OPA3692 OPA 369 2 SBOS228E – FEBRUARY 2002 – REVISED DECEMBER 2008 www.ti.com Triple, Wideband, Fixed Gain Video BUFFER AMPLIFIER With Disable FEATURES APPLICATIONS ● FLEXIBLE SUPPLY RANGE: +5V to +12V Single Supply ±2.5V to ±6V Dual Supplies ● INTERNALLY FIXED GAIN: +2 or ±1 ● HIGH BANDWIDTH (G = +2): 225MHz ● LOW SUPPLY CURRENT: 5.1mA/ch ● LOW DISABLED CURRENT: 150µA/ch ● HIGH OUTPUT CURRENT: 190mA ● OUTPUT VOLTAGE SWING: ±4.0V ● IMPROVED HIGH-FREQUENCY PINOUT ● ● ● ● ● ● ● RGB VIDEO LINE DRIVERS MULTIPLE LINE VIDEO DAs PORTABLE INSTRUMENTS ADC BUFFERS ACTIVE FILTERS WIDEBAND DIFFERENTIAL RECEIVERS IMPROVED UPGRADE TO OPA3682 OPA3692 RELATED PRODUCTS SINGLES DUALS TRIPLES DESCRIPTION Voltage-Feedback OPA690 OPA2690 OPA3690 Current-Feedback OPA691 OPA2691 OPA3691 The OPA3692 provides an easy-to-use, broadband fixed gain, triple buffer amplifier. Depending on the external connections, the internal resistor network may be used to provide either a fixed gain of +2 video buffer, or a gain of +1 or –1 voltage buffer. Operating on a very low 5.1mA/ch supply current, the OPA3692 offers a slew rate and output power normally associated with a much higher supply current. A new output stage architecture delivers high output current with minimal headroom and crossover distortion. This gives exceptional single-supply operation. Using a single +5V supply, the OPA3692 can deliver a 1V to 4V output swing with over 120mA drive current and > 200MHz bandwidth. This combination of features makes the OPA3692 an ideal RGB line driver or single-supply, triple Analog-toDigital Converter (ADC) input driver. Fixed Gain OPA692 — OPA3682 The low 5.1mA/ch supply current of the OPA3692 is precisely trimmed at +25°C. This trim, along with low drift over temperature, ensures lower maximum supply current than competing products that report only a room temperature nominal supply current. System power can be further reduced by using the optional disable control pin. Leaving this disable pin open, or holding it HIGH, gives normal operation. If pulled LOW, the OPA3692 supply current drops to less than 150µA/ch while the output goes into a high-impedance state. This feature may be used for power savings. VR 1/3 OPA3692 75.0Ω 75.0Ω 75Ω Cable RG-59 402Ω VG 402Ω 1/3 OPA3692 75.0Ω 75.0Ω 75Ω Cable RG-59 402Ω VB 402Ω 1/3 OPA3692 75.0Ω 75.0Ω 75Ω Cable RG-59 402Ω 402Ω RGB Line Driver Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2002-2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Power Supply ............................................................................... ±6.5VDC Internal Power Dissipation(2) ............................ See Thermal Information Differential Input Voltage(3) ............................................................... ±1.2V Input Voltage Range ............................................................................ ±VS Storage Temperature Range: D, DBQ ........................... –65°C to +125°C Lead Temperature (soldering, 10s) .............................................. +300°C Junction Temperature (TJ ) ........................................................... +175°C ESD Resistance: HBM .................................................................... 2000V CDM .................................................................... 1500V MM ........................................................................ 200V This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Packages must be derated based on specified θJA. Maximum TJ must be observed. (3) Noninverting input to internal inverting node. PACKAGE/ORDERING INFORMATION(1) PRODUCT OPA3692 " OPA3692 " PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY SO-16 D –40°C to +85°C OPA3692 " " " " SSOP-16 DBQ –40°C to +85°C OPA3692 " " " " OPA3692ID OPA3692IDR OPA3692IDBQT OPA3692IDBQR Rails, 48 Tape and Reel, 2500 Tape and Reel, 250 Tape and Reel, 2500 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATION Top View SSOP, SO OPA3692 402Ω 402Ω –IN A 1 16 DIS A +IN A 2 15 +VS DIS B 3 402Ω 14 OUT A 402Ω –IN B 4 13 –VS +IN B 5 12 OUT B DIS C 6 402Ω 11 +VS 402Ω –IN C 7 10 OUT C +IN C 8 9 –VS ELECTRICAL CHARACTERISTICS: VS = ±5V Boldface limits are tested at +25°C. G = +2 (–IN grounded) and RL = 100Ω (see Figure 1 for AC performance only), unless otherwise noted. OPA3692ID, OPA3692IDBQ MIN/MAX OVER TEMPERATURE(1) TYP PARAMETER AC PERFORMANCE (see Figure 1) Small-Signal Bandwidth (VO < 0.5VPP) Bandwidth for 0.1dB Gain Flatness Peaking at a Gain of +1 Large-Signal Bandwidth Slew Rate Rise-and-Fall Time 2 CONDITIONS +25°C G = +1 G = +2 G = –1 G = +2, VO < 0.5VPP VO < 0.5Vp-p G = +2, VO = 5VPP G = +2, 4V Step G = +2, VO = 0.5V Step G = +2, VO = 5V Step 280 225 220 120 0.2 220 2000 1.6 1.9 +25°C 0°C to 70°C –40°C to +85°C 185 180 170 40 1 35 1.5 30 2 1400 1375 1350 UNITS MIN/ MAX TEST LEVEL(2 ) MHz MHz MHz MHz dB MHz V/µs ns ns typ min typ min max typ min typ typ C B C B B C B C C OPA3692 www.ti.com SBOS228E ELECTRICAL CHARACTERISTICS: VS = ±5V (Cont.) Boldface limits are tested at +25°C. G = +2 (–IN grounded) and RL = 100Ω (see Figure 1 for AC performance only), unless otherwise noted. OPA3692ID, OPA3692IDBQ MIN/MAX OVER TEMPERATURE(1) TYP PARAMETER AC PERFORMANCE (Cont.) Settling Time to 0.02% 0.1% Harmonic Distortion 2nd-Harmonic 3rd-Harmonic Input Voltage Noise Noninverting Input Current Noise Inverting Input Current Noise (Internal) Differential Gain Differential Phase Channel-to-Channel Crosstalk DC PERFORMANCE(3) Gain Error Internal RF and RG Maximum Minimum Average Drift Input Offset Voltage Average Offset Voltage Drift Noninverting Input Bias Current Average Noninverting Input Bias Current Drift Inverting Input Bias Current Average Inverting Input Bias Current Drift CONDITIONS +25°C G = +2, VO = 2V Step G = +2, VO = 2V Step G = +2, f = 5MHz, VO = 2VPP RL = 100Ω RL ≥ 500Ω RL = 100Ω RL ≥ 500Ω f > 1MHz f > 1MHz f > 1MHz NTSC, RL = 150Ω NTSC, RL = 37.5Ω NTSC, RL = 150Ω NTSC, RL = 37.5Ω f = 5MHz, Input Referred, All Hostile 12 8 –69 –79 –76 –94 1.7 12 15 0.07 0.17 0.02 0.07 –82 G = +1 G = +2 G = –1 ±0.2 ±0.3 ±0.2 Current Output, Sourcing Sinking Short-Circuit