Microchip MCP2551E/P High-speed can transceiver Datasheet

M
MCP2551
High-Speed CAN Transceiver
Features
Package Types
• Supports 1 Mb/s operation
• Implements ISO-11898 standard physical layer
requirements
• Suitable for 12V and 24V systems
• Externally-controlled slope for reduced RFI
emissions
• Detection of ground fault (permanent dominant)
on TXD input
• Power-on reset and voltage brown-out protection
• An unpowered node or brown-out event will not
disturb the CAN bus
• Low current standby operation
• Protection against damage due to short-circuit
conditions (positive or negative battery voltage)
• Protection against high-voltage transients
• Automatic thermal shutdown protection
• Up to 112 nodes can be connected
• High noise immunity due to differential bus
implementation
• Temperature ranges:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
PDIP/SOIC
1
8
RS
VSS
2
7
CANH
VDD
3
6
CANL
RXD
4
5
VREF
MCP2551
TXD
Block Diagram
VDD
TXD
Dominant
Detect
VDD
Driver
Control
TXD
RS
Slope
Control
Power-On
Reset
RXD
VREF
Thermal
Shutdown
CANH
0.5 VDD
GND
Reference
Voltage
CANL
Receiver
VSS
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 1
MCP2551
NOTES:
DS21667C-page 2
Preliminary
 2002 Microchip Technology Inc.
MCP2551
1.0
DEVICE OVERVIEW
1.4
Operating Modes
The MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN protocol controller and the physical bus. The MCP2551
provides differential transmit and receive capability for
the CAN protocol controller and is fully compatible with
the ISO-11898 standard, including 24V requirements. It
will operate at speeds of up to 1 Mb/s.
The RS pin allows three modes of operation to be
selected:
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a CAN
controller to signals suitable for transmission over the
bus cabling (differential output). It also provides a buffer
between the CAN controller and the high-voltage spikes
that can be generated on the CAN bus by outside
sources (EMI, ESD, electrical transients, etc.).
When in High-Speed or Slope-Control mode, the drivers for the CANH and CANL signals are internally regulated to provide controlled symmetry in order to
minimize EMI emissions.
1.1
Transmitter Function
The CAN bus has two states: Dominant and Recessive. A dominant state occurs when the differential voltage between CANH and CANL is greater than a
defined voltage (e.g.,1.2V). A recessive state occurs
when the differential voltage is less than a defined voltage (typically 0V). The dominant and recessive states
correspond to the low and high state of the TXD input
pin, respectively. However, a dominant state initiated
by another CAN node will override a recessive state on
the CAN bus.
1.1.1
MAXIMUM NUMBER OF NODES
The MCP2551 CAN outputs will drive a minimum load
of 45Ω, allowing a maximum of 112 nodes to be connected (given a minimum differential input resistance of
20 kΩ and a nominal termination resistor value of
120Ω).
1.2
Receiver Function
The RXD output pin reflects the differential bus voltage
between CANH and CANL. The low and high states of
the RXD output pin correspond to the Dominant and
Recessive states of the CAN bus, respectively.
1.3
Internal Protection
CANH and CANL are protected against battery shortcircuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmitter output stage during such a fault condition.
• High-Speed
• Slope-Control
• Standby
These modes are summarized in Table 1-1.
Additionally, the slope of the signal transitions on
CANH and CANL can be controlled with a resistor connected from pin 8 (RS) to ground, with the slope proportional to the current output at RS, further reducing EMI
emissions.
1.4.1
HIGH-SPEED
The High-Speed mode is selected by connecting the
RS pin to VSS. In this mode, the transmitter output drivers have fast output rise and fall times to support highspeed CAN bus rates.
1.4.2
SLOPE-CONTROL
Slope-Control mode further reduces EMI by limiting the
rise and fall times of CANH and CANL. The slope, or
slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The slope is proportional to the current output at the RS
pin. Since the current is primarily determined by the
slope-control resistance value REXT, a certain slew rate
is achieved by applying a respective resistance.
Figure 1-1 illustrates typical slew rate values as a
function of the slope-control resistance value.
1.4.3
STANDBY MODE
The device may be placed in standby or “SLEEP” mode
by applying a high-level to RS. In SLEEP mode, the
transmitter is switched off and the receiver operates at
a lower current. The receive pin on the controller side
(RXD) is still functional but will operate at a slower rate.
