SemiHow HFU6N40S 400v n-channel mosfet Datasheet

BVDSS = 400 V
RDS(on) typ = 0.83 Ω
HFD6N40S / HFU6N40S
ID = 4.5 A
400V N-Channel MOSFET
D-PAK
I-PAK
2
FEATURES
1
1
2
3
 Originative New Design
3
HFD6N40S
 Superior Avalanche Rugged Technology
 Robust Gate Oxide Technology
HFU6N40S
1.Gate 2. Drain 3. Source
 Very Low Intrinsic Capacitances
 Excellent Switching Characteristics
 Unrivalled Gate Charge : 16 nC (Typ.)
 Extended Safe Operating Area
 Lower RDS(ON) : 0.83 Ω (Typ.) @VGS=10V
 100% Avalanche Tested
Absolute Maximum Ratings
Symbol
TC=25℃ unless otherwise specified
Parameter
Value
Units
400
V
VDSS
Drain-Source Voltage
ID
Drain Current
– Continuous (TC = 25℃)
4.5
A
Drain Current
– Continuous (TC = 100℃)
2.7
A
IDM
Drain Current
– Pulsed
18
A
VGS
Gate-Source Voltage
±30
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
280
mJ
IAR
Avalanche Current
(Note 1)
4.5
A
EAR
Repetitive Avalanche Energy
(Note 1)
4.8
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
PD
Power Dissipation (TA = 25℃)
2.5
W
Power Dissipation (TC = 25℃)
- Derate above 25℃
48
W
0.38
W/℃
TJ, TSTG
Operating and Storage Temperature Range
-55 to +150
℃
TL
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
300
℃
(Note 1)
Thermal Resistance Characteristics
Symbol
Parameter
Typ.
Max.
RθJC
Junction-to-Case
--
2.6
RθJA
Junction-to-Ambient*
--
50
RθJA
Junction-to-Ambient
--
110
Units
℃/W
* When mounted on the minimum pad size recommended (PCB Mount)
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
July 2009
Symbol
Parameter
unless otherwise specified
Test Conditions
Min
Typ
Max
Units
On Characteristics
VGS
RDS(ON)
Gate Threshold Voltage
VDS = VGS, ID = 250 ㎂
2.0
--
4.0
V
Static Drain-Source
On-Resistance
VGS = 10 V, ID = 2.25 A
--
0.83
1.0
Ω
400
--
--
V
ID = 250 ㎂, Referenced to25℃
--
0.54
--
V/℃
VDS = 400 V, VGS = 0 V
--
--
1
㎂
VDS = 320 V, TC = 125℃
--
--
10
㎂
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS Breakdown Voltage Temperature
Coefficient
/ΔTJ
IDSS
Zero Gate Voltage Drain Current
VGS = 0 V, ID = 250 ㎂
IGSSF
Gate-Body Leakage Current,
Forward
VGS = 30 V, VDS = 0 V
--
--
100
㎁
IGSSR
Gate-Body Leakage Current,
Reverse
VGS = -30 V, VDS = 0 V
--
--
-100
㎁
--
480
625
㎊
--
80
105
㎊
--
15
20
㎊
--
13
35
㎱
--
65
140
㎱
--
21
55
㎱
--
16
20
㎱
--
16
20
nC
--
2.3
--
nC
--
8.2
--
nC
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
Switching Characteristics
td(on)
Turn-On Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
VDS = 200 V, ID = 6.0 A,
RG = 25 Ω
(Note 4,5)
VDS = 320 V, ID = 6.0 A,
VGS = 10 V
(Note 4,5)
Gate-Drain Charge
Source-Drain Diode Maximum Ratings and Characteristics
IS
Continuous Source-Drain Diode Forward Current
--
--
4.5
ISM
Pulsed Source-Drain Diode Forward Current
--
--
18
VSD
Source-Drain Diode Forward Voltage
IS = 4.5 A, VGS = 0 V
--
--
1.5
V
trr
Reverse Recovery Time
--
230
--
㎱
Qrr
Reverse Recovery Charge
IS = 6.0 A, VGS = 0 V
diF/dt = 100 A/μs (Note 4)
--
1.7
--
μC
A
Notes ;
