± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 D ESD Protection for RS-232 I/O Pins D D D D D D D DB, DW, OR NT PACKAGE (TOP VIEW) − ±15 kV − Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Four Drivers and Four Receivers Operates up to 120 kbit/s External Capacitors . . . 4 × 0.1 µF Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment DOUT2 DOUT1 RIN2 ROUT2 DIN1 ROUT1 RIN1 GND VCC C1+ V+ C1− 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DOUT3 RIN3 ROUT3 DIN4 DOUT4 DIN3 DIN2 ROUT4 RIN4 V− C2− C2+ description/ordering information The MAX208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output slew rate. ORDERING INFORMATION PDIP (NT) 0°C 0 C to 70 70°C C SOIC (DW) SSOP (DB) PDIP (NT) –40°C –40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA SOIC (DW) SSOP (DB) Tube of 15 MAX208CNT Tube of 25 MAX208CDW Reel of 2000 MAX208CDWR Tube of 60 MAX208CDB Reel of 2000 MAX208CDBR Tube of 15 MAX208INT Tube of 25 MAX208IDW Reel of 2000 MAX208IDWR Tube of 60 MAX208IDB Reel of 2000 MAX208IDBR TOP-SIDE MARKING MAX208CNT MAX208C MA208C MAX208INT MAX208I MB208I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2006, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 FUNCTION TABLES EACH DRIVER INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 5 2 DIN1 DOUT1 18 TTL/CMOS Inputs 1 DIN2 DOUT2 19 24 DIN3 DOUT3 21 20 DIN4 DOUT4 6 7 ROUT1 RIN1 4 3 ROUT2 TTL/CMOS Outputs RIN2 22 RS-232 Inputs 23 ROUT3 RIN3 17 ROUT4 2 RS-232 Outputs POST OFFICE BOX 655303 16 RIN4 • DALLAS, TEXAS 75265 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.3 V to 14 V Negative charge pump voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –14 V to 0.3 V Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V− − 0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Short-circuit duration: DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W (see Notes 2 and 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W (see Notes 2 and 4): NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-3. recommended operating conditions (see Note 5 and Figure 4) Supply voltage VIH VIL Driver high-level input voltage DIN Driver low-level input voltage DIN Driver input voltage DIN VI Receiver input voltage TA Operating free-air temperature MAX208C MAX208I MIN NOM MAX 4.5 5 5.5 2 UNIT V V 0.8 0 5.5 −30 30 0 70 −40 85 V V °C NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 5 and Figure 4) PARAMETER ICC Supply current TEST CONDITIONS No load, VCC = 5 V, TA = 25°C MIN TYP MAX 11 20 UNIT mA NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 5 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 9 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −9 IIH IIL High-level input current Low-level input current VI = VCC VI at 0 V IOS† Short-circuit output current VCC = 5.5 V, VO = 0 V MAX UNIT V V µA 15 200 −15 −200 µA ±10 ±60 mA ro Output resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 W † Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 5 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT Maximum data rate CL = 50 to 1000 pF, One DOUT switching, RL = 3 kΩ to 7 kΩ, See Figure 1 tPLH (D) Propagation delay time, low- to high-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 µs tPHL (D) Propagation delay time, high- to low-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 µs tsk(p) Pulse skew§ CL = 150 pF to 2500 pF, See Figure 2 RL = 3 kΩ to 7 kΩ, 300 ns SR(tr) Slew rate, transition region (see Figure 1) CL = 50 pF to 2500 pF, VCC = 5 V RL = 3 kΩ to 7 kΩ, 120 3 kbit/s 6 30 V/µs TYP UNIT ±15 kV † All typical values are at VCC = 5 V, and TA = 25°C. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. ESD protection PIN DOUT, RIN 4 TEST CONDITIONS Human-Body Model POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 5 and Figure 4) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage VIT+ VIT− Positive-going input threshold voltage Vhys ri Input hysteresis (VIT+ − VIT−) MIN IOH = −1 mA IOL = 1.6 mA Low-level output voltage Negative-going input threshold voltage Input resistance TYP MAX UNIT 3.5 VCC = 5 V, TA = 25°C VCC = 5 V, TA = 25°C VCC = 5 V VI = ±3 V to ±25 V, V 1.7 VCC = 5 V, TA = 25°C 0.4 V 2.4 V 0.8 1.2 0.2 0.5 1 V V 3 5 7 kW NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 5 and Figure 3) PARAMETER TEST CONDITIONS tPLH (R) tPHL (R) Propagation delay time, low- to high-level output tsk(p) Pulse skew‡ CL= 150 pF Propagation delay time, high- to low-level output MIN TYP† MAX 0.5 10 µs 0.5 10 µs 300 UNIT ns † All typical values are at VCC = 5 V, and TA = 25°C. ‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 5: Test conditions are C1−C4 = 0.1 µF, at VCC = 5 V ± 0.5 V. PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tPHL (D) CL (see Note A) Output tPLH (D) 3V −3 V TEST CIRCUIT SR(tr) + t PHL (D) 6V or t 3V −3 V VOH VOL VOLTAGE WAVEFORMS PLH (D) NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL (D) tPLH (D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew Input 3V 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω CL (see Note A) tPHL (R) tPLH (R) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 APPLICATION INFORMATION DOUT2 DOUT1 1 24 2 23 DOUT3 RIN3 5 kΩ RIN2 3 22 5 kΩ ROUT2 5V 4 400 kΩ 21 5V 20 400 kΩ DIN1 ROUT1 ROUT3 5 DIN4 DOUT4 5V 400 kΩ 6 19 DIN3 5V 400 kΩ RIN1 GND + 18 7 DIN2 5 kΩ 8 17 16 0.1 µF − 5 kΩ 9 0.1 µF 6.3V V− + 10 11 0.1 µF 6.3V C1+ C2− 15 − V+ − + 12 C2+ C1− + 14 + − RIN4 0.1 µF 16V VCC − ROUT4 0.1 µF 16 V 13 NOTES: A. Resistor values shown are nominal. B. Non-polarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 4. Typical Operating Circuit and Capacitor Values POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 APPLICATION INFORMATION capacitor selection The capacitor type used for C1−C4 is not critical for proper operation. The MAX208 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2) nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V−. Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V−. Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1−C4). ESD protection TI MAX208 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down. ESD test conditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. Human-Body Model (HBM) The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor. RD 1.5 kΩ VHBM + − CS 100 pF DUT Figure 5. HBM ESD Test Circuit 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006 APPLICATION INFORMATION 1.5 VHBM = 2 kV DUT = 10 V, 1-Ω Zener Diode I DUT − A 1.0 0.5 0.0 0 50 100 150 200 Time − ns Figure 6. Typical HBM Current Waveform Machine Model (MM) The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test no longer is as pertinent to the RS-232 pins. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX208CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CDWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208CNT PREVIEW PDIP NT 24 15 TBD Call TI MAX208IDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDBE4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208IDWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX208INT PREVIEW PDIP NT 24 15 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDI004 – OCTOBER 1994 NT (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN PINS ** A 24 28 A MAX 1.260 (32,04) 1.425 (36,20) A MIN 1.230 (31,24) 1.385 (35,18) B MAX 0.310 (7,87) 0.315 (8,00) B MIN 0.290 (7,37) 0.295 (7,49) DIM 24 13 0.280 (7,11) 0.250 (6,35) 1 12 0.070 (1,78) MAX B 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0°– 15° 0.010 (0,25) M 0.010 (0,25) NOM 4040050 / B 04/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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