The attached microcontroller can monitor RXD for CAN
bus activity and place the transceiver into normal operation via the RS pin (at higher bus rates the first CAN
message may be lost).
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of 165°C. All other parts of the chip
remain operational and the chip temperature is lowered
due to the decreased power dissipation in the transmitter outputs. This protection is essential to protect
against bus line short-circuit induced damage.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 3
MCP2551
TABLE 1-1:
MODES OF OPERATION
Mode
Current at Rs Pin
Standby
Slope-Control
High-Speed
TABLE 1-2:
Resulting Voltage at RS Pin
-IRS < 10 µA
10 µA < -IRS < 200 µA
-IRS < 610 µA
VRS > 0.75VDD
0.4VDD < VRS < 0.6VDD
0 < VRS < 0.3VDD
TRANSCEIVER TRUTH TABLE
VDD
VRS
TXD
4.5V ≤ VDD ≤ 5.5V
VRS < 0.75VDD
0
1 or floating
X
0
1 or floating
X
X
CANH
Bus State( 1)
CANL
RXD( 1)
HIGH
LOW
Dominant
0
Not Driven
Not Driven
Recessive
1
VRS > 0.75VDD
Not Driven
Not Driven
Recessive
1
VPOR < V DD < 4.5V
VRS < 0.75VDD
HIGH
LOW
Dominant
0
(See Note 3)
Not Driven
Not Driven
Recessive
1
Not Driven
Not Driven
Recessive
1
VRS > 0.75VDD
0 < V DD < V POR
X
Not Driven/
Not Driven/
High Impedance
X
No Load
No Load
Note 1: If another bus node is transmitting a dominant bit on the CAN bus, then RXD is a logic 0.
2: X = “don’t care”.
3: Device drivers will function, although outputs are not guaranteed to meet the ISO-11898 specification.
FIGURE 1-1:
SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE
25
Slew Rate V/uS
20
15
10
5
0
10
20
30
40
49
60
70
76
90 100 110 120
Resistance (kΩ)
DS21667C-page 4
Preliminary
 2002 Microchip Technology Inc.
MCP2551
1.5
TXD Permanent Dominant
Detection
1.7.2
Ground supply pin.
If the MCP2551 detects an extended low state on the
TXD input, it will disable the CANH and CANL output
drivers in order to prevent the corruption of data on the
CAN bus. The drivers are disabled if TXD is low for
more than 1.25 ms (minimum). This implies a maximum bit time of 62.5 µs (16 kb/s bus rate) allowing up
to 20 consecutive transmitted dominant bits during a
multiple bit error and error frame scenario. The drivers
remain disabled as long as TXD remains low. A rising
edge on TXD will reset the timer logic and enable the
CANH and CANL output drivers.
1.6
GROUND SUPPLY (VSS)
Power-on Reset
1.7.3
Positive supply voltage pin.
1.7.4
RECEIVER DATA OUTPUT (RXD)
RXD is a CMOS-compatible output that drives high or
low depending upon the differential signals on the
CANH and CANL pins and is usually connected to the
receiver data input of the CAN controller device. RXD
is high when the CAN bus is recessive and low in the
dominant state.
1.7.5
When the device is powered on, CANH and CANL
remain in a high-impedance state until V DD reaches the
voltage level VPORH. In addition, CANH and CANL will
remain in a high-impedance state if TXD is low when
VDD reaches VPORH. CANH and CANL will become
active only after TXD is asserted high. Once powered
on, CANH and CANL will enter a high-impedance state
if the voltage level at VDD falls below V PORL, providing
voltage brown-out protection during normal operation.
SUPPLY VOLTAGE (VDD)
REFERENCE VOLTAGE (VREF)
Reference Voltage Output (Defined as VDD/2).
1.7.6
CAN LOW (CANL)
The CANL output drives the low side of the CAN differential bus. This pin is also tied internally to the receive
input comparator.
1.7.7
CAN HIGH (CANH)
The 8-pin pinout is listed in Table 1-3.
The CANH output drives the high side of the CAN differential bus. This pin is also tied internally to the
receive input comparator.
TABLE 1-3:
1.7.8
1.7
Pin Descriptions
MCP2551 PINOUT
The RS pin is used to select High-Speed, Slope-Control
or Standby modes via an external biasing resistor.
