HSMC HMPSA42M Npn epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6347-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 1/4
HMPSA42M
NPN EPITACIAL PLANAR TRANSISTOR
Description
The HMPSA42M is designed for application as a video output to
drive color CRT, or as a dialer circuit in electronics telephone.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................... 300 V
VCEO Collector to Emitter Voltage ................................................................................... 300 V
VEBO Emitter to Base Voltage ............................................................................................. 6 V
IC Collector Current ....................................................................................................... 800 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE1
*hFE2
*hFE3
fT
Min.
300
300
6
80
80
40
50
Typ.
-
Max.
100
200
750
900
1000
-
Unit
V
V
V
nA
mV
mV
mV
mV
MHz
Test Conditions
IC=100uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VEB=3V, IC=0
IC=20mA, IB=2mA
IC=100mA, IB=10mA
IC=20mA, IB=2mA
IC=100mA, IB=10mA
IC=10mA, VCE=10V
IC=100mA, VCE=10V
IC=200mA, VCE=10V
IC=10mA, VCE=20V, f=100MHZ
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6347-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Cirrent Gain & Collector Current
Cutoff Frequency & Collector Current
1000
100
100
Cutoff Frequency (MHz)
VCE=10V
Current Gain
VCE=10V
10
1
10
1
1
10
100
1000
1
10
Collector Current (mA)
Saturation Voltage & Collector Current
Capacitance & Reverse-Biased Voltage
100
100
10
Capacitance (pF)
Saturation Voltage (V)
100
Collector Current (mA)
1
10
Cob
0.1
VCE(sat) @ IC=10IB
0.01
1
1
10
100
1000
1
10
Collector Current (mA)
100
Reverse-Biased Voltage (V)
Saturation Voltage & Collector Current
Safe Operation Area
1
10
PT=1ms
PT=100ms
Collector Current (mA)
Saturation Voltage (V)
VBE(sat) @ IC=10IB
PT=1s
1
0.1
0.1
1
10
100
Collector Current (mA)
1000
1
10
100
Forward Biased Voltage (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6347-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 3/4
PD-Ta
700
Power Dissipation-PD(mW)
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
o
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6347-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 4/4
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking :
HSMC Logo
B
1 2
Product Series
Part Number
3
Date Code
Rank
α3
C
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
I
G
Ink Mark
α1
Style : Pin 1.Emitter 2.Base 3.Collector
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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