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L=13.7mH, IAS=6.0A, VDD=50V, RG=25Ω, Starting TJ =25°C
3. ISD≤4.5A, di/dt≤200A/μs, VDD≤BVDSS , Starting TJ =25 °C
4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
Electrical Characteristics TC=25 °C
HFD6N40S / HFU6N40S
ID, Drain Current [A]
ID, Drain Current [A]
Typical Characteristics
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 1. On Region Characteristics
RDS(ON)[Ω],
Drain-Source On-Resistance
IDR, Reverse Drain Current [A]
Figure 2. Transfer Characteristics
ID, Drain Current [A]
VSD, Source-Drain Voltage [V]
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
Capacitance [pF]
VGS, Gate-Source Voltage [V]
Figure 3. On Resistance Variation vs
Drain Current and Gate Voltage
VDS, Drain-Source Voltage [V]
Figure 5. Capacitance Characteristics
QG, Total Gate Charge [nC]
Figure 6. Gate Charge Characteristics
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
Typical Characteristics
(continued)
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
3.0
2.5
2.0
1.5
1.0
∗ Note :
1. VGS = 10 V
2. ID = 2.25 A
0.5
0.0
-100
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
5
Operation in This Area
is Limited by R DS(on)
10 µs
4
ID, Drain Current [A]
100 µs
1 ms
10 ms
100 ms
DC
100
* Notes :
1. TC = 25 oC
3
2
1
2. TJ = 150 oC
3. Single Pulse
10-1
100
101
102
0
25
103
50
75
100
125
150
TC, Case Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
ZθJC(t), Thermal Response
ID, Drain Current [A]
101
Figure 10. Maximum Drain Current
vs Case Temperature
D=0.5
100
* Notes :
1. ZθJC(t) = 2.6 oC/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.2
0.1
0.05
10-1
0.02
0.01
PDM
single pulse
10-2
10-5
10-4
t1
10-3
10-2
t2
10-1
100
101
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
Fig 12. Gate Charge Test Circuit & Waveform
50KΩ
12V
VGS
Same Type
as DUT
Qg
200nF
10V
300nF
VDS
VGS
Qgs
Qgd
DUT
3mA
Charge
Fig 13. Resistive Switching Test Circuit & Waveforms
RL
VDS
VDS
90%
VDD
RG
( 0.5 rated VDS )
Vin
DUT
10V
10%
tr
td(on)
td(off)
t on
tf
t off
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
BVDSS
1
EAS = ---- LL IAS2 -------------------2
BVDSS -- VDD
L
VDS
VDD
ID
BVDSS
IAS
RG
10V
ID (t)
DUT
VDS (t)
VDD
tp
Time
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
IS
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• IS controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
IS
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
Vf
VDD
Body Diode
Forward Voltage Drop
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
Package Dimension
TO-252
2.3±0.1
6.6±0.2
1.2±0.3
9.7+0.5
-0.3
2.7±0.3
0.5±0.05
5.6±0.2
1±0.2
5.35±0.15
1.2±0.3
0.05+0.1
-0.05
0.8±0.2
0.6±0.2
0.5+0.1
-0.05
2.3typ
2.3typ
◎ SEMIHOW REV.A0,July 2009
2.3±0.1
6.6±0.2
5.35±0.15
0.75±0.15
0.8±0.15
0.6±0.1
2.3typ
7±0.2
7.5±0.3
5.6±0.2
0.5±0.05
0.5+0.1
-0.05
1.2±0.3
2.3typ
◎ SEMIHOW REV.A0,July 2009
HFD6N40S / HFU6N40S
TO-251
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