Altera EN5395QI 9a powersoc synchronous buck pwm dc-dc converter with integrated inductor 3-pin vid output voltage select Datasheet

Enpirion® Power Datasheet
EN5395QI 9A PowerSoC
Synchronous Buck PWM DC-DC
Converter with Integrated Inductor
3-Pin VID Output Voltage Select
Description
Features
The EN5395QI is a Power System on a Chip
(PowerSoC) DC-DC converter. It is specifically
designed to meet the precise voltage and fast
transient requirements of present and future
high-performance, low-power processor, DSP,
FPGA, ASIC, memory boards, and system level
applications in a distributed power architecture.
Advanced circuit techniques, ultra high switching
frequency,
and
innovative,
high-density,
integrated circuit and proprietary inductor
technology deliver high-quality, ultra compact,
non-isolated DC-DC conversion. Operating this
converter requires as few as five external
components that include small value input and
output ceramic capacitors and a soft-start
capacitor.
Altera’s Enpirion solution significantly helps in
system design and productivity by offering greatly
simplified
board
design,
layout
and
manufacturing requirements. In addition, a
reduction in the number of vendors required for
the complete power solution helps to enable an
overall system cost savings.
Applications
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Area constrained applications
Noise sensitive applications
Low voltage, distributed power architectures
with 2.5V, 3.3V or 5V rails
Computing
Enterprise Storage
Broadband, networking, LAN/WAN, optical
DSL, STB, DVR, DTV, Industrial PC
10mm
12mm
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Integrated Inductor Technology: Integrated
Inductor, MOSFETS, Controller in a 10 x 12 x
1.85mm package
Low Part Count: only 5 MLC Capacitors.
Up to 30W continuous output power.
Low output impedance optimized for ≤ 90 nm
Master/slave configuration for paralleling.
5MHz operating frequency.
High efficiency, up to 93%.
Wide input voltage range of 2.375V to 5.5V.
3-Pin VID output voltage select to choose one
of 7 pre-programmed output voltages.
Output Enable pin and Power OK signal.
Programmable soft-start time.
Adjustable over-current protection.
Thermal shutdown, short circuit, over-voltage
and under-voltage protection.
RoHS compliant, MSL level 3, 260C reflow.
Typical Application Circuit
VIN
2 x 47µF
Ordering Information
Part Number Temp Rating (°C)
Package
EN5395QI
-40 to +85
58-pin QFN T&R
EVB-EN5395QI
QFN Evaluation Board
PVIN
VS0
AVIN
VS1
VS2
1
POK
VID Output
Voltage Select
VSENSE
SS
VOUT
AGND
PGND
15nF
VOUT
2 x 47µF
Figure 1. Simple Layout.
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Pin Configuration
Below is a top view diagram of the EN5395Q package.
NOTE: NC pins are not to be electrically connected to each other or to any external signal, ground, or voltage.
However, they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or
damage.
Figure 2. Pin Diagram, top view.
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Pin Descriptions
PIN
NAME
1-3
NC
4-5
NC(SW)
6-13
NC
14-20
VOUT
21-22
NC(SW)
23
NC
24-29
30-35
PGND
PVIN
36-37
NC
38
ROCP
39
40
AVIN
AGND
41-42
NC
43
44
45
VS2
VS1
VS0
46
POK
47
VSENSE
48
SS
49
50
EAIN
EAOUT
51
COMP
52
ENABLE
53
PWM
54
NC
55
M/S
FUNCTION
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
NO CONNECT – These pins are internally connected to the common drain output of the
internal MOSFETs. NC(SW) pins are not to be electrically connected to any external signal,
ground, or voltage. However, they must be soldered to the PCB. Failure to follow this guideline
may result in part malfunction or damage.
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
Regulated converter output. Connect these pins to the load and place output capacitor from
these pins the PGND pins 24-26.
