CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 1/13 N- AND P-Channel Enhancement Mode MOSFET MTC4303N8J BVDSS ID@VGS=10V(-10V), TA=25°C ID@VGS=10V(-10V), TC=25°C RDSON@VGS=10V(-10V) typ. RDSON@VGS=4.5V(-4.5V) typ. N-CH 30V 5.6A 8.4A 22.4mΩ 57mΩ P-CH -30V -3.6A -5.4A 54.6mΩ 83.2mΩ Features • Simple drive requirement • Low on-resistance • Fast switching speed • Pb-free lead plating and halogen-free package Equivalent Circuit Outline 2928-8J MTC4303N8J G：Gate S：Source D：Drain Pin 1 Ordering Information Device MTC4303N8J-0-T1-G Package Shipping 2928-8J 3000 pcs / Tape & Reel (Pb-free lead plating and halogen-free package) Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel,7” reel Product rank, zero for no rank products Product name MTC4303N8J CYStek Product Specification Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 2/13 CYStech Electronics Corp. Absolute Maximum Ratings (TC=25°C, unless otherwise noted) Parameter Symbol Drain-Source Breakdown Voltage BVDSS Gate-Source Voltage VGS Continuous Drain Current *2 TA=25 °C, VGS=10V (-10V) TA=70 °C, VGS=10V (-10V) Continuous Drain Current TC=25 °C, VGS=10V (-10V) TC=100 °C, VGS=10V (-10V) Pulsed Drain Current IDSM ID IDM *3 Limits N-channel P-channel 30 -30 ±20 ±20 5.6 -3.6 4.5 -2.9 8.4 -5.4 5.9 -3.8 30 -20 TA=25°C, Single device operation V A 1.5 *2 TA=70°C, Single device operation Total Power Dissipation Unit TA=25°C, Single device value at dual operation 0.96 *2 PDSM 1.24 *2 TA=70°C, Single device value at dual operation TC=25°C 3.75 PD * 1 TC=100°C Operating Junction and Storage Temperature Range W 0.79 *2 1.88 Tj; Tstg °C -55~+175 Thermal Data Parameter Symbol Max. Thermal Resistance, Junction-to-ambient, single device operation Max. Thermal Resistance, Junction-to-ambient, single device value at dual operation Max. Thermal Resistance, Junction-to-case Rth,j-a Rth,j-c Value 84 *2 101 *2 40 Unit °C/W Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. 2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C, t≤5s. 216°C/W when mounted on a minimum pad of 2 oz. copper. The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user’s specific board design. 3. Pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low duty cycles to keep initial TJ=25°C. N-Channel Electrical Characteristics (Tc=25°C, unless otherwise specified) Symbol Min. Typ. Max. 30 1.3 - 22.4 57 3.3 2.6 ±100 1 10 30 85 - Unit Test Conditions Static BVDSS VGS(th) IGSS IDSS *RDS(ON) *GFS MTC4303N8J V nA μA mΩ S VGS=0V, ID=250μA VDS=VGS, ID=250μA VGS=±20V, VDS=0V VDS=30V, VGS=0V VDS=24V, VGS=0V, Tj=70°C VGS=10V, ID=4.5A VGS=4.5V, ID=4.5A VDS=10V, ID=3A CYStek Product Specification CYStech Electronics Corp. Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Rg Body Diode *VSD *trr *Qrr - 362 62 54 5.8 15.6 18 6 9.5 1.4 3.3 1 - - 0.8 8.7 3.8 1.2 - Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 3/13 pF VDS=15V, VGS=0V, f=1MHz ns VDS=15V, ID=4.5A, VGS=10V, RG=1Ω nC VDS=24V, ID=4.5A, VGS=10V Ω f=1MHz V ns nC VGS=0V, IS=1A IF=1A, VGS=0V, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% P-Channel Electrical Characteristics (Tc=25°C, unless otherwise specified) Symbol Min. Typ. Max. -30 -1.3 - 54.6 83.2 4.2 -2.6 ±100 -1 -10 75 125 - - 487 59 59 6.2 20.8 31.8 7 11.4 1.7 2.7 10 - - -0.82 8.7 4 -1.2 - Unit Test Conditions Static BVDSS VGS(th) IGSS IDSS *RDS(ON) *GFS S VGS=0, ID=-250μA VDS=VGS, ID=-250μA VGS=±20V, VDS=0V VDS=-30V, VGS=0V VDS=-24V, VGS=0V, Tj=70°C VGS=-10V, ID=-3A VGS=-4.5V, ID=-3A VDS=-10V, ID=-3A pF VDS=-15V, VGS=0V, f=1MHz ns VDS=-15V, ID=-3A, VGS=-10V, RG=1Ω nC VDS=-24V, ID=-3A, VGS=-10V Ω f=1MHz V VGS=0V, IS=-1A ns nC IF=-1A, VGS=0V, dIF/dt=100A/μs V nA μA mΩ Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Rg Body Diode *VSD *trr *Qrr *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTC4303N8J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 4/13 Recommended Soldering Footprint unit : mm MTC4303N8J CYStek Product Specification Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 5/13 CYStech Electronics Corp. Typical Characteristics : Q1( N-channel ) Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.4 ID, Drain Current(A) 25 10V, 9V, 8V, 7V, 6V BVDSS, Normalized Drain-Source Breakdown Voltage 30 5V 20 15 4V 10 1.2 1 0.8 ID=250μA, VGS=0V 0.6 3.5V 5 VGS=3V 0.4 0 0 1 2 3 4 VDS, Drain-Source Voltage(V) -75 -50 -25 5 Reverse Drain Current vs Source-Drain Voltage Static Drain-Source On-State resistance vs Drain Current 1.2 VSD, Source-Drain Voltage(V) R DS(ON) , Static Drain-Source On-State Resistance(mΩ) 1000 100 VGS=4.5V 1 Tj=25°C 0.8 Tj=150°C 0.6 0.4 VGS=10V 10 0.2 0.01 0.1 1 10 ID, Drain Current(A) 100 0 2 4 6 8 IDR , Reverse Drain Current(A) 10 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage 2.4 120 R DS(ON), Normalized Static DrainSource On-State Resistance 150 R DS(ON) , Static Drain-Source OnState Resistance(mΩ) 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) ID=4.5A 90 60 30 VGS=10V, ID=4.5A 2 RDS(ON) @Tj=25°C : 22.4mΩ typ. 1.6 1.2 0.8 VGS=4.5V, ID=4.5A RDS(ON) @Tj=25°C : 57mΩ typ. 0.4 0 0 0 MTC4303N8J 2 4 6 8 VGS, Gate-Source Voltage(V) 10 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) CYStek Product Specification Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 6/13 CYStech Electronics Corp. Typical Characteristics(Cont.) : Q1( N-channel) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage VGS(th), Normalized Threshold Voltage 1000 Capacitance---(pF) Ciss 100 C oss Crss 1.4 1.2 ID=1mA 1 0.8 ID=250μA 0.6 0.4 10 0 5 10 15 20 25 VDS, Drain-Source Voltage(V) -75 -50 -25 30 Forward Transfer Admittance vs Drain Current 50 75 100 125 150 175 10 1 0.1 8 VGS, Gate-Source Voltage(V) GFS , Forward Transfer Admittance(S) 25 Gate Charge Characteristics 10 VDS=10V Pulsed Ta=25°C VDS=15V 6 VDS=24V 4 2 ID=4.5A 0 0.01 0.001 0.01 0.1 1 ID, Drain Current(A) 0 10 2 4 6 8 Qg, Total Gate Charge(nC) 10 Maximum Drain Current vs Junction Temperature Maximum Safe Operating Area 6 ID, Maximum Drain Current(A) 100 ID, Drain Current(A) 0 Tj, Junction Temperature(°C) RDS(ON) Limite 10 100μs 1ms 1 10ms 100m 1s 0.1 TA=25°C, Tj=150°C, VGS=10V RθJA=84°C/W,Single Pulse DC 5 4 3 2 TA=25°C, VGS=10V RθJA=84°C/W 1 0 0.01 0.01 MTC4303N8J 0.1 1 10 100 VDS, Drain-Source Voltage(V) 1000 25 50 75 100 125 150 175 TJ, Junction Temperature(°C) CYStek Product Specification Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 7/13 CYStech Electronics Corp. Typical Characteristics(Cont.) : Q1( N-channel) Typical Transfer Characteristics 50 30 VDS=10V 25 TJ(MAX) =150°C TA=25°C RθJA=84°C/W 40 20 Power (W) ID, Drain Current (A) Single Pulse Power Rating, Junction to Ambient (Note on page 2) 15 30 20 10 10 5 0 0.001 0 0 1 2 3 4 VGS, Gate-Source Voltage(V) 5 6 0.01 0.1 1 Pulse Width(s) 10 100 Transient Thermal Response Curves 1 r(t), Normalized EffectiveTransient Thermal Resistance D=0.5 0.2 0.1 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*RθJA(t) 4.RθJA=84 °C/W 0.1 0.05 0.02 0.01 0.01 Single Pulse 0.001 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 t1, Square Wave Pulse Duration(s) MTC4303N8J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 8/13 Typical Characteristics : Q2( P-channel) Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.4 -BVDSS, Normalized Drain-Source Breakdown Voltage 20 -I D, Drain Current (A) -10V, -9V, -8V, -7V,-6V,-5V 15 -4V 10 -3.5V 5 VGS=-3V 1.2 1 0.8 ID=-250μA, VGS=0V 0.6 0.4 0 0 1 2 3 4 -VDS, Drain-Source Voltage(V) -75 -50 -25 5 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) Source Drain Current vs Source-Drain