Current Closed-Loop Output Impedance DISABLE/POWER DOWN (DIS Pin) Power-Down Supply Current (+VS) Disable Time Enable Time Off Isolation Output Capacitance in Disable Turn-On Glitch Turn-Off Glitch Enable Voltage Disable Voltage Control Pin Input Bias Current POWER SUPPLY Specified Operating Voltage Maximum Operating Voltage Range Maximum Quiescent Current (3 Channels) Minimum Quiescent Current (3 Channels) Power-Supply Rejection Ratio (–PSRR) TEMPERATURE RANGE Specification: D, DBQ Thermal Resistance, θJA D SO-16 DBQ SSOP-16 0°C to 70°C –40°C to +85°C UNITS MIN/ MAX TEST LEVEL(2 ) ns ns typ typ C C dBc dBc dBc dBc nV/√Hz pA/√Hz pA/√Hz % % deg deg dBc max max max max max max max typ typ typ typ typ B B B B B B B C C C C C –62 –70 –72 –87 2.5 14 17 –59 –67 –70 –82 2.9 15 18 –57 –65 –68 –78 3.1 15 19 ±1.5 ±1.6 ±1.6 ±1.7 ±1.7 % % % typ max max C A B ±0.8 457 347 0.13 ±3 +15 +35 ±5 ±25 462 342 0.13 ±3.7 ±12 +43 –300 ±30 ±90 464 340 0.13 ±4.3 ±20 +45 –300 ±40 ±200 Ω Ω %/°C mV µV/°C µA nA/°C µA nA°C max min max max max max max max max A A B A B A B A B ±3.5 100 || 2 ±3.4 ±3.3 ±3.2 V kΩ || pF min typ B C ±4.0 ±3.9 +190 –190 ±250 0.12 ±3.8 ±3.7 +160 –160 ±3.7 ±3.6 +140 –140 ±3.6 ±3.3 +100 –100 V V mA mA mA Ω min min min min typ typ A A A A C C –900 –1050 –1200 3.5 1.7 130 3.6 1.6 150 3.7 1.5 160 µA µs ns dB pF mV mV V V µA max typ typ typ typ typ typ min max max A C C C C C C A A A ±6 ±6 16.8 13.2 50 ±6 17.4 12.75 49 V V mA mA dB typ max max min min C A A A A –40 to +85 °C typ C 100 100 °C/W °C/W typ typ C C 402 402 VCM = 0V VCM = 0V VCM = 0V VCM = 0V VCM = 0V VCM = 0V INPUT Common-Mode Input Range Noninverting Input Impedance OUTPUT Voltage Output Swing +25°C No Load 100Ω Load G = +2, f = 100kHz VDIS = 0, All Channels VIN = +1VDC VIN = +1VDC G = +2, 5MHz –450 1 25 74 4 ±50 ±20 3.3 1.8 75 G = +2, RL = 150Ω, VIN = 0V G = +2, RL = 150Ω, VIN = 0V VDIS = 0, Each Channel ±5 VS = ±5V VS = ±5V Input Referred 15.3 15.3 58 ±1.5 15.9 14.7 52 NOTES: (1) Junction temperature = ambient temperature for low temperature limit and +25°C specifications. Junction temperature = ambient temperature +15°C at high temperature limit specifications. (2) Test Levels: (A) 100% tested at +25°C. Over-temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical value only for information. (3) Current is considered positive out-of-node. VCM is the input common-mode voltage. OPA3692 SBOS228E www.ti.com 3 ELECTRICAL CHARACTERISTICS: VS = +5V Boldface limits are tested at +25°C. G = +2 (–IN grounded though 0.1µF) and RL = 100Ω to VS /2 (see Figure 2 for AC performance only), unless otherwise noted. OPA3692ID, OPA3692IDBQ MIN/MAX OVER TEMPERATURE(1) TYP PARAMETER AC PERFORMANCE (see Figure 2) Small-Signal Bandwidth (VO < 0.5VPP) Bandwidth for 0.1dB Gain Flatness Peaking at a Gain of +1 Large-Signal Bandwidth Slew Rate Rise-and-Fall Time Settling Time to 0.02% 0.1% Harmonic Distortion 2nd-Harmonic 3rd-Harmonic Input Voltage Noise Noninverting Input Current Noise Inverting Input Current Noise DC PERFORMANCE(3) Gain Error Internal RF and RG Minimum Maximum Average Drift Input Offset Voltage Average Offset Voltage Drift Noninverting Input Bias Current Average Noninverting Input Bias Current Drift Inverting Input Bias Current Average Inverting Input Bias Current Drift INPUT Least Positive Input Voltage Most Positive Input Voltage Noninverting Input Impedance OUTPUT Most Positive Output Voltage Least Positive Output Voltage Current Output, Sourcing Sinking Short-Circuit Current Output Impedance DISABLE/POWER DOWN (DIS Pin) Power-Down Supply Current (+VS) Off Isolation Output Capacitance in Disable Turn-On Glitch Turn-Off Glitch Enable Voltage Disable Voltage Control Pin Input Bias Current (DIS) POWER SUPPLY Specified Single-Supply Operating Voltage Maximum Single-Supply Operating Voltage Maximum Quiescent Current (3 Channels) Minimum Quiescent Current (3 Channels) Power-Supply Rejection Ratio (+PSRR) TEMPERATURE RANGE Specification: D, DBQ Thermal Resistance, θJA D SO-16 DBQ SSOP-16 +25°C 0°C to 70°C –40°C to +85°C 168 160 140 40 1 30 2.5 25 3 600 575 550 –66 –73 –72 –77 1.7 12 15 –58 –65 –68 –72 2.5 14 17 –57 –63 –67 –70 2.9 15 18 ±0.2 ±0.3 ±0.2 ±1.5 ±1.5 ±0.8 457 347 0.13 ±3.5 +20 +40 ±5 ±20 1.5 3.5 100 || 2 UNITS MIN/ MAX TEST LEVEL(2 ) MHz MHz MHz MHz dB MHz V/µs ns ns ns ns typ min typ min max typ min typ typ typ typ C B C B B C B C C C C –56 –62 –65 –69 3.1 15 19 dBc dBc dBc dBc nV/√Hz pA/√Hz pA/√Hz max max max max max max max B B B B B B B ±1.6 ±1.6 ±1.7 ±1.7 % % % typ max max C A B 462 342 0.13 ±4.1 ±12 +46 –250 ±25 ±112 464 340 0.13 ±4.8 ±20 +56 –250 ±35 ±200 Ω Ω %/°C mV µV/°C µA nA/°C µA nA°C min max max max max max max max max B B B A B A B A B 1.6 3.4 1.7 3.3 1.8 3.2 V V kΩ || pF max min typ B B C 4.0 3.9 1.0 1.1 +160 –160 ±250 0.12 3.8 3.7 1.2 1.3 +120 –120 3.7 3.6 1.3 1.4 +100 –100 3.5 3.4 1.5 1.6 +80 –80 V V V V mA mA mA Ω min min max max min min typ typ A A A A A A C C –450 65 4 ±50 ±20 3.3 1.8 75 –900 –1050 –1200 3.5 1.7 130 3.6 1.6 150 3.7 1.5 160 µA dB pF mV mV V V µA max typ typ typ typ min max typ A C C B B A A C 12 14.4 12.3 12 15.3 11.4 12 15.9 11.0 V V mA mA dB typ max max min typ C A A A C –40 to +85 °C typ C 100 100 °C/W °C/W typ typ C C CONDITIONS +25°C G = +1 G = +2 G = –1 G = +2, VO < 0.5VPP VO < 0.5VPP G = +2, VO = 2VPP G = +2, 2V Step G = +2, VO = 0.5V Step G = +2, VO = 2V Step G = +2, VO = 2V Step G = +2, VO = 2V Step G = +2, f = 5MHz, VO = 2VPP RL = 100Ω to VS /2 RL ≥ 500Ω to VS /2 RL = 100Ω to VS /2 RL ≥ 500Ω to VS /2 f > 1MHz f > 1MHz f > 1MHz 240 190 195 90 0.2 210 830 2.0 2.3 14 10 G = +1 G = +2 G = –1 402 402 VCM = 2.5V VCM = 2.5V VCM = 2.5V VCM = 2.5V VCM = 2.5V VCM = 2.5V No Load RL = 100Ω No Load RL = 100Ω G = +2, f = 100kHz VDIS = 0, All Channels G = +2, 5MHz G = +2, RL = 150Ω, VIN = 2.5V G = +2, RL = 150Ω, VIN = 2.5V VDIS = 0, Each Channel 5 VS = +5V VS = +5V Input Referred 13.5 13.5 62 NOTES: (1) Junction temperature = ambient temperature for low temperature limit and +25°C specifications. Junction temperature = ambient temperature +15°C at high temperature limit specifications. (2) Test Levels: (A) 100% tested at +25°C. Over-temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical value only for information. (3) Current is considered positive out-of-node. VCM is the input common-mode voltage. 