Material Content Data Sheet Sales Product Name IPD50P03P4L-11 MA# MA000462534 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 369.36 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 1.525 0.41 0.234 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.41 4129 4129 635 0.070 0.02 234.187 63.41 63.49 634038 190 634865 1.906 0.52 0.52 5159 5159 1.265 0.34 3426 22.145 6.00 103.131 27.92 34.26 279217 342598 3.740 1.01 1.01 10126 10126 0.091 0.02 0.000 0.00 0.021 0.01 0.027 0.01 1.015 0.27 59955 246 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 246 72 0.29 Important Remarks: 1. 1 58 2748 2878 1000000