OKI MBF9041BB Saw antenna duplexer (700 to 1000 mhz) Datasheet

OKI Semiconductor
MBF9041BB
FEDW9041BB-02
Issue Date: May 20. 2002
SAW Antenna Duplexer (700 to 1000 MHz)
GENERAL DESCRIPTION
The MBF9041BB is the SAW antenna duplexer for the frequency range of 700 to 1000 MHz.
This SAW Duplexer integrates RF filters at Tx and Rx side, and matching circuit into PKG. This helps to save the
space and weight greatly in the target application such as mobile telephone.
This SAW Duplexer has very low insertion loss by using high quality package.
Due to high harmonics characteristics, total number of components at RF circuit can be minimized.
Thanks to high isolation performance, high sensitivity can be expected. Low insertion loss at Tx saves the power
consumption of mobile telephone which prolong the battery life.
FEATURES
• Complying Standard AMPS, IS-95, IS-136
• Thin package: less than 1.5 mm in height
• PKG I/O Impedance: 50 Ω
PRODUCT DESCRIPTION
Package Type
MBF9041BB
OKI
Rx
041BB
Tx
YZZZ
ANT
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MBF9041BB
PIN ASSIGNMENT & DESCRIPTION
Top view
(12)
(11)
(10)
OKI
(13)
(14)
YZZZ
(1)
(2)
(8)
(7)
041BB
(15)
(16)
(9)
(6)
(5)
(3)
(4)
Bottom view
(16)
(1)
(2)
(3)
(15)
(5)
(14)
This number is for OKI
production purpose only.
(6)
(17)
(7)
(13)
(12)
(4)
(11)
(10)
(9)
(8)
Pin No.
1
Name
GND
Description
Ground Pin
2
3
4
ANT
GND
GND
Antenna Pin
Ground Pin
No Connection *
5
GND
Ground Pin
6
7
Tx
GND
Transmitting Terminal Pin
Ground Pin
8
9
GND
GND
No Connection *
Ground Pin
10
11
12
GND
GND
GND
Ground Pin
Ground Pin
No Connection *
13
14
GND
Rx
Ground Pin
Receiving Terminal Pin
15
GND
Ground Pin
16
17
GND
GND
No Connection *
Ground Pin
Note) Pin No. 4, 8, 12 and 16 are for manufacturer’s internal
use. Do not solder to the PCB.
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MBF9041BB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Min.
Max.
Ta
–30
+85
°C
Storage Temperature
TSTG
–40
+85
°C
Maximum Input Power
PIN
—
2.0
W
Operating Temperature
RECOMMENDED OPERATING CONDITIONS
Parameter
Operating Temperature
Symbol
Ta
Rating
Min.
Max.
–30
+85
Unit
°C
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ELECTRICAL CHARACTERISTICS
Parameter
Condition
Mini.
Typ.
824 to 849 MHz
—
2.4
(Ta = –30 to +85°C)
Max.
Unit/Notes
Tx → Antenna
a)
Insertion loss
2.8
dB
dB
b)
Passband ripple
824 to 849 MHz
—
1.0
1.5
c)
VSWR
824 to 849 MHz
—
1.7
2.0
869 to 894 MHz
40
42
—
d)
Absolute attenuation
dB
1648 to 1698 MHz
30
33
—
dB
2472 to 2547 MHz
30
33
—
dB
Antenna → Rx
a)
Insertion loss
869 to 894 MHz
—
3.4
3.8
dB
b)
Passband ripple
869 to 894 MHz
—
1.4
2.0
dB
c)
VSWR
869 to 894 MHz
—
1.8
2.1
824 to 849 MHz
50
53
—
dB
930 to 1200 MHz
33
38
—
dB
1200 to 1500 MHz
40
45
—
dB
1500 to 1800 MHz
40
45
—
dB
824 to 849 MHz
55
—
—
dB
—
—
—
2
W
d)
Absolute attenuation
Isolation TX → RX
a)
Absolute attenuation
Input Power
a)
Average power
Note: Electrical characteristics described above is guaranteed by the following measurement and
equipment condition.
1) Test board: See next page
2) Measurement machine : Network analyzer
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MBF9041BB
Test Board
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MBF9041BB
MARKING
Company Logo
OKI
Part Symbol
041BB
Lot Number
YZZZ
Antenna Index
Note)
Lot Number
Y:
ZZZ:
Last number of year
Serial number
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MBF9041BB
REFLOW TEMPERATURE PROFILE
The figure below shows recommended temperature profile of infrared reflow and air reflow. Other type
of reflow is not recommended.
The maximum reflow count is 2 times. Washing of this device after reflow process is prohibited.
250
235 to 240°C,
20 sec. max.
Package surface Temperature (°C)
1 to 4°C/sec.
200
Preheat temperature:
120 to 150°C
20 sec.max
1 to 4°C/sec.
150
40 to 60 sec.
100
50
2 to 5°C/sec.
Time (sec.)
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PACKAGE DIMENTION
Unit: mm
General tolerance: ±0.15
9.5
±0.2
±0.2
OKI
7.5
041BB
(2.21)
2.54
(1.3 typ.)
TYP.
5.08
(0.8)
TYP.
(0.8)
1.5max
YZZZ
(2.48)
0.6
4.9
4 - R0.15
1.1
11-0.8
1.5
1.27
3.0
2.54
2.45
12 - R0.2
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RECOMMENDATION FOR SOLDER PAD PATTERN
The solder pad pattern should be designed by customers because it depends on the electrical
performance of the customers’ system. Following is an example of solder pad pattern which is used in
OKI’s package evaluation board. Please be noted that this is for reference purpose only.
25 µm
0.1 mm
0.1 mm
25 µm
0.5 mm
0.1 mm
PCB pad pattern
Metal mask pattern
Pad of Device
Please pay attention to the following items to maintain electrical performance.
(1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in
thickness.
(2) As the impedance of Tx, Rx, ANT is designed for 50 Ω, please consider this for the design of mother board.
(3) The performance of these devices is assured when GND pad (Pin 17) is connected. GND pad (Pin 17) should
be soldered in the same way as above.
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REVISION HISTORY
Document
No.
Date
FEDW9041BB-01
April 2000
FEDW9041BB-02
May20, 2002
Page
Previous Current
Edition
Edition
Description
–
–
Final edition 1
–
–
Final edition 2
1
1
Partially changed the content of “PRODUCT
DESCRIPTION”.
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MBF9041BB
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2002 Oki Electric Industry Co., Ltd.
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