4 OPA3692 www.ti.com SBOS228E TYPICAL CHARACTERISTICS: VS = ±5V TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. SMALL-SIGNAL FREQUENCY RESPONSE LARGE-SIGNAL FREQUENCY RESPONSE 1 7 VO = 1Vp-p G = +1 6 –1 VO = 2Vp-p G = –1 –2 Gain (1dB/div) Normalized Gain (1dB/div) 0 –3 –4 –5 5 4 VO = 4Vp-p G = +2 –6 3 VO = 7Vp-p –7 2 –8 0 250MHz 0 500MHz 125MHz SMALL-SIGNAL PULSE RESPONSE LARGE-SIGNAL PULSE RESPONSE 4 VO = 0.5Vp-p G = +2 300 VO = 5Vp-p G = +2 3 Output Voltage (1V/div) Output Voltage (100mV/div) 400 200 100 0 –100 –200 2 1 0 –1 –2 –3 –300 –4 –400 Time (5ns/div) Time (5ns/div) COMPOSITE VIDEO dG/dP 0.20 Video In DIS DISABLED FEEDTHROUGH vs FREQUENCY –50 +5V 0.18 Video Loads No Pull-Down With 1.3kΩ Pull-Down –5V –60 dG Optional 1.3kΩ Pull-Down 0.12 Feedthrough (dB) 0.14 VDIS = 0 –55 1/3 OPA3692 0.16 dG/dP (%/°) 250MHz Frequency (25MHz/div) Frequency (50MHz/div) dG 0.10 0.08 dP 0.06 –65 –70 –75 –80 –85 0.04 dP –90 0.02 0 –95 1 2 3 0.5 4 10 100 Frequency (MHz) Number of 150Ω Loads OPA3692 SBOS228E 1 www.ti.com 5 TYPICAL CHARACTERISTICS: VS = ±5V (Cont.) TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. HARMONIC DISTORTION vs LOAD RESISTANCE HARMONIC DISTORTION vs SUPPLY VOLTAGE –60 –50 VO = 2Vp-p f = 5MHz VO = 2Vp-p RL = 100Ω f = 5MHz –55 –70 Harmonic Distortion (dBc) Harmonic Distortion (dBc) –65 2nd-Harmonic –75 –80 3rd-Harmonic –85 –90 –95 –60 2nd-Harmonic –65 –70 –75 –80 3rd-Harmonic –85 –100 –90 100 1000 2.0 2.5 3.0 Load Resistance (Ω) 4.5 5.0 5.5 6.0 –65 VO = 2Vp-p RL = 100Ω dBc = dB Below Carrier RL = 100Ω f = 5MHz –60 Harmonic Distortion (dBc) Harmonic Distortion (dBc) 4.0 HARMONIC DISTORTION vs OUTPUT VOLTAGE HARMONIC DISTORTION vs FREQUENCY (G = +2) –50 2nd-Harmonic –70 –80 3rd-Harmonic –90 –100 2nd-Harmonic –70 –75 3rd-Harmonic –80 –85 0.1 1 10 0.1 20 HARMONIC DISTORTION vs FREQUENCY (G = –1) –50 HARMONIC DISTORTION vs FREQUENCY (G = +1) VO = 2Vp-p RL = 100Ω dBc = dB Below Carrier Harmonic Distortion (dBc) –60 2nd-Harmonic –70 –80 3rd-Harmonic –90 5 –50 VO = 2Vp-p RL = 100Ω dBc = dB Below Carrier 1 Output Voltage Swing (Vp-p) Frequency (MHz) Harmonic Distortion (dBc) 3.5 Supply Voltage (±VS) –60 –70 3rd-Harmonic –80 –90 2nd-Harmonic –100 –100 0.1 1 10 20 0.1 Frequency (MHz) 6 1 10 20 Frequency (MHz) OPA3692 www.ti.com SBOS228E TYPICAL CHARACTERISTICS: VS = ±5V (Cont.) TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. 2-TONE, 3RD-ORDER INTERMODULATION SPURIOUS INPUT VOLTAGE AND CURRENT NOISE DENSITY –30 3rd-Order Spurious Level (dBc) Inverting Input Current Noise (15pA/√Hz) 10 Noninverting Current Noise (12pA/√Hz) Voltage Noise (1.7nV/√Hz) 1 dBc = dB below carriers 50MHz –40 –50 –60 20MHz –70 10MHz –80 Load Power at Matched 50Ω Load –90 100 1k 10k 100k 1M 10M –8 –6 –4 Frequency (Hz) RECOMMENDED RS vs CAPACITIVE LOAD Normalized Gain to Capacitive Load (dB) 50 RS (Ω) 40 30 20 10 0 10 2 4 6 8 10 100 9 CL = 10pF 6 3 CL = 47pF 0 CL = 22pF –3 VIN 1/3 OPA3692 402Ω –6 CL = 100pF RS VO CL 1kΩ 402Ω 1kΩ is optional. –9 1k 0 125MHz Capacitive Load (pF) 250MHz Frequency (25MHz/div) SUPPLY AND OUTPUT CURRENT vs TEMPERATURE POWER-SUPPLY REJECTION RATIO vs FREQUENCY 10 65 250 Sourcing Output Current 60 Supply Current (2mA/div) +PSRR 55 PSRR (dB) 0 FREQUENCY RESPONSE vs CAPACITIVE LOAD 60 1 –2 Single-Tone Load Power (dBm) –PSRR 50 45 40 35 30 8 200 Sinking Output Current 6 150 4 100 Quiescent Supply Current (1 Channel) 2 50 Output Current (50mA/div) Current Noise (pA/√Hz) Voltage Noise (nV/√Hz) 100 25 0 20 1k 10k 100k 1M 10M 100M –25 0 25 50 75 100 125 Ambient Temperature (°C) Frequency (Hz) OPA3692 SBOS228E 0 –50 www.ti.com 7 TYPICAL CHARACTERISTICS: VS = ±5V (Cont.) TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. TYPICAL DC DRIFT OVER TEMPERATURE OUTPUT VOLTAGE AND CURRENT LIMITATIONS Output Current Limited VO (V) 2 1 25Ω Load Line 0 –1 50Ω Load Line –2 100Ω Load Line 1W Internal Power Limit Single Channel –3 –4 Output Current Limit 0 50 30 1 20 0.5 10 Inverting Input Bias Current 0 0 –0.5 –10 Input Offset Voltage –1 –20 –1.5 –30 –2 –5 –300 –250 –200 –150 –100 –50 1.5 –40 –50 100 150 200 250 300 –25 0 25 50 75 100 125 Ambient Temperature (°C) IO (mA) LARGE-SIGNAL DISABLE/ENABLE RESPONSE DISABLE/ENABLE GLITCH 6.0 0 2.0 1.6 Output Voltage 0.8 0.4 VIN = +1V 0 VDIS Output Voltage (10mV/div) Output Voltage (400mV/div) 2.0 6.0 VDIS (2V/div) 4.0 VDIS 1.2 0 30 20 Output Voltage VIN = 0V 10 0 –10 –20 Time (20ns/div) ALL HOSTILE CROSSTALK CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY –55 10 –60 –65 1/3 OPA3692 ZO –5V 402Ω 2 Channels Driving Input Referred Crosstalk to Inactive Channel –70 Crosstalk (dB) Output Impedance (Ω) +5V 1 4.0 2.0 Time (200ns/div) 50Ω Input Bias Currents (µA) 3 40 Noninverting Input Bias Current Input Offset Voltage (mV) 1W Internal Power Limit Single Channel 4 2 VDIS (2V/div) 5 –75 –80 –85 402Ω –90 –95 0.1 –100 10k 100k 1M 10M 0.3 100M 8 1 10 100 Frequency (MHz) Frequency (Hz) OPA3692 www.ti.com SBOS228E TYPICAL CHARACTERISTICS: VS = +5V TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. LARGE-SIGNAL FREQUENCY RESPONSE SMALL-SIGNAL FREQUENCY RESPONSE 1 7 VO = 0.5Vp-p 0 6 Normalized Gain (1dB/div) G = +1 –1 Gain (1dB/div) 5 –2 G = –1 –3 –4 –5 3 2 –6 G = +2 1 –7 RL = 100Ω to 2.5V –8 0 0 250MHz 0 500MHz 125MHz LARGE-SIGNAL PULSE RESPONSE SMALL-SIGNAL PULSE RESPONSE 4.1 2.9 Output Voltage (400mV/div) G = +2 VO = 0.5Vp-p 2.8 2.7 2.6 2.5 2.4 2.3 G = +2 VO = 2Vp-p 3.7 3.3 2.9 2.5 2.1 1.7 1.3 2.2 0.9 2.1 Time (5ns/div) Time (5ns/div) RECOMMENDED RS vs CAPACITIVE LOAD FREQUENCY RESPONSE vs CAPACITIVE LOAD 9 60 6 Normalized Gain to Capacitive Load (dB) 70 50 RS (Ω) 250MHz Frequency (25MHz/div) Frequency (50MHz/div) Output Voltage (100mV/div) VO = 2Vp-p VO = 1Vp-p 4 40 30 20 CL = 10pF CL = 22pF 3 CL = 47pF 0 +5V –3 0.1µF 50Ω Source VIN 0.1µF 57.6Ω 10 –6 0 –9 + 6.8µF 806Ω 806Ω 1/3 OPA3692 VO CL = 100pF Dis 100Ω VS/2 402Ω 402Ω (1kΩ is optional) 0.1µF 1 10 100 1k 0 Capacitive Load (pF) OPA3692 SBOS228E 125MHz 250MHz