Rohm BD6026GU Silicon monolithic integrated circuit Datasheet

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Structure
Silicon Monolithic Integrated Circuit
Product Name
Power supply for CCD camera / White LED driver / RGB LED driver
of mobile phone
Type
BD6026GU
Features
A system power supply for the CCD camera module
Built-in white LED driver for the LCD back light and RGB LED driver
o
○Absolute Maximum Ratings (Ta=25 C)
Parameter
Symbol
Rating
Maximum Applied Voltage 1
VMAX1
20(*1)
Maximum Applied Voltage 2
VMAX2
16(*2)
Maximum Applied Voltage 3
VMAX3
15(*3)
Maximum Applied Voltage 4
VMAX4
-13.5(*4)
Maximum Applied Voltage 5
VMAX5
6(*5)
Power Dissipation
Pd
2500(*6)
Operating Temperature Range
Topr
-30 to 85
Storage Temperature Range
Tstg
-55 to 150
(*1) VPLUS11, VPLUS12, VPLUS2 pin (*2) CAMP pin
(*3) LEDR, LEDG, LEDB, BKLED, FLED1, FLED2 pin
(*4) VNEG11, VNEG12, CAMN pin
(*5) Except *1~ *4 pin
o
o
(*6) Power dissipation deleting is 20mW/ C, when it’s used in over 25 C.
It’s deleting is on the board that is ROHM’s standard.
Unit
V
V
V
V
V
mW
o
C
o
C
Condition
Unit
Condition
o
○Recommended operating conditions (Ta=-30 to 85 C)
Rating
Min.
Typ.
Max.
VBAT power supply voltage
VBAT
2.7
3.6
4.5
VIO power supply voltage
VIO
1.62
3.0
3.3
This product isn’t designed to protect itself against radioactive rays.
Parameter
Symbol
REV. A
V
V
2/4
○Electrical Characteristics
o
Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V
Parameter
Symbol
Min.
Spec
Typ.
Max.
Unit
Circuit Current
VBAT Circuit current 1
VBAT Circuit current 2
VBAT Circuit current 3
IQ1
IQ2
IQ3
-
0.5
0.1
6.2
3.0
3.0
9.3
µA
µA
µA
VBAT Circuit current 5
IQ5
-
11
16
µA
Condition
RSTB=0V
RSTB=0V, VIO=0V
REGVCC ON (Energy save mode)
REGVCC ON (Energy save mode)
REG1 ON (Energy save mode)
REG2 ON (Energy save mode)
REGVCC ON (Normal Mode)
SWREG1 ON (Vo=14V, Io=1mA)
VBAT Circuit current 8
IQ8
-
26
39
mA
SWREG3 ON (Vo=-10V, Io=1mA)
(Add 30h=01h, Add 80h=01h)
REGCP ON, REGCN ON
SWREG1
(DC/DC for white LED and power supply for Camera )
FLED1 drive current 3
IFLED13
27.0
30.0
33.0
FLED2 drive current 3
IFLED23
27.0
30.0
33.0
BKLED drive current 3
IBKLED3
27.0
30.0
33.0
SWREG2
(DC/DC for RGB LED )
mA
mA
mA
LEDR Drive current
(Large current 2)
ILEDR32
mA
LEDG Drive current
(Large current 2)
ILEDG32
LEDB Drive current
(Large current 2)
ILEDB32
REGCP
Add=80h Data=3Eh
Add=90h Data=1Eh
Add=A0h Data=0Ch
178
210
242
Add=50h Data=1Eh
Add=B0h Data=02h
Add=A0h Data=0Ah
178
210
242
mA
Add=60h Data=1Eh
Add=B0h Data=02h
Add=A0h Data=09h
178
210
242
mA
Add=70h Data=1Eh
Add=B0h Data=02h
(15V/13V LDO)
Output voltage 1
VO151
14.5
15.0
15.5
V
Output voltage 2
VO152
12.5
13.0
13.5
V
REGCN
Add=80h Data=1Eh
Io=60mA, REGCPVSEL=0,
VPLUS12=16V
Io=60mA, REGCPVSEL=1,
VPLUS12=14V
(-8V/-7.5/-7V LDO)
Io=100mA, VNEG12=-10V
Output voltage 1
VO81
-8.4
-8.0
-7.6
V
Output voltage 2
VO82
-7.9
-7.5
-7.1
V
Output voltage 3
VO83
-7.4
-7.0
-6.6
V
ICUR3
0.57
0.60
0.63
V
Add=E0h, Data=FFh
VO11
VO12
2.94
3.04
3.00
3.10
3.06
3.16
V
V
Io=150mA, REG1VSEL=0, REG1MD=1
VO13
2.85
3.00
3.15
V
Io=100μA, REG1VSEL=0, REG1MD=0
VO14
2.945
3.100
3.255
V
Io=100μA, REG1VSEL=1, REG1MD=0
VO21
VO22
1.74
2.45
1.80
2.50
1.86
2.55
V
V
Io=100mA, REG2VSEL=L, REG2MD=1
VO23
1.70
1.80
1.90
V
Io=100μA, REG2VSEL=L, REG2MD=0
VO24
2.375
2.500
2.625
V
