Vicor NBM6123T60E12A7M00 Non-isolated, fixed ratio dc-dc converter Datasheet

NBM™ Bus Converter
NBM6123x60E12A7yzz
®
S
US
C
C
NRTL
US
Non-Isolated, Fixed Ratio DC-DC Converter
Features
Product Ratings
• Up to 170 A continuous output current
• 2944 W/in3 power density
VPRI = 54 V (36 – 60 V)
PSEC= up to 2000 W
VSEC = 10.8 V (7.2 – 12.0 V)
(NO LOAD)
K = 1/5
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
• 6123 through-hole ChiP package
n 2.402” x 0.990” x 0.286”
Product Description
(61.00 mm x 25.14 mm x 7.26 mm)
The VI Chip® Non-Isolated Bus Converter (NBM™) is a high
efficiency Sine Amplitude Converter™ (SAC™), operating from
a 36 to 60 VDC primary bus to deliver a non-isolated,
ratiometric output from 7.2 to 12.0 VDC.
Typical Applications
• DC Power Distribution
• High End Computing Systems
The NBM6123x60E12A7yzz offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the primary side of the NBM module. With a primary to
secondary K factor of 1/5, that capacitance value can be
reduced by a factor of 25x, resulting in savings of board area,
material and total system cost.
• Automated Test Equipment
• Industrial Systems
• High Density Power Supplies
• Communications Systems
• Transportation
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the NBM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
The NBM non-isolated topology allows operation in forward
and reverse directions and provides bidirectional protections.
However if power train is disabled by any protection, and VSEC
is present, then voltage equal to VSEC minus two diode drops
will appear on primary side.
NBM™ Bus Converter
Rev 1.1
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Typical Application
NBM
TM
EN
enable/disable
switch
VAUX
FUSE
+VSEC
+VPRI
SGND
VPRI
PGND
PRIMARY
SECONDARY
CI_NBM_ELEC
POL
SOURCE_RTN
NBM6123x60E12A7yzz+ Point of Load
NBM™ Bus Converter
Rev 1.1
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Pin Configuration
1
TOP VIEW
2
+VSEC
A
A’ +VSEC
PGND1
B
B’ PGND2
PGND1
C
C’ PGND2
+VSEC
D
D’ +VSEC
+VSEC
E
E’
+VSEC
PGND1
F
F’
PGND2
PGND1
G
G’ PGND2
+VSEC
H
H’ +VSEC
+VPRI
I
I’
TM
+VPRI
J
J’
EN
+VPRI
K
K’ VAUX
+VPRI
L
L’
SGND
6123 ChiP Package
Pin Descriptions
Pin Number
Signal Name
Type
I1, J1, K1, L1
+VPRI
PRIMARY POWER
I’2
TM
OUTPUT
J’2
EN
INPUT
K’2
VAUX
OUTPUT
L’2
SGND
SIGNAL RETURN
A1, D1, E1, H1,
A’2, D’2, E’2, H’2
B1, C1, F1, G1
B’2, C’2, F’2, G’2
+VSEC
PGND*
SECONDARY
POWER
SECONDARY
POWER RETURN
Function
Positive primary transformer power terminal
Temperature Monitor; Primary side referenced signals
Enables and disables power supply; Primary side referenced signals
Auxilary Voltage Source; Primary side referenced signals
Signal return terminal only. Do not connect to PGND
Positive secondary transformer power terminal
Transformer power return terminal
*For proper operation an external low impedance connection must be made between listed -PGND1 and PGND2 terminals.
NBM™ Bus Converter
Rev 1.1
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Part Ordering Information
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Max
Secondary
Voltage
Secondary
Output
Current
Temperature
Grade
Option
NBM
6123
x
60
E
12
A7
y
zz
Non-isolated
Bus Converter
Module
61 = L
23 = W
T = TH
36 – 60 V
12 V
No Load
00 = Analog Ctrl
S = SMT
60 V
170 A
T = -40°C – 125°C
01 = PMBus Ctrl
M = -55°C – 125°C
0R = Reversible Analog Ctrl
0P = Reversible PMBus Ctrl
All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).