Frequency (25MHz/div) www.ti.com 9 TYPICAL CHARACTERISTICS: VS = +5V (Cont.) TA = +25°C, G = +2 (–In grounded), and RL = 100Ω, (see Figure 1 for AC performance only), unless otherwise noted. HARMONIC DISTORTION vs FREQUENCY HARMONIC DISTORTION vs LOAD RESISTANCE –60 –50 Harmonic Distortion (dBc) Harmonic Distortion (dBc) VO = 2Vp-p f = 5MHz –65 2nd-Harmonic –70 3rd-Harmonic –75 –80 2nd-Harmonic –70 –80 3rd-Harmonic 0.1 1k 1 Frequency (MHz) HARMONIC DISTORTION vs OUTPUT VOLTAGE 2-TONE, 3RD-ORDER INTERMODULATION SPURIOUS –30 3rd-Order Spurious Level (dBc) RL = 100Ω to 2.5V f = 5MHz –65 2nd-Harmonic –70 –75 3rd-Harmonic –80 1 2 50MHz –40 –45 –50 –55 20MHz –60 –65 10MHz –70 –75 Load Power at Matched 50Ω Load –14 3 20 dBc = dB Below Carriers –35 –80 0.1 10 Load Resistance (Ω) –60 Harmonic Distortion (dBc) –60 –90 100 –12 –10 –8 –6 –4 –2 0 2 Single-Tone Load Power (dBm) Output Voltage Swing (Vp-p) 10 VO = 2Vp-p RL = 100Ω to 2.5V OPA3692 www.ti.com SBOS228E APPLICATIONS INFORMATION WIDEBAND BUFFER OPERATION The OPA3692 gives the exceptional AC performance of a wideband, current-feedback op amp with a highly linear, high-power output stage. It features internal RF and RG resistors that make it easy to select a gain of +2, +1, or –1 without external resistors. Requiring only 5.1mA/ch quiescent current, the OPA3692 swings to within 1V of either supply rail and delivers in excess of 160mA at room temperature. This low output headroom requirement, along with supply voltage independent biasing, gives remarkable +5V single-supply operation. The OPA3692 will deliver greater than 200MHz bandwidth driving a 2Vp-p output into 100Ω on a +5V single supply. Previous boosted output stage amplifiers have typically suffered from very poor crossover distortion as the output current goes through zero. The OPA3692 achieves a comparable power gain with much better linearity. Figure 1 shows the DC-coupled, gain of +2, dual powersupply circuit configuration used as the basis of the ±5V Electrical and Typical Characteristics. For test purposes, the input impedance is set to 50Ω with a resistor to ground and the output impedance is set to 50Ω with a series output resistor. Voltage swings reported in the specifications are taken directly at the input and output pins while load powers (dBm) are defined at a matched 50Ω load. For the circuit of Figure 1, the total effective load will be 100Ω || 804Ω = 89Ω. The disable control line (DIS) is typically left open to ensure normal amplifier operation. In addition to the usual powersupply decoupling capacitors to ground, a 0.1µF capacitor can be included between the two power-supply pins. This optional capacitor typically improves the 2nd-harmonic distortion performance by 3dB to 6dB. Figure 2 shows the AC-coupled, gain of +2, single-supply circuit configuration used as the basis of the +5V Electrical and Typical Characteristics. Though not a rail-to-rail design, the OPA3692 requires minimal input and output voltage headroom compared to other very wideband, current-feedback op amps. It will deliver a 3Vp-p output swing on a single +5V supply with greater than 150MHz bandwidth. The key requirement of broadband single-supply operation is to maintain input and output signal swings within the usable voltage ranges at both the input and the output. The circuit in Figure 2 establishes an input midpoint bias using a simple resistive divider from the +5V supply (two 806Ω resistors). The input signal is then ACcoupled into this midpoint voltage bias. The input voltage can swing to within 1.5V of either supply pin, giving a 2Vp-p input signal range centered between the supply pins. The input impedance matching resistor (57.6Ω) used for testing is adjusted to give a 50Ω input match when the parallel combination of the biasing divider network is included. The gain resistor (RG) is AC-coupled, giving the circuit a DC gain of +1, which puts the input DC bias voltage (2.5V) on the output as well. Again, on a single +5V supply, the output voltage can swing to within 1V of either supply pin while delivering more than 120mA output current. A demanding 100Ω load to a midpoint bias is used in this characterization circuit. The new output stage used in the OPA3692 can deliver large bipolar output currents into this midpoint load with minimal crossover distortion, as shown by the +5V supply, 3rd-harmonic distortion plots. Although Figure 2 shows a single +5V operation, this same circuit is suitable for applications up to a single +12V supply. +VS +5V 0.1µF 50Ω Source 6.8µF 806Ω 0.1µF DIS VIN 57.6Ω + 1/3 OPA3692 806Ω VO 100Ω VS/2 RF 402Ω +5V DIS RG 402Ω + 0.1µF 50Ω Source 6.8µF 0.1µF VIN 50Ω 1/3 OPA3692 50Ω 50Ω Load FIGURE 2. AC-Coupled, G = +2, Single-Supply Specification and Test Circuit. RF 402Ω VIDEO RGB AMPLIFIER The front page shows an RGB amplifier based on the OPA3692. The package pinout supports a signal flow-through printed circuit board (PCB). The internal resistors simplify the PCB even more, while maintaining good gain accuracy. For systems that need to conserve power, the total supply current for the disabled OPA3692 is only 450µA. RG 402Ω 0.1µF + 6.8µF –5V FIGURE 1. DC-Coupled, G = +2, Bipolar Supply, Specification and Test Circuit. This triple op amp could also be used to drive triple video ADCs to digitize component video. OPA3692 SBOS228E www.ti.com 11 HIGH-SPEED INSTRUMENTATION AMPLIFIER 7 Figure 3 shows an instrumentation amplifier based on the OPA3692. The offset matching between inputs makes this an attractive input stage for this application. The differential-tosingle-ended gain for this circuit is 2.0V/V. The inputs are high impedance, with only 1pF to ground at each input. The loads on the OPA3692 outputs are equal for the best harmonic distortion possible. 6 5 Gain (dB) 4 3 2 1 0 –1 20log –2 VOUT |V1 – V2| –3 1 10 100 400 Frequency (MHz) V1 1/3 OPA3692 402Ω 200Ω 200Ω FIGURE 4. High-Speed Instrumentation Amplifier Response. 