TECHNICAL DATA IN74AC193 Presettable 4-Bit Binary UP/DOWN Counter High-Speed Silicon-Gate CMOS The IN74AC193 is identical in pinout to the LS/ALS193, HC/HCT193. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALS outputs. The counter has two separate clock inputs, a Count Up Clock and Count Down Clock inputs. The direction of counting is determined by which input is clocked. The outputs change state synchronous with the LOW-to-HIGH transitions on the clock inputs. This counter may be preset by entering the desired data on the P0, P1, P2, P3 input. When the Parallel Load input is taken low the data is loaded independently of either clock input. This feature allows the counters to be used as devide-by-n by modifying the count lenght with the preset inputs. In addition the counter can also be cleared. This is accomplished by inputting a high on the Master Reset input. All 4 internal stages are set to low independently of either clock input.Both a Terminal Count Down (TCD) and Terminal Count Up (TCU) Outputs are provided to enable cascading of both up and down counting functions. The TCD output produces a negative going pulse when the counter underflows and TCU outputs a pulse when the counter overflows. The counter can be cascaded by connecting the TCU and TCD outputs of one device to the Count Up Clock and Count Down Clock inputs, respectively, of the next device. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 μA; 0.1 μA @ 25°C • High Noise Immunity Characteristic of CMOS Devices • Outputs Source/Sink 24 mA ORDERING INFORMATION IN74AC193N Plastic IN74AC193D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 16 =VCC PIN 8 = GND Rev. 00 IN74AC193 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 2.0 6.0 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 150 40 25 ns/V -40 VCC =3.0 V VCC =4.5 V VCC =5.5 V 0 0 0 VIN from 30% to 70% VCC This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74AC193 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum High-Level Input Voltage VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 2.1 3.15 3.85 2.1 3.15 3.85 V VIL Maximum Low -Level Input Voltage VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 0.9 1.35 1.65 0.9 1.35 1.65 V VOH Minimum High-Level Output Voltage IOUT ≤ -50 μA 3.0 4.5 5.5 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VIN=VIH or VIL IOL=12 mA IOL=24 mA IOL=24 mA 3.0 4.5 5.5 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 μA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 80 μA * VIN=VIH or VIL IOH=-12 mA IOH=-24 mA IOH=-24 mA VOL Maximum Low-Level Output Voltage IOUT ≤ 50 μA V * IIN 8.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Note: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC FUNCTION TABLE MR PL Inputs CPU H X L L L H L H L H L H X = don’t care X X H H Mode CPD X X H H Reset(Asyn.) Preset(Asyn.) No Count Count Up Count Down No Count The IN74AC193 is an UP/DOWN MODULO16 Binary Counter. Logic equations For Terminal Count: TCU = Q0 • Q1 • Q2 • Q3 • CPU TCD = Q0 • Q1 • Q2 • Q3 • CPD Rev. 00 IN74AC193 AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=3.0 ns) VCC* Symbol Parameter V Guaranteed Limits 25 °C Min -40°C to 85°C Max 88 120 Min Unit Max fmax Maximum Clock Frequency (Figure 1) 3.3 5.0 40 55 tPLH Propagation Delay, CPU or CPD to TCU or TCD (Figure 2) 3.3 5.0 20 13 22 14.5 ns tPHL Propagation Delay, CPU or CPD to TCU or TCD (Figure 2) 3.3 5.0 19 11.5 21 13.0 ns tPLH Propagation Delay, CPU or CPD to Qn (Figure 1) 3.3 5.0 15 10 17.0 11.5 ns tPHL Propagation Delay, CPU or CPD to Qn (Figure 1) 3.3 5.0 15 9.5 17.0 11 ns tPLH Propagation Delay, Pn to Qn (Figure 3) 3.3 5.0 15 10 17.0 11.5 ns tPHL Propagation Delay, Pn to Qn (Figure 3) 3.3 5.0 15 9.5 17.0 11 ns tPLH Propagation Delay, PL to Qn (Figure 4) 3.3 5.0 15 10 17 11.5 ns tPHL Propagation Delay, PL to Qn (Figure 4) 3.3 5.0 20 12.5 22 14 ns tPHL Propagation Delay, MR to Qn (Figure 5) 3.3 5.0 20 12.5 22 14 ns tPLH Propagation Delay, MR to TCU (Figure 6) 3.3 5.0 18 12 20 13.5 ns tPHL Propagation Delay, MR to TCD (Figure 6) 3.3 5.0 19 11.5 21 13.0 ns tPLH Propagation Delay, PL to TCU or TCD (Figure 6) 3.3 5.0 20 13 22 14.5 ns tPHL Propagation Delay, PL to TCU or TCD (Figure 6) 3.3 5.0 15 8.5 17 10 ns tPLH Propagation Delay, Pn to TCU or TCD (Figure 6) 3.3 5.0 20 13 22 14.5 ns tPHL Propagation Delay, Pn to TCU or TCD (Figure 6) 3.3 5.0 20 12.5 22 14 ns CIN Maximum Input Capacitance 5.0 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 45 pF Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V * Rev. 00 IN74AC193 TIMING REQUIREMENTS (CL=50pF, Input tr=tf=3.0 ns) VCC* Symbol Parameter Guaranteed Limits V 25 °C -40°C to 85°C Unit tsu Minimum Setup Time, Pn to PL (Figure 7) 3.3 5.0 9 6 10 7 ns th Minimum Hold Time, PL to Pn (Figure 7) 3.3 5.0 -1.0 -1.0 0 0 ns tw Minimum Pulse Width, PL (Figure 4) 3.3 5.0 17 12 21 13 ns tw Minimum Pulse Width, CPU or CPD (Figure 1) 3.3 5.0 11 8 12 9 ns tw Minimum Pulse Width, MR (Figure 5) 3.3 5.0 14 10 16 12 ns trec Minimum Recovery Time, PL to CPU or CPD (Figure 5) 3.3 5.0 9 12 10 13 ns trec Minimum Recovery Time, MR to CPU or CPD (Figure 5) 3.3 5.0 17 12 21 14 ns Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V * Figure 1. Switching Waveforms Figure 3. Switching Waveforms Figure 2. Switching Waveforms Figure 4. Switching Waveforms Rev. 00 IN74AC193 Figure 5. Switching Waveforms Figure 6. Switching Waveforms Figure 7. Switching Waveforms TIMING DIAGRAM Rev. 00 IN74AC193 EXPANDED LOGIC DIAGRAM Rev. 00 IN74AC193 N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 9 16 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 B 1 8 5.33 C F L C D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 -T- SEATING PLANE N G K M H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 H B 1 G P 8 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 9.8 10 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.72 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00