TECHNICAL NOTE
Motor Driver IC Series for Printers
DC Brush Motor Driver
for Paper Feed or Carriage Use
BA6920FP-Y, BA6219BFP-Y
●Description
The BA6920FP-Y and BA6219BFP-Y are full-on drivers for motors with DC brushes. They operate in forward rotation mode, reverse rotation
mode, stop (idling) mode, or brake mode, that are selectable according to the input logic (two inputs). The output voltage can be set through
the output voltage setting pin.
●Features
1) Large output current. (BA6219BFP-Y)
2) Built-in thermal shutdown circuit
3) The output voltage can be set flexibly through the output voltage setting pin.
4) Built-in standby (stop) circuit. (BA6920FP-Y)
●Applications
Devices that use DC brush motors, such as photo printers, scanners, mini printers, and fax machines.
●Absolute maximum ratings
Parameter
Limit
Symbol
Unit
BA6219BFP-Y
BA6920FP-Y
VCC1, 2,
24
-
V
VM, VCC
-
36
V
Pd
*1450
*1450
mW
Topr
-25～+75
-30～+85
℃
Applied voltage
Power dissipation
Operating temperature range
Tstg
-55～+150
-55～+150
℃
Output current
IOmax
2200**
1000**
mA
Junction temperature
Tjmax
150
150
℃
Storage temperature range
* Reduced by 11.6 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
** Must not exceed Pd or ASO.
500μs pulses at a duty of 1/100.
●Operating conditions
BA6219BFP-Y
Parameter
Symbol
Operating voltage
Unit
Power supply voltage
VCC1,2
8～18
V
Symbol
Operating voltage
Unit
VCC
6.5～34
V
VM
6.5～34
V
BA6920FP-Y
Parameter
Power supply voltage
Ver.B Oct.2005
●Electrical characteristics
BA6219BFP-Y (Unless otherwise specified, Ta=25°C, VCC1=12 V, VCC2=12 V)
Parameter
Symbol
Limit
Min.
Typ.
Max.
Unit
Conditions
Circuit current 1
ICC1
-
1.2
2.5
mA
Standby mode (stop)
Circuit current 2
ICC2
-
16
35
mA
Forward rotation or reverse mode
Circuit current 3
ICC3
-
25
60
mA
Brake mode
High-level input voltage
VIH
3.0
-
VCC
V
Low-level input voltage
VIL
0
-
1.0
V
IVREF
0.6
1.2
2.4
mA
RL=60Ω
CD1 constant-current value
ICD1
0.7
1.5
3.0
mA
(IN1, IN2) = (H, L): Current from CD1 to GND
CD2 constant-current value
(IN1, IN2) = (H, L): Current from CD2 to GND
VR bias current
ICD2
0.7
1.5
3.0
mA
Output leak current
IOL
-
-
1
mA
FOUT high output voltage
VHF
6.5
-
-
V
(IN1, IN2) = (L, L): Current flowing into VCC2
RL=60Ω VR=6.8V
FOUT low output voltage
VLF
-
-
1.2
V
RL=60Ω VR=6.8V
ROUT high output voltage
VHR
6.5
-
-
V
RL=60Ω VR=6.8V
ROUT low output voltage
VLR
-
1.2
V
RL=60Ω VR=6.8V
BA6920FP-Y (Unless otherwise specified, Ta=25°C, VCC1=12 V, VM=12 V)
Parameter
Symbol
Limit
Min.
Typ.
Max.
