TI1 LM317SX/NOPB Lm117/lm317a/lm317-n three-terminal adjustable regulator Datasheet

LM117, LM317A, LM317-N
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SNVS774O – MAY 2004 – REVISED JANUARY 2014
LM117/LM317A/LM317-N Three-Terminal Adjustable Regulator
Check for Samples: LM117, LM317A, LM317-N
FEATURES
1
•
2
•
•
•
•
•
•
•
•
Specified 1% Output Voltage Tolerance
(LM317A)
Specified max. 0.01%/V Line Regulation
(LM317A)
Specified max. 0.3% Load Regulation (LM117)
Specified 1.5A Output Current
Adjustable Output Down to 1.2V
Current Limit Constant with Temperature
P+ Product Enhancement tested
80 dB Ripple Rejection
Output is Short-Circuit Protected
DESCRIPTION
The LM117 series of adjustable 3-terminal positive
voltage regulators is capable of supplying in excess
of 1.5A over a 1.2V to 37V output range. They are
exceptionally easy to use and require only two
external resistors to set the output voltage. Further,
both line and load regulation are better than standard
fixed regulators. Also, the LM117 is packaged in
standard transistor packages which are easily
mounted and handled.
In addition to higher performance than fixed
regulators, the LM117 series offers full overload
protection available only in IC's. Included on the chip
are current limit, thermal overload protection and safe
area protection. All overload protection circuitry
remains fully functional even if the adjustment
terminal is disconnected.
Normally, no capacitors are needed unless the device
is situated more than 6 inches from the input filter
capacitors in which case an input bypass is needed.
An optional output capacitor can be added to improve
transient response. The adjustment terminal can be
bypassed to achieve very high ripple rejection ratios
which are difficult to achieve with standard 3-terminal
regulators.
Besides replacing fixed regulators, the LM117 is
useful in a wide variety of other applications. Since
the regulator is “floating” and sees only the input-tooutput differential voltage, supplies of several
hundred volts can be regulated as long as the
maximum input to output differential is not exceeded,
i.e., avoid short-circuiting the output.
Also, it makes an especially simple adjustable
switching regulator, a programmable output regulator,
or by connecting a fixed resistor between the
adjustment pin and output, the LM117 can be used
as a precision current regulator. Supplies with
electronic shutdown can be achieved by clamping the
adjustment terminal to ground which programs the
output to 1.2V where most loads draw little current.
For applications requiring greater output current, see
LM150 series (3A) and LM138 series (5A) data
sheets. For the negative complement, see LM137
series data sheet.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Typical Applications
Full output current not available at high input-output voltages
*Needed if device is more than 6 inches from filter capacitors.
†Optional—improves transient response. Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum
electrolytic are commonly used to provide improved output impedance and rejection of transients.
Figure 1. 1.2V–25V Adjustable Regulator
LM117/LM317A/LM317-N Package Options
Part Number
Package Drawing
Package Type
NDS
TO-3
LM117K STEEL
LM317K
LM317AT
LM317T
NDE
TO-220
LM317T/LF01
NDG
LM317S
KTT
TO-263
DCY
SOT-223
NDT
TO
LM317AEMP
LM317EMP
Output Current
1.5A
1.0A
LM117H
LM317AH
LM317H
LM317AMDT
LM317MDT
0.5A
NDP
TO-252
NOTE
For part numbers that can be ordered, please see the Package Option Addendum at the
end of the datasheet.
