OKI MR27V1602FMA 1,048,576-word x 16-bit or 2,097,152-word x 8-bit one time prom Datasheet

OKI Semiconductor
MR27V1602F
FEDR27V1602F-01-02
Issue Date: Jul. 9, 2004
1,048,576–Word × 16–Bit or 2,097,152–Word × 8–Bit One Time PROM
GENERAL DESCRIPTION
The MR27V1602F is a 16 Mbit electrically One Time Programmable Read-Only Memory that can be
electrically switched between 1,048,576-word × 16-bit and 2,097,152-word × 8-bit by the state of the BYTE# pin.
The MR27V1602F supports high speed asynchronous read operation using a single 3.3V power supply.
FEATURES
· 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically switchable configuration
· +3.3 V power supply
· Access time
80 nS MAX
· Operating current
16 mA MAX (5MHz)
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Tri-state output
· Packages:
44-pin plastic SOP (SOP44-P-600-1.27-K)
(MR27V1602FMA)
48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-1K) (MR27V1602FTN)
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MR27V1602F / OTP
PIN CONFIGURATION (TOP VIEW)
A15 1
48 A16
A14 2
47 BYTE#/VPP
NC 1
44 NC
A13 3
46 VSS
A18 2
43 A19
A12 4
45 D15/A–1
A17 3
42 A8
A11 5
44 D7
A7 4
41 A9
A10 6
43 D14
A6 5
40 A10
A9 7
42 D6
A5 6
39 A11
A8 8
41 D13
A4 7
38 A12
A19 9
A3 8
37 A13
NC 10
39 D12
A2 9
36 A14
NC 11
38 D4
A1 10
35 A15
NC 12
37 VCC
A0 11
34 A16
NC 13
36 D11
33 BYTE#/VPP
NC 14
35 D3
32 VSS
NC 15
34 D10
CE# 12
VSS 13
40 D5
31 D15/A–1
A18 16
33 D2
D0 15
30 D7
A17 17
32 D9
D8 16
29 D14
A7 18
31 D1
D1 17
28 D6
A6 19
30 D8
D9 18
27 D13
A5 20
29 D0
D2 19
26 D5
A4 21
28 OE#
25 D12
A3 22
27 VSS
24 D4
A2 23
26 CE#
23 VCC
A1 24
25 A0
OE# 14
D10 20
D3 21
D11 22
44-pin SOP
48-pin TSOP(I)
Pin name
Functions
D15/A–1
Data output/Address input
A0 to A19
Address input
D0 to D14
Data output
CE#
Chip enable
OE#
Output enable
BYTE#/VPP
Mode switch/Program power supply voltage
VCC
Power supply voltage
VSS
GND
NC
Non connection
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OKI Semiconductor
MR27V1602F / OTP
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
BYTE#/VPP
CE
OE
PGM
Row Decoder
OE#
Memory Cell Matrix
1,048,576 × 16-Bit or 2,097,152 × 8-Bit
Multiplexer
Column Decoder
Address Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
CE#
Output Buffer
D0
D2
D1
D4
D3
D6
D5
D8
D7
D10
D9
D12
D11
D14
D13
D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
FUNCTION TABLE
CE#
OE#
BYTE#/VPP
Read (16-Bit)
Mode
L
L
H
Read (8-Bit)
L
L
L
Output disable
L
H
Standby
H
∗
Program
L
H
Program inhibit
H
H
Program verify
H
L
H
L
VCC
D0 to D7
D8 to D14
D15/A–1
DOUT
DOUT
3.3 V
H
Hi–Z
Hi–Z
Hi–Z
L
L/H
∗
∗
DIN
8.2 V
4.0 V
Hi–Z
DOUT
∗: Don’t Care (H or L)
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OKI Semiconductor
MR27V1602F / OTP
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Operating temperature under bias
Storage temperature
Condition
Ta
—
Tstg
Input voltage
VI
Output voltage
VO
Power supply voltage
VCC
Program power supply voltage
VPP
relative to VSS
Value
Unit
0 to 70
°C
–55 to 125
°C
–0.5 to VCC+0.5
V
–0.5 to VCC+0.5
V
–0.5 to 5
V
–0.5 to 9.0
V
Power dissipation per package
PD
Ta = 25°C
1.0
W
Output short circuit current
IOS
—
10
mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
VCC power supply voltage
VCC
3.0
—
3.6
V
VPP power supply voltage
VPP
–0.5
—
VCC+0.5
V
Input “H” level
VIH
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
–0.5∗∗
—
0.6
V
VCC = 3.0 to 3.6 V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
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MR27V1602F / OTP
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
parameter
Input leakage current
Symbol
Condition
Min.
Typ.
Max.
Unit
ILI
VI = 0 to VCC
—
—
10
µA
ILO
VO = 0 to VCC
—
—
10
µA
VCC power supply current
ICCSC
CE# = VCC
—
—
10
µA
(Standby)
ICCST
CE# = VIH
—
—
1
mΑ
—
—
16
mA
Output leakage current
VCC power supply current
(Read)
CE# = VIL, OE# = VIH
ICCA
f=5MHz
VPP power supply current
IPP
VPP = VCC
—
—
10
µA
Input “H” level
VIH
—
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
—
–0.5∗∗
—
0.6
V
Output “H” level
VOH
IOH = –2 mA
2.4
—
—
V
Output “L” level
VOL
IOL = 4 mA
—
—
0.4
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
Parameter
Symbol
Address cycle time
Condition
Min.
Max.
