DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D186 BC875; BC879 NPN Darlington transistors Product specification Supersedes data of 1999 May 28 2004 Nov 05 Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 FEATURES PINNING • High DC current gain (min. 1000) PIN DESCRIPTION • High current (max. 1 A) 1 base • Low voltage (max. 80 V) 2 collector • Integrated diode and resistor. 3 emitter APPLICATIONS handbook, halfpage • Relay drivers. 2 1 1 2 DESCRIPTION 3 NPN Darlington transistor in a TO-92 (SOT54) plastic package. PNP complement: BC878. MAM307 Fig.1 3 Simplified outline (TO-92; SOT54) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BC875 SC-43A DESCRIPTION plastic single-ended leaded (through hole) package; 3 leads BC879 2004 Nov 05 2 VERSION SOT54 Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO PARAMETER collector-base voltage CONDITIONS MAX. UNIT open emitter − 60 V − 100 V BC875 − 45 V BC879 − 80 V BC875 BC879 VCES MIN. collector-emitter voltage VBE = 0 V VEBO emitter-base voltage − 5 V IC collector current (DC) − 1 A ICM peak collector current − 2 A IB base current (DC) Ptot total power dissipation Tstg open collector − 0.2 A − 0.83 W storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb ambient temperature −65 +150 °C Tamb ≤ 25 °C; note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. 2004 Nov 05 3 VALUE UNIT 150 K/W Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICES PARAMETER CONDITIONS collector-emitter cut-off current TYP. MAX. UNIT VBE = 0 V BC875 VCE = 45 V − − 50 nA BC879 VCE = 80 V − − 50 nA − − 50 nA IC = 150 mA 1000 − − IC = 0.5 A IEBO emitter-base cut-off current VEB = 4 V; IC = 0 A hFE DC current gain VCE = 10 V; see Fig.2 VCEsat MIN. collector-emitter saturation voltage 2000 − − IC = 0.5 A; IB = 0.5 mA − − 1.3 V IC = 1 A; IB = 1 mA − − 1.8 V VBEsat base-emitter saturation voltage IC = 1 A; IB = 1 mA − − 2.2 V fT transition frequency VCE = 5 V; IC = 0.5 A; f = 100 MHz − 200 − MHz ICon = 500 mA; IBon = 0.5 mA; IBoff = −0.5 mA − 500 − ns − 1300 − ns Switching times (between 10% and 90% levels) ton turn-on time toff turn-off time MGD838 5000 handbook, full pagewidth hFE 4000 3000 2000 1000 0 10−1 1 10 VCE = 10 V. Fig.2 DC current gain; typical values. 2004 Nov 05 4 102 IC (mA) 103 Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 2004 Nov 05 REFERENCES IEC JEDEC JEITA TO-92 SC-43A 5 EUROPEAN PROJECTION ISSUE DATE 97-02-28 04-06-28 Philips Semiconductors Product specification NPN Darlington transistors BC875; BC879 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Nov 05 6 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/05/pp7 Date of release: 2004 Nov 05 Document order number: 9397 750 13576