Standard Models
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Max
Secondary
Voltage
Secondary
Output
Current
Temperature
Grade
Option
NBM
6123
T
60
E
12
A7
T
0R
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
+VPRI_DC to –VPRI_DC
Min
Max
Unit
-1
80
V
1
V/µs
16
V
4.6
V
5.5
V
4.6
V
VPRI_DC or VSEC_DC slew rate
(operational)
+VSEC_DC to –VSEC_DC
-1
TM to –VPRI_DC
EN to –VPRI_DC
-0.3
VAUX to –VPRI_DC
NBM™ Bus Converter
Rev 1.1
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Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
60
V
15
V
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction)
Primary Input Voltage range,
continuous
VPRI µController
PRI to SEC Input Quiescent Current
36
VPRI_DC
VPRI_DC voltage where µC is initialized,
(ie VAUX = Low, powertrain inactive)
VµC_ACTIVE
Disabled, EN Low, VPRI_DC = 54 V
IPRI_Q
7
TINTERNAL ≤ 100ºC
12
VPRI_DC = 54 V, TINTERNAL = 25ºC
PRI to SEC No Load Power
Dissipation
PRI to SEC Inrush Current Peak
8
VPRI_DC = 54 V
PPRI_NL
10
19
14
VPRI_DC = 36 V to 60 V
22
15
TINTERNAL ≤ 100ºC
DC Primary Input Current
Transformation Ratio
Secondary Output Power
(continuous)
Secondary Output Power (pulsed)
Secondary Output Current
(continuous)
Secondary Output Current (pulsed)
PRI to SEC Efficiency (ambient)
IPRI_IN_DC
PSEC_OUT_PULSE
1/5
ηAMB
2000
W
Specified at VPRI_DC = 60 V; 10 ms pulse, 25% Duty
cycle, PSEC_AVG = 50% rated PSEC_OUT_DC
2350
W
170
A
200
A
10 ms pulse, 25% Duty cycle, ISEC_OUT_AVG = 50% rated
ISEC_OUT_DC
VPRI_DC = 54 V, ISEC_OUT_DC = 170 A
96.5
VPRI_DC = 36 V to 60 V, ISEC_OUT_DC = 170 A
95.6
97.5
VPRI_DC = 54 V, ISEC_OUT_DC = 85 A
97.3
98
96.5
97.1
%
PRI to SEC Efficiency (hot)
ηHOT
VPRI_DC = 54 V, ISEC_OUT_DC = 170 A
PRI to SEC Efficiency
(over load range)
η20%
34 A < ISEC_OUT_DC < 170 A
90
RSEC_COLD
VPRI_DC = 54 V, ISEC_OUT_DC = 170 A, TINTERNAL = -40°C
0.5
0.8
1.1
RSEC_AMB
VPRI_DC = 54 V, ISEC_OUT_DC = 170 A
0.8
1.3
1.8
RSEC_HOT
VPRI_DC = 54 V, ISEC_OUT_DC = 170 A, TINTERNAL = 100°C
1.1
1.55
2.0
FSW
Frequency of the Output Voltage Ripple = 2x FSW
1.02
1.07
1.12
VSEC_OUT_PP
CSEC_EXT = 0 µF, ISEC_OUT_DC = 170 A, VPRI_DC = 54 V,
20 MHz BW
PRI to SEC Output Resistance
Switching Frequency
Secondary Output Voltage Ripple
Secondary Output Leads Inductance
(Parasitic)
%
%
125
TINTERNAL ≤ 100ºC
Primary Input Leads Inductance
(Parasitic)
A
V/V
Specified at VPRI_DC = 60 V
ISEC_OUT_DC
ISEC_OUT_PULSE
A
34.4
Primary to secondary, K = VSEC_DC / VPRI_DC, at no load
PSEC_OUT_DC
W
50
At ISEC_OUT_DC = 170 A, TINTERNAL ≤ 100ºC
K
12
VPRI_DC = 36 V to 60 V, TINTERNAL = 25 ºC
VPRI_DC = 60 V, CSEC_EXT = 3000 µF, RLOAD_SEC = 20% of
full load current
IPRI_INR_PK
mA
mΩ
MHz
mV
400
LPRI_IN_LEADS
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
3
nH
LSEC_OUT_LEADS
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
0.64
nH
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 5 of 26
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NBM6123x60E12A7yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction) Cont.
Effective Primary Capacitance
(Internal)
Effective Secondary Capacitance
(Internal)
Effective Secondary Output
Capacitance (External)
Effective Secondary Output
Capacitance (External)
CPRI_INT
Effective Value at 54 VPRI_DC
CSEC_INT
Effective Value at 10.8 VSEC_DC
CSEC_OUT_EXT
Excessive capacitance may drive module into SC
protection
CSEC_OUT_AEXT
CSEC_OUT_AEXT Max = N * 0.5 * CSEC_OUT_EXT MAX, where
N = the number of units in parallel
16.80
µF
140
µF
3000
µF
1010
ms
Protection PRIMARY to SECONDARY (Forward Direction)
Auto Restart Time
Primary Overvoltage Lockout
Threshold
Primary Overvoltage Recovery
Threshold
Primary Overvoltage Lockout
Hysteresis
Primary Overvoltage Lockout
Response Time
Primary Undervoltage Lockout
Threshold
Primary Undervoltage Recovery
Threshold
Primary Undervoltage Lockout
Hysteresis
Primary Undervoltage Lockout
Response Time
Primary Undervoltage Startup Delay
Primary Soft-Start Time
Secondary Output Overcurrent Trip
Threshold
Secondary Output Overcurrent
Response Time Constant
Secondary Output Short Circuit
Protection Trip Threshold
Secondary Output Short Circuit
Protection Response Time
Overtemperature Shutdown
Threshold
Overtemperature Recovery
Threshold
Undertemperature Shutdown
Threshold
Undertemperature Restart Time
tAUTO_RESTART
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
940
VPRI_OVLO+
63
66
69
V
VPRI_OVLO-
60
63
66
V
VPRI_OVLO_HYST
3
V
tPRI_OVLO
30
µs
VPRI_UVLO-
28
30
32
V
VPRI_UVLO+
32
34
36
V
VPRI_UVLO_HYST
4
V
tPRI_UVLO
100
µs
From VPRI_DC = VPRI_UVLO+ to powertrain active, EN
tPRI_UVLO+_DELAY floating, (i.e One time Startup delay form application
of VPRI_DC to VSEC_DC)
30
ms
From powertrain active. Fast Current limit protection
disabled during Soft-Start
1
ms
tPRI_SOFT-START
201
ISEC_OUT_OCP
tSEC_OUT_OCP
Effective internal RC filter
tOTP–
Temperature sensor located inside controller IC;
Protection not available for M-Grade units.