NO CONNECT – These pins are internally connected to the common drain output of the
internal MOSFETs. NC(SW) pins are not to be electrically connected to any external signal,
ground, or voltage. However, they must be soldered to the PCB. Failure to follow this guideline
may result in part malfunction or damage.
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
Output power ground. Refer to layout guideline section.
Input power supply. Connect to input power supply. Decouple with input capacitor to PGND.
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
Optional Over Current Protection adjust pin. Place ROCP resistor between this pin and AGND
(pin 40) to adjust the over current trip point.
Analog voltage input for the controller circuits. Connect this pin to the input power supply.
Analog ground for the controller circuits.
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
Voltage select line 2 input. See Table 1.
Voltage select line 1 input. See Table 1.
Voltage select line 0 input. See Table 1.
Power OK is an open drain transistor for power system state indication. POK is a logic high
when VOUT is with -10% to +20% of VOUT nominal.
Remote voltage sense input. Connect this pin to the load voltage at the point to be regulated.
Soft-Start node. The soft-start capacitor is connected between this pin and AGND. The value
of this capacitor determines the startup timing.
Optional Error Amplifier input. Allows for customization of the control loop.
Optional Error Amplifier output. Allows for customization of the control loop.
Output of the buffer leading to the error amplifier. Used for external modifications of the
compensation network.
Input Enable. Applying a logic high, enables the output and initiates a soft-start. Applying a
logic low disables the output.
PWM input/output. Used for optional master/slave configuration. When M/S pin is asserted
“low”, PWM will output the gate-drive PWM waveform. When the M/S pin is asserted “high”,
the PWM pin is configured as an input for PWM signal from the “master” device. PWM pin
can drive up to 3 slave devices.
NO CONNECT – This pin should not be electrically connected to any external signal, voltage,
or ground. This pin may be connected internally. However, this pin must be soldered to the
PCB.
Optional Master/Slave select pin. Asserting pin “low” places device in Master Mode for current
sharing. PWM pin (53) will output PWM drive signal. Asserting pin “high” will place the device
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PIN
NAME
56-58
FUNCTION
in Slave Mode. PWM pin (53) will be configured to input (receive) PWM drive signal from
“Master” device.
NO CONNECT – Do not electrically connect these pins to each other or to PCB. CAUTION!
May be internally connected.
NC
Block Diagram
PVIN
POK
UVLO
Power
Good
Logic
Thermal Limit
Over Voltage
VOUT
Current Limit
ROCP
NC(SW)
P-Drive
VOUT
(-)
N-Drive
PWM
Comp
(+)
PGND
Compensation
Sawtooth
Generator
VSENSE
Voltage
Selector
(-)
Error
Amp
ENABLE
SS
VS0
VS1
VS2
(+)
Reference
Voltage
selector
Soft Start
Bandgap
Reference
EAOUT
EAIN COMP
AVIN
AGND
Figure 3. System block diagram.
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Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond
recommended operating conditions is not implied. Stress beyond absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rated conditions for
extended periods may affect device reliability.
PARAMETER
SYMBOL
MIN
MAX
UNITS
VIN
-0.5
-0.5
-0.5
-0.5
-0.5
-65
7.0
VIN
2.5
3.0
VIN + 0.3
150
260
V
V
Input Supply Voltage
Voltages on: ENABLE, VSENSE, VS0-VS2, M/S
Voltages on: EAIN, EAOUT, COMP
Voltages on: SS, PWM
Voltages on: POK
Storage Temperature Range
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
ESD Rating (based on Human Body Model)
TSTG
°C
°C
V
2000
Recommended Operating Conditions
PARAMETER
SYMBOL
Input Voltage Range
VIN
Output Voltage Range (NOTE 1)
VOUT
Output Current (NOTE 2)
IOUT
Operating Ambient Temperature
TA
Operating Junction Temperature
TJ
Note 1: VDROPOUT = ILOAD x Dropout Resistance
Note 2: Reference figures 5 and 6 for the Output Current Derating Curves.
