RF SWITCH CG2214M6 L, S-band Power SPDT Enter aMedium Short Document/Title NameSwitch Here DESCRIPTION PACKAGE The CG2214M6 is a pHEMT GaAs SPDT (Single Pole Double Throw) switch. This device can operate from 0.05 to 3.0 GHz, having low insertion loss and high isolation. 6-pin lead-less mini mold package (1.5mm x 1.1mm x 0.55mm) FEATURES Control voltage : VC(H) = 1.8 to 5.0 V (3.0 V TYP.) VC(L) = -0.2 to 0.2 V (0 V TYP.) Low insertion loss : Lins1 = 0.30 dB TYP. @ f = 0.05 to 0.5 GHz Lins2 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz Lins3 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz Lins4 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz Lins5 = 0.35 dB TYP. @ f = 2.5 to 3.0 GHz High isolation : ISL1 = 38 dB TYP. @ f = 0.05 to 0.5 GHz ISL2 = 32 dB TYP. @ f = 0.5 to 1.0 GHz ISL3 = 27 dB TYP. @ f = 1.0 to 2.0 GHz ISL4 = 25 dB TYP. @ f = 2.0 to 2.5 GHz ISL5 = 23 dB TYP. @ f = 2.5 to 3.0 GHz Power handling : Pin(0.5dB) = +32 dBm TYP. @ f = 3.0 GHz VC(H) = 3.0 V, VC(L) = 0 V APPLICATIONS Wireless LAN (IEEE 802.11 b/g/n/ac) ORDERING INFORMATION Part Number Order Number CG2214M6 CG2214M6-C2 CG2214M6-EVAL CG2214M6-EVAL This document is subject to change without notice. Date Published: September 2017 CDS-0025-04 (Issue C) Package 6-pin lead-less mini mold package (Pb-Free) Marking C07 Description • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • MOQ 9 kpcs/reel • Evaluation Board with DC block capacitors, power supply bypass capacitors, and RF and DC connectors • MOQ 1 1 CG2214M6 PIN CONFIGURATION AND INTERNAL BLOCK DIAGRAM TRUTH TABLE VC1 VC2 RFC-RF1 RFC-RF2 Low High ON OFF High Low OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25˚C, unless otherwise specified) Parameter Symbol Rating Unit VC 6.0Note 1 V Control Voltage Input Power Note 2 dBm Note 3 dBm +33 Pin1 Pin2 +29 Operating Ambient Temperature TA -45~+85 ˚C Storage Temperature Tstg -55~+150 ˚C Note 1. |VC1 - VC2| ≦ 6.0 V 2. 3.0V ≦ |VC1 – VC2| ≦ 5.0 V, f ≧ 0.4 GHz 3. 3.0V ≦ |VC1 – VC2| ≦ 5.0 V, 0.4GHz ≧ f ≧ 0.05GHz RECOMMENDED OPERATING RANGE (TA = +25˚C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit f 0.05 - 3.0 GHz Switch Control Voltage (H) VC(H) +1.8 +3.0 +5.3 V Switch Control Voltage (L) VC(L) -0.2 0 +0.2 V Operating Frequency This document is subject to change without notice. 2 CG2214M6 ELECTRICAL CHARACTERISTICS 1 (TA = +25˚C, VC(H) = 3.0 V, VC(L) = 0 V, Zo = 50 Ω, DC Block Capacitance = 56 pF, unless otherwise specified) Parameter Insertion Loss Symbol Condition MIN. TYP. MAX. Unit LINS1 f=0.05 to 0.5GHz Note 1 - 0.30 0.50 dB LINS2 f=0.5 to 1.0GHz - 0.30 0.50 dB LINS3 f=1.0 to 2.0GHz - 0.30 0.50 dB LINS4 f=2.0 to 2.5GHz - 0.35 0.55 dB LINS5 f=2.5 to 3.0GHz - 0.35 0.55 dB ISL1 f=0.05 to 0.5GHz Note 1 35 38 - dB ISL2 f=0.5 to 1.0GHz 29 32 - dB ISL3 f=1.0 to 2.0GHz 24 27 - dB ISL4 f=2.0 to 2.5GHz 22 25 - dB ISL5 f=2.5 to 3.0GHz 20 23 - dB RL f=0.05 to 3.0GHz Note 1 15 20 - dB 0.1dB Loss Compression Input Power Note 2 Pin(0.1dB) f=0.05 ~ 0.5GHz Note 1 - +26 - dBm f=0.5 ~ 3.0GHz - +30 - dBm 0.5dB Loss Compression Input Power Note 3 Pin(0.5dB) f=0.05 ~ 0.5GHz Note 1 - +28 - dBm f=0.5 ~ 3.0GHz - +32 - dBm Isolation Return Loss 2nd Harmonics 2f0 f=3.0GHz, Pin=+20dBm - -85 - dBc 3rd Harmonics 3f0 f=3.0GHz, Pin=+20dBm - -85 - dBc 3rd Order Input Intercept Point IIP3 f=2.5GHz, 2-tone 1MHz Spacing - +58 - dBm Error Vector Magnitude EVM 802.11g, 64QAM, 54Mbps Pin≦+25dBm - 2.5 - % Switch Control Current ICONT RF none - 1 10 uA 50% CTL to 90/10% RF - 50 - ns Switching Speed tSW Note 1. DC block capacitance = 1000 pF at f = 0.05 to 0.5 GHz Note 2. Pin(0.1dB) is the measured input power level when the insertion loss increases 0.1dB more than that of the linear range. Note 3. Pin(0.5dB) is the measured input power level when the insertion loss increases 0.5dB more than that of the linear range This document is subject to change without notice. 3 CG2214M6 ELECTRICAL CHARACTERISTICS 2 (TA=+25℃, VC(H)=1.8V, VC(L)=0V, Parameter Insertion Loss Isolation Return Loss 0.1dB Loss Compression Input Power Note 2 0.5dB Loss Compression Input Power Note 3 Switch Control Current Zo=50Ω, Symbol DC Block Capacitance=56pF, unless otherwise specified) Condition MIN. TYP. MAX. Unit LINS1 f=0.05 to 0.5GHz Note 1 --- 0.30 0.50 dB LINS2 f=0.5 to 1.0GHz --- 0.30 0.50 dB LINS3 f=1.0 to 2.0GHz --- 0.30 0.50 dB LINS4 f=2.0 to 2.5GHz --- 0.35 0.55 dB LINS5 f=2.5 to 3.0GHz --- 0.35 0.55 dB ISL1 f=0.05 to 0.5GHz Note 1 35 38 --- dB ISL2 f=0.5 to 1.0GHz 29 32 --- dB ISL3 f=1.0 to 2.0GHz 24 27 --- dB ISL4 f=2.0 to 2.5GHz 22 25 --- dB ISL5 f=2.5 to 3.0GHz 20 23 --- dB RL f=0.05 to 3.0GHz Note 1 15 20 --- dB Pin(0.1dB) f=0.05~0.5GHz Note 1 --- +19 --- dBm f=0.5~3.0GHz --- +23 --- dBm f=0.05~0.5GHz Note 1 --- +22 --- dBm f=0.5~3.0GHz --- +26 --- dBm RF none --- 1 10 uA Pin(0.5dB) ICONT Switching Speed TSW 50% CTL to 90/10% RF --50 --ns Note 1. DC block capacitance = 1000pF at f=0.05 to 0.5GHz Note 2. Pin(0.1dB) is the measured input power level when the insertion loss increases 0.1dB more than that of the linear range. Note 3. Pin(0.5dB) is the measured input power level when the insertion loss increases 0.5dB more than that of the linear range. This document is subject to change without notice. 