Io=100μA, REG2VSEL=H,, REG2MD=0
Constant current drive
CURSENS pin control
voltage 3
REG1
(3.0V/3.1V LDO)
Output voltage 1
Output voltage 2
Output voltage
(Energy save mode) 1
Output voltage
(Energy save mode) 2
REG2
(1.8V/2.5V LDO)
Output voltage 1
Output voltage 2
Output voltage
(Energy save mode) 1
Output voltage
(Energy save mode) 2
REV. A
REGCNVSEL1=0, REGCNVSEL2=0
Io=100mA, VNEG12=-10V
REGCNVSEL1=1/0, REGCNVSEL2=1
Io=100mA, VNEG12=-9V
REGCNVSEL1=1, REGCNVSEL2=0
Io=150mA, REG1VSEL=1, REG1MD=1
Io=100mA, REG2VSEL=H, REG2MD=1
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○External dimensions
○Terminals
PIN
Type
BD6026GU
PIN Name
PIN
PIN Name
PIN
H10
PIN Name
A1
T1
C9
TESTO
TRSW3
A2
GND2
C10
REG2O
J1
VIO
A3
VBAT1
D1
REG1CNT
J2
TESTI
A4
LEDR
D2
REG2CNT
J3
REG2VSEL
A5
GND3
D9
VBAT3
J4
VCC
A6
LEDB
D10
VBAT4
J5
FLED2
A7
CAMN
E1
CUR
J6
FLED1
A8
GND5
E2
CURSENS
J7
TRSW1
A9
CAMP
E9
IREF
J8
SENSP1
A10
T2
E10
REG1O
J9
SENSN1
B1
VPLUS2
F1
LEDCTL
J10
GND8
B2
GND1
F2
REGVCCCNT
K1
T4
B3
VBAT2
F9
SENSP3
K2
GND11
B4
TRSW2
F10
VREF
K3
VBAT8
B5
LEDG
G1
RSTB
K4
BKLED
B6
GND4
G2
CLK
K5
GND10
B7
VNEG12
G9
VBAT5
K6
VBAT7
B8
GND6
G10
VBAT6
K7
GND9
LOT No.
VCSP85H5 (65pins)
(Unit : mm)
B9
GND7
H1
DATA
K8
VPLUS11
B10
VPLUS12
H2
STRB
K9
SENSN3
C1
SENSN2
H8
NC
K10
T3
C2
SENSP2
H9
VNEG11
○Block diagram
VBAT1~8
PWM
Comp
TRSW1
PWM
Comp
Driver
SENSP1
+ -
SENSP2
SENSN2
SWREG1
SWREG2
Driver
TRSW2
Current
Limiter
+
-
- +
VPLUS2
OSC
+ -
- +
+
ERR
Amp
+
-
Current
Limiter
OSC
Over Voltage
DET
SENSN1
Over Voltage
DET
ERR
Amp
VPLUS11
+
VPLUS12
SEL
LEDB
SEL
LEDG
LEDR
BKLED
FLED1
TESTO
VREF
Reference
Voltage
VREF
IREF
Reference
Current
IREF
VCC
LDO
2.45V
FLED2
SWREG3
SENSP3
Current
Limiter
+
SENSN3
Power
Supply
REGVCCCNT
TRSW3
Driver
VIO
Over Voltage
DET
REG1CNT
+
+
REG2VSEL
VNEG11
ERR
Amp
PWM
Comp
REG2CNT
+
OSC
VNEG12
REGCP
Level
CLK
Shift
VPLUS12
CPU I/F
LDO
15V/13V
VNEG12
LDO
-8V/-7.5V/-7V
CAMP
REGCN
DATA
Control
STRB
CPU I/F
REG1
Logic
LDO
3.0V/3.1V
CPU I/F
RSTB
CAMN
REG1O
REG2
LEDCTL
LDO
1.8V/2.5V
CPU I/F
REG2O
TESTI
+
-
T1
8BIT
DAC
T2
T3
T4
GND1~11
REV. A
CUR
CURSENS
-
-
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○Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and
GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the
external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a
capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly
check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity
dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or
higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is
aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee
of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its
operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation
(Pd) in actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited
because it has the possibility that a operation becomes unstable.
(11) DC/DC converter
Please select the low DCR inductors to decrease power loss for DC/DC converter.
(12) Other cautions on use
Please consult supplementary documents such as function description of this LSI.
REV. A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
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instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
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