Bi BB1110RC13 Resistor capacitor network thick film resistors ceramic chip capacitor Datasheet

MODEL BB1110RC
Resistor capacitor network
Thick film resistors
Ceramic chip capacitors
DISCRIPTION
Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local
decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip
chip attachment. Their unique construction yields extremely low capacitance and inductance
parasitics critical for these high-speed applications.
FEATURES
•
Integrated resistor and capacitor network
•
High density packaging
•
High temperature solder balls
•
Industry standard ball diameter and pitch
•
Excellent high frequency performance
SCHEMATIC
C1-9 = 0.1uF
R1-9 = 50 Ω
ELECTRICAL1
Resistance Tolerance
± 1%
Capacitance Tolerance
± 10%
Capacitor Type
X5R
Capacitor Maximum Voltage
10 volts
TCR
200 ppm/°C
Operating Temperature Range
-55°C to +85°C
Maximum Resistor Power
0.05 watts at 70°C
Package Power Rating
1
1.0 watt @ 70°C
Specifications subject to change without notice.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
August 30, 2005
Website: www.bitechnologies.com
page 1 of 2
BI technologies
MODEL BB1110RC
MECHANICAL
Solder Ball Finish
SnPb 10/90
Solder Ball Co-planarity
0.15 mm
Substrate Material
Al2O3
Resistor Material
Cermet
ORDERING INFORMATION2
BB 1 1 10 RC 7
Model Series
Tape Reel packing
Channels: 9
Resistor Capacitor Network
Solder ball Pitch: 1.0 mm
Nominal: 50 ohms / 0.1uf
PACKING INFORMATION
Tape reel suffix (also reel size in inches)
7
13
Part count/reel
750
3000
OUTLINE DRAWING
Units: mm
2
Contact our customer service for custom designs and features.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
October 7, 2004
Website: www.bitechnologies.com
page 2 of 2
BI technologies
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