Unit
Conditions
Circuit current 1
ICC1
5
8
12
mA
Forward rotation or reverse mode
Circuit current 2
ICC2
3
5
8
mA
Brake mode
IST
-
-
15
μA
Standby mode
High-level input voltage
VIH
3.0
-
-
V
Low-level input voltage
VIL
-
-
0.8
V
High-level input current
IIH
100
200
300
μA
Circuit current
during standby mode
VIN=3.0V
Io = 200 mA: Total voltage of both high and low sides
Output saturation voltage
VCE
-
2.2
3.3
V
Power saving off voltage
VPS OFF
-
-
0.8
V
Operating mode
Power saving on voltage
VPS ON
2.0
Standby mode
REF bias current
IREF
-
-
V
12
35
μA
of output transistor
VREF=6V,Io=100mA
●I/O Logic table
BA6219BFP-Y
IN1
IN2
OUT1
OUT2
Mode
H
L
H
L
Forward rotation
L
H
L
H
Reverse rotation
H
H
L
L
Brake
L
L
OPEN(Hi-Z)
OPEN(Hi-Z)
Stop
BA6920FP-Y
FIN
RIN
POWER SAVE
OUT1
OUT2
Mode
H
L
L
H
L
Forward rotation
L
H
L
L
H
Reverse rotation
H
H
L
L
L
Brake
OPEN
OPEN
(Hi-Z)
(Hi-Z)
OPEN
OPEN
Power saving mode
(Hi-Z)
(Hi-Z)
(Output stop)
L
L
L
Don't Care
Don't Care
H
Stop
Note: When the POWERSAVE pin is at high level, OUT1 and OUT2 will be open regardless of the FIN or RIN logic.
2/8
●Reference data
30
-25℃
1.5
1
75℃
25℃
0.5
0
25
-25℃
20
15
5
12
14
16
18
10
15
Circuit current:Icc2[mA]
12
25℃
-30℃
9
6
12
14
16
85℃
3
0
15
20
25
30
7.5
12
9
-30℃
6
3
35
25℃
85℃
10
15
20
25
30
2.4
Output L Voltage:VOL[V
-0.9
85℃
25℃
-1.7
-30℃
-2.1
0.4
0.6
0.8
25℃
-25℃
6.75
0.5
2
1.4
1.6
25℃
-25℃
0.8
0.4
1.2
75℃
1.0
0.8
25℃
0.6
-30℃
0.4
0.2
0.0
0
0.5
Output Current:Iout[A]
1
1.5
2
0
0.2
Output Current:Iout[A]
0.4
0.6
0.8
1
Output Current:Iout[A]
Fig. 8 Low Output vs Output Current
(BA6219BFP-Y)
Fig. 7 High Output vs Output Current
(BA6920BFP-Y)
1.5
Fig. 6 High Output vs Output Current
(BA6219BFP-Y)
75℃
1.2
1
Output Current:Iout[A]
VCC1=VCC2=12V
VREF=5V
2.0
1
18
75℃
7
0
0.0
0.2
16
7.25
35
Fig. 5 Circuit current 2 (Brake)
(BA6920FP-Y)
-0.5
14
VCC1= VCC2=12Ｖ
VREF=6.8V
Supply Voltage:Vcc[v]
-0.1
12
6.5
5
Fig. 4 Circuit current 1 (Forward rotation)
(BA6920FP-Y)
0
10
Fig. 3 Circuit current 3 (Brake)
(BA6219BFP-Y)
FIN=H, RIN=H
VCC=VM
Supply Voltage:Vcc[v]
-1.3
10
Supply Voltage:Vcc[v]
Output L Voltage:VOL[V]
10
25℃
8
0
5
75℃
20
18
Fig. 2 Circuit current 2 (Reverse rotation)
(BA6219BFP-Y)
FIN=H, RIN=L
VCC=VM
-25℃
30
Supply Voltage :Vcc[v]
Fig. 1 Circuit current 1 (Standby)
(BA6219BFP-Y)
15
IN1=IN2=H
VCC1=VCC2
0
8
Output H Voltage:VOH[V
10
Supply Voltage:Vcc[v]
Circuit current:Icc1[mA]
75℃
25℃
10
0
8
Output H Voltage:VOH[V]
40
IN1=L, IN2=H
VCC1=VCC2
Circuit current:Icc3[mA]
IN1=IN2=L
VCC1=VCC2
Circuit current :Icc2[mA]
Circuit Current:Icc1[mA]
2
Fig. 9 Low Output vs Output Current
(BA6920AFP-Y)
3/8
N.C.
N.C.
N.C.
N.C.
N.C.
N.C
(GND)
Fig.11
Fig.10
N.C.
FIN
FIN
(GND)
N.C.
VREF
RIN
RNF
OUT2
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
OUT2
N.C.