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 6 of 26
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µs
125
105
tUTP_RESTART
A
1
Temperature sensor located inside controller IC
A
µs
250
tSEC_OUT_SCP
tUTP
250
100
ISEC_OUT_SCP
tOTP+
220
°C
110
3
115
°C
-45
°C
s
NBM6123x60E12A7yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
12.0
V
General Powetrain SECONDARY to PRIMARY Specification (Reverse Direction)
Secondary Input Voltage range,
continuous
7.2
VSEC_DC
VSEC_DC = 10.8 V, TINTERNAL = 25ºC
SEC to PRI No Load Power
Dissipation
DC Secondary Input Current
Primary Ouptut Power (continuous)
Primary Output Power (pulsed)
Primary Output Current (continuous)
Primary Output Current (pulsed)
SEC to PRI Efficiency (ambient)
PSEC_NL
ISEC_IN_DC
PPRI_OUT_DC
PPRI_OUT_PULSE
10
8.0
VSEC_DC = 10.8 V
19
VSEC_DC = 7.2 V to 12.0 V, TINTERNAL = 25ºC
14
VSEC_DC = 7.2 V to 12.0 V
22
ηAMB
172
A
Specified at VSEC_DC = 12.0 V
2000
W
Specified at VSEC_DC = 12.0 V; 10 ms pulse,
25% Duty cycle, PPRI_AVG = 50% rated PPRI_OUT_DC
2400
W
34
A
40.8
A
10 ms pulse, 25% Duty cycle,
IPRI_OUT_AVG = 50% rated IPRI_OUT_DC
VSEC_DC = 10.8 V, IPRI_OUT_DC = 34 A
96.1
97.1
VSEC_DC = 7.2 V to 12.0 V, IPRI_OUT_DC= 34 A
94.9
VSEC_DC = 10.8 V, IPRI_OUT_DC = 17 A
97.3
98
96.3
97
%
SEC to PRI Efficiency (hot)
ηHOT
VSEC_DC = 10.8 V, IPRI_OUT_DC = 34 A
SEC to PRI Efficiency (over load
range)
η20%
6.80 A < IPRI_OUT_DC < 34 A
90
RPRI_COLD
VSEC_DC = 10.8 V, IPRI_OUT_DC = 34 A, TINTERNAL = -40°C
22
30
38
RPRI_AMB
VSEC_DC = 10.8 V, IPRI_OUT_DC = 34 A
28
42
56
RPRI_HOT
VSEC_DC = 10.8 V, IPRI_OUT_DC = 34 A, TINTERNAL = 100°C
36
45
54
SEC to PRI Output Resistance
Primary Output Voltage Ripple
VPRI_OUT_PP
W
At IPRI_DC = 34 A, TINTERNAL ≤ 100ºC
IPRI_OUT_DC
IPRI_OUT_PULSE
12
CPRI_OUT_EXT = 0 µF, IPRI_OUT_DC = 34 A,
VSEC_DC = 10.8 V, 20 MHz BW
%
%
625
mV
1500
TINTERNAL ≤ 100ºC
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 7 of 26
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800 927.9474
mΩ
NBM6123x60E12A7yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
100
µF
Protection SECONDARY to PRIMARY (Reverse Direction)
Effective Primary Output Capacitance
(External)
CPRI_OUT_EXT
Excessive capacitance may drive module into SC
protection when starting from Secondary to Primary
Secondary Overvoltage Lockout
Threshold
VSEC_OVLO+
12.8
13.2
13.6
V
Secondary Overvoltage Recovery
Threshold
VPRI_OVLO-
12
12.6
13.2
V
Secondary Overvoltage Lockout
Response Time
tPRI_OVLO
30
µs
Secondary Undervoltage Lockout
Threshold
VSEC_UVLO-
5.6
6
6.4
V
Secondary Undervoltage Recovery
Threshold
VPRI_UVLO+-
6.4
6.8
7.2
V
Secondary Undervoltage Lockout
Response Time
tSEC_UVLO
Primary Output Overcurrent Trip
Threshold
IPRI_OUT_OCP
Powertrain is stopped but current can flow from
Secondary to Primary through MOSFET body Diodes
Primary Output Overcurrent
Response Time Constant
tPRI_OUT_OCP
Effective internal RC filter
Primary Short Circuit Protection Trip
Threshold
IPRI_SCP
Primary Short Circuit Protection
Response Time
tPRI_SCP
100
40
44
100
Powertrain is stopped but current can flow from
Secondary to Primary through MOSFET body Diodes
50
Rev 1.1
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50
A
µs
A
1
NBM™ Bus Converter
µs
µs
NBM6123x60E12A7yzz
200
180
Secondary
Output Current (A)
160
140
120
100
80
60
40
20
0
25
50
75
100
125
Case Temperature (°C)
Top only at temperature
Top and leads at
temperature
Leads at temperature
Top, leads, & belly at
temperature
2750
Secondary Output Current (A)
Secondary Output Power (W)
Figure 1 — Specified thermal operating area
2500
2250
2000
1750
1500
1250
1000
750
36
38
41
43
46
48
50
53
55
58
230
210
190
170
150
130
110
90
36
60
38
41
Primary Input Voltage (V)
PSEC_OUT_DC
43
ISEC_OUT_DC
PSEC_OUT_PULSE
Secondary Output Capacitance
(% Rated CSEC_EXT_MAX)
Figure 2 — Specified electrical operating area using rated RSEC_HOT
110
100
90
80
70
60
50
40
30
20
10
0
0
46
48
50
53
55
Primary Input Voltage (V)
20
40
60
80
Secondary Output Current (% ISEC_OUT_DC)
Figure 3 — Specified Primary start-up into load current and external capacitance
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 9 of 26
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800 927.9474
100
ISEC_OUT_PULSE
58
60
NBM6123x60E12A7yzz
Signal Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Temperature Monitor
• The TM pin is a standard analog I/O configured as an output from an internal µC.
• The TM pin monitors the internal temperature of the controller IC within an accuracy of ±5°C.
• µC 250 kHz PWM output internally pulled high to 3.3 V.