Pin
Number
Pin
Name
1
TXD
Transmit Data Input
2
VSS
Ground
3
VDD
Supply Voltage
4
RXD
Receive Data Output
5
VREF
Reference Output Voltage
6
CANL
CAN Low-Level Voltage I/O
7
CANH
CAN High-Level Voltage I/O
8
RS
1.7.1
SLOPE RESISTOR INPUT (RS)
Pin Function
Slope-Control Input
TRANSMITTER DATA INPUT (TXD)
TXD is a TTL compatible input pin. The data on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data output of the CAN controller device. When TXD is low,
CANH and CANL are in the dominant state. When TXD
is high, CANH and CANL are in the recessive state,
provided that another CAN node is not driving the CAN
bus with a dominant state. TXD has an internal pull-up
resistor (nominal 25 kΩ to VDD).
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 5
MCP2551
2.0
ELECTRICAL
CHARACTERISTICS
2.1
Terms and Definitions
2.1.5
Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH - VCANL.
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.1.1
BUS VOLTAGE
VCANL and V CANH, denoting the voltages of the bus line
wires, CANL and CANH, relative to ground of each
individual CAN node.
2.1.2
2.1.6
Capacitance seen between CANL (or CANH) and
ground during the recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
2.1.7
INTERNAL RESISTANCE, RIN (OF A
CAN NODE)
FIGURE 2-1:
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF (OF A CAN
NODE)
Capacitance seen between CANL and CANH during
the recessive state when the CAN node is
disconnected from the bus (see Figure 2-1).
2.1.4
INTERNAL CAPACITANCE, CIN (OF
A CAN NODE)
Resistance seen between CANL (or CANH) and
ground during the recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).
COMMON MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANL and VCANH with
respect to ground, for which proper operation will occur,
if up to the maximum number of CAN nodes are
connected to the bus.
2.1.3
DIFFERENTIAL VOLTAGE, VDIFF
(OF CAN BUS)
PHYSICAL LAYER
DEFINITIONS
ECU
RIN
CANL
RIN
CANH
CIN
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF (OF A CAN
NODE)
CDIFF
RDIFF
CIN
GROUND
Resistance seen between CANL and CANH during the
recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).
DS21667C-page 6
Preliminary
 2002 Microchip Technology Inc.
MCP2551
Absolute Maximum Ratings†
VDD............................................................................................................................................................................. 7.0V
DC Voltage at TXD, RXD, VREF and VS .............................................................................................-0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1).......................................................................................................... -42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2)............................................................................................. -250V to +250V
Storage temperature ............................................................................................................................... -55°C to +150°C
Operating ambient temperature .............................................................................................................. -40°C to +125°C
Virtual Junction Temperature, TVJ (Note 3) ............................................................................................ -40°C to +150°C
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
ESD protection on CANH and CANL pins (Note 4) ................................................................................................... 6 kV
ESD protection on all other pins (Note 4) .................................................................................................................. 4 kV
Note 1: Short-circuit applied when TXD is high and low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 7
MCP2551
2.2
DC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
DC Specifications
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
Supply:
—
75
mA
Dominant; VTXD = 0.8V; VDD
D2
—
10
mA
Recessive; VTXD = +2V;
RS = 47 kΩ
D3
—
365
µA
-40°C ≤ TAMB ≤ +85°C,
Standby; (Note 2)
—
465
µA
-40°C ≤ TAMB ≤ +125°C,
Standby; (Note 2)
D1
IDD
Supply Current
D4
V PORH
High-level of the power-on reset
comparator
3.8
4.3
V
CANH, CANL outputs are
active when VDD > VPORH
D5
VPORL
Low-level of the power-on reset
comparator
3.4
4.0
V
CANH, CANL outputs are not
active when VDD < VPORL
D6
V PORD
Hysteresis of power-on reset
comparator
0.3
0.8
V
Note 1
2.0
3.0
V
VTXD = VDD; no load.
