PHILIPS BZG03-C39 Voltage regulator diode Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D168
BZG03 series
Voltage regulator diodes
Preliminary specification
Supersedes data of October 1993
1996 Jun 07
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
BZG03 series
FEATURES
DESCRIPTION
• Glass passivatedb
DO-214AC surface mountable
package with glass passivated chip.
• High maximum operating
temperature
• Low leakage current
• Excellent stability
,,
,,
,,
cathode
band
handbook, 4 columns
• UL 94V-O classified plastic
package
• Zener working voltage range:
10 to 270 V for 35 types
• Supplied in 12 mm embossed tape.
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
k
a
Top view
Side view
MSA473
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Ptot
total power dissipation
Ttp = 100 °C; see Fig.2
−
3.00
W
Ptot
total power dissipation
Tamb = 50 °C; see Fig.2; device
mounted on an Al2O3 PCB (see Fig.5)
−
1.25
W
PZSM
non-repetitive peak reverse power
dissipation
tp = 100 µs; square pulse;
Tj = 25 °C prior to surge; see Fig.3
−
600
W
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
−65
+175
°C
1996 Jun 07
2
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
BZG03 series
ELECTRICAL CHARACTERISTICS
Total series
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
forward voltage
VF
MAX.
IF = 0.5 A; see Fig.4
1.2
UNIT
V
Per type
Tj = 25 °C unless otherwise specified.
TYPE
No.
SUFFIX
WORKING VOLTAGE
VZ (V) at IZ
DIFFERENTIAL TEMPERATURE
TEST
RESISTANCE
COEFFICIENT CURRENT
rdif (Ω) at IZ
SZ (%/K) at IZ
(1)
MIN.
NOM.
MAX.
TYP.
C10
9.4
10
10.6
2
C11
10.4
11
11.6
C12
11.4
12
C13
12.4
C15
IR (µA)
MAX.
4
0.05
0.09
50
7
7.5
4
7
0.05
0.10
50
4
8.2
12.7
4
7
0.05
0.10
50
3
9.1
13
14.1
5
10
0.05
0.10
50
2
10
13.8
15
15.6
5
10
0.05
0.10
50
1
11
C16
15.3
16
17.1
6
15
0.06
0.11
25
1
12
C18
16.8
18
19.1
6
15
0.06
0.11
25
1
13
C20
18.8
20
21.2
6
15
0.06
0.11
25
1
15
C22
20.8
22
23.3
6
15
0.06
0.11
25
1
16
C24
22.8
24
25.6
7
15
0.06
0.11
25
1
18
C27
25.1
27
28.9
7
15
0.06
0.11
25
1
20
C30
28
30
32
8
15
0.06
0.11
25
1
22
C33
31
33
35
8
15
0.06
0.11
25
1
24
C36
34
36
38
21
40
0.06
0.11
10
1
27
C39
37
39
41
21
40
0.06
0.11
10
1
30
C43
40
43
46
24
45
0.07
0.12
10
1
33
C47
44
47
50
24
45
0.07
0.12
10
1
36
C51
48
51
54
25
60
0.07
0.12
10
1
39
C56
52
56
60
25
60
0.07
0.12
10
1
43
C62
58
62
66
25
80
0.08
0.13
10
1
47
C68
64
68
72
25
80
0.08
0.13
10
1
51
C75
70
75
79
30
100
0.08
0.13
10
1
56
C82
77
82
87
30
100
0.08
0.13
10
1
62
C91
85
91
96
60
200
0.09
0.13
5
1
68
C100
94
100
106
60
200
0.09
0.13
5
1
75
C110
104
110
116
80
250
0.09
0.13
5
1
82
C120
114
120
127
80
250
0.09
0.13
5
1
91
3
MAX.
VR (V)
MIN.
1996 Jun 07
MAX.
IZ (mA)
REVERSE CURRENT
at REVERSE VOLTAGE
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
TYPE
No.
SUFFIX
WORKING VOLTAGE
BZG03 series
DIFFERENTIAL TEMPERATURE
TEST
RESISTANCE
COEFFICIENT CURRENT
VZ (V) at IZ
rdif (Ω) at IZ
SZ (%/K) at IZ
(1)
MIN.
NOM.
MAX.
TYP.
MAX.
MIN.
MAX.
IZ (mA)
REVERSE CURRENT
at REVERSE VOLTAGE
IR (µA)
MAX.
VR (V)
C130
124
130
141
110
300
0.09
0.13
5
1
100
C150
138
150
156
130
300
0.09
0.13
5
1
110
C160
153
160
171
150
350
0.09
0.13
5
1
120
C180
168
180
191
180
400
0.09
0.13
5
1
130
C200
188
200
212
200
500
0.09
0.13
5
1
150
C220
208
220
233
350
750
0.09
0.13
2
1
160
C240
228
240
256
400
850
0.09
0.13
2
1
180
C270
251
270
289
450
1000
0.09
0.13
2
1
200
Note
1. To complete the type number the suffix is added to the basic type number, e.g. BZG03-C130.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
thermal resistance from junction to tie-point
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
25
K/W
note 1
100
K/W
note 2
150
K/W
Notes
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5.
For more information please refer to the “General Part of associated Handbook”.
1996 Jun 07
4
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
BZG03 series
GRAPHICAL DATA
MBH451
4
MBH452
104
handbook, halfpage
handbook, halfpage
Ptot
PZSM
(W)
(W)
3
103
2
102
1
10
10−2
0
100
0
T (°C)
200
Solid line: tie-point temperature.
Dotted line: ambient temperature; device mounted on an Al2O3 PCB
as shown in Fig.5.
1
tp (ms)
10
Tj = 25 °C prior to surge.
Fig.3
Fig.2
10−1
Maximum total power dissipation as a
function of temperature.
Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
MBH453
3
50
handbook, halfpage
IF
(A)
2
4.5
50
2.5
1
1.25
0
1
0
VF (V)
MSB213
2
Tj = 25 °C.
Dimensions in mm.
Fig.4
Forward current as a function of forward
voltage; typical values.
1996 Jun 07
Fig.5 Printed-circuit board for surface mounting.
5
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
BZG03 series
PACKAGE OUTLINE
5.5
5.1
4.5
4.3
handbook, full pagewidth
2.3
2.0
0.05
2.8 1.6
2.4 1.4
,
,
,
,
0.2
3.3
2.7
MSA414
Dimensions in mm.
The marking band indicates the cathode.
Fig.6 DO-214AC; SOD106.
1996 Jun 07
6
Philips Semiconductors
Preliminary specification
Voltage regulator diodes
BZG03 series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 07
7
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