MIN
MAX
UNITS
2.375
0.75
0
-40
-40
5.5
VIN - VDROPOUT
9
+85
+125
V
V
A
°C
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Resistance: Junction to Ambient (0 LFM) (Note 3)
θJA
18
Thermal Resistance: Junction to Case (0 LFM)
θJC
1.5
Thermal Overload Trip Point
TJ-TP
+150
Thermal Overload Trip Point Hysteresis
20
Note 3: Based on four layer board and proper thermal design in line with JEDEC EIJ/JESD 51 standards
°C/W
°C/W
°C
°C
Electrical Characteristics
NOTE: VIN=5.5V over operating temperature range unless otherwise noted.
Typical values are at TA = 25°C.
PARAMETER
VOUT Initial Accuracy
Overall VOUT Accuracy
(Line, Load, and
Temperature combined)
Transient Response Peak
Deviation
SYMBOL
∆VOUT_INIT
∆VOUT_ALL
∆VOUT
TEST CONDITIONS
TA = 25C, 2.375V ≤ VIN ≤ 5.5V
ILOAD = 1A; TA = 25°C
VID Output Voltage Setting (V):
1.2, 1.25, 1.5, 1.8, 2.5, 3.3
0.8
2.4V ≤ VIN ≤ 5.5V
-40°C ≤ TA ≤ +85°C
0A ≤ ILOAD ≤ 9A
VID Output Voltage Setting (V):
1.2, 1.25, 1.5, 1.8, 2.5, 3.3
0.8
(IOUT = 0% to 100% or 100% to
0% or rated load)
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MIN
TYP
MAX
UNITS
%
-2
-3
+2
+3
%
-3
-4
+3
+4
5
%
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PARAMETER
Under Voltage Lock out
threshold
Switching Frequency
Continuous Output Current
SYMBOL
VUVLO
IOUT
IOCP_TH
IS
Disable Threshold
VDISABLE
Enable Threshold
VENABLE
Enable Pin Current
VS0-VS1, Enable Voltage
Threshold
VTH
VS0-VS2 Pin Input Current
IVSX
IEN
POK threshold High
POK threshold Low
POK Low Voltage
POK High Voltage
Dropout Resistance
∆IOUT
2.375V ≤ VIN ≤ 5.5V
0.603 <VOUT < VIN-0.5
TA = -40°C to +60°C
NOTE: reference figures 5 and 6
for the output current derating
curves
ENABLE=0V
Max voltage to ensure the
converter is disabled
2.375V ≤ VIN ≤ 5.5V
5.5V < VIN
VIN = 5.5V
Pin = Low
Pin = High
VSX = GND
VSX = VIN
VSX = Open
Percentage of VOUT Nominal
Percentage of VOUT Nominal
IPOK = 4mA (Max Sink Current)
With 2 – 4 converters in parallel,
the difference between any 2
parts. ∆VIN < 50mV; RTRACE <
10mΩ.
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MAX
2.2
2.1
5
FSWITCH
Current Limit Threshold
Shut-Down Supply Current
Current Balance
TEST CONDITIONS
VIN = 5V, 1.2V ≤ VOUT ≤ 3.3V
COUT = 2 x 47 μF
VIN Increasing
VIN Decreasing
UNITS
V
MHz
9
A
11
50
A
µA
0.8
1.8
2.0
V
V
µA
50
0.0
1.4
0.4
VIN
50
0
0
120
90
µA
50
%
%
V
V
mΩ
+/-10
%
0.4
VIN
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Typical Performance Characteristics
Circuit of Figure 1, VIN = 5 V, VOUT = 1.2 V and TA = 25°C, unless otherwise noted.
Efficiency (Vin = 5.0V)
Efficiency (VIN =3.3V)
95
Efficiency (%)
Efficiency (%)
90
85
80
75
70
65
60
0
2
4
6
8
95
90
85
80
75
70
65
60
55
50
0
10
Top to Bottom: VOUT = 2.5 V, 1.8 V, 1.5 V, 1.2 V, 0.8 V
Transient Response: 5VIN/1.2VOUT, 0-9A, 7A/uS.