SIGNAL TYPE
STATE
Startup
ATTRIBUTE
Powertrain active to TM
time
TM Duty Cycle
SYMBOL
CONDITIONS / NOTES
TYP
MAX
100
tTM
18.18
TMPWM
TM Current
MIN
ITM
UNIT
µs
68.18
%
4
mA
Recommended External filtering
DIGITAL
OUTPUT
Regular
Operation
TM Capacitance (External)
CTM_EXT
Recommended External filtering
0.01
µF
TM Resistance (External)
RTM_EXT
Recommended External filtering
1
kΩ
ATM
10
mV / °C
VTM_AMB
1.27
V
Specifications using recommended filter
TM Gain
TM Voltage Reference
TM Voltage Ripple
VTM_PP
RTM_EXT = 1 K Ohm, CTM_EXT = 0.01 uF, VPRI_DC
= 54 V, ISEC_DC = 170 A
28
mV
TINTERNAL ≤ 100ºC
40
Enable / Disable Control
• The EN pin is a standard analog I/O configured as an input to an internal µC.
• It is internally pulled high to 3.3 V.
• When held low the NBM™ internal bias will be disabled and the powertrain will be inactive.
• In an array of NBMs, EN pins should be interconnected to synchronize startup.
• Unit must not be disabled if a load is present on +VPRI while in reverse operation.
SIGNAL TYPE
STATE
Startup
ANALOG
INPUT
Regular
Operation
ATTRIBUTE
EN to Powertrain active
time
SYMBOL
tEN_START
EN Voltage Threshold
VEN_TH
EN Resistance (Internal)
REN_INT
EN Disable Threshold
CONDITIONS / NOTES
MIN
VPRI_DC > VPRI_UVLO+, EN held low both
conditions satisfied for T > tPRI_UVLO+_DELAY
TYP
MAX
250
µs
2.3
Internal pull up resistor
V
1.5
kΩ
1
VEN_DISABLE_TH
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 10 of 26
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UNIT
V
NBM6123x60E12A7yzz
Signal Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Auxiliary Voltage Source
• The VAUX pin is a standard analog I/O configured as an output from an internal µC.
• VAUX is internally connected to µC output as internally pulled high to a 3.3 V regulator with 2% tolerance, a 1% resistor of 1.5 kΩ.
• VAUX can be used as a "Ready to process full power" flag. This pin transitions VAUX voltage after a 2 ms delay from the start of powertrain activating,
signaling the end of softstart.
• VAUX can be used as "Fault flag". This pin is pulled low internally when a fault protection is detected.
SIGNAL TYPE
ANALOG
OUTPUT
STATE
ATTRIBUTE
SYMBOL
Startup
Powertrain active to VAUX
time
tVAUX
VAUX Voltage
VVAUX
VAUX Available Current
IVAUX
Regular
MIN
TYP
MAX
2
Powertrain active to VAUX High
2.8
UNIT
ms
3.3
V
4
mA
50
VAUX Voltage Ripple
VVAUX_PP
Operation
Fault
CONDITIONS / NOTES
VAUX Capacitance
(External)
CVAUX_EXT
VAUX Resistance (External)
RVAUX_EXT
VAUX Fault Response Time
tVAUX_FR
100
TINTERNAL ≤ 100ºC
0.01
VPRI_DC < VµC_ACTIVE
From fault to VVAUX = 2.8 V, CVAUX = 0 pF
Signal Ground
• Signal ground is internally connect to PGND through a zero ohm resistor.
• Internal SGND traces are not designed to support high current.
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 11 of 26
09/2015
800 927.9474
1.5
mV
µF
kΩ
10
µs
VAUX
TM
OUTPUT
OUTPUT
OUTPUT
EN
+VPRI
+VSEC
BIDIR
INPUT
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 12 of 26
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800 927.9474
STARTUP
tVAUX
tPRI_UVLO+_DELAY
VPRI_UVLO+
VµC_ACTIVE
VPRI_OVLO+
VNOM
OVER VOLTAGE
VPRI_UVLO-
VPRI_OVLO-
up
ll u
N
O P
ER
T
N- AL
PU
OV
R
N
T
T
U
TU TER
U
E YO N
NP G E
U T IN
Z
I
I
R
P
O
L
Y TA
IN U X
IA NDA RN
AR OL
T
A
C
I
D
V
_
I N CO T U R I M V
RI
P
VP N &
µc SE
E
tAUTO-RESTART
ENABLE CONTROL
OVER CURRENT
>
tPRI_UVLO+_DELAY
tSEC_OUT_SCP
SHUTDOWN
GE
NT
TA
H
L
E
W G
EV
VO
LO HI
S
T
T F
I
D
D
RE
U
U
F
P
LE LE
T
RC
IN N-O
UL PUL
PU
CI
P
Y
R
N
T
R
I
R
A TU
LE LE
C
_D
IM
AB AB
HO
RI
R
S
N
P
N
P
V
E
E
RT
TA
NBM6123x60E12A7yzz
NBM™ Forward Direction Timing Diagram
VAUX
TM
OUTPUT
OUTPUT
OUTPUT
EN
+VSEC
+VPRI
BIDIR
INPUT
VSEC_OVLO+
VNOM
STARTUP
tVAUX
tPRI_UVLO+_DELAY
VPRI = +VSEC – (~1.4V)
VµC_ACTIVE
VSEC_UVLO+
OVER VOLTAGE
VSEC_UVLO-
VSEC_OVLO-
up
llN
u
-O L P
T
ER
RN NA
PU
U
OV
T
T TER
Y
U
T
R E
E
IZ Y O ON DA AG
PU IN
AL AR N- ON LT
IN UX
I
C
O
IT M R
C
VA
_D
IN PRI TU SE V
EC
c
VS N &
µ
E
NBM™ Bus Converter
Rev 1.1
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Page 13 of 26
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OVER CURRENT
tAUTO-RESTART
NOT SUPPORTED CONDITION,
PERMANENT DAMAGE MAY OCCUR
ENABLE CONTROL
>
tPRI_UVLO+_DELAY
tPRI_OUT_OCP
SHUTDOWN
RED LINE: LOAD MUST NOT BE PRESENT
TO PRENEVENT DAMAGE TO UNIT
/
UT F
H
RT
T NT
OW HIG
TA
N P -O F
EN EVE
I
L
S
R
Y N
R IT
RE
ED ED
AR UR
T
CU C U
LL LL
D
U
R
U
U
R
P
N ET
P
VE T CI
IN
E LE P
CO AG
L
O
C
E
S LT
_D
AB AB
OR
EC
VO
EN EN
VS
SH
NBM6123x60E12A7yzz
NBM™ Reverse Direction Timing Diagram
NBM6123x60E12A7yzz
High Level Functional State Diagram
Conditions that cause state transitions are shown along arrows. Sub-sequence activities listed inside the state bubbles.