4 CG2214M6 TYPICAL CHARACTERISTICS (Vc(H)=3V, Vc(L)=0V, TA=+25℃, DC Block Capacitance=56pF, through board loss is subtracted in insertion loss data) Typical Isolation vs. Frequency Typical Insertion Loss vs. Frequency Typical Insertion Loss vs. Input Power Typical Return Loss vs. Frequency This document is subject to change without notice. 5 CG2214M6 EVALUATION CIRCUIT Note C0 :0.05 to 0.5 GHz 1000pF : 0.5 to 3.0 GHz 56pF The application circuits and their parameters are for reference only and are not intended for use in actual designs. DC Blocking Capacitors are required at all RF ports. PACKAGE DIMENSIONS 6-pin lead-less mini mold package (Unit: mm) This document is subject to change without notice. 6 CG2214M6 RECOMMENDED SOLDERING CONDITIONS Recommended Soldering Conditions are available on CEL’s Part Summary page under Associated Documents This document is subject to change without notice. 7 CG2214M6 REVISION HISTORY Version Change to current version Page(s) CDS-0021-01 (Issue A) February 17, 2016 CDS-0021-02 (Issue B) March 29, 2016 Initial datasheet N/A Added Eval Board ordering information Updated marking information 1, 2 CDS-0021-03 (Issue C) April 20, 2016 Updated Features section 1 CDS-0021-03 (Issue D) August 11, 2016 Removed “preliminary” All CDS-0025-01 (Issue A) September 14, 2016 Revise CDS No. CDS-0021-03 to CDS-0025-01 N/A CDS-0025-01 (Issue B) January 11, 2017 Revised Electrical Characteristics table Added “Recommended Soldering Conditions” section 3, 5 CDS-0025-04 (Issue C) September 11, 2017 Updated Applications section Added Error Vector Magnitude parameter to Electrical Characteristics table 1, Added a second Electrical Characteristics table Added Typical Characteristics graphs section 1, 2, 3, 4, 5 This document is subject to change without notice. 8 CG2214M6 [CAUTION] ・ All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. ・ You should not alter, modify, copy, or otherwise misappropriate any CEL product, whether in whole or in part. ・ CEL does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of CEL products or technical information described in this document. No license, expressed, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of CEL or others. ・ Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. CEL assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. ・ CEL has used reasonable care in preparing the information included in this document, but CEL does not warrant that such information is error free. CEL assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. ・ Although CEL endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a CEL product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. ・ Please use CEL products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. CEL assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. ・ This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of CEL. ・ Please contact CEL if you have any questions regarding the information contained in this document or CEL products, or if you have any other inquiries. This document is subject to change without notice. 9 CG2214M6 [CAUTION] This product uses gallium arsenide (GaAs) of the toxic substance appointed in laws and ordinances. GaAs vapor and powder are hazardous to human health if inhaled or ingested. ・ Do not dispose in fire or break up this product. ・ Do not chemically make gas or powder with this product. ・ When discarding this product, please obey the laws of your country. ・ Do not lick the product or in any way allow it to enter the mouth. [CAUTION] Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. CEL Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054 • Tel: (408) 919-2500 • www.cel.com For a complete list of sales offices, representatives and distributors, Please visit our website: www.cel.com/contactus For inquiries email us at [email protected] This document is subject to change without notice. 10