CD2
N.C.
N.C.
VCC2
N.C
N.C.
N.C.
VCC1
GND
IN2
N.C.
GND
FIN
FIN
(GND)
N.C.
N.C.
OUT1
N.C.
GND
IN1
N.C.
VR.
N.C.
N.C.
CD1
N.C.
BA6920FP-Y
(GND)
BA6219BFP-Y
GND
OUT1
POWER SAVE
FIN
VCC
VM
●Pin assignment
●Block diagram
BA6219BFP-Y
BA6920FP-Y
③Current limiting resistor
- 1～100μF
+
①For preventing upper and
lower transistors from turning on simultaneously
POWER
0.01～1μF
SAVE
5～10Ω
④
VR
VCC2
VCC1
③Current limiting resistor
- 1～100μF
0.1μF
+
VCC1
VM
5～10Ω
POWER
CD1
LOGIC
IN2
OUT1 MOTOR
0.01μF
CONTROL
IN1
RIN
LOGIC
FIN
OUT2
CD2
TSD
①For preventing upper and
lower transistors from
turning on simultaneously 0.01～1μF
Fig.12
OUT2
TSD
0.1μF
GND
OUT1 MOTOR
0.01μF
CONTROL
ZD
②For output
oscillation
prevention
0.01～0.1μF
GND
②For output
oscillation
prevention
0.01～0.1μF
RNF
VREF
④
ZD
Fig.13
●Explanation of external components
① Capacitors that prevent upper and lower transistors from turning on simultaneously (Capacitors to connect to CD1 and CD2 pins in the
case of BA6219BFP-Y).
The rising of the base potential of the transistor at high-level output is delayed to prevent both transistors from turning on simultaneously.
Set the capacitance between 0.01μF and 1μF and ensure that a penetration current does not flow during output mode changes, since
the transistors do not turn on simultaneously.
② Capacitor for output oscillation prevention
The output pin may generate noise or oscillate, depending on the set mounting conditions, such as the power supply circuit, motor
characteristics, and PCB pattern artwork. Connect a capacitor with a capacitance value of 0.01μF to 0.1μF to prevent noise oscillation.
③ Resistance for current limiting
A resistor used to prevent collector loss and limit the current of output shorting. Although the required resistance varies with the supply
voltage, a resistance of approximately 5Ω to 10Ω should be selected. When designing the circuit, pay utmost attention to voltage
reduction resulting from a rush current that flows when the driving of the motor starts.
④ Zener diode for output voltage setting
Zener diode for high output voltage VR (VREF) setting. The zener voltage can be set almost equal to high output voltage.
BA6219BFP-Y
PIN No.
2
BA6920FP-Y
Pin Name
CD1
Function
Pin No
Pin name
Capacitor connection pin for prevention of
5
OUT2
6
RNF
upper and lower transistors to turn on
simultaneously
Function
Motor output pin
Connection pin for output current
detection on the GND pin of the
4
VR
High output voltage setting pin
6
IN1
Logic input pin
8
GND
7
GND
GND
9
OUT1
8
IN2
Logic input pin
16
VM
Motor power supply
output block
GND
Motor output pin
10
VCC1
Power supply pin for small signal block
17
Vcc
Power supply pin
11
VCC2
Power supply pin for motor output
18
FIN
Logic input pin
Capacitor connection pin for prevention of
upper and lower transistors to turn on
19
POWER
13
CD2
simultaneously
20
RIN
15
OUT2
Motor output pin
21
VREF
19
GND
GND
20
GND
GND
FIN
GND
24
OUT1
Motor output pin
FIN
GND
SAVE
Power saving input pin
Logic input pin
High output voltage setting pin
Note: Be sure to connect the heat
dissipation fin to the GND pin.
Note: Pins 1 to 4, 7, 10 to 14, and 20 to 24 are NC pins.
Note: Be sure to connect the heat
dissipation fin to the GND pin.
Note: Pins 1, 3, 5, 9, 12, 14, 16 to 18, 21 to 18, 21 to 23, and 25 are NC pins.