Application
of input voltage to VPRI_DC
VμC_ACTIVE < VPRI_DC < VPRI_UVLO+
Application
of input voltage to VSEC_DC
VμC_ACTIVE <
VSEC_DC
K
< VPRI_UVLO+
VPRI_DC > VPRI_UVLO+
or VSEC_DC > VSEC_UVLO+
STANDBY SEQUENCE
STARTUP SEQUENCE
TM Low
TM Low
EN High
EN High
VAUX Low
VAUX Low
Powertrain Stopped
Powertrain Stopped
ENABLE falling edge,
or OTP detected
tPRI_UVLO+_DELAY
expired
ONE TIME DELAY
INITIAL STARTUP
Input OVLO or UVLO,
Output OCP,
UTP, OVLO or UVLO, or
Input OCP detected
Fault
Autorecovery
ENABLE falling edge,
or OTP detected
FAULT
SEQUENCE
SUSTAINED
OPERATION
Input OVLO or UVLO,
Output OCP,
UTP, OVLO or UVLO, or
Input OCP detected
TM Low
EN High
VAUX Low
Powertrain Stopped
TM PWM
EN High
VAUX High
Powertrain Active
Short Circuit detected
Note: During reverse direction operation a load must not be present if the powertrain is in any stopped state while the supply voltage is present on +VSEC.
NBM™ Bus Converter
Rev 1.1
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NBM6123x60E12A7yzz
Application Characteristics
18
16
14
12
10
8
6
4
38
41
43
46
48
50
53
55
58
60
98.5
98.0
97.5
97.0
96.5
96.0
95.5
-40
-20
0
Primary Input Voltage (V)
- 40°C
25°C
90°C
VPRI:
88
80
72
64
56
48
40
32
24
16
8
0
PD
0
17
34
51
68
85
102
119
136
153
PRI to SEC, Power Dissipation
PRI to SEC, Efficiency (%)
99
98
97
96
95
94
93
92
91
90
89
88
54 V
17
34
17
34
51
68
85
102
119
136
153
170
Secondary Output Current (A)
VPRI:
36 V
54 V
100
54 V
60 V
51
68
85
102
119
136
153
88
80
72
64
56
48
40
32
24
16
8
0
170
36 V
54 V
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Case Temperature (°C)
60 V
ISEC_OUT:
Figure 8 — Efficiency and power dissipation at TCASE = 90°C
60 V
Figure 7 — Efficiency and power dissipation at TCASE = 25°C
PRI to SEC, Power Dissipation
PRI to SEC, Efficiency (%)
88
80
72
64
56
48
40
32
24
16
8
0
PD
0
80
Secondary Output Current (A)
VPRI :
60 V
Figure 6 — Efficiency and power dissipation at TCASE = -40°C
99
98
97
96
95
94
93
92
91
90
89
88
60
PD
0
170
PRI to SEC, Output Resistance (mΩ)
36 V
36 V
99
98
97
96
95
94
93
92
91
90
89
88
Secondary Output Current (A)
VPRI :
40
Figure 5 — Full load efficiency vs. temperature; VPRI_DC
Figure 4 — No load power dissipation vs. VPRI_DC
PRI to SEC, Efficiency (%)
TTOP SURFACE CASE:
20
Case Temperature (ºC)
PRI to SEC, Power Dissipation
36
PRI to SEC, Full Load Efficiency (%)
PRI to SEC, Power Dissipation (W)
Product is mounted and temperature controlled via top side cold plate, unless otherwise noted. All data presented in this section are collected data form
primary sourced units processing power in forward direction.See associated figures for general trend data.