Voltage Static Drain-Source On-State resistance vs Drain Current 1000 1.2 -VSD , Source-Drain Voltage(V) RDS(on), Static Drain-Source On-State Resistance(mΩ) VGS=0V VGS=-4.5V 100 VGS=-10V 10 0.01 0.8 Tj=150°C 0.6 0.4 0.2 0.1 1 -ID, Drain Current(A) 10 0 100 R DS(on) , Normalized Static Drain-Source On-State Resistance 300 250 2 4 6 -IS , Source Drain Current(A) 8 10 Drain-Source On-State Resistance vs Junction Tempearture Static Drain-Source On-State Resistance vs Gate-Source Voltage R DS(on) , Static Drain-Source On-State Resistance(mΩ) Tj=25°C 1 ID=-3A 200 150 100 50 2 1.8 1.6 VGS=-10V, ID=-3A RDS(ON) @Tj=25°C : 54.6mΩ typ. 1.4 1.2 1 VGS=-4.5V, ID=-3A RDS(ON) @Tj=25°C : 83.2mΩ typ. 0.8 0.6 0.4 0 0 MTC4303N8J 2 4 6 8 -VGS, Gate-Source Voltage(V) 10 -75 -50 -25 0 25 50 75 100 125 150 175 200 Tj, Junction Temperature(°C) CYStek Product Specification Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 9/13 CYStech Electronics Corp. Typical Characteristics(Cont.) : Q2(P-channel) Threshold Voltage vs Junction Tempearture Capacitance vs Drain-to-Source Voltage -VGS(th) , Normalized Threshold Voltage 1000 Capacitance---(pF) Ciss 100 C oss Crss 1.4 1.2 ID=-1mA 1 0.8 ID=-250μA 0.6 0.4 10 0 5 10 15 20 25 -VDS, Drain-Source Voltage(V) -75 -50 -25 30 Forward Transfer Admittance vs Drain Current 25 50 75 100 125 150 175 Gate Charge Characteristics 10 -VGS, Gate-Source Voltage(V) 10 GFS, Forward Transfer Admittance(S) 0 Tj, Junction Temperature(°C) 1 0.1 VDS=-10V Pulsed TA=25°C 8 VDS=-15V 6 VDS=-24V 4 2 ID=-3A 0 0.01 0.001 0.01 0.1 1 -ID, Drain Current(A) 0 10 2 4 6 8 10 12 Qg, Total Gate Charge(nC) 14 16 Maximum Drain Current vs Junction Temperature Maximum Safe Operating Area 5 100 10 -I D, Maximum Drain Current(A) -I D, Drain Current(A) 4.5 RDS(ON) Limited 100μs 1ms 10ms 1 100m 1s 0.1 TA=25°C, Tj=150°C, VGS=-10V RθJA=84°C/W, Single Pulse DC 4 3.5 3 2.5 2 1.5 1 TA=25°C, VGS=-10V RθJA=84°C/W 0.5 0 0.01 0.01 MTC4303N8J 0.1 1 10 100 -ID, Drain-Source Voltage(V) 1000 25 50 75 100 125 150 Tj, Junction Temperature(°C) 175 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 10/13 Typical Characteristics(Cont.) : Q2(P-channel) Typical Transfer Characteristics 50 20 VDS=-10V 18 16 TJ(MAX) =150°C TA=25°C RθJA=84°C/W 40 14 Power (W) -I D, Drain Current (A) Single Pulse Power Rating, Junction to Ambient (Note on page 2) 12 10 8 30 20 6 10 4 2 0 0.001 0 0 1 2 3 4 -VGS, Gate-Source Voltage(V) 5 6 0.01 0.1 1 Pulse Width(s) 10 100 Transient Thermal Response Curves 1 r(t), Normalized Effective Transient Thermal Resistance D=0.5 0.2 0.1 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*RθJA(t) 4.RθJA=84°C/W 0.1 0.05 0.02 0.01 0.01 Single Pulse 0.001 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 t1, Square Wave Pulse Duration(s) MTC4303N8J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 11/13 Reel Dimension Carrier Tape Dimension MTC4303N8J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 12/13 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTC4303N8J CYStek Product Specification CYStech Electronics Corp. Spec. No. : C022N8J Issued Date : 2018.03.07 Revised Date : age No. : 13/13 2928-8J Dimension Marking: D1 D1 D2 D2 Date Code 4303 S1 G1 S2 G2 8-Lead 2928-8J Plastic Package CYStek Package Code: N8J Millimeters Min. Max. 0.935 1.100 0.010 0.100 0.925 1.000 0.250 0.400 0.100 0.200 2.950 3.100 2.500 3.000 DIM A A1 A2 b c D E Inches Min. Max. 0.0368 0.0433 0.0004 0.0039 0.0364 0.0394 0.0098 0.0157 0.0039 0.0079 0.1161 0.1220 0.0984 0.1181 DIM E1 E2 e L θ θ1 Millimeters Min. Max. 2.300 2.500 2.650 3.050 0.65 BSC 0.300 0.600 0° 8° 7° TYP Inches Min. Max. 0.0906 0.0984 0.1043 0.1201 0.0256 BSC 0.0118 0.0236 0° 8° 7° TYP Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTC4303N8J CYStek Product Specification