EPCOS B57221V2152+060 Smd ntc thermistors with nickel barrier termination Datasheet

B572**
Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0402
V 2**
SMD NTC thermistors with nickel barrier termination
Applications
0,5±0,05
0,6 max.
0,25±0,15
– mobile phone applications (e.g. battery pack, TCXO, LCD)
– data systems
– automotive electronics
1,0±0,1
■ Temperature measurement and compensation in
Features
■ Multilayer SMD NTC with inner electrodes
■ Ni barrier termination (Ag/Ni/Sn)
■ High accuracy: ± 5 % in resistance,
Termination
B value tolerance down to ± 1,5 % available on request
■ Excellent long-term ageing stability in high-temperature
and high-humidity environment
■ Superior resistance stability during soldering (change < 1 %)
TNT0395-Q
Dimensions in mm
Approx. weight 4,5 mg
Options
Alternative resistance ratings, resistance tol. < 5 % and B value tol. < 3 % available on request
Delivery mode
Cardboard tape, 180-mm reel, PU: 10000 pcs
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB)
Resistance tolerance
Rated temperature
B value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P251)
∆R N/R N
TN
∆B/B
δth1)
τc1)
Cth1)
B25/85
55/125/56
150
± 5 %, ± 10 %
25
±3%
approx. 2,5
approx. 3,0
approx. 7,5
B 25/100
mW
°C
mW/K
s
mJ/K
Ordering code
No. of R/T
characteristic
B 25/50
K
K
K
100
8501
3470
3540
3550
B57211V2101+060
150
8501
3470
3540
3550
B57211V2151+060
220
8501
3470
3540
3550
B57211V2221+060
330
8501
3470
3540
3550
B57211V2331+060
470
8501
3470
3540
3550
B57211V2471+060
1,0 k
8502
3940
3980
4000
B57221V2102+060
1,5 k
8502
3940
3980
4000
B57221V2152+060
2,2 k
8502
3940
3980
4000
B57221V2222+060
3,3 k
8502
3940
3980
4000
B57221V2332+060
4,7 k
8502
3940
3980
4000
B57221V2472+060
8502
3940
3980
4000
B57221V2103+060
R 25
Ω
10 k
1) Depends on mounting situation
48
05/02
Temperature Measurement
B572**
SMD NTC Thermistors with Nickel Barrier Termination, Size 0402
B25/85
B 25/100
V 2**
Ordering code
No. of R/T
characteristic
B 25/50
K
K
K
10 k
8503
4390
4470
4500
B57231V2103+060
15 k
8503
4390
4470
4500
B57231V2153+060
22 k
8503
4390
4470
4500
B57231V2223+060
33 k
8503
4390
4470
4500
B57231V2333+060
47 k
8503
4390
4470
4500
B57231V2473+060
R 25
Ω
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25/R 25
(typical)
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
<2%
Storage in damp
heat, steady state
IEC
60068-2-3
JIS C 0022
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/–3) %
Duration: 56 days
<2%
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: – 55 °C < 2 %
Upper test temperature: 125 °C
Number of cycles: 100
Endurance
Solderability
Pmax: 150 mW
T: (65 ± 2) °C
t: 1000 h
IEC
60068-2-58
JIS C 0054
<2%
95 % of
terminations
wetted
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
Resistance drift
after soldering
Reflow soldering profile
49
Remarks
05/02
<1%
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++49 89 636 09, FAX (0 89) 636-2 26 89
(
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