Product Folder Sample & Buy Tools & Software Technical Documents Support & Community ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 ADC12D1x00RF 12-Bit, 3.2-GSPS and 2-GSPS RF-Sampling ADC 1 Device Overview 1.1 Features 1 • Excellent Noise and Linearity up to and Above fIN = 2.7 GHz • Configurable to Either 3.2 or 2 GSPS Interleaved or 1600 or 1000 MSPS Dual ADC • New DESCLKIQ Mode for High Bandwidth, High Sampling Rate Apps • Pin-Compatible With ADC10D1x00, ADC12D1x00 • AutoSync Feature for Multi-Chip Synchronization • Internally Terminated, Buffered, Differential Analog Inputs • Interleaved Timing Automatic and Manual Skew Adjust • Test Patterns at Output for System Debug • Time Stamp Feature to Capture External Trigger • Programmable Gain, Offset, and tAD Adjust Feature • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs 1.2 • • • • Applications 3G/4G Wireless Basestations – Receive Path – DPD Path Wideband Microwave Backhaul RF Sampling Software Defined Radios Military Communications 1.3 • Key Specifications – Resolution 12 Bits – Interleaved 3.2- and 2-GSPS ADC • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73 dBFS (Typical) • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85 dBFS (Typical) • Noise Floor –154.6/–154 dBm/Hz (Typical) • Power 3.94/3.42 W (Typical) – Dual 1600/1000 MSPS ADC, Fin = 498 MHz • ENOB 9.2/9.4 Bits (Typical) • SNR 58.2/58.8 dB (Typical) • SFDR 66.7/71.9 dBc (Typical) • Power per Channel 1.97/1.71 W (Typical) • • • • • SIGINT RADAR and LIDAR Wideband Communications Consumer RFs Tests and Measurements Description The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.31996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C. Device Information (1) PART NUMBER ADC12D1000RF ADC12D1600RF (1) PACKAGE BODY SIZE BGA (40) 27.00 mm × 27.00 mm For more information, see Section 10, Mechanical Packaging and Orderable Information. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 1.4 Functional Block Diagram 2 Device Overview www.ti.com Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table of Contents 1 2 3 Device Overview ......................................... 1 Detailed Description ................................... 35 Features .............................................. 1 5.1 Overview 1.2 Applications ........................................... 1 5.2 Functional Block Diagram ........................... 35 1.3 Description ............................................ 1 1.4 Functional Block Diagram ............................ 2 ................................. ........................... 5.5 Programming ........................................ 5.6 Register Maps ....................................... Application and Implementation .................... 6.1 Application Information .............................. 6.2 Typical Application .................................. Power Supply Recommendations .................. 7.1 System Power-on Considerations ................... 7.2 Supply Voltage ...................................... Layout .................................................... 8.1 Layout Guidelines ................................... 8.2 Layout Example ..................................... 8.3 Thermal Management ............................... Device and Documentation Support ............... 9.1 Device Support ...................................... 9.2 Documentation Support ............................. 9.3 Related Links ........................................ 9.4 Community Resources .............................. 9.5 Trademarks.......................................... 9.6 Electrostatic Discharge Caution ..................... 9.7 Glossary ............................................. Revision History ......................................... 3 Pin Configuration and Functions ..................... 4 Pin Attributes ......................................... 5 3.1 4 5 1.1 6 Specifications ........................................... 14 4.1 Absolute Maximum Ratings ......................... 14 4.2 ESD Ratings 4.3 Recommended Operating Conditions ............... 15 4.4 Thermal Information ................................. 15 4.5 Electrical Characteristics: Static Converter ......... 16 4.6 4.7 Electrical Characteristics: Dynamic Converter ...... 17 Electrical Characteristics: Analog Input/Output and Reference ........................................... 21 4.8 Electrical Characteristics: I-Channel to Q-Channel . 22 4.9 Electrical Characteristics: Sampling Clock .......... 22 4.10 4.11 Electrical Characteristics: AutoSync Feature ....... 22 Electrical Characteristics: Digital Control and Output Pin ................................................... 23 ........................................ 14 4.12 Electrical Characteristics: Power Supply ............ 24 4.13 Electrical Characteristics: AC ....................... 25 4.14 Timing Requirements: Serial Port Interface ......... 26 4.15 Timing Requirements: Calibration 4.16 .................. Typical Characteristics .............................. 26 30 7 8 9 ............................................ 35 5.3 Feature Description 36 5.4 Device Functional Modes 44 45 50 56 56 65 68 68 70 71 71 73 75 77 77 79 80 80 80 80 80 10 Mechanical, Packaging, and Orderable Information .............................................. 80 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (April 2013) to Revision H • Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .......................................... 1 Changes from Revision F (April 2013) to Revision G • Page Changed layout of National Data Sheet to TI format ........................................................................... 55 Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Revision History 3 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 3 Pin Configuration and Functions BGA Package 292-Pin NXA Top-View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A GND V_A SDO TPM NDM V_A GND V_E GND_E DId0+ V_DR DId3+ GND_DR DId6+ V_DR DId9+ B Vbg GND ECEb SDI CalRun V_A GND GND_E V_E DId0- DId2+ DId3- DId5+ DId6- DId8+ DId9- DId10+ C Rtrim+ Vcmo Rext+ SCSb SCLK V_A NC V_E GND_E DId1+ DId2- DId4+ DId5- DId7+ DId8- DId10- D DNC Rtrim- Rext- GND GND CAL DNC V_A V_A DId1- V_DR DId4- GND_DR DId7- V_DR GND_DR E V_A Tdiode+ DNC F V_A G 18 19 20 DId11- GND_DR A DI0+ DI1+ DI1- B DI0- V_DR DI2+ DI2- C V_DR DI3+ DI4+ DI4- D GND GND_DR DI3- DI5+ DI5- E GND_TC Tdiode- DNC GND_DR DI6+ DI6- GND_DR F V_TC GND_TC V_TC V_TC DI7+ DI7- DI8+ DI8- G H VinI+ V_TC GND_TC V_A GND GND GND GND GND GND DI9+ DI9- DI10+ DI10- H J VinI- GND_TC V_TC VbiasI GND GND GND GND GND GND V_DR DI11+ DI11- V_DR J K GND VbiasI V_TC GND_TC GND GND GND GND GND GND ORI+ ORI- DCLKI+ DCLKI- K L GND VbiasQ V_TC GND_TC GND GND GND GND GND GND ORQ+ ORQ- DCLKQ+ DCLKQ- L M VinQ- GND_TC V_TC VbiasQ GND GND GND GND GND GND N VinQ+ V_TC GND_TC V_A GND GND GND GND GND GND P V_TC GND_TC V_TC R V_A GND_TC V_TC T V_A GND_TC GND_TC U GND_TC CLK+ PDI GND GND RCOut1- V CLK- DCLK _RST+ PDQ CalDly DES RCOut2+ RCOut2- W DCLK _RST- GND DNC DDRPh RCLK- Y GND V_A FSR RCLK+ RCOut1+ 1 2 3 GND_DR DId11+ GND_DR DQ11+ DQ11- GND_DR M DQ9+ DQ9- DQ10+ DQ10- N V_TC DQ7+ DQ7- DQ8+ DQ8- P V_TC V_DR DQ6+ DQ6- V_DR R GND V_DR DQ3- DQ5+ DQ5- T 4 DNC V_A V_A DQd1- V_DR DQd4- V_E GND_E DQd1+ DQd2- DQd4+ DQd5- DQd5+ V_DR V_DR GND_DR DQ3+ DQ4+ DQ4- U DQd7+ DQd8- DQd10- DQ0- GND_DR DQ2+ DQ2- V DQd6- DQd8+ DQd9- DQd10+ DQ0+ DQ1+ DQ1- W V_DR DQd9+ GND_DR DQd11+ DQd11- GND_DR GND_DR DQd7- V_A GND GND_E V_E DQd0- DQd2+ DQd3- V_A GND V_E GND_E DQd0+ V_DR DQd3+ GND_DR DQd6+ 6 7 8 9 10 11 5 12 13 14 15 16 17 18 19 Y 20 The center ground pins are for thermal dissipation and must be soldered to a ground plane to ensure rated performance. See Section 8.1 for more information. 