SOT-223 vs. TO-252 Packages
Figure 2. Scale 1:1
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Connection Diagrams
CASE IS OUTPUT
CASE IS OUTPUT
Figure 3. TO-3 (NDS)
Metal Can Package
Bottom View
Package Drawing NDS
Figure 4. TO (NDT)
Metal Can Package
Bottom View
Package Drawing NDT
Figure 5. TO-263 (KTT)
Surface-Mount Package
Top View
Package Drawing KTT
Figure 6. TO-220 (NDE)
Plastic Package
Front View
Package Drawing NDE
Figure 7. 4-Lead SOT-223 (DCY)
Top View Surface-Mount Package
Package Number DCY
Figure 8. TO-252 (NDP)
Front View Surface Mount Package
Package Drawing NDP
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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ABSOLUTE MAXIMUM RATINGS
(1) (2)
Power Dissipation
Internally Limited
+40V, −0.3V
Input-Output Voltage Differential
−65°C to +150°C
Storage Temperature
Lead Temperature
ESD Tolerance
(1)
(2)
(3)
Metal Package (Soldering, 10 seconds)
300°C
Plastic Package (Soldering, 4 seconds)
260°C
(3)
3 kV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
OPERATING TEMPERATURE RANGE
LM117
−55°C ≤ TJ ≤ +150°C
LM317A
−40°C ≤ TJ ≤ +125°C
0°C ≤ TJ ≤ +125°C
LM317-N
Preconditioning
Thermal Limit Burn-In
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LM117 ELECTRICAL CHARACTERISTICS (1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
Parameter
Conditions
LM117
(2)
Min
Typ
Max
Units
1.20
1.25
1.30
V
0.01
0.02
0.02
0.05
%/V
0.1
0.3
0.3
1
%
0.03
0.07
%/W
Adjustment Pin Current
50
100
μA
10 mA ≤ IOUT ≤ IMAX (1)
Adjustment Pin Current Change
3V ≤ (VIN − VOUT) ≤ 40V
0.2
5
μA
Reference Voltage
3V ≤ (VIN − VOUT) ≤ 40V,
10 mA ≤ IOUT ≤ IMAX (1)
Line Regulation
3V ≤ (VIN − VOUT) ≤ 40V
Load Regulation
10 mA ≤ IOUT ≤ IMAX (1)
Thermal Regulation
20 ms Pulse
Temperature Stability
TMIN ≤ TJ ≤ TMAX
Minimum Load Current
(VIN − VOUT) = 40V
(VIN − VOUT) ≤ 15V
Current Limit
(VIN − VOUT) = 40V
RMS Output Noise, % of VOUT
Ripple Rejection Ratio
(3)
(3)
1
3.5
5
NDS Package
1.5
2.2
3.4
NDT Package
0.5
0.8
1.8
NDS Package
0.3
0.4
NDT Package
0.15
0.20
10 Hz ≤ f ≤ 10 kHz
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
66
A
%
dB
80
0.3
Thermal Resistance, θJC
Junction-to-Case
NDS (TO-3) Package
2
NDT (TO) Package
21
Thermal Resistance, θJA
Junction-to-Ambient
(No Heat Sink)
NDS (TO-3) Package
39
NDT (TO) Package
186
(3)
A
65
TJ = 125°C, 1000 hrs
(2)
mA
0.003
Long-Term Stability
(1)
%
dB
1
%
°C/W
°C/W
IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A
for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum
junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is :
PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
Specifications and availability for military and space grades of LM117/883 can be found in the LM117QML datasheet (SNVS356).
Specifications and availability for military and space grades of LM117/JAN can be found in the LM117JAN datasheet (SNVS365).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
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LM317A and LM317-N ELECTRICAL CHARACTERISTICS (1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
LM317A
Parameter
Conditions
Reference Voltage
3V ≤ (VIN − VOUT) ≤ 40V,
10 mA ≤ IOUT ≤ IMAX (1)
Line Regulation
3V ≤ (VIN − VOUT) ≤ 40V
Load Regulation
10 mA ≤ IOUT ≤ IMAX (1)
Thermal Regulation
20 ms Pulse
Min
Typ
Max
Min
Typ
Max
Unit
s
1.238
1.250
1.262
-
1.25
-
V
1.225
1.250
1.270
1.20
1.25
1.30
V
0.005
0.01
0.01
0.02
0.01
0.02
0.04
0.07
%/V
0.1
0.3
0.5
1
0.1
0.3
0.5
1.5
%
0.04
0.07
0.04
0.07
%/W
50
100
50
100
μA
0.2
5
0.2
5
μA
10
3.5
10
mA
(2)
(2)
Adjustment Pin Current
Adjustment Pin Current
Change
10 mA ≤ IOUT ≤ IMAX (1)
3V ≤ (VIN − VOUT) ≤ 40V
Temperature Stability
TMIN ≤ TJ ≤ TMAX
Minimum Load Current
(VIN − VOUT) = 40V
1
3.5
(VIN − VOUT) ≤ 15V
Current Limit
Ripple Rejection Ratio
Long-Term Stability
Thermal Resistance, θJC
Junction-to-Case
-
-
-
1.5
2.2
3.4
1.5
2.2
3.4
1.5
2.2
3.4
NDT Package
0.5
0.8
1.8
0.5
0.8
1.8
-
-
0.15
0.40
DCY, NDE Packages
0.15
0.40
0.15
0.40
NDT Package
0.075
0.20
0.075
0.20
10 Hz ≤ f ≤ 10 kHz
0.003
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
TJ = 125°C, 1000 hrs
65
66
80
0.3
6
dB
80
0.3
-
2
4
KTT (TO-263) Package
-
4
23.5
23.5
NDT (TO) Package
21
21
NDP (TO-252) Package
12
12
DCY (SOT-223) Package
-
39
50
50
-
50
140
140
186
186
103
103
(3)
DCY (SOT-223) Package
NDP (TO-252) Package
(3)
65
4
(3)
NDT (TO) Package
(2)
1
(3)
A
%
NDE (TO-220) Package
NDE (TO-220) Package
(1)
66
A
0.003
NDS (TO-3) Package
KTT (TO-263) Package
%
DCY, NDE Packages
NDS (TO-3) Package
Thermal Resistance, θJA
Junction-to-Ambient
(No Heat Sink)
1
NDS, KTT Packages
NDS, KTT Packages
(VIN − VOUT) = 40V
RMS Output Noise, % of
VOUT
LM317-N
dB
1
%
°C/W
°C/W
IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A
for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum
junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is :
PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the APPLICATION HINTS section for heatsink
techniques.