-2
+2
mA
-2V < V(CAHL,CANH) < +7V,
0V <VDD < 5.5V
-10
+10
mA
-5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V
2.75
4.5
V
VTXD = 0.8V
VTXD = 0.8V
Bus Line (CANH; CANL) Transmitter:
D7
D8
VCANH(r);VCANL(r) CANH, CANL Recessive bus
voltage
IO(CANH)(reces)
IO( CANL)(reces)
Recessive output current
D9
D10
VO(CANH)
CANH dominant output voltage
CANL dominant output voltage
D11
VO(CANL)
0.5
2.25
V
D12
VDIFF(r)(o)
Recessive differential output
voltage
-500
+50
mV
D13
VDIFF (d)(o)
Dominant differential output
voltage
1.5
3.0
V
D14
IO(SC)(CANH)
CANH short-circuit output
current
—
-200
mA
VCANH = -5V
—
-100
(typical)
mA
VCANH = -40V, +40V. (Note 1)
CANL short circuit output current
—
200
mA
VCANL = -40V, +40V. (Note 1)
-1.0
+0.5
V
-2V < V(CANL, CANH) < +7V
(Note 3)
-1.0
+0.4
V
-12V < V(CANL, CANH ) < +12V
(Note 3)
0.9
5.0
V
-2V < V(CANL, CANH) < +7V
(Note 3)
1.0
5.0
V
-12V < V(CANL, CANH) < +12V
(Note 3)
D15
D16
IO(SC)(CANL)l
VTXD = 2V; no load
VTXD = 0.8V; VDD = 5V
40 Ω < RL < 60 Ω (Note 2)
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D17
D18
VDIFF(r)(i)
V DIFF(d)(i)
Recessive differential input
voltage
Dominant differential input
voltage
D19
V DIFF(h)(i)
100
200
mV
D20
RIN
Differential input hysteresis
CANH, CANL common-mode
input resistance
5
50
kΩ
D21
RIN(d)
Deviation between CANH and
CANL common-mode input
resistance
-3
+3
%
see Figure 2-4. (Note 1)
VCANH = VCANL
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.
DS21667C-page 8
Preliminary
 2002 Microchip Technology Inc.
MCP2551
2.2
DC Characteristics (Continued)
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V
DC Specifications (Continued)
Param
No.
Sym
Characteristic
Min
Max
Units
Conditions
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22
RDIFF
Differential input resistance
20
100
kΩ
D24
ILI
CANH, CANL input leakage
current
—
150
µA
VDD < VPOR ;
VCANH = VCANL = +5V
Output recessive
Transmitter Data Input (TXD):
D25
VIH
High-level input voltage
2.0
—
V
D26
VIL
Low-level input voltage
—
+0.8
V
Output dominant
D27
IIH
High-level input current
-1
+1
µA
VTXD = VDD
D28
IIL
Low-level input current
-100
-400
µA
VTXD = 0V
Receiver Data Output (RXD):
D31
VOH
High-level output voltage
0.7
—
V
IOH = 8 mA
D32
VOL
Low-level output voltage
—
0.8
V
IOL = 8 mA
0.45 VDD
0.55 VDD
V
-50 µA < IVREF < 50 µA
Voltage Reference Output (VREF ):
D33
VREF
Reference output voltage
Standby/Slope-Control (RS pin):
D34
VSTB
0.75 VDD
—
V
D35
ISLOPE
Input voltage for standby mode
Slope-control mode current
-10
-200
µA
D36
V SLOPE
Slope-control mode voltage
0.4 VDD
0.6 VDD
V
Thermal Shutdown:
D37
TJ(sd)
Shutdown junction temperature
155
180
o
C
Note 1
D38
TJ (h)
Shutdown temperature
hysteresis
20
30
o
C
-12V < V(CANL, CANH) < +12V
(Note 3)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.
FIGURE 2-2:
TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
0.1µF
VDD
CANH
TXD
VREF
CAN
Transceiver
60 Ω
100 pF
RXD
30 pF
CANL
GND
RS
Rext
Note:
RS may be connected to V DD or GND via a load resistor depending on desired operating mode
as described in Section 1.7.8, “Slope Resistor Input”.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 9
MCP2551
FIGURE 2-3:
TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
CANH
TXD
VREF
CAN
Transceiver
500 pF
60Ω
Schaffner
Generator
RXD
CANL
RS
GND
500 pF
Note:
Rext
RS may be connected to VDD or
GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8
The wave forms of the applied transients shall be in accordance with “ISO-7637, Part 1”, test pulses 1, 2, 3a and 3b.
FIGURE 2-4:
HYSTERESIS OF THE RECEIVER
RXD (receive data
output voltage)
VOH
VDIFF (r)(i)
VDIFF (d)(i)
VOL
hysteresis
D19
0.5
0.9
VDIFF (V)
DS21667C-page 10
Preliminary
 2002 Microchip Technology Inc.
MCP2551
2.3
AC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°CVDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°CVDD = 4.5V to 5.5V
AC Specifications
Param
No.