402Ω MULTIPLEXED CONVERTER DRIVER 1/3 OPA3692 402Ω 402Ω 1/3 OPA3692 402Ω The converter driver in Figure 5 multiplexes among the three input signals. The OPA3692s enable and disable times support multiplexing among video signals. The make-beforebreak disable characteristic of the OPA3692 ensures that the output is always under control. To avoid large switching glitches, switch during the sync or retrace portions of the video signal—the two inputs should be almost equal at these times. The output is always under control, so the switching glitches for two 0V inputs are < 20mV. With standard video signals levels at the inputs, the maximum differential voltage across the disabled inputs will not exceed the ±1.2V maximum rating. VOUT 402Ω V2 FIGURE 3. High-Speed Instrumentation Amplifier. As shown in Figure 4, the OPA3692 used as an instrumentation amplifier has a 240MHz, –3dB bandwidth. This plot has been made for a 1Vp-p output signal using a low-impedance differential input source. V1 The output resistors isolate the outputs from each other when switching between channels. The feedback network of the disabled channels forms part of the load seen by the enabled amplifier, attenuating the signal slightly. 100Ω 1/3 OPA3692 4.99kΩ 402Ω V2 0.1µF 402Ω 100Ω 1/3 OPA3692 402Ω 0.1µF 4.99kΩ REFT +3.5V 0.1µF REFB +1.5V +In 402Ω ADS826 10-Bit 60MSPS 100pF –In CM V3 100Ω 1/3 OPA3692 402Ω 402Ω 0.1µF Selection Logic FIGURE 5. Multiplexed Converter Driver. 12 OPA3692 www.ti.com SBOS228E LOW-PASS FILTER The demonstration fixtures can be requested at the Texas Instruments web site at (www.ti.com) through the OPA3692 product folder. The circuit in Figure 6 realizes a 7th-order Butterworth lowpass filter with a –3dB bandwidth of 20MHz. This filter is based on the KRC active filter topology, which uses an amplifier with the fixed gain ≥ 1. The OPA3692 makes a good amplifier for this type of filter. The component values have been adjusted to compensate for the parasitic effects of the op amp. MACROMODELS AND APPLICATIONS SUPPORT Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for video and RF amplifier circuits where parasitic capacitance and inductance can have a major effect on circuit performance. A SPICE model for the OPA692 is available through the Texas Instruments web site at www.ti.com. Use three of these models to simulate the OPA3692. These models do a good job of predicting small-signal AC and transient performance under a wide variety of operating conditions. They do not do as well in predicting the harmonic distortion or dG/dP characteristics. These models do not attempt to distinguish between the package types in their small-signal AC performance. DESIGN-IN TOOLS DEMONSTRATION FIXTURES Two PCBs are available to assist in the initial evaluation of circuit performance using the OPA3692 in its two package options. Both of these are offered free of charge as unpopulated PCBs, delivered with a user's guide. The summary information for these fixtures is shown in Table I. PRODUCT PACKAGE ORDERING NUMBER LITERATURE NUMBER OPA3692IDBQ OPA3692ID SSOP-16 SO-16 DEM-OPA-SSOP-3B DEM-OPA-SO-3A SBOU006 SBOU007 TABLE I. OPA3692 Demonstration Boards. 120pF 47.5Ω 49.9Ω 56pF 110Ω VIN 220pF 124Ω 82pF 255Ω 1/3 OPA3692 1/3 OPA3692 22pF 402Ω 402Ω 402Ω 402Ω (open) 180pF 48.7Ω 7TH-ORDER BUTTERWORTH FILTER RESPONSE 95.3Ω 20 –0 1/3 OPA3692 68pF VOUT Gain (dB) –20 402Ω –40 –60 402Ω –80 (open) –100 1 3 10 30 100 300 1000 Frequency (MHz) FIGURE 6. 7th-Order Butterworth Filter. OPA3692 SBOS228E www.ti.com 13 OPERATING SUGGESTIONS DRIVING CAPACITIVE LOADS GAIN SETTING Setting the gain with the OPA3692 is very easy. For a gain of +2, ground the –IN pin and drive the +IN pin with the signal. For a gain of +1, leave the –IN pin open and drive the +IN pin with the signal. For a gain of –1, ground the +IN pin and drive the –IN pin with the signal. As the internal resistor values (not their ratios) change significantly over temperature and process, external resistors should not be used to modify the gain. OUTPUT CURRENT AND VOLTAGE The OPA3692 provides output voltage and current capabilities that are unsurpassed in a low-cost monolithic op amp. Under no-load conditions at 25°C, the output voltage typically swings closer than 1V to either supply rail; the tested swing limit is within 1.2V of either rail. Into a 15Ω load (the minimum tested load), it is tested to deliver more than ±160mA. The specifications described previously, though familiar in the industry, consider voltage and current limits separately. In many applications, it is the voltage • current, or V-I product, which is more relevant to circuit operation. Refer to the Output Voltage and Current Limitations plot in the Typical Characteristics. The X- and Y-axes of this graph show the zero-voltage output current limit and the zero-current output voltage limit, respectively. The four quadrants give a more detailed view of the OPA3692 output drive capabilities, noting that the graph is bounded by a safe operating area of 1W maximum internal power dissipation. Superimposing resistor load lines onto the plot shows that the OPA3692 can drive ±2.5V into 25Ω or ±3.5V into 50Ω without exceeding the output capabilities or the 1W dissipation limit. A 100Ω load line (the standard test circuit load) shows the full ±3.9V output swing capability, as shown in the Electrical Characteristics. The minimum specified output voltage and current overtemperature are set by worst-case simulations at the cold temperature extreme. Only at cold start-up does the output current and voltage decrease to the numbers shown in the Electrical Characteristic tables. As the output transistors deliver power, their junction temperatures increase, decreasing their VBEs (increasing the available output voltage swing) and increasing their current gains (increasing the available output current). In steady-state operation, the available output voltage and current is always greater than that shown in the over-temperature specifications because the output stage junction temperatures are higher than the minimum specified operating ambient. To protect the output stage from accidental shorts to ground and the power supplies, output short-circuit protection is included in the OPA3692. This circuit acts to limit the maximum source or sink current