ttl translator Datasheet

MC10H125
Quad MECL‐to‐TTL
Translator
Description
The MC10H125 is a quad translator for interfacing data and control
signals between the MECL section and saturated logic section of
digital systems. The 10H part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay, and no increase in power-supply current.
Outputs of unused translators will go to low state when their inputs
are left open.
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16
20 1
1
Features
PDIP−16
P SUFFIX
CASE 648−08
• Propagation Delay, 2.5 ns Typical
• Voltage Compensated
• Improved Noise Margin 150 mV
•
•
(Over Operating Voltage and Temperature Range)
MECL 10K Compatible
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
PLLC−20
FN SUFFIX
CASE 775−02
MARKING DIAGRAMS*
1 20
16
MC10H125P
AWLYYWWG
10H125G
AWLYYWW
1
PDIP−16
A
WL, L
YY, Y
WW, W
G
PLLC−20
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
Package
Shipping†
MC10H125FNG
PLLC−20
(Pb-Free)
46 Units / Tube
MC10H125FNR2G
PLLC−20
(Pb-Free)
500 Tape & Reel
MC10H125PG
PDIP−16
(Pb-Free)
25 Units / Tube
†For information on tape and reel specifications, including part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
August, 2016 − Rev. 14
1
Publication Order Number:
MC10H125/D
MC10H125
2
4
3
6
5
7
10
12
11
14
13
15
1
VBB*
GND = Pin 16
VCC ( +5.0 Vdc) = Pin 9
VEE ( −5.2 Vdc) = Pin 8
*VBB to be used to supply bias to the MC10H125
only and bypassed (when used) with 0.01 mF to
0.1 mF capacitor to ground (0 V). VBB can source < 1.0 mA.
Figure 1. Logic Diagram
VBB
1
16
GND
Ain
2
15
Din
Ain
3
14
Din
Aout
4
13
Dout
Bout
5
12
Cout
Bin
6
11
Cin
Bin
7
10
Cin
VEE
8
9
VCC
VBB
1
AIN
2
AIN
AOUT
GND
DIN
DIN DOUT Exposed Pad (EP)
16
15
14
12
COUT
11
CIN
3
10
CIN
4
9
VCC
MC10H125
5
6
BOUT BIN
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables.
13
7
8
BIN
VEE
Pin assignment for QFN16 Package.
Figure 2. Pin Assignment
Table 1. DIP CONVERSION TABLES
16−Pin DIL to 20−Pin PLCC
16 PIN DIL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
20 PIN PLCC
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
20−Pin DIL to 20−Pin PLCC
20 PIN DIL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
20 PIN PLCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
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MC10H125
Table 2. MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
Power Supply (VCC = 5.0 V)
Characteristic
−8.0 to 0
Vdc
VCC
Power Supply (VEE = −5.2 V)
0 to +7.0
Vdc
VI
Input Voltage (VCC = 5.0 V)
0 to VEE
Vdc
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range
− Plastic
− Ceramic
°C
−55 to +150
−55 to +165
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V +5%; VCC = 5.0 V + 5.0 %) (Note 2)
0°
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Negative Power
Supply Drain
Current
−
44
−
40
−
44
mA
Positive Power Supply
Drain Current
−
63
−
63
−
63
mA
−
40
−
40
−
40
mA
IinH
Input Current
−
225
−
145
−
145
mA
ICBO
Input Leakage Current
−
1.5
−
1.0
−
1.0
mA
VOH
High Output Voltage
IOH = −1.0 mA
2.5
−
2.5
−
2.5
−
Vdc
VOL
Low Output Voltage
IOL = +20 mA
−
0.5
−
0.5
−
0.5
Vdc
VIH
High Input Voltage (Note 1)
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
VIL
Low Input Voltage (Note 1)
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
IOS
Short Circuit Current
60
150
60
150
50
150
mA
VBB
Reference Voltage
−1.38
−1.27
−1.35
−1.25
−1.31
−1.19
Vdc
−
−
Symbol
IE
ICCH
ICCL
VCMR
Characteristic
Common Mode
Range (Note 3)
−2.85 to +0.3
V
Typical
VPP
Input Sensitivity (Note 4)
150
mV
1. When VBB is used as the reference voltage.
2. Each MECL 10H™ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mVp−p differential input required to obtain full logic swing on output.
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MC10H125
Table 4. AC CHARACTERISTICS
0°
Symbol
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
tpd
Propagation Delay
0.8
3.3
0.85
3.35
0.9
3.4
ns
tr
Rise Time (Note 1)
0.3
1.2
0.3
1.2
0.3
1.2
ns
tf
Fall Time (Note 1)
0.3
1.2
0.3
1.2
0.3
1.2
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Output Voltage = 1.0 V to 2.0 V. RL = 500 W to GND and CL = 25 pF to GND. Refer to Figure 1.
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes
fixture
capacitance
CL *
RL
AC TEST LOAD
GND
Figure 1. TTL Output Loading Used for Device Evaluation
APPLICATION INFORMATION
An advantage of this device is that MECL-level
information can be received, via balanced twisted pair lines,
in the TTL equipment. This isolates the MECL-logic from
the noisy TTL environment. Power supply requirements are
ground, +5.0 V and −5.2 V.
The MC10H125 incorporates differential inputs and
Schottky TTL “totem pole” outputs. Differential inputs
allow for use as an inverting/non-inverting translator or as
a differential line receiver. The VBB reference voltage is
available on Pin 1 for use in single-ended input biasing. The
outputs of the MC10H125 go to a low-logic level whenever
the inputs are left floating, and a high-logic output level is
achieved with a minimum input level of 150 mVp−p.
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MC10H125
PACKAGE DIMENSIONS
20 LEAD PLLC
FN SUFFIX
CASE 775−02
ISSUE F
B
0.007 (0.180)
Y BRK
−N−
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
−L−
−M−
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D−D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
C
H
−T−
VIEW S
G1
0.010 (0.250) S T L-M
SEATING
PLANE
F
0.007 (0.180)
VIEW S
S
N
T L-M
S
N
S
K
0.004 (0.100)
J
M
K1
E
G
0.007 (0.180)
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
M
T L-M
S
N
S
MC10H125
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
CASE 648−08
ISSUE V
D
A
16
9
E
H
E1
1
NOTE 8
b2
8
c
B
TOP VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
NOTE 3
L
A1
C
D1
e
SEATING
PLANE
M
eB
END VIEW
16X b
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
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