Sym
1
tBIT
Bit time
1
62.5
µs
VRS = 0V
2
fBIT
Bit frequency
16
1000
kHz
VRS = 0V
3
TtxL2bus(d)
Delay TXD to bus active
—
70
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
4
TtxH2bus(r)
Delay TXD to bus inactive
—
125
ns
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
—
170
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
130
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
250
ns
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
—
175
ns
-40°C ≤ TAMB ≤ +85°C,
VRS = 0V
—
225
ns
-40°C ≤ TAMB ≤ +85°C,
RS = 47 kΩ
—
235
ns
-40°C ≤ TAMB ≤ +125°C,
VRS = 0V
—
400
ns
-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ
CANH, CANL slew rate
5.5
8.5
V/µs
Wake-up time from standby
(Rs pin)
—
5
µs
see Figure 2-6
—
550
ns
VRS = +4V; (see Figure 2-7)
CANH; CANL input
capacitance
—
20
(typical)
pF
1 Mbit/s data rate;
VTXD = VDD, (Note 1)
Differential input
capacitance
—
10
(typical)
pF
1 Mbit/s data rate
(Note 1)
1.25
4
ms
—
1
µs
5
6
TtxL2rx(d)
TtxH2rx(r)
7
SR
10
tWAKE
11
Min
Delay TXD to receive active
Delay TXD to receiver
inactive
TbusD2rx(s) Bus dominant to RXD Low
(standby mode)
12
CIN(CANH)
CIN(CANL)
13
CDIFF
14
TtxL2busZ
15
Characteristic
TX Permanent Dominant
Timer Disable Time
TtxR2pdt(res) TX Permanent Dominant
Timer Reset Time
Max
Units
Conditions
Refer to Figure 1-1;
RS = 47 kΩ, (Note 1)
Rising edge on TXD while
device is in permanent
dominant state
Note 1: This parameter is periodically sampled and not 100% tested.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 11
MCP2551
2.4
Timing Diagrams and Specifications
FIGURE 2-5:
TIMING DIAGRAM FOR AC CHARACTERISTICS
VDD
TXD (transmit data
input voltage)
0V
VDIFF (CANH,
CANL differential
voltage)
RXD (receive data
output voltage)
0.5V
0.9V
0.7 VDD
0.3 VDD
3
4
5
6
FIGURE 2-6:
TIMING DIAGRAM FOR WAKEUP FROM STANDBY
VRS Slope resistor
input voltage
VDD
0.6 VDD
0V
VRXD Receive data
output voltage
0.3 VDD
10
VTXD = 0.8V
FIGURE 2-7:
TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)
1.5V
VDIFF, Differential
voltage
0.9V
0V
Receive data
output voltage
0.3 VDD
11
VRS = 4V; VTXD = 2V
DS21667C-page 12
Preliminary
 2002 Microchip Technology Inc.
MCP2551
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
YYWW
MCP2551
I/P256
0234
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
Legend:
Note:
*
XX...X
YY
WW
NNN
MCP2551
I/SN0234
256
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 13
MCP2551
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
§
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21667C-page 14
Preliminary
 2002 Microchip Technology Inc.
MCP2551
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 15
MCP2551
NOTES:
DS21667C-page 16
Preliminary
 2002 Microchip Technology Inc.
MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Examples:
Package
a)
MCP2551-I/P: Industrial temperature,
PDIP package.
b)
MCP2551-E/P: Extended temperature,
PDIP package.
Device:
MCP2551= High-Speed CAN Transceiver
c)
MCP2551-I/SN: Industrial temperature,
SOIC package.
Temperature
Range:
I
E
d)
MCP2551T-I/SN: Tape and Reel, Industrial
Temperature, SOIC package.
e)
MCP2551T-E/SN:
Tape
and
Reel,
Extended Temperature, SOIC package.
Package:
P
SN
=
=
-40°C to +85°C
-40°C to +125°C
=
=
Plastic DIP (300 mil Body) 8-lead
Plastic SOIC (150 mil Body) 8-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
Preliminary
DS21667C-page 17
MCP2551
NOTES:
DS21667C-page 18
Preliminary
 2002 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, K EELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21667C - page 19
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 15-16, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-82350361 Fax: 86-755-82366086
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
11/15/02
DS21667C-page 20
 2002 Microchip Technology Inc.