180 A
Figure 9 — ROUT vs. temperature; Nominal VPRI_DC
ISEC_DC = 100 A at TCASE = 90°C
NBM™ Bus Converter
Rev 1.1
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Page 15 of 26
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80
100
Secondary Output Voltage Ripple (mV)
NBM6123x60E12A7yzz
200
175
150
125
100
75
50
25
0
0
17
34
51
68
85
102
119
136
153
170
Secondary Output Current (A)
VPRI:
384 V
Figure 10 — VSEC_OUT_PP vs. ISEC_DC ; No external CSEC_OUT_EXT. Board
mounted module, scope setting : 20 MHz analog BW
Figure 11 — Full load ripple, 270 µF CPRI_OUT_EXT; No external
CSEC_OUT_EXT. Board mounted module, scope setting :
20 MHz analog BW
Figure 12 — 0 A– 170 A transient response:
CPRI_OUT_EXT = 270 µF, no external CSEC_OUT_EXT
Figure 13 — 170 A – 0 A transient response:
CIN = 270 µF, no external CSEC_OUT_EXT
Figure 14 — Start up from application of VPRI_DC= 54 V, 20% IOUT,
100% CSEC_OUT_EXT
Figure 15 — Start up from application of EN with pre-applied
VPRI_DC = 54 V, 20% ISEC_DC, 100% CSEC_OUT_EXT
NBM™ Bus Converter
Rev 1.1
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Page 16 of 26
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NBM6123x60E12A7yzz
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
60.87 / [2.396] 61.00 / [2.402] 61.13 / [2.407]
mm/[in]
Width
W
24.76 / [0.975] 25.14 / [0.990] 25.52 / [1.005]
mm/[in]
Height
H
7.21 / [0.284]
mm/[in]
Volume
Vol
Weight
W
Lead finish
Without Heatsink
7.26 / [0.286]
7.31 / [0.288]
11.13 / [0.679]
cm3/[in3]
41 / [1.45]
g/[oz]
Nickel
0.51
2.03
Palladium
0.02
0.15
0.003
0.051
-40
125
Gold
µm
Thermal
Operating Temperature
TINTERNAL
NBM6123T60E12A7T0R (T-Grade)
Thermal Resistance Top Side
ΦINT-TOP
Estimated thermal resistance to maximum
temperature internal component from
isothermal top
1.28
°C/W
Estimated thermal resistance to
maximum temperature internal
component from isothermal leads
1.24
°C/W
1.18
°C/W
34
Ws/°C
Thermal Resistance Leads
Thermal Resistance Bottom Side
ΦINT-LEADS
Estimated thermal resistance to
ΦINT-BOTTOM maximum temperature internal
component from isothermal bottom
Thermal Capacity
°C
Assembly
Storage temperature
ESD Withstand
NBM6123T60E12A7T0R (T-Grade)
-40
ESDHBM
Human Body Model, "ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)
ESDCDM
Charge Device Model, "JESD 22-C101-E" Class II (200V to < 500V)
NBM™ Bus Converter
Rev 1.1
vicorpower.com
Page 17 of 26
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125
°C
NBM6123x60E12A7yzz
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Soldering[1]
Peak Temperature Top Case
135
°C
Safety
Isolation voltage / Dielectric test
VHIPOT
PRIMARY to SECONDARY
N/A
PRIMARY to CASE
2250
SECONDARY to CASE
2250
N/A
Isolation Capacitance
CPRI_SEC
Unpowered Unit
Insulation Resistance
RPRI_SEC
At 500 Vdc
MTBF
V
N/A
0
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer
3.34
MHrs
Telcordia Issue 2 - Method I Case III; 25°C
Ground Benign, Controlled
5.26
MHrs
cURus "UL 60950-1"
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
[1]
pF
MΩ
cTÜVus "EN 60950-1"
Agency Approvals / Standards
N/A
Product is not intended for reflow solder attach.
NBM™ Bus Converter
Rev 1.1
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Page 18 of 26
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NBM™ Bus Converter
Rev 1.1
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SGND
VAUX
EN
TM
1.5 kΩ
SGND
Startup /
Re-start Delay
Over-Temp
Under-Temp
Cntrl
SEPIC EN
Over Voltage
UnderVoltage
VAUX
EN
TM PWM
+Vcc2
Current sense
Current Flow detection
+ Forward IPRI_DC sense
Signal Pins
1.5 kΩ
3.3v
Linear
Regulator
Digital Controller
+Vcc1
Differential Current
Sensing
Fast Current
Limit
Slow Current
Limit
Modulator
Temperature
Sensor
Soft-Start
On/Off
SEPIC
Gate Drive
Transformer
+VSEC
+VPRI
C04
0Ω
PGND2
SGND
C03
Q05
Q07
Q02
Q01
+VSEC
Lr
PGND2
PGND1
Half-Bridge
Synchronous
Rectification
Secondary Stage
Cr
Full Bridge
Primary Stage
+VPRI
Q06
Q04
Q03
Q06
PGND1
C02
C01
+VSEC
NBM6123x60E12A7yzz
NBM™ Module Block Diagram
Analog Controller
NBM6123x60E12A7yzz
Sine Amplitude Converter™ Point of Load Conversion
CPRI_INT
CPRI_INT_ESR
0.5 mΩ
16.80 µF
0.53 nH
LPRI_IN_LEADS = 3 nH
ISEC
RSEC
1.25 mΩ
LSEC_OUT_LEADS = 0.64 nH
+VSEC
+VPRI
1.25 mΩ
V•I
IPRI_Q
174 mA
1/5 • ISEC
+
+
–
1/5 • VPRI
CSEC_INT_ESR
60.4 µΩ
–
CSEC_INT
140 µF
K
–PGND
Figure 16 — NBM module AC model
The Sine Amplitude Converter (SAC™) uses a high frequency resonant
tank to move energy from Primary to secondary and vice versa. (The
resonant tank is formed by Cr and leakage inductance Lr in the power
transformer windings as shown in the NBM™ module Block Diagram).
The resonant LC tank, operated at high frequency, is amplitude
modulated as a function of input voltage and output current. A small
amount of capacitance embedded in the primary and secondary stages
of the module is sufficient for full functionality and is key to achieving
high power density.
The NBM6123x60E12A7yzz SAC can be simplified into the preceeding
model.
The use of DC voltage transformation provides additional interesting
attributes. Assuming that RSEC = 0 Ω and IPRI_Q = 0 A, Eq. (3) now
becomes Eq. (1) and is essentially load independent, resistor R is now
placed in series with VIN.
