TDK C3225X7R2E154K200AA Multilayer ceramic chip capacitor Datasheet

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Creation Date : March 14, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3225X7R2E154K200AA
TDK item description C3225X7R2E154KT****
Commercial Grade
Applications
Please refer to Part No. CGA6M3X7R2E154K200AA for Automotive use.
Feature
Mid Mid Voltage (100 to 630V)
Series
C3225 [EIA 1210]
Status
Production
Size
Length(L)
3.20mm ±0.40mm
Width(W)
2.50mm ±0.30mm
Thickness(T)
2.00mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
Recommended Land Pattern (PA)
2.00mm to 2.40mm
Recommended Land Pattern (PB)
1.00mm to 1.20mm
Recommended Land Pattern (PC)
1.90mm to 2.50mm
Electrical Characteristics
Capacitance
150nF ±10%
Rated Voltage
250VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
3333MΩ
Other
Soldering Method
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
1000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : March 14, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3225X7R2E154K200AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C3225X7R2E154K200AA
ESR
C3225X7R2E154K200AA
Capacitance
C3225X7R2E154K200AA
C3225X7R2E154K200AA
Temperature Characteristic
C3225X7R2E154K200AA(No Bias)
DC Bias Characteristic
C3225X7R2E154K200AA(DC Bias =
125V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C3225X7R2E154K200AA(100kHz)
C3225X7R2E154K200AA(500kHz)
C3225X7R2E154K200AA(1MHz)
Multilayer Ceramic Chip Capacitors
C3225X7R2E154K200AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : March 14, 2017 (GMT)
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