4 Pin Configuration and Functions Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 3.1 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Pin Attributes Table 3-1. Analog Front-End and Clock Balls PIN NAME NO. I/O EQUIVALENT CIRCUIT DESCRIPTION VA CLK+/- U2/V1 I 50k AGND VA 100 VBIAS 50k Differential Converter Sampling Clock. In the Non-DES Mode, the analog inputs are sampled on the positive transitions of this clock signal. In the DES Mode, the selected input is sampled on both transitions of this clock. This clock must be AC-coupled. AGND VA DCLK_RST+/- V2/W1 I Differential DCLK Reset. A positive pulse on this input is used to reset the DCLKI and DCLKQ outputs of two or more ADC12D1x00RFs to synchronize them with other ADC12D1x00RFs in the system. DCLKI and DCLKQ are always in phase with each other, unless one channel is powered down, and do not require a pulse from DCLK_RST to become synchronized. The pulse applied here must meet timing relationships with respect to the CLK input. Although supported, this feature has been superseded by AutoSync. AGND 100 VA AGND VA RCLK+/- Y4/W5 I 50k AGND VA 100 VBIAS 50k Reference Clock Input. When the AutoSync feature is active, and the ADC12D1x00RF is in Slave Mode, the internal divided clocks are synchronized with respect to this input clock. The delay on this clock may be adjusted when synchronizing multiple ADCs. This feature is available in ECM through Control Register (Addr: Eh). AGND Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Pin Configuration and Functions 5 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 3-1. Analog Front-End and Clock Balls (continued) PIN NAME I/O NO. EQUIVALENT CIRCUIT VA 100: RCOut1+/RCOut2+/- Y5/U6 V6/V7 100: O - + A GND VA Rext+/- C3/D3 I/O V DESCRIPTION Reference Clock Output 1 and 2. These signals provide a reference clock at a rate of CLK/4, when enabled, independently of whether the ADC is in Master or Slave Mode. They are used to drive the RCLK of another ADC12D1x00RF, to enable automatic synchronization for multiple ADCs (AutoSync feature). The impedance of each trace from RCOut1 and RCOut2 to the RCLK of another ADC12D1x00RF should be 100-Ω differential. Having two clock outputs allows the autosynchronization to propagate as a binary tree. Use the DOC Bit (Addr: Eh, Bit 1) to enable or disable this feature; default is disabled. External Reference Resistor terminals. A 3.3-kΩ ±0.1% resistor should be connected between Rext+/-. The Rext resistor is used as a reference to trim internal circuits which affect the linearity of the converter; the value and precision of this resistor should not be compromised. GND VA Rtrim+/- C1/D2 I/O V GND Input Termination Trim Resistor terminals. A 3.3-kΩ ±0.1% resistor should be connected between Rtrim+/-. The Rtrim resistor is used to establish the calibrated 100-Ω input impedance of VinI, VinQ and CLK. These impedances may be fine tuned by varying the value of the resistor by a corresponding percentage; however, the tuning range and performance is not specified for such an alternate value. VA Tdiode_P Tdiode+/- E2/F3 GND Passive VA Temperature Sensor Diode Positive (Anode) and Negative (Cathode) Terminals. This set of pins is used for die temperature measurements. It has not been fully characterized. Tdiode_N GND 6 Pin Configuration and Functions Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 3-1. Analog Front-End and Clock Balls (continued) PIN NAME NO. I/O EQUIVALENT CIRCUIT Bandgap Voltage Output or LVDS Common-mode Voltage Select. This pin provides a buffered version of the bandgap output voltage and is capable of sourcing or sinking 100 µA and driving a load of up to 80 pF. Alternately, this pin may be used to select the LVDS digital output common-mode voltage. If tied to logic-high, the 1.2-V LVDS commonmode voltage is selected; 0.8 V is the default. VA VBG B1 O GND VA VCMO VCMO C2 200k I/O Enable AC Coupling 8 pF GND 50k AGND H1/J1 N1/M1 I VCMO 100 Control from VCMO VA 50k AGND Common-Mode Voltage Output or Signal Coupling Select. If AC-coupled operation at the analog inputs is desired, this pin should be held at logic-low level. This pin is capable of sourcing or sinking up to 100 µA. For DC-coupled operation, this pin should be left floating or terminated into high impedance. In DC-coupled Mode, this pin provides an output voltage which is the optimal common-mode voltage for the input signal and should be used to set the common-mode voltage of the driving buffer. Differential signal I- and Q-inputs. In the Non-Dual Edge Sampling (Non-DES) Mode, each I- and Q-input is sampled and converted by its respective channel with each positive transition of the CLK input. In Non-ECM (Non-Extended Control Mode) and DES Mode, both channels sample the I-input. In Extended Control Mode (ECM), the Q-input may optionally be selected for conversion in DES Mode by the DEQ Bit (Addr: 0h, Bit 6). VA VinI+/VinQ+/- DESCRIPTION Each I- and Q-channel input has an internal common-mode bias that is disabled when DC-coupled Mode is selected. Both inputs must be either ACor DC-coupled. The coupling mode is selected by the VCMO Pin. In Non-ECM, the full-scale range of these inputs is determined by the FSR Pin; both I- and Q-channels have the same full-scale input range. In ECM, the fullscale input range of the I- and Q-channel inputs may be independently set through the Control Register (Addr: 3h and Addr: Bh). The high and low full-scale input range setting in Non-ECM corresponds to the mid and minimum full-scale input range in ECM. The input offset may also be adjusted in ECM. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Pin Configuration and Functions 7 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 3-2. Control and Status Balls PIN NAME NO. I/O EQUIVALENT CIRCUIT VA CAL D6 I GND DESCRIPTION Calibration cycle initiate. The user can command the device to execute a selfcalibration cycle by holding this input high a minimum of tCAL_H after having held it low a minimum of tCAL_L. If this input is held high at the time of power on, the automatic power-on calibration cycle is inhibited until this input is cycled low-thenhigh. This pin is active in both ECM and Non-ECM. In ECM, this pin is logically OR'd with the CAL Bit (Addr: 0h, Bit 15) in the Control Register. Therefore, both pin and bit must be set low and then either can be set high to execute an oncommand calibration. VA CalDly V4 Calibration Delay select. By setting this input logic-high or logic-low, the user can select the device to wait a longer or shorter amount of time, respectively, before the automatic power-on selfcalibration is initiated. This feature is pincontrolled only and is always active during ECM and Non-ECM. I GND VA CalRun B5 Calibration Running indication. This output is logic-high while the calibration sequence is executing. This output is logic-low otherwise. O GND VA DDRPh W4 I GND 8 Pin Configuration and Functions DDR Phase select. This input, when logic-low, selects the 0° Data-to-DCLK phase relationship. When logic-high, it selects the 90° Data-to-DCLK phase relationship, that is, the DCLK transition indicates the middle of the valid data outputs. This pin only has an effect when the chip is in 1:2 Demuxed Mode, that is, the NDM pin is set to logic-low. In ECM, this input is ignored and the DDR phase is selected through the Control Register by the DPS Bit (Addr: 0h, Bit 14); the default is 0° Mode. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 3-2. Control and Status Balls (continued) PIN NAME NO. I/O EQUIVALENT CIRCUIT VA DES V5 I GND DNC D1, D7, E3, F4, W3, U7 — NONE VA 50 k: ECE B3 I DESCRIPTION Dual Edge Sampling (DES) Mode select. In the Non-Extended Control Mode (NonECM), when this input is set to logic-high, the DES Mode of operation is selected, meaning that the VinI input is sampled by both channels in a time-interleaved manner. The VinQ input is ignored. When this input is set to logic-low, the device is in Non-DES Mode, that is, the I- and Qchannels operate independently. In the Extended Control Mode (ECM), this input is ignored and DES Mode selection is controlled through the Control Register by the DES Bit (Addr: 0h, Bit 7); default is Non-DES Mode operation. Do Not Connect. These pins are used for internal purposes and should not be connected, that is, left floating. Do not ground. Extended Control Enable bar. Extended feature control through the SPI interface is enabled when this signal is asserted (logic-low). In this case, most of the direct control pins have no effect. When this signal is deasserted (logic-high), the SPI interface is disabled, all SPI registers are reset to their default values, and all available settings are controlled through the control pins. GND VA FSR Y3 I GND NC C7 — NONE Full-Scale input Range select. In NonECM, when this input is set to logic-low or logic-high, the full-scale differential input range for both I- and Q-channel inputs is set to the lower or higher FSR value, respectively. In the ECM, this input is ignored and the full-scale range of the Iand Q-channel inputs is independently determined by the setting of Addr: 3h and Addr: Bh, respectively. The high (lower) FSR value in Non-ECM corresponds to the mid (minimum) available selection in ECM; the FSR range in ECM is greater. Not Connected. This pin is not bonded and may be left floating or connected to any potential. VA NDM A5 Non-Demuxed Mode select. Setting this input to logic-high causes the digital output bus to be in the 1:1 Non-Demuxed Mode. Setting this input to logic-low causes the digital output bus to be in the 1:2 Demuxed Mode. This feature is pincontrolled only and remains active during ECM and Non-ECM. I GND Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Pin Configuration and Functions 9 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 3-2. Control and Status Balls (continued) PIN NAME NO. I/O EQUIVALENT CIRCUIT VA 50 k: PDI PDQ U3 V3 I GND DESCRIPTION Power Down I- and Q-channel. Setting either input to logic-high powers down the respective I- or Q-channel. Setting either input to logic-low brings the respective Ior Q-channel to a operational state after a finite time delay. This pin is active in both ECM and Non-ECM. In ECM, each Pin is logically OR'd with its respective Bit. Therefore, either this pin or the PDI and PDQ Bit in the Control Register can be used to power down the I- and Q-channel (Addr: 0h, Bit 11 and Bit 10), respectively. VA 100 k: SCLK C5 I Serial Clock. In ECM, serial data is shifted into and out of the device synchronously to this clock signal. This clock may be disabled and held logic-low, as long as timing specifications are not violated when the clock is enabled or disabled. GND VA 100 k: SCS C4 I Serial Chip Select bar. In ECM, when this signal is asserted (logic-low), SCLK is used to clock in serial data which is present on SDI and to source serial data on SDO. When this signal is deasserted (logic-high), SDI is ignored and SDO is in tri-stated. GND VA 100 k: SDI B4 Serial Data-In. In ECM, serial data is shifted into the device on this pin while SCS signal is asserted (logic-low). I GND VA SDO A3 Serial Data-Out. In ECM, serial data is shifted out of the device on this pin while SCS signal is asserted (logic-low). This output is tri-stated when SCS is deasserted. O GND 10 Pin Configuration and Functions Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 3-2. Control and Status Balls (continued) PIN NAME NO. I/O EQUIVALENT CIRCUIT DESCRIPTION VA TPM A4 Test Pattern Mode select. With this input at logic-high, the device continuously outputs a fixed, repetitive test pattern at the digital outputs. In the ECM, this input is ignored and the Test Pattern Mode can only be activated through the Control Register by the TPM Bit (Addr: 0h, Bit 12). I GND Table 3-3. Power and Ground Balls PIN I/O EQUIVALENT CIRCUIT GND A1, A7, B2, B7, D4, D5, E4, K1, L1, T4, U4, U5, W2, W7, Y1, Y7, H8:N13 — NONE Ground Return for the Analog circuitry. GNDDR A13, A17, A20, D13, D16, E17, F17, F20, M17, M20, U13, U17, V18, Y13, Y17, Y20 — NONE Ground Return for the Output Drivers. GNDE A9, B8, C9, V9, W8, Y9 — NONE Ground Return for the Digital Encoder. GNDTC F2, G2, H3, J2, K4, L4, M2, N3, P2, R2, T2, T3, U1 — NONE Ground Return for the Track-and-Hold and Clock circuitry. VA A2, A6, B6, C6, D8, D9, E1, F1, H4, N4, R1, T1, U8, U9, W6, Y2, Y6 — NONE Power Supply for the Analog circuitry. This supply is tied to the ESD ring. Therefore, it must be powered up before or with any other supply. NONE Bias Voltage I-channel. This is an externally decoupled bias voltage for the I-channel. Each pin should individually be decoupled with a 100-nF capacitor through a low-resistance, low-inductance path to GND. NAME NO. VbiasI J4, K2 — DESCRIPTION VbiasQ L2, M4 — NONE Bias Voltage Q-channel. This is an externally decoupled bias voltage for the Q-channel. Each pin should individually be decoupled with a 100-nF capacitor through a low-resistance, low-inductance path to GND. VDR A11, A15, C18, D11, D15, D17, J17, J20, R17, R20, T17, U11, U15, U16, Y11, Y15 — NONE Power Supply for the Output Drivers. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Pin Configuration and Functions 11 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 3-3. Power and Ground Balls (continued) PIN I/O EQUIVALENT CIRCUIT A8, B9, C8, V8, W9, Y8 — NONE Power Supply for the Digital Encoder. G1, G3, G4, H2, J3, K3, L3, M3, N2, P1, P3, P4, R3, R4 — NONE Power Supply for the Track-and-Hold and Clock circuitry. NAME NO. VE VTC DESCRIPTION Table 3-4. High-Speed Digital Outputs PIN NAME NO. I/O EQUIVALENT CIRCUIT VDR DCLKI+/DCLKQ+/- K19/K20 L19/L20 - + + - O DESCRIPTION Data Clock Output for the I- and Qchannel data bus. These differential clock outputs are used to latch the output data and, if used, should always be terminated with a 100-Ω differential resistor placed as closely as possible to the differential receiver. Delayed and non-delayed data outputs are supplied synchronously to this signal. In 1:2 Demux Mode or NonDemux Mode, this signal is at ¼ or ½ the sampling clock rate, respectively. DCLKI and DCLKQ are always in phase with each other, unless one channel is powered down, and do not require a pulse from DCLK_RST to become synchronized. DR GND DI11+/DI10+/DI9+/DI8+/DI7+/DI6+/DI5+/DI4+/DI3+/DI2+/DI1+/DI0+/· DQ11+/DQ10+/DQ9+/DQ8+/DQ7+/DQ6+/DQ5+/DQ4+/DQ3+/DQ2+/DQ1+/DQ0+/- 12 J18/J19 H19/H20 H17/H18 G19/G20 G17/G18 F18/F19 E19/E20 D19/D20 D18/E18 C19/C20 B19/B20 B18/C17 · M18/M19 N19/N20 N17/N18 P19/P20 P17/P18 R18/R19 T19/T20 U19/U20 U18/T18 V19/V20 W19/W20 W18/V17 Pin Configuration and Functions VDR - + + - O I- and Q-channel Digital Data Outputs. In Non-Demux Mode, this LVDS data is transmitted at the sampling clock rate. In Demux Mode, these outputs provide ½ the data at ½ the sampling clock rate, synchronized with the delayed data, that is, the other ½ of the data which was sampled one clock cycle earlier. Compared with the DId and DQd outputs, these outputs represent the later time samples. If used, each of these outputs should always be terminated with a 100-Ω differential resistor placed as closely as possible to the differential receiver. DR GND Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 3-4. High-Speed Digital Outputs (continued) PIN NAME NO. DId11+/DId10+/DId9+/DId8+/DId7+/DId6+/DId5+/DId4+/DId3+/DId2+/DId1+/DId0+/· DQd11+/DQd10+/DQd9+/DQd8+/DQd7+/DQd6+/DQd5+/DQd4+/DQd3+/DQd2+/DQd1+/DQd0+/- A18/A19 B17/C16 A16/B16 B15/C15 C14/D14 A14/B14 B13/C13 C12/D12 A12/B12 B11/C11 C10/D10 A10/B10 · Y18/Y19 W17/V16 Y16/W16 W15/V15 V14/U14 Y14/W14 W13/V13 V12/U12 Y12/W12 W11/V11 V10/U10 Y10/W10 I/O EQUIVALENT CIRCUIT DESCRIPTION VDR - + + - O Delayed I- and Q-channel Digital Data Outputs. In Non-Demux Mode, these outputs are tri-stated. In Demux Mode, these outputs provide ½ the data at ½ the sampling clock rate, synchronized with the non-delayed data, that is, the other ½ of the data which was sampled one clock cycle later. Compared with the DI and DQ outputs, these outputs represent the earlier time samples. If used, each of these outputs should always be terminated with a 100-Ω differential resistor placed as closely as possible to the differential receiver. DR GND VDR ORI+/ORQ+/- K17/K18 L17/L18 - + + - O Out-of-Range Output for the I- and Qchannel. This differential output is asserted logic-high while the over- or under-range condition exists, that is, the differential signal at each respective analog input exceeds the full-scale value. Each OR result refers to the current Data, with which it is clocked out. If used, each of these outputs should always be terminated with a 100-Ω differential resistor placed as closely as possible to the differential receiver. ORQ. (1) DR GND (1) This pin and bit functionality is not tested in production test; performance is tested in the specified and default mode only. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Pin Configuration and Functions 13 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 4 Specifications Absolute Maximum Ratings (1) (2) 4.1 MIN Supply Voltage (VA, VTC, VDR, VE) Supply Difference - max(VA/TC/DR/E) - min(VA/TC/DR/E) MAX UNIT 2.2 V 0 100 mV Voltage on Any Input Pin (except VIN±) –0.15 (VA + 0.15) V VIN± Voltage –0.5 2.5 V 0 100 mV Input Current at Any Pin (3) ±50 mA ADC12D1x00RF Package Power Dissipation at TA ≤ 85°C (3) 3.45 W 150 °C Ground Difference - max(GNDTC/DR/E) – min(GNDTC/DR/E) Storage Temperature (1) (2) (3) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0 V, unless otherwise specified. When the input voltage at any pin exceeds the power supply limits, that is, less than GND or greater than VA, the current at that pin should be limited to 50 mA. In addition, overvoltage at a pin must adhere to the maximum voltage limits. Simultaneous overvoltage at multiple pins requires adherence to the maximum package power dissipation limits. These dissipation limits are calculated using JEDEC JESD51-7 thermal model. Higher dissipation may be possible based on specific customer thermal situation and specified package thermal resistances from junction to case. 4.2 ESD Ratings VALUE V(ESD) (1) (2) (3) 14 Electrostatic discharge (1) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (2) ±2500 Charged device model (CDM), per JEDEC specification JESD22-C101 (3) ±1000 Machine model (MM) ±250 UNIT V Human body model is 100-pF capacitor discharged through a 1.5-kΩ resistor. Machine model is 220 pF discharged through 0 Ω. Charged device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Recommended Operating Conditions (1) (2) 4.3 MIN Ambient Temperature, TA ADC12D1x00RF (Standard JEDEC thermal model) NOM MAX –40 Junction Temperature, TJ UNIT 85 °C 140 °C Supply Voltage (VA, VTC, VE) 1.8 2 V Driver Supply Voltage (VDR) 1.8 VA V –0.4 2.4 V VIN± Voltage (3) DC-coupled VIN± Differential Voltage (4) DC-coupled at 100% duty cycle 1 DC-coupled at 20% duty cycle 2 DC-coupled at 10% duty cycle VIN± Current (3) AC-coupled VIN± Power 2.8 –50 50 Maintaining common-mode voltage, AC-coupled 15.3 Not maintaining common-mode voltage, ACcoupled 17.1 Ground Difference – max(GNDTC/DR/E) -min(GNDTC/DR/E) CLK± Voltage 0 Differential CLK Amplitude VCMI Common-Mode Input Voltage (1) (2) (3) (4) V mA dBm 0 V VA V 0.4 2 VP-P VCMO – 150 VCMO +150 mV Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the Absolute Maximum Ratings. Recommended Operating Conditions indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0 V, unless otherwise specified. Proper common-mode voltage must be maintained to ensure proper output codes, especially during input overdrive. This rating is intended for DC-coupled applications; the voltages and duty cycles listed may be safely applied to VIN+/- for the lifetime of the part. 4.4 Thermal Information ADC12D1x00RF THERMAL METRIC (1) NXA [BGA] UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 16 °C/W RθJC(top) Junction-to-case (top) thermal resistance 2.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 15 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 4.5 www.ti.com Electrical Characteristics: Static Converter Unless otherwise specified, the following apply after calibration for VA = VDR = VTC = VE = 1.9 V; I- and Q-channels, ACcoupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC-coupled Sine Wave Sampling Clock, fCLK = 1600/1000 MHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300 Ω ± 0.1%; Analog Signal Source Impedance = 100-Ω Differential; Non-Demux Non-DES Mode; Duty Cycle Stabilizer on. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) PARAMETER INL TEST CONDITIONS MIN TYP MAX 12 UNIT Resolution with No Missing Codes TA = TMIN to TMAX Integral Non-Linearity (Best fit) 1 MHz DC-coupled over-ranged sine wave, TA = 25°C bits ±2.5 ±7.25 LSB 1 MHz DC-coupled over-ranged sine wave, TA = TMIN to TMAX ±0.4 ±0.96 LSB ±45 DNL Differential Non-Linearity VOFF Offset Error VOFF_ADJ Input Offset Adjustment Range Extended Control Mode PFSE Positive Full-Scale Error See (4) ±25 mV NFSE Negative Full-Scale Error See (4) ±25 mV 5 Out-of-Range Output Code (5) (1) (VIN+) − (VIN−) > + Full Scale, TA = TMIN to TMAX 4095 (VIN+) − (VIN−) < − Full Scale, TA = TMIN to TMAX 0 LSB mV The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device. V A TO INTERNAL CIRCUITRY I/O GND (2) (3) (4) (5) 16 To ensure accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass capacitors. Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing Quality Level). Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 4-8. For relationship between Gain Error and Full-Scale Error, see Specification Definitions for Gain Error. This parameter is specified by design and is not tested in production. Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 4.6 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Electrical Characteristics: Dynamic Converter (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DESIQ MODE –3 dB (2) 1.75 GHz 2.7 GHz –3 dB (2) 1.2 GHz –6 dB 2.3 GHz –9 dB 2.7 GHz 3 GHz –3 dB (2) 2.7 GHz –6 dB 3.1 GHz –9 dB 3.5 GHz 4 GHz –6 dB DESI, DESQ MODE Bandwidth –12 dB NON-DES MODE, DESCLKIQ MODE –12 dB NON-DES MODE D.C. to Fs/2 D.C. to Fs D.C. to 3Fs/2 D.C. to 2Fs ±0.3 ADC12D1600RF ±0.8 ADC12D1000RF ±0.4 ADC12D1600RF ±1 ADC12D1000RF ±0.8 ADC12D1600RF ±3.6 ADC12D1000RF ±0.9 ADC12D1600RF ±2.2 ADC12D1000RF ±1 ADC12D1600RF ±7.4 ADC12D1000RF ±2.7 ADC12D1600RF ±0.9 ADC12D1000RF ±0.7 ADC12D1600RF ±5.4 ADC12D1000RF ±1.3 ADC12D1600RF ±0.7 ADC12D1000RF ±0.6 ADC12D1600RF ±4.2 ADC12D1000RF ±0.9 dB dB dB dB DESI, DESQ MODE D.C. to Fs/2 Gain Flatness D.C. to Fs dB dB DESIQ MODE D.C. to Fs/2 D.C. to Fs dB dB DESCLKIQ MODE D.C. to Fs/2 D.C. to Fs CER (1) (2) 10–18 Code Error Rate Error/ Sample This parameter is specified by design and/or characterization and is not tested in production. The –3 dB point is the traditional Full-Power Bandwidth (FPBW) specification. Although the insertion loss is approximately half at this frequency, the dynamic performance of the ADC does not necessarily begin to degrade to a level below which it may be effectively used in an application. The ADC may be used at input frequencies above the –3 dB FPBW point, for example for the ADC12D1000RF, into the 5th Nyquist zone. Depending on system requirements, it is only necessary to compensate for the insertion loss. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 17 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Electrical Characteristics: Dynamic Converter(1) (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DES MODE –76.7 ADC12D1600RF –63.7 FIN = 2670 MHz ± 2.5 MHz at –13 dBFS –73 ADC12D1000RF –60 –78.6 ADC12D1600RF –65.6 FIN = 2070 MHz ± 2.5 MHz at –13 dBFS IMD3 –77 ADC12D1000RF 3rd order Intermodulation Distortion –64 –82.7 ADC12D1600RF –66.7 FIN = 2670 MHz ± 2.5 MHz at –16 dBFS –85 ADC12D1000RF –69 –80.1 ADC12D1600RF –64.1 FIN = 2070 MHz ± 2.5 MHz at –16 dBFS –83 ADC12D1000RF –67 ADC12D1600RF Noise Floor Density 50-Ω single-ended termination, DES Mode ADC12D1000RF dBFS dBc dBFS dBc dBFS dBc dBFS dBc dBFS dBc dBFS dBc dBFS dBc dBFS dBc –154.6 dBm/Hz –153.6 dBFS/Hz –154 dBm/Hz –153 dBFS/Hz NON-DES MODE (3) (4) (5) AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS ENOB Effective Number of Bits AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS SINAD Signal-to-Noise Plus Distortion Ratio AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS (3) (4) (5) (6) 18 ADC12D1600RF 9.4 ADC12D1000RF 9.6 ADC12D1600RF 9.3 ADC12D1000RF 9.6 ADC12D1600RF 8.6 (6) 9.2 ADC12D1000RF 8.7 (6) 9.4 ADC12D1600RF 9 ADC12D1000RF 9.3 ADC12D1600RF 8.8 ADC12D1000RF 9 bits bits bits bits bits ADC12D1600RF 58 ADC12D1000RF 59.7 ADC12D1600RF 57.5 dB ADC12D1000RF 59.7 dB ADC12D1600RF 53.5 (6) 57.4 ADC12D1000RF 54.1 (6) 58.6 ADC12D1600RF 55.9 ADC12D1000RF 57.6 ADC12D1600RF 54.9 ADC12D1000RF 55.9 dB dB dB dB The Dynamic Specifications are ensured for room to hot ambient temperature only (25°C to 85°C). Refer to the plots of the dynamic performance vs. temperature in Typical Characteristics to see typical performance from cold to room temperature (–40°C to 25°C). The Fs/2 spur was removed from all the dynamic performance specifications. Typical dynamic performance is only tested at Fin = 498 MHz; other input frequencies are specified by design and / or characterization and are not tested in production. TA = TMIN to TMAX Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Electrical Characteristics: Dynamic Converter(1) (continued) PARAMETER TEST CONDITIONS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS SNR Signal-to-Noise Ratio AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS THD Total Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS 2nd Harm Second Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS 3rd Harm Third Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS SFDR Spurious-Free Dynamic Range AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 1448 MHz at –0.5 dBFS MIN TYP ADC12D1600RF 59 ADC12D1000RF 60.1 ADC12D1600RF 58.6 ADC12D1000RF MAX dB dB 60 ADC12D1600RF 54.6 (6) 58.2 ADC12D1000RF 55.1 (6) 58.8 ADC12D1600RF 57 ADC12D1000RF 58.2 ADC12D1600RF 55.4 ADC12D1000RF 56.1 ADC12D1600RF –65 ADC12D1000RF –69.7 dB dB dB dB ADC12D1600RF –64 ADC12D1000RF –71.9 ADC12D1600RF –64.9 –60 (6) ADC12D1000RF –72 –61 (6) ADC12D1600RF –62.4 8 ADC12D1000RF –66. ADC12D1600RF –64.1 ADC12D1000RF –69 ADC12D1600RF –78.6 ADC12D1000RF –79.3 ADC12D1600RF –83 ADC12D1000RF –91.6 ADC12D1600RF –74 ADC12D1000RF –86.3 ADC12D1600RF –70.6 ADC12D1000RF –73 ADC12D1600RF –71 ADC12D1000RF –73.7 ADC12D1600RF –67.5 ADC12D1000RF –71.9 ADC12D1600RF –64.4 ADC12D1000RF –75.4 ADC12D1600RF –71 ADC12D1000RF –74.8 ADC12D1600RF –63.2 ADC12D1000RF –68.9 ADC12D1600RF –75.7 ADC12D1000RF –73.5 ADC12D1600RF 67.9 ADC12D1000RF 71.4 ADC12D1600RF 64.5 ADC12D1000RF ADC12D1600RF 58 66.7 ADC12D1000RF 61 (6) 71.9 ADC12D1600RF 63.8 ADC12D1000RF 68.4 ADC12D1600RF 67.3 ADC12D1000RF 66.5 Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF dB dB dB dB dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 75 (6) Copyright © 2011–2015, Texas Instruments Incorporated UNIT dBc dBc dBc Specifications 19 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Electrical Characteristics: Dynamic Converter(1) (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DES MODE (3) (7) (5) AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS ENOB Effective Number of Bits ADC12D1600RF 9.3 ADC12D1000RF 9.5 ADC12D1600RF 9.3 ADC12D1000RF 9.4 AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS 9.3 ADC12D1600RF 8.9 ADC12D1000RF 8.8 ADC12D1600RF 57.9 ADC12D1000RF 58.7 ADC12D1600RF 57.5 ADC12D1000RF 58.2 ADC12D1600RF 57.5 ADC12D1000RF 57.7 ADC12D1600RF 