AOS Semiconductor Product Reliability Report AOT2500L, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOT2500L. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOT2500L passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Appendix: Test data I. Product Description: The AOT2500L uses Trench MOSFET technology that is uniquely optimized to provide the most efficient high frequency switching performance. Both conduction and switching power losses are minimized due to an extremely low combination of RDS(ON), Ciss and Coss. This device is ideal for boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting. -RoHS Compliant -Halogen-Free Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOT2500L Standard sub-micron 150V N-Channel MOSFET TO220 Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOT2500L Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 12 lots 168hrs 500 hrs 1000 hrs 2 lots 6 lots Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 2 lots 6 lots 77 pcs / lot HAST 130°c , 85%RH, 33.3 psi, Vds = 80% of Vdsmax 96 hrs 9 lots Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs HTGB HTRB Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Lot Attribution Total Sample size Number of Failures Reference Standard 2541pcs 0 JESD22A113 616pcs 0 JESD22A108 0 JESD22A108 693pcs 0 JESD22A110 (Note A*) 12 lots 77 pcs / lot 924pcs 0 JESD22A102 (Note A*) 77 pcs / lot 0 JESD22A104 77 pcs / lot 616pcs 12 lots (Note A*) 924pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.27 MTTF = 34906 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOT2500L). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (4x77x500 +12x77x1000) x259] = 3.27 9 8 MTTF = 10 / FIT = 3.06 x 10 hrs = 34906 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 x 10-5eV / K 130 deg C 150 deg C 2.59 1 3