VSEC
RRIN
Vin
V
PRI
+
–
SAC™
SAC
1/5
KK==1/32
Vout
At no load:
VSEC = VPRI • K
(1)
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
K=
Figure 17 — K = 1/5 Sine Amplitude Converter
with series input resistor
The relationship between VPRI and VSEC becomes:
VSEC
(2)
VPRI
VSEC = (VPRI – IPRI • RIN) • K
Substituting the simplified version of Eq. (4)
(IPRI_Q is assumed = 0 A) into Eq. (5) yields:
In the presence of load, VOUT is represented by:
VSEC = VPRI • K – ISEC • RSEC
(3)
VSEC = VPRI • K – ISEC • RIN • K2
and IOUT is represented by:
ISEC =
(5)
IPRI – IPRI_Q
K
(4)
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance of
the power transformer. IQ represents the quiescent current of the SAC
control, gate drive circuitry, and core losses.
NBM™ Bus Converter
Rev 1.1
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(6)
NBM6123x60E12A7yzz
This is similar in form to Eq. (3), where RSEC is used to represent the
characteristic impedance of the SAC™. However, in this case a real R on
the primary side of the SAC is effectively scaled by K2 with respect
to the secondary.
Assuming that R = 1 Ω, the effective R as seen from the secondary side is 40
mΩ, with K = 1/5 .
A similar exercise should be performed with the additon of a capacitor
or shunt impedance at the primary input to the SAC. A switch in series
with VPRI is added to the circuit. This is depicted in Figure 18.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic components
because magnetizing currents remain low. Small magnetics mean small
path lengths for turns. Use of low loss core material at high frequencies
also reduces core losses.
SS
VVin
PRI
Low impedance is a key requirement for powering a high-current, lowvoltage load efficiently. A switching regulation stage should have
minimal impedance while simultaneously providing appropriate
filtering for any switched current. The use of a SAC between the
regulation stage and the point of load provides a dual benefit of scaling
down series impedance leading back to the source and scaling up shunt
capacitance or energy storage as a function of its K factor squared.
However, the benefits are not useful if the series impedance of the SAC
is too high. The impedance of the SAC must be low, i.e. well beyond the
crossover frequency of the system.
+
–
C
C
SAC™
SAC
K = 1/5
K = 1/32
VVout
SEC
The two main terms of power loss in the NBM™ module are:
n No load power dissipation (PPRI_NL): defined as the power
used to power up the module with an enabled powertrain
at no load.
n Resistive loss (RSEC): refers to the power loss across
the NBM module modeled as pure resistive impedance.
Figure 18 — Sine Amplitude Converter with input capacitor
PDISSIPATED= PPRI_NL + PRSEC
A change in VPRI with the switch closed would result in a change in
capacitor current according to the following equation:
IC(t) = C
dVPRI
dt
(7)
Assume that with the capacitor charged to VPRI, the switch is opened
and the capacitor is discharged through the idealized SAC. In this case,
IC= ISEC • K
(8)
(10)
Therefore,
PSEC_OUT = PPRI_IN – PDISSIPATED = PRI_IN – PPRI_NL – PRSEC
The above relations can be combined to calculate the overall module
efficiency:
h =
PSEC_OUT
PIN
=
PPRI_IN – PPRI_NL – PRSEC
PIN
substituting Eq. (1) and (8) into Eq. (7) reveals:
ISEC
C •
=
K2
dISEC
dt
(9)
The equation in terms of the output has yielded a K2 scaling factor for
C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger capacitance on
the secondary output when expressed in terms of the input. With a
K= 1/5 as shown in Figure 18, C = 1 μF would appear as C = 25 μF when
viewed from the secondary.
(11)
=
VPRI • IPRI – PPRI_NL – (ISEC)2 • RSEC
VIN • IIN
= 1–
(
)
PPRI_NL + (ISEC)2 • RSEC
VPRI • IPRI
NBM™ Bus Converter
Rev 1.1
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(12)
NBM6123x60E12A7yzz
Input and Output Filter Design
Thermal Considerations
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformer based SAC does not require external
filtering to function properly. The resonant LC tank, operated at
extreme high frequency, is amplitude modulated as a function of input
voltage and output current and efficiently transfers charge through the
non-isolated transformer. A small amount of capacitance embedded in
the primary and secondary stages of the module is sufficient for full
functionality and is key to achieving power density.
The ChiP package provides a high degree of flexibility in that it presents
three pathways to remove heat from internal power dissipating
components. Heat may be removed from the top surface, the bottom
surface and the leads. The extent to which these three surfaces are
cooled is a key component for determining the maximum power that is
available from a ChiP, as can be seen from Figure 1.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
n Guarantee low source impedance:
To take full advantage of the NBM™ module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5 MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100 nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation. With
an interconnect inductance of 200 nH, the RC damper
may be as high as 1 μF in series with 0.3 Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
Since the ChiP has a maximum internal temperature rating, it is
necessary to estimate this internal temperature based on a real thermal
solution. Given that there are three pathways to remove heat from the
ChiP, it is helpful to simplify the thermal solution into a roughly
equivalent circuit where power dissipation is modeled as a current
source, isothermal surface temperatures are represented as voltage
sources and the thermal resistances are represented as resistors. Figure
19 shows the “thermal circuit” for a NBM module 6123 in an
application where the top, bottom, and leads are cooled. In this case,
the NBM power dissipation is PDTOTAL and the three surface
temperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. This
thermal system can now be very easily analyzed using a SPICE
simulator with simple resistors, voltage sources, and a current source.
The results of the simulation would provide an estimate of heat flow
through the various pathways as well as internal temperature.
Thermal Resistance Top
n Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor.
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:
The module primary/secondary voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even when disabled, the powertrain is exposed
to the applied voltage and power MOSFETs must
withstand it.
Total load capacitance at the output of the NBM module shall not
exceed the specified maximum. Owing to the wide bandwidth and low
output impedance of the module, low-frequency bypass capacitance
and significant energy storage may be more densely and efficiently
provided by adding capacitance at the input of the module. At
frequencies <500 kHz the module appears as an impedance of RSEC
between the source and load.
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. (13).
CSEC_EXT =
CPRI_EXT
MAX INTERNAL TEMP
0°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
0.00°C / W
TCASE_BOTTOM(°C)
Power Dissipation (W)
0°C / W
+
–
TLEADS(°C)
+
–
+
–
Figure 19 — Top case, Bottom case and leads thermal model
Alternatively, equations can be written around this circuit and
analyzed algebraically:
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD2 • 1.24 = TCASE_BOTTOM
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1+ PD2+ PD3
Where TINT represents the internal temperature and PD1, PD2, and PD3
represent the heat flow through the top side, bottom side, and leads
respectively.
Thermal Resistance Top
MAX INTERNAL TEMP
0°C / W
Thermal Resistance Bottom
0.00°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
Thermal Resistance Leads
0°C / W
TLEADS(°C)
+
–
(13)
K2
This enables a reduction in the size and number of capacitors used in a
typical system.
TCASE_TOP(°C)
Figure 20 — Top case and leads thermal model
NBM™ Bus Converter
Rev 1.1
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TCASE_TOP(°C)
+
–
NBM6123x60E12A7yzz
Figure 20 shows a scenario where there is no bottom side cooling. In
this case, the heat flow path to the bottom is left open and the
equations now simplify to:
VPRI
ZIN_EQ1
NBM1
TINT – PD1 • 1.24 = TCASE_TOP
ZOUT_EQ1
VSEC
R0_1
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1 + PD3
ZIN_EQ2
NBM2
ZOUT_EQ2
R0_2
+ DC
Thermal Resistance Top
Load
MAX INTERNAL TEMP
0°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
0.00°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
0°C / W
TLEADS(°C)
TCASE_TOP(°C)
+
–
ZIN_EQn
NBMn
ZOUT_EQn
R0_n
Figure 21 — Top case thermal model
Figure 22 — NBM module array
Figure 21 shows a scenario where there is no bottom side and leads
cooling. In this case, the heat flow path to the bottom is left open and
the equations now simplify to:
TINT – PD1 • 1.24 = TCASE_TOP
PDTOTAL = PD1
Please note that Vicor has a suite of online tools, including a simulator
and thermal estimator which greatly simplify the task of determining
whether or not a NBM™ thermal configuration is valid for a given
condition. These tools can be found at:
http://www.vicorpower.com/powerbench.
Fuse Selection
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide thermal
protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating
(usually greater than maximum current of NBM module)
Current Sharing
n Maximum voltage rating
The performance of the SAC™ topology is based on efficient transfer of
energy through a transformer without the need of closed loop control.
For this reason, the transfer characteristic can be approximated by an
ideal transformer with a positive temperature coefficient series
resistance.
n Ambient temperature
This type of characteristic is close to the impedance characteristic of a
DC power distribution system both in dynamic (AC) behavior and for
steady state (DC) operation.
Startup and Reverse Operation
(usually greater than the maximum possible input voltage)
When multiple NBM modules of a given part number are connected in
an array they will inherently share the load current according to the
equivalent impedance divider that the system implements from the
power source to the point of load.
Some general recommendations to achieve matched array impedances
include:
n Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n An input filter is required for an array of NBMs in order to
prevent circulating currents.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
n Nominal melting I2t
n Recommend fuse: ≤ 60 A Littelfuse TLS Series or
Littelfuse 456 Series rated 40 A
The NBM6123T60E12A7T0R is capable of startup in forward and
reverse direction once the applied voltage is greater than the
undervoltage lockout threshold.
The non-isolated bus converter modules are capable of reverse power
operation. Once the unit is enabled, energy can be transferred from
secondary back to the primary whenever the secondary voltage
exceeds VPRI • K. The module will continue operation in this fashion for
as long as no faults occur.
Startup loading could be set to no greater than 20% of rated max
current respectively in forward or reverse direction. A load must not be
present on the +VPRI pin if the powertrain is not actively switching.
Remove +VPRI load prior to disabling the module using EN pin. Primary
MOSEFT body diode conduction will occur if unit stops switching while
a load is present on the +VPRI and +VSEC voltage is two diodes drop
higher than +VPRI.
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NBM™ Module Through Hole Package Mechanical Drawing and Recommended Land Pattern
+VSEC
+VSEC
PGND1
PGND2
PGND1
PGND2
+VSEC
+VSEC
+VSEC
+VSEC
PGND1
PGND2
PGND1
PGND2
+VSEC
+VSEC
+VPRI
TM
+VPRI
EN
+VPRI
VAUX
+VPRI
SGND
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Revision History
Revision
Date
1.0
09/08/15
1.1
09/28/15
Description
Initial Release
Page Number(s)
n/a
Changed PRI to SEC Input Quiescent Current
Added certifications
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1 & 15
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Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom
power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and
is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are
used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all
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Specifications are subject to change without notice.
Vicor’s Standard Terms and Conditions
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
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In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the
“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment
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UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS
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VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS
PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support
devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform
when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the
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Vicor and its subsidiaries own Intellectual Property (including issued U.S. and pending patent applications) relating to the products described in this
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The products described on this data sheet are protected by the following U.S. Patents Numbers:
6,911,848; 6,930,893; 6,934,166; 7,145,786; 7,782,639; 8,427,269 and for use under 6,975,098 and 6,984,965.
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Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
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Rev 1.1
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