Unit
tC
—
80
—
ns
tACC
CE# = OE# = VIL
—
80
ns
CE# access time
tCE
OE# = VIL
—
80
ns
OE# access time
tOE
CE# = VIL
—
30
ns
tCHZ
OE# = VIL
0
20
ns
tOHZ
CE# = VIL
0
20
ns
tOH
CE# = OE# = VIL
0
—
ns
Address access time
Output disable time
Output hold time
Measurement conditions
Input signal level --------------------------------------0 V / 3 V
Input timing reference level-------------------------1/2 Vcc
Output load ---------------------------------------------50 pF
Output timing reference level ------------------- 1/2 Vcc
Output load
Output
50 pF
(Including scope and jig)
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OKI Semiconductor
MR27V1602F / OTP
TIMING CHART (READ CYCLE)
16-BIT READ MODE (BYTE# = VIH)
tC
tC
Address
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
Valid Data
D0 to D15
Valid Data
Hi-Z
Hi-Z
8-BIT READ MODE (BYTE# = VIL)
tC
tC
Address
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
Valid Data
D0 to D7
Hi-Z
Valid Data
Hi-Z
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OKI Semiconductor
MR27V1602F / OTP
ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION)
DC Characteristics
(Ta = 25°C ± 5°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
ILI
VI = VCC+0.5 V
—
—
10
µA
VPP power supply current (Program)
IPP2
CE# = VIL
—
—
50
mA
VCC power supply current
ICC
—
—
—
50
mA
Input “H” level
VIH
—
3.0
—
VCC+0.5
V
Input leakage current
Input “L” level
VIL
—
–0.5
—
0.8
V
Output “H” level
VOH
IOH = –400 µA
2.4
—
—
V
Output “L” level
VOL
IOL = 2.1 mA
—
—
0.45
V
Program voltage
VPP
—
7.95
8.2
8.45
V
VCC power supply voltage
VCC
—
3.9
4.0
4.1
V
Voltage is relative to VSS.
AC Characteristics
(VCC = 4.0 V ± 0.1 V, BYTE#/VPP = 8.2 V ± 0.25 V, Ta = 25°C ± 5°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Address set-up time
tAS
—
100
—
—
ns
OE# set-up time
tOES
—
2
—
—
µs
Data set-up time
tDS
—
100
—
—
ns
Address hold time
tAH
—
2
—
—
µs
Data hold time
tDH
—
100
—
—
ns
Output float delay time from OE#
tOHZ
—
0
—
100
ns
VPP voltage set-up time
tVS
—
2
—
—
µs
Program pulse width
tPW
—
9
10
11
µs
Data valid from OE#
tOE
—
—
—
100
ns
Address hold from OE# high
tAOH
—
0
—
—
ns
Pin Check Function
Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer.
Setting up address as following condition call the preprogrammed codes on device outputs.
(VCC = 3.3 V ± 0.1 V, CE# = VIL, OE# = VIL, BYTE#/VPP = VIH, Ta = 25°C ± 5°C)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
0
1
0
1
0
1
0
0
1
1
FF00
1
0
1
0
1
0
1
1
0
0
00FF
0
1
0
1
0
1
0
1
0
VH∗
1
0
1
0
1
0
1
0
1
VH∗
A10 A11 A12 A13 A14 A15 A16 A17 A18 A19
Other conditions
DATA
FFFF
∗: VH = 7.0V ± 0.25 V
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MR27V1602F / OTP
Consecutive Programming Waveforms
A0 to A19
tAS
tAH
CE#
tPW
High
OE#
tDH
tDS
Din
D0 to D15
Din
tVS
BYTE#/Vpp
Consecutive Program Verify Waveforms
A0 to A19
High
CE#
tACC
tAHO
OE#
tOE
D0 to D15
BYTE#/Vpp
tOHZ
Dout
Dout
8.0 V
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OKI Semiconductor
MR27V1602F / OTP
Program and Program Verify Cycle Waveforms
A0 to A19
tAS
tAHO
CE#
tPW
tOES
OE#
tOHZ
tDH
tDS
tOE
tOHZ
Dout
Din
D0 to D15
8.0 V
BYTE#/Vpp
Pin Capacitance
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Symbol
Input
CIN1
BYTE#/VPP
CIN2
Output
COUT
Condition
VI = 0 V
VO = 0 V
Min.
Typ.
Max.
—
—
8
—
—
120
—
—
10
Unit
pF
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FEDR27V1602F-01-02
OKI Semiconductor
MR27V1602F / OTP
Programming/Verify Flow Chart
Programming
Verify
Start
Start
Pin Check
Pin Check
NG
Bad Insertion
NG
Bad Insertion
PASS
PASS
Address = First Location
Address = First Location
VCC = 4.0 V
VCC = 2.8 V/VPP = 2.8 V
VPP = 8.2 V
NG
Verify
PASS
Program 10 µs
VCC = 4.0 V/VPP = 4.0 V
Increment Address
NO
Last Address?
NG
Verify
YES
PASS
Address = First Location
Device Passed
Device Failed
X=0
NG
Verify(One Word)
X = X+1
PASS
Increment Address
NO
YES
Last Address?
X = 2?
YES
NO
VCC = 2.8 V/VPP = 2.8 V
Verify
Program 10 µs
NG
PASS
Device Passed
Device Failed
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MR27V1602F / OTP
PACKAGE DIMENSIONS
(Unit: mm)
SOP44-P-600-1.27-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
2.10 TYP.
4/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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MR27V1602F / OTP
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.55 TYP.
1/Dec. 2, 1999
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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MR27V1602F / OTP
REVISION HISTORY
Page
Previous
Current
Edition
Edition
Document
No.
Date
FEDR27V1602F-01-01
Apr. 20, 2004
–
–
Final edition 1
FEDR27V1602F-01-02
Jul. 9, 2004
4
4
Add PD condition and IOS = 10mA
Description
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MR27V1602F / OTP
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any
system or application where the failure of such system or application may result in the loss or damage of
property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2004 Oki Electric Industry Co., Ltd.
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