Features ! W NE ■ ■ ■ ■ ■ ■ Applications ■ Very low profile High voltage Lead-free construction Symmetrical 2018 footprint Agency recognition pending ■ ■ ■ Power Over Ethernet (IEEE 802.3 af) port protection Firewire and i.Link IEEE 1394 port protection Automotive electronic control module protection Telecom equipment low voltage protection MF-SMDF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 V max. Volts 60 60 15 15 33 10 I max. Amps 20 10 40 40 40 40 Itrip Resistance Amperes at 23 °C Hold Trip Ohms at 23 °C RMin. R1Max. 0.30 0.55 1.10 1.50 1.50 2.00 0.450 0.200 0.100 0.070 0.070 0.048 0.80 1.20 2.20 3.00 3.00 4.10 2.250 0.950 0.390 0.175 0.175 0.095 Max. Time To Trip Tripped Power Dissipation Amperes at 23 °C Seconds at 23 °C Watts at 23 °C Typ. 1.5 2.5 8.0 8.0 8.0 8.0 1.5 4.0 0.5 0.9 0.9 2.7 0.7 1.0 1.1 1.2 1.2 1.3 Environmental Characteristics Operating Temperature ......................................-40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................125 °C Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-SMDF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 -40 ˚C 0.48 / 0.96 0.86 / 1.72 1.59 / 3.18 2.21 / 4.42 2.21 / 4.42 2.81 / 5.62 -20 ˚C 0.42 / 0.84 0.77 / 1.54 1.43 / 2.86 1.97 / 3.94 1.97 / 3.94 2.54 / 5.08 0 ˚C 0.35 / 0.70 0.70 / 1.40 1.20 / 2.40 1.70 / 3.40 1.70 / 3.40 2.27 / 4.54 23 ˚C 0.30 / 0.60 0.55 / 1.10 1.10 / 2.20 1.50 / 3.00 1.50 / 3.00 2.00 / 4.00 40 ˚C 0.24 / 0.48 0.48 / 0.96 0.94 / 1.88 1.26 / 2.52 1.26 / 2.52 1.73 / 3.46 50 ˚C 0.21 / 0.42 0.43 / 0.86 0.85 / 1.70 1.15 / 2.30 1.15 / 2.30 1.59 / 3.18 60 ˚C 0.17 / 0.34 0.38 / 0.76 0.72 / 1.44 1.00 / 2.00 1.00 / 2.00 1.46 / 2.92 70 ˚C 0.15 / 0.30 0.36 / 0.72 0.69 / 1.38 0.91 / 1.82 0.91 / 1.82 1.32 / 2.64 85 ˚C 0.10 / 0.20 0.26 / 0.52 0.57 / 1.14 0.73 / 1.46 0.73 / 1.46 1.12 / 2.24 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Product Dimensions A Model MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 B Min. 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) C Max. 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) Min. 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) Max. 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Packaging: 2000 pcs. per reel. Top and Bottom View A UNIT = Side View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004) B MM (INCHES) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. 3.4 ± 0.1 (.134 ± .004) D E Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) E Recommended Storage: 40 °C max./70 % RH max. Typical Time to Trip at 23 ˚C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Time to Trip (Seconds) 10 MF-SMDF050 MF-SMDF030 1 0.1 MF-SMDF200 0.01 MF-SMDF150 MF-SMDF100 0.001 0.1 1 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 10 100 MF-SMDF Series - PTC Resettable Fuses Solder Reflow Recommendations 300 Preheating How to Order Soldering MF - SMDF 150/33 T - 2 Cooling Multifuse® Product Designator Series SMDF = 2018 Surface Mount Component Temperature (°C) 250 200 Hold Current, Ihold 030-200 (0.30 Amps - 2.00 Amps) 150 Higher Voltage Option __ = Standard Voltage /33 = 33 Volt Rated 100 Optional Terminal Finish __ = Standard Au Finish T = Optional Sn Finish 50 Packaging Packaged per EIA 481-1 -2 = Tape and Reel 0 160–220 10–20 120 Time (seconds) Typical Part Marking Represents total content. Layout may vary. BI-WEEKLY DATE CODE: WEEKS 13-14 = G 10 3G Notes: • MF-SMDF models cannot be wave soldered. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. MANUFACTURER'S TRADEMARK YEAR CODE: 3 = 2003 PART IDENTIFICATION: 30 = MF-SMDF030 05 = MF-SMDF050 10 = MF-SMDF100 15 = MF-SMDF150 20 = MF-SMDF200 MF-SMDF SERIES, REV. B, 05/04 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-NSMF & MF-SMDF Series Tape and Reel Specifications MF-NSMF Series per EIA 481-1 MF-SMDF Series per EIA 481-2 W 8.0 ± 0.30 (0.315 ± 0.012) 16.0 ± 0.3 (0.630 ± 0.012) P0 4.0 ± 0.10 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) P1 P2 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 8.0 ± 0.1 (0.315 ± 0.004) 2.0 ± 0.1 (0.079 ± 0.004) A0 1.85 ± 0.10 (0.073 ± 0.004) 5.1 ± 0.15 (0.201 ± 0.006) B0 3.45 ± 0.10 (0.136 ± 0.004) 5.6 ± 0.23 (0.220 ± 0.009) Tape Dimensions 12.1 (0.476) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 7.5 ± 0.10 (0.295 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) B1 max. D0 F 1.75 ± 0.10 (0.069 ± 0.004) 6.25 (0.246) 0.6 (0.024) E1 E2 min. T max. 0.1 (0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 0.74 ± 0.10 (0.029 ± 0.004) 1.0 ± 0.15 (0.039 ± 0.015) 390 (15.35) 160 (6.30) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 331 (13.03) 50 (1.97) T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. UNIT = P0 T D0 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) P2 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 W1(MEASURED AT HUB) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.