Material Content Data Sheet Sales Product Name SPA06N60C3 Issued MA# MA001044372 Package PG-TO220-3-121 28. August 2013 Weight* 2240.47 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7723-14-0 7439-89-6 7440-50-8 4.096 0.18 0.687 0.03 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.18 1828 1828 307 0.206 0.01 686.221 30.63 30.67 306285 92 306684 0.708 0.03 0.03 316 316 2.210 0.10 987 207.774 9.27 895.195 39.96 49.33 399557 493282 7.942 0.35 0.35 3545 3545 0.305 0.01 0.001 0.00 0.245 0.01 0.612 0.03 1.591 0.07 0.130 0.01 0.433 0.02 432.110 19.29 92737 136 0.01 1 273 0.11 710 2. 3. 193 19.32 192866 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1092 58 Important Remarks: 1. 136 109 193117 1000000