COUT = 5x22uF.
6
8
10
Top to Bottom: VOUT = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V, 0.8 V
Ripple Voltage, 3.3VIN/1.2VOUT, IOUT=9A,
COUT = 5x22uF.
Transient Response: 5VIN/3.3VOUT, 0-9A, 7A/uS.
COUT = 5x22uF
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Load (Amperes)
Load (Amperes)
Ripple Voltage, 5.5VIN/1.2VOUT, IOUT=9A,
COUT = 5x22uF.
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Start up waveforms VIN=5.0V, VOUT=1.2V, CSS=15nF,
Ch 1 = VOUT, Ch 3 = ENABLE, Ch 4 = POK.
Start up waveforms VIN=5.0V, VOUT=3.3V, CSS=15nF,
Ch 1 = VOUT, Ch 3 = ENABLE, Ch 4 = POK.
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Functional Description
The
EN5395QI is
a synchronous, pin
programmable power supply with integrated
power MOSFET switches and integrated
inductor. The nominal input voltage range is
2.375-5.5V. The output can be set to common
pre-set voltages by connecting appropriate
combinations of 3 voltage selection pins to
ground. The feedback control loop is a type III
voltage-mode and the part uses a low-noise
PWM topology. Up to 9A of output current can
be drawn from this converter. The 5MHz
operating frequency enables the use of smallsize output capacitors.
Table 1: Output Voltage Select Table
The power supply has the following protection
features:
• Programmable over-current protection (to
protect the IC from excessive load current)
• Thermal shutdown with hysteresis.
• Over-voltage protection
• Under-voltage lockout circuit to disable the
converter output when the input voltage is
less than approximately 2.2V
VS1*
VS0*
Output Voltage
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
3.3V
2.5V
1.8V
1.5V
1.25V
1.2V
0.8V
Reserved
Input Capacitor Selection
The EN5395QI requires between 40-80uF of
input capacitance. Low ESR ceramic capacitors
are required with X5R or X7R rated dielectric
formulation.
Y5V or equivalent dielectric
formulations must not be used as these lose
capacitance with frequency, temperature and
bias voltage.
In some applications, lower value capacitors are
needed in parallel with the larger, capacitors in
order to provide high frequency decoupling.
Additional features include:
• Soft-start circuit, limiting the in-rush
current when the converter is powered up.
• Power good circuit indicating whether the
output voltage is within 90%-120% of the
programmed voltage.
Table 2. Recommended input capacitors.
Description
22uF, 10V,
X7R, 1210
Output Voltage Programming
MFG
P/N
Murata
GRM32ER71A226KE20L
Taiyo Yuden
The EN5395QI output voltage is programmed
using a 3-pin voltage-ID or VID selector. Three
binary VID pins allow the user to choose one of
seven pre-set voltages. Refer to table 1 for the
proper VID pin settings to program VOUT .
47uF, 10V,
X5R, 1210
Murata
LMK325B7226KM-T
GRM32ER61A476KE20L
Taiyo Yuden
LMK325BJ476KM-T
Output Capacitor Selection
The voltage select pins, VS0, VS1, and VS2, are
pulled-up internally and so will default to a logic
high, or “1”, if left “open”. Connecting the voltage
select pin to ground will result in a logic “0”.
The EN5395QI has been optimized for use with
approximately 100μF of output capacitance. Low
ESR ceramic capacitors are required with X5R or
X7R rated dielectric formulation.
Y5V or
equivalent dielectric formulations must not be
used as these loose capacitance with frequency,
temperature and bias voltage.
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Table 3. Recommended output capacitors.