4/8
●IC Operation
BA6920FP-Y(BA6219BFP-Y)
1) I/O mode of input block FIN (IN1) and RIN (IN2)
A pin where control signals are input. Each mode operates as explained below.
When the FIN (IN1) is set to high and RIN (IN2) is set to low, the forward rotation mode will be set and a current will flow from OUT1 to
OUT2. When the FIN (IN1) is set to low and RIN (IN2) is set to high, the reverse rotation mode will be set and a current will flow from
OUT2 to OUT1. When both FIN (IN1) and RIN (IN2) are set to high, the brake mode will be set. At that time, the output transistor on the
high side will be turned off to stop the supply of the motor drive current while the output transistor on the low side will be turned on to
absorb the motor back EMF to brake the motor. When both FIN (IN1) and RIN (IN2) are set to low, OUT1 and OUT2 will be both open
potential and the motor will stop.
2) High output voltage setting function
With this function, the output voltage can be set through the high output voltage setting pin in order to control the rotation speed of the
motor. If the high output voltage is set to a lower value, the power consumption of the IC will become high. Consider the power
dissipation (Pd) of the IC under actual operating conditions, and implement thermal designing with a sufficient margin.
VCC1
2-1. BA6219BF-Y (See Fig.14)
{High output voltage is expressed by the following equation.
VoutH (high output voltage) = VR + {VF(Q5) + VF (Q6) + VF (Q7) - VF (Q2) -VF (Q3) - VF (Q4)}
≒VR +ΔVF
Q2
(VF is the base-emitter voltage in the forward direction)
Although ΔVF depends on the output current, Vo is almost VR.
The maximum value VoutHmax of high output voltage that can be set is as follows.
VoutHmax < VCC1 - Vsat (Q1) - VF (Q2) - VF (Q3) - VF (Q4)
VCC2
Q1
Q3
Q5
Q4
Q6
Q7
≒VCC1 - 2.5 V
OUT
{Relation of VCC1, VCC2, and VR
VR
VCC1, VCC2, and VR should be set as follows.
Fig.14
VR < VCC2 - Vsat (Q3) + VF (Q3) + VF (Q2) - {VF (Q5) + (Q6) + (Q7)}
≒VCC2 - 1 V
High output voltage
Operating Conditions
Pin
Voltage
Unit
VCC1
8 ～ 18
V
VCC2
8 ～ 18
V
VR
Shown above
-
VR (VREF) voltage
2-2. BA6920FP-Y (See Fig. 16)
{High output voltage is expressed by the following equation:
VoutH (high output voltage) = Vref voltage + {VF (Q2) + VF( Q3)} - {VF(Q4) + VF (Q5)}
Output Voltage Control Range
Fig.15
≒Vref voltage +ΔVF
(VF is the base-emitter voltage in the forward direction)
Although ΔVF depends on the output current, Vo is almost VR.
VCC
The VOH is beyond control if the Vref value is higher than the above, and determined
by the voltage condition of VCC and VM.
For example, when Vref = VCC
= VM,
VM
VOH≒VCC - Vsat (Q1) - VF (Q4) -VF (Q5)
Q1
≒VCC - 1.7 V
{Relation of VCC, VM, and VREF
Q4
VCC1, VCC2, and VR should be set as follows.
VREF < VM - Vsat (Q5) + VF (Q5) + VF (Q4) - {VF (Q2) + (Q3)}
≒ VM - 0.3 V
Q2
Q5
Q3
Operating conditions
pin
OUT
Voltage
Unit
VCC
6.5 ～ 34
V
VM
6.5 ～ 34
V
VREF
Shown above
-
VREF
Fig.16
3 ) Selection of forward or reverse rotation
To change the rotation direction of the motor in operation, be sure to brake or open the motor current on time.
In the above case,
Braking: The braking time or over. The braking time is defined as the time of setting the output low level voltage to the GND
potential or below, when the brake operates.
Opening: A period of 1 ms or over is recommended.
5/8
●Power Dissipation Reduction (Common)
Pd[Ｗ]
2.0
1.5
1.45
1.0
0.5
0
25
75 85 100
50
125
150 Ta[℃]
Fig.17
When mounted on a glass epoxy board with a dimension of 70 mm x 70 mm x 1.6 mm.