55.1 ADC12D1000RF 54.8 AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS Signal-to-Noise Plus Distortion Ratio SINAD AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS 8.7 AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS Signal-to-Noise Ratio AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS THD Total Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS 2nd Harm Second Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS 20 bits dB dB dB dB dB dB ADC12D1000RF 59.2 58.5 ADC12D1600RF 58.1 ADC12D1000RF 58 ADC12D1600RF 55.9 ADC12D1000RF 55 ADC12D1600RF –65.2 ADC12D1000RF –68.1 ADC12D1600RF –64.2 ADC12D1000RF –68.4 ADC12D1600RF –66.2 ADC12D1000RF –68.3 ADC12D1600RF –62.9 ADC12D1000RF –66.4 ADC12D1600RF –81.5 ADC12D1000RF –87.4 ADC12D1600RF –84.2 ADC12D1000RF –77.1 ADC12D1600RF –69.7 ADC12D1000RF –73.4 ADC12D1600RF –70.5 ADC12D1000RF –76.4 54.3 –67 AIN = 1448 MHz at –0.5 dBFS (7) bits 58.8 AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS bits 54.1 AIN = 1448 MHz at –0.5 dBFS AIN = 125 MHz at –0.5 dBFS bits ADC12D1600RF AIN = 248 MHz at –0.5 dBFS SNR bits –73.6 dB dB dB dB dB dB dB dB dB dBc dBc dBc dBc dBc These measurements were taken in Extended Control Mode (ECM) with the DES Timing Adjust feature enabled (Addr: 7h). This feature is used to reduce the interleaving timing spur amplitude, which occurs at fs/2-fin, and thereby increase the SFDR, SINAD and ENOB. Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Electrical Characteristics: Dynamic Converter(1) (continued) PARAMETER TEST CONDITIONS AIN = 125 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS 3rd Harm Third Harmonic Distortion AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS MIN –66 ADC12D1000RF –69.3 ADC12D1600RF –63.8 ADC12D1000RF –73.3 ADC12D1600RF –69.7 ADC12D1000RF –72.6 ADC12D1600RF –63.5 ADC12D1000RF –69.9 AIN = 1448 MHz at –0.5 dBFS AIN = 248 MHz at –0.5 dBFS Spurious-Free Dynamic Range AIN = 498 MHz at –0.5 dBFS AIN = 998 MHz at –0.5 dBFS ADC12D1600RF 66.9 ADC12D1000RF 69 ADC12D1600RF 65 ADC12D1000RF 67.1 ADC12D1600RF 70.4 ADC12D1000RF 65 ADC12D1600RF 64.1 ADC12D1000RF 61.7 AIN = 1448 MHz at –0.5 dBFS 4.7 MAX UNIT dBc dBc dBc dBc –67.1 AIN = 125 MHz at –0.5 dBFS SFDR TYP ADC12D1600RF dBc dBc dBc dBc dBc 61.3 dBc Electrical Characteristics: Analog Input/Output and Reference PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FSR Pin Low 540 (1) 600 660 (1) mVP-P FSR Pin High 740 (1) 800 860 (1) mVP-P ANALOG INPUTS NON-EXTENDED CONTROL MODE VIN_FSR Analog Differential Input Full Scale Range Analog Input Capacitance, Non-DES Mode (2) (3) CIN Analog Input Capacitance, DES Mode RIN (2) (3) EXTENDED CONTROL MODE FM(14:0) = 0000h 600 mVP-P FM(14:0) = 4000h (default) 800 mVP-P FM(14:0) = 7FFFh 1000 mVP-P Differential 0.02 pF 1.6 pF 0.08 pF Each input pin to ground Differential Each input pin to ground Differential Input Resistance 2.2 pF 91 (1) 100 109 (1) 1.15 (1) 1.25 1.35 (1) Ω COMMON-MODE OUTPUT VCMO Common-Mode Output Voltage ICMO = ±100 µA (4) 38 V TC_VCMO Common-Mode Output Voltage Temperature Coefficient ICMO = ±100 µA ppm/°C VCMO_LVL VCMO input threshold to set DC-coupling Mode See (4) 0.63 V CL_VCMO Maximum VCMO Load Capacitance See (2) 80 (1) pF BANDGAP REFERENCE VBG Bandgap Reference Output Voltage TC_VBG Bandgap Reference Voltage Temperature Coefficient IBG = ±100 µA CL_VBG Maximum Bandgap Reference load Capacitance See (1) (2) (3) (4) 1.15 (1) IBG = ±100 µA (4) (2) 1.25 1.35 (1) 32 80 (1) V ppm/°C pF TA = TMIN to TMAX This parameter is specified by design and is not tested in production. The differential and pin-to-ground input capacitances are lumped capacitance values from design. This parameter is specified by design and/or characterization and is not tested in production. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 21 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 4.8 www.ti.com Electrical Characteristics: I-Channel to Q-Channel PARAMETER X-TALK (1) TEST CONDITIONS Offset Match See Positive Full-Scale Match TYP MAX UNIT 2 LSB Zero offset selected in Control Register 2 LSB Negative Full-Scale Match Zero offset selected in Control Register 2 Phase Matching (I, Q) fIN = 1.0 GHz (1) <1 Degree Crosstalk from I-channel (Aggressor) to Q-channel (Victim) Aggressor = 867 MHz F.S., Victim = 100 MHz F.S. –70 dB Crosstalk from Q-channel (Aggressor) to I-channel (Victim) Aggressor = 867 MHz F.S., Victim = 100 MHz F.S. –70 dB LSB This parameter is specified by design and/or characterization and is not tested in production. 4.9 Electrical Characteristics: Sampling Clock PARAMETER TEST CONDITIONS VIN_CLK Differential Sampling Clock Input Level (1) CIN_CLK Sampling Clock Input Capacitance (3) RIN_CLK (1) (2) (3) MIN (1) Sampling Clock Differential Input Resistance MIN TYP MAX UNIT Sine Wave Clock Differential Peak-to-Peak 0.4 (2) 0.6 2 (2) VP-P Square Wave Clock Differential Peak-to-Peak 0.4 (2) 0.6 2 (2) Differential Each input to ground See (1) 0.1 pF 1 pF 100 Ω This parameter is specified by design and/or characterization and is not tested in production. TA = TMIN to TMAX This parameter is specified by design and is not tested in production. 4.10 Electrical Characteristics: AutoSync Feature PARAMETER TEST CONDITIONS MIN TYP VIN_RCLK Differential RCLK Input Level (1) CIN_RCLK RCLK Input Capacitance (1) RIN_RCLK RCLK Differential Input Resistance IIH_RCLK Input Leakage Current; VIN = VA IIL_RCLK Input Leakage Current; VIN = GND 33 VO_RCOUT Differential RCOut Output Voltage –360 (1) 22 MAX UNIT Differential Peak-to-Peak 360 mVP-P Differential 0.12 pF 1 pF Each input to ground See (1) 100 Ω 22 µA µA mVP-P This parameter is specified by design and/or characterization and is not tested in production. Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 4.11 Electrical Characteristics: Digital Control and Output Pin PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL CONTROL PINS (DES, CalDly, CAL, PDI, PDQ, TPM, NDM, FSR, DDRPh, ECE, SCLK, SDI, SCS) 0.7×VA (1) VIH Logic High Input Voltage VIL Logic Low Input Voltage IIH Input Leakage Current; VIN = VA IIL Input Leakage Current; VIN = GND Digital Control Pin Input Capacitance (2) V 0.02 μA –0.02 μA SCS, SCLK, SDI –17 μA PDI, PDQ, ECE –38 μA Measured from each control pin to GND 1.5 pF FSR, CalDly, CAL, NDM, TPM, DDRPh, DES CIN_DIG V 0.3×VA (1) DIGITAL OUTPUT PINS (Data, DCLKI, DCLKQ, ORI, ORQ) VOD ΔVO LVDS Differential Output Voltage DIFF VBG = Floating, OVS = High 400 (1) 630 800 (1) mVP-P VBG = Floating, OVS = Low 230 (1) 460 630 (1) mVP-P VBG = VA, OVS = High 670 mVP-P VBG = VA, OVS = Low 500 mVP-P ±1 mV VBG = Floating 0.8 V VBG = VA 1.2 V ±1 mV ±4 mA 100 Ω 1.65 V Change in LVDS Output Swing Between Logic Levels VOS Output Offset Voltage (3) ΔVOS Output Offset Voltage Change Between Logic Levels See IOS Output Short-Circuit Current (3) VBG = Floating; D+ and D− connected to 0.8 V ZO VOH VOL VID_DRST RIN_DRST (1) (2) (3) (3) Differential Output Impedance See Logic High-Output Level CalRun, IOH = −100 µA, (3) SDO, IOH = −400 µA (3) CalRun, IOL = 100 µA, SDO, IOL = 400 µA (3) Logic Low-Output Level VCMI_DRST (3) DCLK_RST Common-Mode Input Voltage Differential DCLK_RST Input Voltage (3) 0.15 V See (3) 1.25 V See (3) VIN_CL See (3) VP-P K Differential DCLK_RST Input Resistance Ω 100 TA = TMIN to TMAX This parameter is specified by design and is not tested in production. This parameter is specified by design and/or characterization and is not tested in production. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 23 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 4.12 Electrical Characteristics: Power Supply PARAMETER TEST CONDITIONS PDI = PDQ = Low IA Analog Supply Current PDI = Low; PDQ = High PDI = High; PDQ = Low MIN 1225 ADC12D1000RF 1140 ADC12D1600RF 670 ADC12D1000RF 625 ADC12D1600RF 670 ADC12D1000RF 625 ADC12D1600RF 490 ADC12D1000RF 410 ADC12D1600RF 290 ADC12D1000RF 250 ADC12D1600RF 290 ADC12D1000RF 250 PDI = PDQ = High PDI = PDQ = Low Track-and-Hold and Clock Supply Current ITC PDI = Low; PDQ = High PDI = High; PDQ = Low IDR Output Driver Supply Current mA mA mA mA mA mA mA 0.65 µA PDI = PDQ = Low 270 mA PDI = Low; PDQ = High 140 mA PDI = High; PDQ = Low 140 mA 6 µA ADC12D1600RF 105 ADC12D1000RF 55 ADC12D1600RF 50 ADC12D1000RF 30 ADC12D1600RF 50 ADC12D1000RF 30 1:2 DEMUX MODE PDI = PDQ = Low ADC12D1600RF 2090 2310 (1) ADC12D1000RF 1875 2105 (1) NON-DEMUX MODE PDI = PDQ = Low ADC12D1600RF 2075 ADC12D1000RF 1800 ADC12D1600RF 4 4.4 (1) ADC12D1000RF 3.6 4 (1) ADC12D1600RF 2.2 ADC12D1000RF 2 ADC12D1600RF 2.2 ADC12D1000RF 2 PDI = Low; PDQ = High PDI = High; PDQ = Low PDI = PDQ = High ITOTAL UNIT PDI = PDQ = High PDI = PDQ = Low Digital Encoder Supply Current MAX 2.7 PDI = PDQ = High IE TYP ADC12D1600RF Total Supply Current mA mA mA 34 µA mA mA 1:2 DEMUX MODE PDI = PDQ = Low PDI = Low; PDQ = High PC Power Consumption PDI = High; PDQ = Low PDI = PDQ = High 6.4 W W W mW NON-DEMUX MODE PDI = PDQ = Low (1) TA = TMIN to TMAX 24 Specifications ADC12D1600RF 3.94 ADC12D1000RF 3.42 W Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 4.13 Electrical Characteristics: AC PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SAMPLING CLOCK (CLK) fCLK (max) Maximum Sampling Clock Frequency ADC12D1600RF 1.6 (1) ADC12D1000RF 1 (1) Non-DES Mode; LFS = 0b fCLK (min) MHz 150 (1) MHz 300 Minimum Sampling Clock Frequency Non-DES Mode; LFS = 1b GHz (1) 500 (1) DES Mode Sampling Clock Duty Cycle fCLK(min) ≤ fCLK ≤ fCLK(max) (2) tCL Sampling Clock Low Time See (3) tCH Sampling Clock High Time See (3) See (3) 45 45 20% (1) 50% ADC12D1600RF 200 (1) 500 ADC12D1000RF 125 (1) 312.5 ADC12D1600RF 200 (1) 500 ADC12D1000RF 125 (1) 312.5 45% (1) 50% MHz 80% (1) ps ps DATA CLOCK (DCLKI, DCLKQ) DCLK Duty Cycle tSR Setup Time DCLK_RST± See (2) tHR Hold Time DCLK_RST± See (2) (3) 5 (1) 90° Mode (3) 4 (1) 0° Mode (3) 5 (1) See 55% (1) ps ps Sampling Clock Cycles tPWR Pulse Width DCLK_RST± tSYNC_DLY DCLK Synchronization Delay tLHT Differential Low-to-High Transition Time 10%-to-90%, CL = 2.5 pF (2) 200 ps tHLT Differential High-to-Low Transition Time 10%-to-90%, CL = 2.5 pF (2) 200 ps tSU Data-to-DCLK Setup Time DDR 90° Mode (3) tH DCLK-to-Data Hold Time DDR 90° Mode (3) tOSK DCLK-to-Data Output Skew 50% of DCLK transition to 50% of Data transition DDR 0° Mode, SDR Mode (3) ±50 1.29 ns 0.2 ps (rms) 3.2 ns Sampling Clock Cycles ADC12D1600RF 500 ADC12D1000RF 870 ADC12D1600RF 500 ADC12D1000RF 870 ps ps ps DATA INPUT-TO-OUTPUT tAD Aperture Delay (2) Sampling CLK+ Rise to Acquisition of Data tAJ Aperture Jitter See tOD Sampling Clock-to Data Output Delay (in addition to Latency) 50% of Sampling Clock transition to 50% of Data transition (2) Latency in 1:2 Demux Non-DES Mode (3) DI, DQ Outputs 34 (1) DId, DQd Outputs 35 (1) DI Outputs 34 (1) Latency in 1:4 Demux DES Mode (3) tLAT DQ Outputs 34.5 (1) DId Outputs 35 (1) DQd Outputs Latency in Non-Demux Non-DES Mode (3) Latency in Non-Demux DES Mode (3) (2) tORR Over Range Recovery Time tWU Wake-Up Time (PDI/PDQ low to Rated Accuracy Conversion) (1) (2) (3) (2) 35.5 DI Outputs 34 (1) DQ Outputs 34 (1) DI Outputs 34 (1) DQ Outputs Differential VIN step from ±1.2 V to 0 V to accurate conversion Non-DES Mode (3) DES Mode (3) Sampling Clock Cycles (1) 34.5 (1) Sampling Clock Cycles 1 500 ns 1 µs TA = TMIN to TMAX This parameter is specified by design and/or characterization and is not tested in production. This parameter is specified by design and is not tested in production. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 25 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 4.14 Timing Requirements: Serial Port Interface PARAMETER fSCLK TEST CONDITIONS Serial Clock Frequency See MIN NOM (1) MAX 15 UNIT MHz Serial Clock Low Time 30 (2) ns Serial Clock High Time 30 (2) ns ns tSSU Serial Data-to-Serial Clock Rising Setup Time See (1) 2.5 tSH Serial Data-to-Serial Clock Rising Hold Time See (1) 1 tSCS SCS-to-Serial Clock Rising Setup Time See (3) 2.5 ns tHCS SCS-to-Serial Clock Falling Hold Time See (3) 1.5 ns tBSU Bus turnaround time See (3) 10 ns (1) (2) (3) ns This parameter is specified by design and is not tested in production. TA = TMIN to TMAX This parameter is specified by design and/or characterization and is not tested in production. 4.15 Timing Requirements: Calibration PARAMETER TEST CONDITIONS MIN NOM MAX Non-ECM tCAL Calibration Cycle Time tCAL_L CAL Pin Low Time Sampling Clock Cycles 4.1×107 ECM CSS = 0b ECM CSS = 1b tCAL_H tCalDly (1) (2) CAL Pin High Time See (1) 1280 (2) See (1) (2) 1280 Calibration delay determined by CalDly Pin (1) Sampling Clock Cycles 224 (2) CalDly = Low 30 (2) CalDly = High UNIT 2 Sampling Clock Cycles This parameter is specified by design and is not tested in production. TA = TMIN to TMAX Sample N DI Sample N-1 DId VINI+/- Sample N+1 tAD CLK+ tOD DId, DI Sample N-39 and Sample N-38 Sample N-37 and Sample N-36 Sample N-35 and Sample N-34 tOSK DCLKI+/(0° Phase) tSU tH DCLKI+/(90° Phase) The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case, the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ. Both I- and Q-channel use the same CLK. Figure 4-1. Clocking in 1:2 Demux Non-DES Mode 26 Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Sample N Sample N-1 DQ DQ VINQ+/- Sample N+1 tAD CLK+ tOD DQ Sample N-37 Sample N-34 Sample N-35 Sample N-36 Sample N-33 tOSK DCLKQ+/(0° Phase) The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case, the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ. Both I- and Q-channel use the same CLK. Figure 4-2. Clocking in Non-Demux Non-DES Mode DId VINQ+/- DQd c Sample N-1.5 Sample N-1 DQ DI c c Sample N Sample N-0.5 c Sample N+1 tAD c c CLK+/tOD DQd, DId, DQ, DI Sample N-37.5, N-37, N-36.5, N-36 Sample N-39.5, N-39, N-38.5, N-38 Sample N-35.5, N-35, N-34.5, N-34 tOSK DCLKQ+/(0° Phase) tSU tH DCLKQ+/(90° Phase) The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case, the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ. Both I- and Q-channel use the same CLK. Figure 4-3. Clocking in 1:4 Demux DES Mode Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 27 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 Sample N-1 DI www.ti.com Sample N - 0.5 DQ Sample N DI