Description
MFG
P/N
10uF, 10V,
X7R, 1206
Murata
GRM31CR71A106KA01L
Taiyo Yuden
LMK316B7106KL-T
Murata
GRM31CR60J226KE19L
Taiyo Yuden
LMK316BJ226KL-T
Murata
GRM31CR60J476ME19L
Taiyo Yuden
JMK316BJ476ML-T
22uF, 6.3V,
X5R, 1206
47uF, 6.3V,
X5R, 1206
Rise Time: TR = Css* 80KΩ
Output ripple voltage is determined by the
aggregate output capacitor impedance. Output
impedance, denoted as Z, is comprised of
effective series resistance, ESR, and effective
series inductance, ESL:
Z = ESR + ESL.
Placing output capacitors in parallel reduces the
impedance and will hence result in lower ripple
voltage.
1
Z Total
=
1
1
1
+
+ ... +
Z1 Z 2
Zn
Typical ripple versus capacitor arrangement is
given below (5.5VIN/1.2VOUT ):
Output Capacitor
Configuration
2 x 47uF
5 x 22 uF
capacitor, which is placed between the SS pin
(pin 48) and the AGND pin (pin 40).
Typical Output Ripple (mVp-p)
(as measured on EN5395QI
Evaluation Board)
20
12
Enable Operation
The ENABLE pin provides a means to shut down
the device, or enable normal operation. A logic
low will disable the converter and cause it to shut
down. A logic high will enable the converter into
normal operation. When the ENABLE pin is
asserted high, the device will undergo a normal
soft start.
Soft-Start Operation
Soft start is a method to reduce in-rush current
when the device is enabled. The output voltage
is ramped up slowly upon start-up. The output
rise time is controlled by choice of a soft-start
During start-up of the converter, the reference
voltage to the error amplifier is gradually
increased to its final level by an internal current
source of typically 10uA. Typical soft-start rise
time is 1mS to 3mS. Typical SS capacitor values
are in the range of 15nF to 30 nF.
POK Operation
The POK signal is an open drain signal from the
converter indicating the output voltage is within
the specified range. The POK signal will be a
logic high when the output voltage is within 90% 120% of the programmed output voltage. If the
output voltage goes outside of this range, the
POK signal will be a logic low until the output
voltage has returned to within this range. In the
event of an over-voltage condition the POK
signal will go low and will remain in this condition
until the output voltage has dropped to 95% of
the programmed output voltage before returning
to the high state.
The internal POK FET is designed to tolerate up
to 4mA. The pull-up resistor value should be
chosen to limit the current from exceeding this
value when POK is logic low.
Over-Current Protection
When an over current condition occurs, VOUT is
pulled low. This condition is maintained for a
period of 1.2 ms and then a normal soft start
cycle is initiated. If the over current condition still
persists, this cycle will repeat.
The OCP trip point is nominally set to 150% of
maximum rated load. It is possible to increase
the OCP trip point to 200% of the maximum rated
load by connecting a 5kΩ resistor between the
ROCP pin (pin 38) and AGND (pin 40). This
option is intended for startup into capacitive
loads such as certain FPGAs and ASICs.
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Over-Voltage Protection
When the output voltage exceeds 120% of the
programmed output voltage, the PWM operation
stops, the lower N-MOSFET is turned on and the
POK signal goes low. When the output voltage
drops below 95% of the programmed output
voltage, normal PWM operation resumes and
POK returns to its high state.
Thermal Overload Protection
Thermal shutdown will disable operation once
the Junction temperature exceeds approximately
150ºC. Once the junction temperature drops by
approx 20ºC, the converter will re-start with a
normal soft-start.
Input Under-voltage Lock-out
Circuitry is provided to ensure that when the
input voltage is below the specified voltage
range, the converter will not start-up. Circuits for
hysteresis, input de-glitch and output leading
edge blanking are included to ensure high noise
immunity and prevent false tripping.
In some cases modifications to the compensation
may be required. The EN5395QI provides access
to the internal compensation network to allow for
customization. For more information, contact
Power Applications support.
Parallel Device Operation
In order to power a load that is higher than the
rated 9A of the EN5395, from 2 to 4 devices can
be placed in parallel for providing a single load
with up to 36A of output current.