to approximately 250mA. 14 One of the most demanding, but yet very common load conditions for an op amp is capacitive loading. Often, the capacitive load is the input of an ADC—including additional external capacitance that may be recommended to improve ADC linearity. A high-speed amplifier like the OPA3692 can be very susceptible to decreased stability and closed-loop response peaking when a capacitive load is placed directly on the output pin. When the amplifier open-loop output resistance is considered, this capacitive load introduces an additional pole in the signal path that can decrease the phase margin. Several external solutions to this problem have been suggested. When the primary considerations are frequency response flatness, pulse response fidelity, and/or distortion, the simplest and most effective solution is to isolate the capacitive load from the feedback loop by inserting a series isolation resistor between the amplifier output and the capacitive load. This does not eliminate the pole from the loop response, but rather shifts it and adds a zero at a higher frequency. The additional zero acts to cancel the phase lag from the capacitive load pole, thus increasing the phase margin and improving stability. The Typical Characteristics show the recommended RS versus capacitive load and the resulting frequency response at the load. Parasitic capacitive loads greater than 2pF can begin to degrade the performance of the OPA3692. Long PCB traces, unmatched cables, and connections to multiple devices can easily cause this value to be exceeded. Always consider this effect carefully, and add the recommended series resistor as close as possible to the OPA3692 output pin (see the Board Layout Guidelines section). DISTORTION PERFORMANCE The OPA3692 provides good distortion performance into a 100Ω load on ±5V supplies. Relative to alternative solutions, it provides exceptional performance into lighter loads and/or operating on a single +5V supply. Generally, until the fundamental signal reaches very high frequency or power levels, the 2nd-harmonic dominates the distortion with a negligible 3rdharmonic component. Focusing then on the 2nd-harmonic, increasing the load impedance improves distortion directly. Remember that the total load includes the feedback network in the noninverting configuration (see Figure 1); this is the sum RF + RG, whereas in the inverting configuration, it is just RF. Also, providing an additional supply decoupling capacitor (0.1µF) between the supply pins (for bipolar operation) improves the 2nd-order distortion slightly (3dB to 6dB). In most op amps, increasing the output voltage swing increases harmonic distortion directly. The Typical Characteristics show the 2nd-harmonic increasing at a little less than the expected 2X rate while the 3rd-harmonic increases at a little less than the expected 3X rate. Where the test power doubles, the 2nd-harmonic increases only by less than the expected 6dB, whereas the 3rd- OPA3692 www.ti.com SBOS228E harmonic increases by less than the expected 12dB. This also shows up in the 2-tone, 3rd-order intermodulation spurious (IM3) response curves. The 3rd-order spurious levels are extremely low at low output power levels. The output stage continues to hold them low even as the fundamental power reaches very high levels. As the Typical Characteristics show, the spurious intermodulation powers do not increase as predicted by a traditional intercept model. As the fundamental power level increases, the dynamic range does not decrease significantly. For two tones centered at 20MHz, with 10dBm/tone into a matched 50Ω load (that is, 2Vp-p for each tone at the load, which requires 8Vp-p for the overall 2-tone envelope at the output pin), the Typical Characteristics show a 58dBc difference between the test-tone power and the 3rd-order intermodulation spurious levels. This exceptional performance improves further when operating at lower frequencies. NOISE PERFORMANCE The OPA3692 offers an excellent balance between voltage and current noise terms to achieve low output noise. The inverting current noise (15pA/√Hz) is significantly lower than earlier solutions while the input voltage noise (1.7nV/√Hz) is lower than most unity-gain stable, wideband, voltage-feedback op amps. This low input voltage noise was achieved at the price of higher noninverting input current noise (12pA/√Hz). As long as the AC source impedance looking out of the noninverting node is less than 100Ω, this current noise will not contribute significantly to the total output noise. The op amp input voltage noise and the two input current noise terms combine to give low output noise under a wide variety of operating conditions. Figure 7 shows the op amp noise analysis model with all the noise terms included. In this model, all noise terms are taken to be noise voltage or current density terms in either nV/√Hz or pA/√Hz. ENI RS EO OPA3692 IBN The total output spot noise voltage can be computed as the square root of the sum of all squared output noise voltage contributors. Equation 1 shows the general form for the output noise voltage using the terms shown in Figure 7. (1) 2 2 EO = ENI2 + (IBNR S ) + 4kTRS NG2 + (IBIRF ) + 4kTRFNG Dividing this expression by the noise gain (NG = (1+RF/RG)) gives the equivalent input-referred spot noise voltage at the noninverting input as shown in Equation 2. (2) 2 4kTRF 2 I R EN = ENI2 + (IBNR S ) + 4kTRS + BI F + NG NG Evaluating these two equations for the OPA3692 circuit and component values shown in Figure 1 gives a total output spot noise voltage of 8nV/√Hz and a total equivalent input spot noise voltage of 4nV/√Hz. This total input-referred spot noise voltage is higher than the 1.7nV/√Hz specification for the op amp voltage noise alone. This reflects the noise added to the output by the inverting current noise times the feedback resistor. This inverting node current noise is modeled as internal to the OPA3692 with RF set internally as well. DC ACCURACY The OPA3692 provides exceptional bandwidth in high gains, giving fast pulse settling but only moderate DC accuracy. The Electrical