IRF830I-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Ease of Paralleling
D
▼ Fast Switching Characteristic
▼ Simple Drive Requirement
G
▼ RoHS Compliant & Halogen-Free
BVDSS
500V
RDS(ON)
1.5Ω
ID
4.5A
S
Description
APEC MOSFET provide the power designer with the best combination of
fast switching , lower on-resistance and reasonable cost.
G
D
TO-220CFM(I)
S
The TO-220CFM isolation package is widely preferred for commercialindustrial through hole applications.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
500
V
VGS
Gate-Source Voltage
+20
V
ID@TC=25℃
Continuous Drain Current, V GS @ 10V
4.5
A
ID@TC=100℃
Continuous Drain Current, V GS @ 10V
2.8
A
18
A
36.7
W
101
mJ
4.5
A
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
2
EAS
Single Pulse Avalanche Energy
IAR
Avalanche Current
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Rthj-c
Maximum Thermal Resistance, Junction-case
Rthj-a
Maximum Thermal Resistance, Junction-ambient
Data & specifications subject to change without notice
Value
Unit
3.4
℃/W
62
℃/W
1
200907281
IRF830I-HF
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=1mA
500
-
-
V
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=2.7A
-
-
1.5
Ω
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
4
V
gfs
Forward Transconductance
VDS=10V, ID=2.7A
-
2.4
-
S
IDSS
Drain-Source Leakage Current
VDS=500V, VGS=0V
-
-
25
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
ID=3.1A
-
28
45
nC
3
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=400V
-
4
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
16
-
nC
3
td(on)
Turn-on Delay Time
VDD=250V
-
10
-
ns
tr
Rise Time
ID=3.1A
-
15
-
ns
td(off)
Turn-off Delay Time
RG=12Ω,VGS=10V
-
41
-
ns
tf
Fall Time
RD=80.6Ω
-
20
-
ns
Ciss
Input Capacitance
VGS=0V
-
710
1140
pF
Coss
Output Capacitance
VDS=25V
-
170
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
60
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2
-
Ω
Min.
Typ.
IS=4.5A, VGS=0V
-
-
1.5
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
3
3
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=3.1A, VGS=0V,
-
370
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
3.9
-
uC
Notes:
1.Pulse width limited by Max. junction temperature.
o
2.Starting Tj=25 C , VDD=50V , L=10mH , RG=25Ω
3.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
IRF830I-HF
8
5
4
10V
7 .0V
6 .0V
3
5 .0 V
o
T C =25 C
ID , Drain Current (A)
6
ID , Drain Current (A)
T C =150 o C
10V
7.0V
6.0V
4
2
V G = 4. 5 V
5.0V
2
1
V G =4.5V
0
0
0
4
8
12
16
0
20
V DS , Drain-to-Source Voltage (V)
4
8
12
16
20
24
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
3
1.2
1.1
Normalized RDS(ON)
Normalized BVDSS (V)
I D =2.7A
V G =10V
1
2
1
0.9
0
0.8
-50
0
50
100
-50
150
o
T j , Junction Temperature ( C)
0
50
100
150
T j , Junction Temperature ( o C )
Fig 3. Normalized BVDSS v.s. Junction
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
1.4
8
1.2
T j = 150 o C
Normalized VGS(th) (V)
10
T j = 25 o C
IS (A)
6
4
1
0.8
0.6
2
0.4
0
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
IRF830I-HF
f=1.0MHz
10000
12
I D =3.1A
V DS =100V
V DS =250V
V DS =400V
8
1000
C iss
C (pF)
VGS , Gate to Source Voltage (V)
10
6
C oss
4
100
C rss
2
0
10
0
10
20
30
40
1
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
10
Operation in this area
limited by RDS(ON)
ID (A)
100us
1ms
1
10ms
100ms
1s
DC
0.1
o
T c =25 C
Single Pulse
Normalized Thermal Response (Rthjc)
1
Duty factor=0.5
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
t
Single Pulse
T
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
0.001
0.01
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4