ON MC14042BFEL Quad transparent latch Datasheet

MC14042B
Quad Transparent Latch
The MC14042B Quad Transparent Latch is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. Each latch has a separate data input, but all four
latches share a common clock. The clock polarity (high or low) used to
strobe data through the latches can be reversed using the polarity
input. Information present at the data input is transferred to outputs Q
and Q during the clock level which is determined by the polarity input.
When the polarity input is in the logic “0” state, data is transferred
during the low clock level, and when the polarity input is in the logic
“1” state the transfer occurs during the high clock level.
Features
•
•
•
•
•
•
•
•
Buffered Data Inputs
Common Clock
Clock Polarity Control
Q and Q Outputs
Double Diode Input Protection
Supply Voltage Range = 3.0 Vdc to 1 8 Vdc
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Value
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 1)
500
mW
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
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MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
16
MC14042BCP
AWLYYWWG
1
16
SOIC−16
D SUFFIX
CASE 751B
14042BG
AWLYWW
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MC14042B
ALYWG
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 6
1
Publication Order Number:
MC14042B/D
MC14042B
PIN ASSIGNMENT
Q3
1
16
VDD
Q0
2
15
Q3
Q0
3
14
D3
D0
4
13
D2
CLOCK
5
12
Q2
POLARITY
6
11
Q2
D1
7
10
Q1
VSS
8
9
Q1
TRUTH TABLE
Clock
Polarity
Q
0
1
1
0
0
0
1
1
Data
Latch
Data
Latch
LOGIC DIAGRAM
CLOCK
POLARITY
5
D0
LATCH
1
4
2
3
6
D1
LATCH
2
7
10
9
D2
VDD = PIN 16
VSS = PIN 8
LATCH
3
13
11
12
D3
LATCH
4
14
1
15
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2
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
MC14042B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
1.0
2.0
4.0
−
−
−
0.002
0.004
0.006
1.0
2.0
4.0
−
−
−
30
60
120
mAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
mAdc
IT = (1.0 mA/kHz) f + IDD
IT = (2.0 mA/kHz) f + IDD
IT = (3.0 mA/kHz) f + IDD
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.004.
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3
mAdc
MC14042B
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SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time, D to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Propagation Delay Time, Clock to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Clock Pulse Width
tWH
Clock Pulse Rise and Fall Time
Hold Time
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
220
90
60
440
180
120
5.0
10
15
−
−
−
220
90
60
440
180
120
5.0
10
15
300
100
80
150
50
40
−
−
−
5.0
10
15
−
−
−
−
−
−
15
5.0
4.0
5.0
10
15
100
50
40
50
25
20
−
−
−
5.0
10
15
50
30
25
0
0
0
−
−
−
ns
no
ns
ns
ms
tTLH,
tTHL
th
Setup Time
Unit
ns
tsu
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
ORDERING INFORMATION
Package
Shipping †
MC14042BCP
PDIP−16
500 Units / Rail
MC14042BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14042BD
SOIC−16
48 Units / Rail
MC14042BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14042BDR2
SOIC−16
2500 Units / Tape & Reel
MC14042BDR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
SOEIAJ−16
2000 Units / Tape & Reel
Device
MC14042BFEL
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC14042B
16
VDD
1
f
20 ns
5
6
4
PULSE
GENERATOR 1
7
13
14
CLOCK
POLARITY
D0
D1
D2
D3
8
For Power Dissipation test, each output
is loaded with capacitance CL.
2
3
10
9
11
12
1
15
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
DATA INPUT
90%
50%
tPLH
10%
VSS
tTHL
VDD
16
PULSE
GENERATOR 1
5
PULSE
GENERATOR 2
4
CLOCK
6
POLARITY
D0
7
D1
13
D2
14
D3
NOTE: CL connected to output under test.
2
3
10
9
11
12
1
15
VSS
50%
10%
tWH
20 ns
90%
DATA INPUT
P.G. 2
50%
tsu
Q OUTPUT
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
20 ns
90%
CLOCK INPUT
P.G. 1
8
90%
th
tPLH
50%
10%
*Input clock rise time is 20 ns except for maximum rise time test.
Figure 2. AC Test Circuit and Timing Diagram
(Clock to Output)
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5
tTHL
tPHL
90%
Figure 1. AC and Power Dissipation Test Circuit and Timing Diagram
(Data to Output)
20* ns
50%
10%
tTLH
Q OUTPUT
10%
tPHL
90%
Q OUTPUT
20 ns
50%
tTLH
MC14042B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
−T−
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14042B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE O
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
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7
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
MC14042B
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MC14042B/D
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