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TYPICAL PERFORMANCE CHARACTERISTICS
Output Capacitor = 0 μF unless otherwise noted
Load Regulation
Current Limit
Figure 9.
Figure 10.
Adjustment Current
Dropout Voltage
Figure 11.
Figure 12.
VOUT vs VIN, VOUT = VREF
VOUT vs VIN, VOUT = 5V
Figure 13.
Figure 14.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Output Capacitor = 0 μF unless otherwise noted
8
Temperature Stability
Minimum Operating Current
Figure 15.
Figure 16.
Ripple Rejection
Ripple Rejection
Figure 17.
Figure 18.
Ripple Rejection
Output Impedance
Figure 19.
Figure 20.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Output Capacitor = 0 μF unless otherwise noted
Line Transient Response
Load Transient Response
Figure 21.
Figure 22.
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APPLICATION HINTS
In operation, the LM117 develops a nominal 1.25V reference voltage, VREF, between the output and adjustment
terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a
constant current I1 then flows through the output set resistor R2, giving an output voltage of
(1)
Since the 100 μA current from the adjustment terminal represents an error term, the LM117 was designed to
minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is
returned to the output establishing a minimum load current requirement. If there is insufficient load on the output,
the output will rise.
External Capacitors
An input bypass capacitor is recommended. A 0.1 μF disc or 1μF solid tantalum on the input is suitable input
bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when
adjustment or output capacitors are used but the above values will eliminate the possibility of problems.
The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass
capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μF bypass capacitor
80 dB ripple rejection is obtainable at any output level. Increases over 10 μF do not appreciably improve the
ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to
include protection diodes to prevent the capacitor from discharging through internal low current paths and
damaging the device.
In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance
even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to
equal 1μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some
types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may
seem to work better than a 0.1 μF disc as a bypass.
Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external
capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μF solid
tantalum (or 25 μF aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of
the load capacitance larger than 10 μF will merely improve the loop stability and output impedance.
Load Regulation
The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain
maximum performance. The current set resistor connected between the adjustment terminal and the output
terminal (usually 240Ω) should be tied directly to the output (case) of the regulator rather than near the load. This
eliminates line drops from appearing effectively in series with the reference and degrading regulation. For
example, a 15V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to
line resistance of 0.05Ω × IL. If the set resistor is connected near the load the effective line resistance will be
0.05Ω (1 + R2/R1) or in this case, 11.5 times worse.
Figure 23 shows the effect of resistance between the regulator and 240Ω set resistor.
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Figure 23. Regulator with Line Resistance in Output Lead
With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two
separate leads to the case. However, with the TO-39 package, care should be taken to minimize the wire length
of the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground
sensing and improve load regulation.
Protection Diodes
When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10 μF capacitors have
low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and the rate of decrease of VIN. In the LM117, this discharge path is through a large junction that
is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output
capacitors of 25 μF or less, there is no need to use diodes.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted. Internal to the LM117 is a 50Ω resistor which limits the peak
discharge current. No protection is needed for output voltages of 25V or less and 10 μF capacitance. Figure 24
shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output
capacitance.
D1 protects against C1
D2 protects against C2
Figure 24. Regulator with Protection Diodes
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Heatsink Requirements
The LM317-N regulators have internal thermal shutdown to protect the device from over-heating. Under all
operating conditions, the junction temperature of the LM317-N should not exceed the rated maximum junction
temperature (TJ) of 150°C for the LM117, or 125°C for the LM317A and LM317-N. A heatsink may be required
depending on the maximum device power dissipation and the maximum ambient temperature of the application.
To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be calculated:
PD = ((VIN − VOUT) × IL) + (VIN × IG)
(2)
Figure 25 shows the voltage and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX):
TR(MAX) = TJ(MAX) − TA(MAX)
(3)
where TJ(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the
LM317A/LM317-N), and TA(MAX) is the maximum ambient temperature which will be encountered in the
application.