Paralleling more than 1 device is accomplished
by selecting a master device and tying that M/S
pin to AGND. All slave devices should have their
M/S pin tied to AVIN. The PWM pin from the
master device is connected to all slave device
PWM pins. The PWM signal is a 5 MHz drive
signal and must be routed appropriately. (See
Figure 4.)
1. All master and slave devices should have
identical placement and values of input,
output and soft-start capacitors.
2. All master and slave devices should have
their ENABLE pins tied together and
should be operated simultaneously with a
fast rising edge of 10 uSec or less, to
ensure that devices start up at the same
time. Startup imbalance could lead to
OCP condition on first device to startup.
3. The maximum board trace resistance
between any 2 devices VOUT pins should
be less than 10mΩ.
4. The maximum difference of PVIN between
any 2 devices should be less than 50mV.
Compensation
The EN5395 is internally compensated through
the use of a type 3 compensation network and is
optimized for use with about 100μF of output
capacitance and will provide excellent loop
bandwidth and transient performance for most
applications. (See the section on Capacitor
Selection for details on recommended capacitor
types.) Voltage mode operation provides high
noise immunity at light load.
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Figure 4 . Paralleling of two devices.
Figure 5. Output Current Derating Curve, VIN = 5.0V
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Figure 6 . Output Current Derating Curve, VIN = 3.3V
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Layout Recommendations
Figure 7. Layout of power and ground planes.
Figure 8. Use of vias connecting local and system ground.
Recommendation 1: Input and output
capacitors should be placed as close to the
EN5395QI package as possible to reduce EMI
from input and output loop currents. This
reduces the physical area of the Input and
Output AC current loops.
vias as possible. The diameter of the vias
should be less than 0.3mm. This provides the
quiet, or analog ground for the converter and
also provides the path for heat dissipation from
the converter. A later section of this note
makes a recommendation on the PCB
footprint.
Recommendation 2: Place a slit in the
input/output capacitor ground plane just
beyond the common connection point of the
GND pins of the device as shown in figure 7.
Recommendation 5: The system ground
plane referred to in recommendations 3 and 4
should be the first layer immediately below the
surface layer. This ground plane should be
continuous and un-interrupted below the
converter and the input and output capacitors
that carry large AC currents.
Recommendation 3: Multiple small (0.25mm)
vias should be used to connect ground terminal
of the Input capacitor and the output capacitor
to the system ground plane as shown in figure
8.
Recommendation 6: As with any switch-mode
DC/DC converter, do not run sensitive signal or
control lines
underneath the converter
package.
Recommendation 4: The large thermal pad
underneath the component must be connected
to the system ground plane through as many
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Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Lead frame offers many advantages in thermal performance, in reduced electrical lead resistance, ,
and in overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the
lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached.
This results in several small pads being exposed on the bottom of the package.
Only the large thermal pad and the perimeter pads are to be mechanically or electrically connected to
the PC board. The PCB top layer under the EN5395QI should be clear of any metal except for the
large thermal pad. The “grayed-out” area in Figure 9 represents the area that should be clear of any
metal (traces, vias, or planes), on the top layer of the PCB.
Figure 10 demonstrates the recommended PCB footprint for the EN5395QI. Figure 11 shows the
shape and location of the exposed metal pads as well as the mechanical dimension of the large
thermal pad and the pins.
Figure 9. Lead-Frame exposed metal. Grey area highlights exposed metal that is not to be mechanically or
electrically connected to the PCB.
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Figure 10. EN5395QI PCB Footprint (Top View)
The solder stencil aperture for the thermal pad is shown in blue and is based on Enpirion power product manufacturing
specifications.
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Package Dimensions
Figure 11. Package dimensions.
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Contact Information
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com/
© 2013 Altera Corporation—Confidential. All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, HARDCOPY, MAX, MEGACORE, NIOS,
QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other
countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at
www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's
standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or
liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera.
Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders
for products or services.
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