Reduced by 11.6 mW/°C over 25°C.
Must not exceed Pd or ASO.
●I/O Circuit Diagram
Input (BA6219BFP-Y)
Input (BA6920FP-Y)
FIN
RIN
IN1,IN2
13.2kΩ
11kΩ
20kΩ
4.7kΩ
11kΩ
10kΩ
10kΩ
10kΩ
20kΩ
10kΩ
GND
Fig.18
Output (BA6219BFP-Y)
Fig.19
Output (BA6920FP-Y)
VCC
CD1
VCC2
VM
CD2
Q1
Q4
VCC1
Q5
Q2
OUT2
VR
OUT1
OUT1 OUT2
Q3
VREF
GND
RNF
GND
Fig.20
Fig.21
●Operation Notes
1)
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2)
Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external
direction diode can be added.
6/8
3)
Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate
the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a
capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, note that capacitance
characteristic values are reduced at low temperatures.
4)
GND voltage
5)
Thermal design
6)
Inter-pin shorts and mounting errors
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or
if pins are shorted together.
7)
Actions in a strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8)
ASO
9)
Thermal shutdown circuit
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut
the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after
operating this circuit or use the IC in an environment where the operation of this circuit is assumed.
10)
TSD on temperature [°C] (Typ.)
Hysteresis temperature [°C] (Typ.)
BA6680FS
175
25
BD6761FS
175
35
BD6762FV
175
23
PWM drive
Voltage between the output FET drain and source may exceed the absolute maximum ratings due to the fluctuation of VCC at the time
of PWM driving. If there is the threat of this problem, it is recommended to take physical countermeasures for safety such as inserting
the capacitor between the VCC pin of FET and the detection resistor pin.
11)
Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
discharge capacitors after each process or step.
Always
Always turn the IC's power supply off before connecting it to or removing it from a jig
or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.
Use similar precaution when
transporting or storing the IC.
12)
Regarding input pin of the IC (Fig. 22)
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor.
For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a
voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Transistor (NPN)
Resistor
Pin A
Pin B
C
Pin B
B
E
Pin A
N
N
P+
N
P+
P
N
Parasitic
element
P+
P substrate
Parasitic element
GND
B
N
P+
P
N
C
E
Parasitic
element
P substrate
Parasitic element
GND
GND
GND
Other adjacent elements
Fig.22 Example of IC structure
13)
Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents
do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components,
either.
7/8
●Selecting a model name when ordering
B
6
A
9
2
0
F
P
-
Y
E
2
－
Part number
ROHM model name
Package type
Taping type
E2 = Reel-wound embossed taping
HSOP25
<Tape and Reel information>
<Dimension>
Embossed carrier tape
Tape
Quantity
13.6 ± 0.2
0.11
0.3Min.
7.8 ± 0.3
1.9 ± 0.1
1
1.95 ± 0.1
13
0.8
2000pcs
E2
Direction
of feed
14
5.4 ± 0.2
25
2.75 ± 0.1
(Correct direction: 1pin of product should be at the upper left when you
hold reel on the left hand, and you pull out the tape on the right hand)
0.25 ± 0.1
0.1
1234
1234
1Pin
1234
1234
Reel
1234
(Unit:mm)
1234
1234
0.36 ± 0.1
Direction of feed
※Orders are available in complete units only.
The contents described herein are correct as of October, 2005
The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD.
Any part of this application note must not be duplicated or copied without our permission.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding
upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any
warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such
infringement, or arising from or connected with or related to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other
proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer.
The products described herein utilize silicon as the main material.
The products described herein are not designed to be X ray proof.
Published by
Application Engineering Group
Catalog No.05T333Be '05.10 ROHM C 1000 TSU
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
ROHM Customer Support System
www.rohm.com
Copyright © 2008 ROHM CO.,LTD.
THE AMERICAS / EUROPE / ASIA / JAPAN
Contact us : webmaster@ rohm.co. jp
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
TEL : +81-75-311-2121
FAX : +81-75-315-0172
Appendix1-Rev2.0