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (θJA) can be calculated:
θJA = (TR(MAX) / PD)
(4)
Figure 25. Power Dissipation Diagram
If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no
additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual
package rating either the power dissipation (PD) needs to be reduced, the maximum ambient temperature TA(MAX)
needs to be reduced, the thermal resistance (θJA) must be lowered by adding a heatsink, or some combination of
these.
If a heatsink is needed, the value can be calculated from the formula:
θHA ≤ (θJA - (θCH + θJC))
(5)
where (θCH is the thermal resistance of the contact area between the device case and the heatsink surface, and
θJC is thermal resistance from the junction of the die to surface of the package case.
When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than, or equal to, this number.
The θ(H−A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that
plots temperature rise vs power dissipation for the heatsink.
Heatsinking Surface Mount Packages
The TO-263 (KTT), SOT-223 (DCY) and TO-252 (NDP) packages use a copper plane on the PCB and the PCB
itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to
the plane.
Heatsinking the SOT-223 (DCY) Package
Figure 26 and Figure 27 show the information for the SOT-223 package. Figure 27 assumes a θ(J−A) of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see
AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and TO252 packages.
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Figure 26. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 27. Maximum Power Dissipation vs TAMB for the SOT-223 Package
Heatsinking the TO-263 (KTT) Package
Figure 28 shows for the TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB
with 1 ounce copper and no solder mask over the copper area used for heatsinking.
As shown in Figure 28, increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of θ(J−A) for the TO-263 package mounted to a PCB is 32°C/W.
Figure 28. θ(J−A) vs Copper (1 ounce) Area for the TO-263 Package
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As a design aid, Figure 29 shows the maximum allowable power dissipation compared to ambient temperature
for the TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).
Figure 29. Maximum Power Dissipation vs TAMB for the TO-263 Package
Heatsinking the TO-252 (NDP) Package
If the maximum allowable value for θJA is found to be ≥103°C/W (Typical Rated Value) for the TO-252 package,
no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the
calculated value for θJA falls below these limits, a heatsink is required.
As a design aid, Table 1 shows the value of the θJA of NDP the package for different heatsink area. The copper
patterns that we used to measure these θJAs are shown in Figure 34. Figure 30 reflects the same test results as
what are in Table 1.
Figure 31 shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.
Figure 32 shows the maximum allowable power dissipation vs. copper area (in2) for the TO-252 device. Please
see AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and
TO-252 packages.
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Table 1. θJA Different Heatsink Area
Layout
(1)
Copper Area
Thermal Resistance
Top Side (in2) (1)
Bottom Side (in2)
(θJA°C/W) TO-252
1
0.0123
0
103
2
0.066
0
87
3
0.3
0
60
4
0.53
0
54
5
0.76
0
52
6
1.0
0
47
7
0.066
0.2
84
8
0.066
0.4
70
9
0.066
0.6
63
10
0.066
0.8
57
11
0.066
1.0
57
12
0.066
0.066
89
13
0.175
0.175
72
14
0.284
0.284
61
15
0.392
0.392
55
16
0.5
0.5
53
Tab of device attached to topside of copper.
Figure 30. θJA vs 2oz Copper Area for TO-252
Figure 31. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
Figure 32. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO-252
Figure 33. Top View of the Thermal Test Pattern in Actual Scale
16
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
Figure 34. Bottom View of the Thermal Test Pattern in Actual Scale
Schematic Diagram
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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17
LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
Typical Applications
NOTE: Min. output ≊ 1.2V
Figure 35. 5V Logic Regulator with Electronic Shutdown
Figure 36. Slow Turn-On 15V Regulator
†Solid tantalum
*Discharges C1 if output is shorted to ground
Figure 37. Adjustable Regulator with Improved Ripple Rejection
18
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
Figure 38. High Stability 10V Regulator
‡Optional—improves ripple rejection
†Solid tantalum
*Minimum load current = 30 mA
Figure 39. High Current Adjustable Regulator
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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19
LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
Full output current not available at high input-output voltages
Figure 40. 0 to 30V Regulator
Figure 41. Power Follower
20
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
†Solid tantalum
*Lights in constant current mode
Figure 42. 5A Constant Voltage/Constant Current Regulator
Figure 43. 1A Current Regulator
*Minimum load current ≊ 4 mA
Figure 44. 1.2V–20V Regulator with Minimum Program Current
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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21
LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
Figure 45. High Gain Amplifier
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 46. Low Cost 3A Switching Regulator
22
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 47. 4A Switching Regulator with Overload Protection
Figure 48. Precision Current Limiter
Figure 49. Tracking Preregulator
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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23
LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
(Compared to LM117's higher current limit)
—At 50 mA output only ¾ volt of drop occurs in R3 and R4
Figure 50. Current Limited Voltage Regulator
*All outputs within ±100 mV
†Minimum load—10 mA
Figure 51. Adjusting Multiple On-Card Regulators with Single Control*
Figure 52. AC Voltage Regulator
24
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
Use of RS allows low charging rates with fully charged battery.
Figure 53. 12V Battery Charger
Figure 54. 50mA Constant Current Battery Charger
Figure 55. Adjustable 4A Regulator
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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25
LM117, LM317A, LM317-N
SNVS774O – MAY 2004 – REVISED JANUARY 2014
www.ti.com
*Sets peak current (0.6A for 1Ω)
**The 1000μF is recommended to filter out input transients
Figure 56. Current Limited 6V Charger
*Sets maximum VOUT
Figure 57. Digitally Selected Outputs
26
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
LM117, LM317A, LM317-N
www.ti.com
SNVS774O – MAY 2004 – REVISED JANUARY 2014
REVISION HISTORY
Changes from Revision N (Auust 2013) to Revision O
Page
•
Deleted MDT Package .......................................................................................................................................................... 6
•
Changed 0.112 ..................................................................................................................................................................... 6
•
Changed 0.30 ....................................................................................................................................................................... 6
•
Changed 0.112 ..................................................................................................................................................................... 6
•
Changed 0.30 ....................................................................................................................................................................... 6
•
Deleted MDT Package .......................................................................................................................................................... 6
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM117 LM317A LM317-N
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27
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jan-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM117H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-55 to 125
LM117HP+
LM117H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-55 to 125
LM117HP+
LM117K STEEL
ACTIVE
TO-3
NDS
2
50
TBD
Call TI
Call TI
-55 to 125
LM117K
STEELP+
LM117K STEEL/NOPB
ACTIVE
TO-3
NDS
2
50
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM117K
STEELP+
LM317AEMP
NRND
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
N07A
LM317AEMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N07A
LM317AEMPX
NRND
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
LM317AEMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
N07A
N07A
LM317AH
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-40 to 125
LM317AHP+
LM317AH/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
-40 to 125
LM317AHP+
LM317AMDT
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LM317
AMDT
LM317AMDT/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM317
AMDT
LM317AMDTX
NRND
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LM317
AMDT
LM317AMDTX/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM317
AMDT
LM317AT
NRND
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM317AT P+
LM317AT/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM317AT P+
LM317EMP
NRND
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
0 to 125
N01A
LM317EMP/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 125
N01A
LM317EMPX/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 125
N01A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jan-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM317H
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
0 to 125
LM317HP+
LM317H/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
AU
Level-1-NA-UNLIM
0 to 125
LM317HP+
LM317K STEEL
ACTIVE
TO-3
NDS
2
50
TBD
Call TI
Call TI
0 to 125
LM317K
STEELP+
LM317K STEEL/NOPB
ACTIVE
TO-3
NDS
2
50
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
0 to 125
LM317K
STEELP+
LM317MDT/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LM317
MDT
LM317MDTX/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 125
LM317
MDT
LM317S/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
0 to 125
LM317S
P+
LM317SX/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
0 to 125
LM317S
P+
LM317T
NRND
TO-220
NDE
3
45
TBD
Call TI
Call TI
LM317T P+
LM317T/LF01
ACTIVE
TO-220
NDG
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-4-260C-72 HR
LM317T P+
LM317T/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 125
LM317T P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jan-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jan-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM317AEMP
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317AEMP/NOPB
SOT-223
DCY
4
1000
330.0
LM317AEMPX
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
16.4
7.0
7.5
2.2
12.0
16.0
LM317AEMPX/NOPB
SOT-223
DCY
4
2000
Q3
330.0
16.4
7.0
7.5
2.2
12.0
16.0
LM317AMDTX
TO-252
NDP
3
Q3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM317AMDTX/NOPB
TO-252
NDP
LM317EMP
SOT-223
DCY
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
LM317EMP/NOPB
SOT-223
Q3
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM317EMPX/NOPB
LM317MDTX/NOPB
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
LM317SX/NOPB
Q2
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jan-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM317AEMP
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM317AEMP/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM317AEMPX
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM317AEMPX/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM317AMDTX
TO-252
NDP
3
2500
367.0
367.0
35.0
LM317AMDTX/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LM317EMP
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM317EMP/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM317EMPX/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM317MDTX/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LM317SX/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDS0002A
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
T03F (Rev B)
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
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