Characteristics show an input offset voltage comparable to high-speed voltage-feedback amplifiers. However, the two input bias currents are somewhat higher and are unmatched. Bias current cancellation techniques do not reduce the output DC offset for OPA3692. As the two input bias currents are unrelated in both magnitude and polarity, matching the source impedance looking out of each input to reduce their error contribution to the output is ineffective. Evaluating the configuration of Figure 1, using worst-case +25°C input offset voltage and the two input bias currents, gives a worst-case output offset range equal to: ±(NG • VOS(MAX)) + (IBN • RS/2 • NG) ± (IBI • RF) ERS 4kT RG where NG = noninverting signal gain RF √4kTRS = ±(2 • 3mV) + (35µA • 25Ω • 2) ± (402Ω • 25µA) RG IBI √4kTRF 4kT = 1.6E –20J at 290°K = ±6mV + 1.75mV ± 10.05mV = –14.3mV → +17.8mV Minimizing the resistance seen by the noninverting input will give the best DC offset performance. FIGURE 7. Noise Model. OPA3692 SBOS228E www.ti.com 15 DISABLE OPERATION The OPA3692 provides an optional disable feature that can be used either to reduce system power or to implement a simple channel multiplexing operation. If the DIS control pin is left unconnected, the OPA3692 operates normally. To disable, the control pin must be asserted LOW. Figure 8 shows a simplified internal circuit for the disable control feature. +VS 15kΩ VDIS Due to the high output power capability of the OPA3692, heatsinking or forced airflow may be required under extreme operating conditions. Maximum desired junction temperature will set the maximum allowed internal power dissipation as described following. In no case should the maximum junction temperature be allowed to exceed 175°C. 110kΩ IS Control –VS FIGURE 8. Simplified Disable Control Circuit. In normal operation, base current to Q1 is provided through the 110kΩ resistor while the emitter current through the 15kΩ resistor sets up a voltage drop that is inadequate to turn on the two diodes in the Q1 emitter. As VDIS is pulled LOW, additional current is pulled through the 15kΩ resistor, eventually turning on these two diodes (≈ 75µA). At this point, any additional current pulled out of VDIS goes through those diodes holding the emitter-base voltage of Q1 at approximately 0V. This shuts off the collector current out of Q1, turning the amplifier off. The supply current in the disable mode is only what is required to operate the circuit of Figure 8. Additional circuitry ensures that turn-on time occurs faster than turn-off time (make-beforebreak). When disabled, the output and input nodes go to a highimpedance state. If the OPA3692 is operating in a gain of +1, this shows a very high impedance (2pF || 1MΩ) at the output and exceptional signal isolation. If operating at a gain of +2, the total feedback network resistance (RF + RG) will appear as the impedance looking back into the output, but the circuit will still show very high forward and reverse isolation. If configured as an inverting amplifier, the input and output will be connected through the feedback network resistance (RF + RG) giving relatively poor input to output isolation. 16 The transition edge rate (dV/dt) of the DIS control line influences this glitch. For the curve, Disable/Enable Glitch, shown in the Typical Characteristics, the edge rate was reduced until no further reduction in glitch amplitude was observed. This approximately 1V/ns maximum slew rate can be achieved by adding a simple RC filter into the V DIS pin from a higher speed logic line. If extremely fast transition logic is used, a 2kΩ series resistor between the logic gate and the DIS input pin provides adequate bandlimiting using just the parasitic input capacitance on the DIS pin while still ensuring an adequate logic level swing. THERMAL ANALYSIS Q1 25kΩ One key parameter in disable operation is the output glitch when switching in and out of the disabled mode. Typical Characteristics show these glitches for the circuit of Figure 1 with the input signal set to 0V. The glitch waveform at the output pin is plotted along with the DIS pin voltage. Operating junction temperature (TJ) is given by TA + PD • θJA. The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is simply the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load but, for a grounded resistive load, be at a maximum when the output is fixed at a voltage equal to 1/2 of either supply voltage (for equal bipolar supplies). Under this condition PDL = VS2/(4 • RL), where RL includes feedback network loading. Note that it is the power in the output stage and not in the load that determines internal power dissipation. As a worst-case example, compute the maximum TJ using an OPA3692 in the circuit of Figure 1 operating at the maximum specified ambient temperature of +85°C with all three outputs driving a grounded 100Ω load to +2.5V: PD = 10V • 17.4mA + 3 (52/(4 • (100Ω || 804Ω)) = 384mW Maximum TJ = +85°C + (0.384W • 100°C/W) = 123.4°C This worst-case condition is within the maximum junction temperature. Normally, this extreme case is not encountered. Careful attention to internal power dissipation is required. OPA3692 www.ti.com SBOS228E BOARD LAYOUT GUIDELINES Achieving optimum performance with a high frequency amplifier like the OPA3692 requires careful attention to board layout parasitics and external component types. Recommendations that will optimize performance include: a) Minimize parasitic capacitance to any AC ground for all of the signal I/O pins. Parasitic capacitance on the output pin can cause instability: on the noninverting input, it can react with the source impedance to cause unintentional bandlimiting. To reduce unwanted capacitance, a window around the signal I/O pins should be opened in all of the ground and power planes around those pins. Otherwise, ground and power planes should be unbroken elsewhere on the board. b) Minimize the distance (< 0.25") from the power-supply pins to high frequency 0.1µF decoupling capacitors. At the device pins, the ground and power plane layout should not be in close proximity to the signal I/O pins. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. The power-supply connections (on pins 9, 11, 13, and 15) should always be decoupled with these capacitors. An optional supply decoupling capacitor across the two power supplies (for bipolar operation) will improve 2nd-harmonic distortion performance. Larger (2.2µF to 6.8µF) decoupling capacitors, effective at lower frequency, should also be used on the main supply pins. These may be placed somewhat farther from the device and may be shared among several devices in the same area of the PCB. c) Careful selection and placement of external components will preserve the high-frequency performance of the OPA3692. Resistors should be a very low reactance type. Surface-mount resistors work best and allow a tighter overall layout. Metal-film and carbon composition, axiallyleaded resistors can also provide good high-frequency performance. Again, keep their leads and PCB trace length as short as possible. Never use wirewound type resistors in a high-frequency application. Other network components, such as noninverting input termination resistors, should also be placed close to the package. d) Connections to other wideband devices on the board may be made with short direct traces or through onboard transmission lines. For short connections, consider the trace and the input to the next device as a lumped capacitive load. Relatively wide traces (50mils to 100mils) should be used, preferably with ground and power planes opened up around them. Estimate the total capacitive load and set RS from the plot of recommended RS versus Capacitive Load. Low parasitic capacitive loads (< 5pF) may not need an RS because the OPA3692 is nominally compensated to operate with a 2pF parasitic load. If a long trace is required, and the 6dB signal loss intrinsic to a doublyterminated transmission line is acceptable, implement a matched impedance transmission line using microstrip or stripline techniques (consult an ECL design handbook for microstrip and stripline layout techniques). A 50Ω environment is normally not necessary on board, and in fact, a higher impedance environment will improve distortion as shown in the Distortion versus Load plots. With a characteristic board trace impedance defined based on board material and trace dimensions, a matching series resistor into the trace from the output of the OPA3692 is used as well as a terminating shunt resistor at the input of the destination device. Remember also that the terminating impedance will be the parallel combination of the shunt resistor and the input impedance of the destination device; this total effective impedance should be set to match the trace impedance. The high output voltage and current capability of the OPA3692 allows multiple destination devices to be handled as separate transmission lines, each with their own series and shunt terminations. If the 6dB attenuation of a doubly-terminated transmission line is unacceptable, a long trace can be seriesterminated at the source end only. Treat the trace as a capacitive load in this case and set the series resistor value as shown in the plot of RS versus Capacitive Load. This will not preserve signal integrity as well as a doubly-terminated line. If the input impedance of the destination device is low, there will be some signal attenuation due to the voltage divider formed by the series output into the terminating impedance. e) Socketing a high-speed part like the OPA3692 is not recommended. The additional lead length and pin-to-pin capacitance introduced by the socket can create an extremely troublesome parasitic network which can make it almost impossible to achieve a smooth, stable frequency response. Best results are obtained by soldering the OPA3692 onto the board. INPUT AND ESD PROTECTION The OPA3692 is built using a very high-speed complementary bipolar process. The internal junction breakdown voltages are relatively low for these very small geometry devices. These breakdowns are reflected in the Absolute Maximum Ratings table. All device pins have limited ESD protection using internal diodes to the power supplies as shown in Figure 9. +V CC External Pin –V CC FIGURE 9. Internal ESD Protection. These diodes provide moderate protection to input overdrive voltages above the supplies as well. The protection diodes can typically support 30mA continuous current. Where higher currents are possible (for example, in systems with ±15V supply parts driving into the OPA3692), current-limiting series resistors should be added into the two inputs. Keep these resistor values as low as possible since high values degrade both noise performance and frequency response. OPA3692 SBOS228E Internal Circuitry www.ti.com 17 Revision History DATE REVISION PAGE 12/08 E 2 6/06 D SECTION DESCRIPTION Absolute Maximum Ratings Changed minimum Storage Temperature Range from −40°C to −65°C. 13 Design-In Tools 18 Applications Information Demonstration fixture numbers changed. Added Revision History table. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 18 OPA3692 www.ti.com SBOS228E PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) OPA3692ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA3692 OPA3692IDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 3692 OPA3692IDBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 3692 OPA3692IDBQT ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 3692 OPA3692IDBQTG4 ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 3692 OPA3692IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA3692 OPA3692IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA3692 OPA3692IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA3692 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA3692IDBQR SSOP DBQ 16 OPA3692IDBQT SSOP DBQ OPA3692IDR SOIC D SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 5.2 2.1 8.0 12.0 Q1 2500 330.0 12.4 6.4 16 250 180.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA3692IDBQR SSOP DBQ 16 2500 367.0 367.0 35.0 OPA3692IDBQT SSOP DBQ 16 250 210.0 185.0 35.0 OPA3692IDR SOIC D 16 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated