2 Pad Metal Package, 4.7 mm x 13.3 mm Product Features: HC49USM Series Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock 13.3 Max. 4.73 Frequency 3.2 MHz to 100.000 MHz 11.4 0.2 0.1 H Max. See Part Number Guide ESR (Equivalent Series Resistance) 3.2 MHz – 3.49 MHz 3.5 MHz – 3.99 MHz 4.0 MHz – 4.99 MHz 5.0 MHz – 5.99 MHz 6.0 MHz – 6.99 MHz 7.0 MHz – 8.9 MHz 9.0 MHz – 12.9 MHz 13 MHz – 19.9 MHz 20 MHz – 36 MHz rd 27 MHz – 100 MHz (3 O.T.) 300 Ω Max. 200 Ω Max. 150 Ω Max. 120 Ω Max. 100 Ω Max. 80 Ω Max. 60 Ω Max. 40 Ω Max. 30 Ω Max. 100 Ω Max. Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25° C ±30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature ±50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Standard Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 1 mW Max. Aging ±5 ppm Max. / Year Standard 3.9 Nom. 0.5 Min. Insulator 1.6 Recommended Pad Layout 0° C to +70° C Standard (see Part Number Guide for more options) Operating Storage Dimension Units: mm -40° C to +85° C Standard Part Number Guide Package HC49USM (4.5 mm H) HC49USM2 (3.5 mm H) HC49USM3 - 04/09 0.2 5.5 Temperature (3.1 mm H) 0.8 Sample Part Number: HC49USM – FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm 5 = -40°C to +85°C J = ±10 ppm J = ±10 ppm 9 = -10°C to +50°C Mode (overtone) Load Capacitance (pF) 18 pF Standard or Specify ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = N/A Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 24 +/-.3 12 +/-.2 11.5 +/-.2 25 +/-1.5 80/100 330 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code 04/09 ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com Specifications subject to change without notice Page 2