VINQ+/- Sample N + 0.5 DQ Sample N+1 tAD CLK+ tOD DQ, DI Sample N-37.5, N-37 Sample N-36.5, N-36 Sample N-35.5, N-35 Sample N-34.5, N-34 Sample N-33.5, N-33 tOSK DCLKQ+/(0° Phase) The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case, the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId and DI instead of VinQ, DCLKQ, DQd and DQ. Both I- and Q-channel use the same CLK. Figure 4-4. Clocking in Non-Demux Mode DES Mode Synchronizing Edge tSYNC_DLY CLK tHR tSR DCLK_RSTtOD DCLK_RST+ tPWR DCLKI+ DCLKQ+ Figure 4-5. Data Clock Reset Timing (Demux Mode) tCAL tCAL CalRun tCAL_H tCalDly CAL Calibration Delay determined by CalDly (Pin V4) tCAL_L POWER SUPPLY Figure 4-6. Power-on and On-Command Calibration Timing 28 Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Single Register Access SCS tSCS tHCS tHCS 1 8 24 9 SCLK SDI Command Field Data Field LSB MSB tSH tSSU tBSU SDO read mode) Data Field High Z High Z LSB MSB Figure 4-7. Serial Interface Timing IDEAL POSITIVE FULL-SCALE TRANSITION Output Code ACTUAL POSITIVE FULL-SCALE TRANSITION 1111 1111 1111 (4095) 1111 1111 1110 (4094) 1111 1111 1101 (4093) POSITIVE FULL-SCALE ERROR MID-SCALE TRANSITION 1000 0000 0000 (2048) 0111 1111 1111 (2047) OFFSET ERROR IDEAL NEGATIVE FULL-SCALE TRANSITION ACTUAL NEGATIVE FULL-SCALE TRANSITION NEGATIVE FULL-SCALE ERROR 0000 0000 0010 (2) 0000 0000 0001 (1) 0000 0000 0000 (0) -VIN/2 (VIN+) < (VIN-) (VIN+) > (VIN-) 0.0V +VIN/2 Differential Analog Input Voltage (+VIN/2) - (-VIN/2) Figure 4-8. Input / Output Transfer Characteristic Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 29 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 4.16 Typical Characteristics 3 3 2 2 1 1 INL (LSB) INL (LSB) VA = VDR = VTC = VE = 1.9 V, fCLK = 1600 MHz / 1000 MHz for the ADC12D1600RF / ADC12D1000RF, respectively, fIN = 498 MHz, TA= 25°C, I-channel, Demux Non-DES Mode, unless otherwise stated. 0 0 -1 -1 -2 -2 -3 -3 0 4095 0 OUTPUT CODE Figure 4-9. INL vs Code (ADC12D1600RF) 1.0 Figure 4-10. INL vs Code (ADC12D1000RF) 1.0 +INL -INL 0.5 INL (LSB) INL (LSB) 0.5 0.0 0.0 -0.5 -0.5 -1.0 -1.0 -50 +INL -INL -50 0 50 TEMPERATURE (°C) 100 0 100 Figure 4-12. INL vs Temperature (ADC12D1000RF) 0.75 0.50 0.50 0.25 0.25 DNL (LSB) 0.75 0.00 0.00 -0.25 -0.25 -0.50 -0.50 -0.75 -0.75 0 4095 0 OUTPUT CODE Figure 4-13. DNL vs Code (ADC12D1600RF) 30 50 TEMPERATURE (°C) Figure 4-11. INL vs Temperature (ADC12D1600RF) DNL (LSB) 4095 TEMPERATURE (°C) Specifications 4095 OUTPUT CODE Figure 4-14. DNL vs Code (ADC12D1000RF) Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 0.50 0.50 0.25 0.25 DNL (LSB) DNL (LSB) Typical Characteristics (continued) 0.00 -0.25 0.00 -0.25 +DNL -DNL -0.50 -50 0 50 +DNL -DNL 100 -0.50 -50 TEMPERATURE (°C) 0 50 100 TEMPERATURE (°C) Figure 4-15. DNL vs Temperature (ADC12D1600RF) Figure 4-16. DNL vs Temperature (ADC12D1000RF) 10 10 NON-DES MODE DES MODE 9 ENOB ENOB 9 8 7 8 7 NON-DES MODE DES MODE 6 6 -50 0 50 TEMPERATURE (°C) 100 2.0 2.1 2.2 VA(V) Figure 4-18. ENOB vs Supply Voltage (ADC12D1600RF) 10 10 9 9 ENOB ENOB Figure 4-17. ENOB vs Temperature (ADC12D1600RF) 1.8 8 7 1.9 NON-DES MODE DES MODE 8 7 NON-DES MODE DES MODE 6 0 1000 2000 INPUT FREQUENCY (MHz) 6 3000 Figure 4-19. ENOB vs Input Frequency (ADC12D1600RF) 0.75 1.00 1.25 1.50 1.75 VCMI(V) Figure 4-20. ENOB vs VCMI (ADC12D1600RF) Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 31 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Typical Characteristics (continued) 10 60 NON-DES MODE DES MODE 58 SNR (dB) ENOB 9 8 7 56 54 52 NON-DES MODE DES MODE 6 50 0.75 1.00 1.25 1.50 1.75 VCMI(V) Figure 4-21. ENOB vs VCMI (ADC12D1000RF) -50 60 55 SNR (dB) SNR (dB) 58 56 54 50 45 52 NON-DES MODE DES MODE 50 NON-DES MODE DES MODE 40 2.0 2.1 2.2 VA(V) Figure 4-23. SNR vs Supply Voltage (ADC12D1600RF) 1.9 0 1000 2000 INPUT FREQUENCY (MHz) -40 NON-DES MODE DES MODE NON-DES MODE DES MODE -50 THD (dBc) THD (dBc) -50 -60 -60 -70 -70 -80 -80 0 50 TEMPERATURE (°C) 100 Figure 4-25. THD vs Temperature (ADC12D1600RF) 32 Specifications 3000 Figure 4-24. SNR vs Input Frequency (ADC12D1600RF) -40 -50 100 Figure 4-22. SNR vs Temperature (ADC12D1600RF) 60 1.8 0 50 TEMPERATURE (°C) 1.8 1.9 2.0 2.1 2.2 VA(V) Figure 4-26. THD vs Supply Voltage (ADC12D1600RF) Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Typical Characteristics (continued) -40 80 NON-DES MODE DES MODE NON-DES MODE DES MODE 70 SFDR (dBc) THD (dBc) -50 -60 60 -70 50 -80 40 0 1000 2000 INPUT FREQUENCY (MHz) 3000 Figure 4-27. THD vs Input Frequency (ADC12D1600RF) -50 0 50 TEMPERATURE (°C) 100 Figure 4-28. SFDR vs Temperature (ADC12D1600RF) 80 80 NON-DES MODE DES MODE 70 SFDR (dBc) SFDR (dBc) 70 60 50 50 40 40 1.8 2.0 2.1 2.2 VA(V) Figure 4-29. SFDR vs Supply Voltage (ADC12D1600RF) -40 1.9 NON-DES MODE DES MODE 0 1000 2000 INPUT FREQUENCY (MHz) 3000 Figure 4-30. SFDR vs Input Frequency (ADC12D1600RF) -40 NON-DES MODE NON-DES MODE -50 CROSSTALK (dBFS) -50 CROSSTALK (dBFS) 60 -60 -70 -80 -60 -70 -80 -90 -90 -100 -100 0 1000 2000 3000 AGGRESSOR INPUT FREQUENCY (MHz) 0 1000 2000 3000 AGGRESSOR INPUT FREQUENCY (MHz) Figure 4-31. CROSSTALK vs Source Frequency (ADC12D1600RF) Figure 4-32. CROSSTALK vs Source Frequency (ADC12D1000RF) Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Specifications 33 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Typical Characteristics (continued) 5.0 0 4.5 POWER (W) -3 SIGNAL GAIN (dB) DEMUX MODE NON-DEMUX MODE -6 -9 -12 0 1000 2000 3000 INPUT FREQUENCY (MHz) 3.5 3.0 2.5 DESI MODE DESIQ MODE NON-DES, DESCLKIQ MODE -15 4.0 2.0 4000 0 Figure 4-33. Insertion Loss (ADC12D1x00RF) 5.0 400 800 1200 CLOCK FREQUENCY (MHz) 1600 Figure 4-34. Power Consumption vs Clock Frequency (ADC12D1600RF) DEMUX MODE NON-DEMUX MODE POWER (W) 4.5 4.0 3.5 3.0 2.5 2.0 0 250 500 750 CLOCK FREQUENCY (MHz) 1000 Figure 4-35. Power Consumption vs Clock Frequency (ADC12D1000RF) 34 Specifications Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 5 Detailed Description 5.1 Overview The ADC12D1x00RF device is a versatile A/D converter with an innovative architecture which permits very high-speed operation. The controls available ease the application of the device to circuit solutions. Optimum performance requires adherence to the provisions discussed here and in Application Information. This section covers an overview, a description of control modes (Extended Control Mode and NonExtended Control Mode), and features. The ADC12D1x00RF uses a calibrated folding and interpolating architecture that achieves a high Effective Number of Bits (ENOB). The use of folding amplifiers greatly reduces the number of comparators and power consumption. Interpolation reduces the number of front-end amplifiers required, minimizing the load on the input signal and further reducing power requirements. In addition to correcting other non-idealities, ON-chip calibration reduces the INL bow often seen with folding architectures. The result is an extremely fast, high performance, low power converter. The analog input signal (which is within the converter's input voltage range) is digitized to twelve bits at speeds of 150/150 MSPS to 3.2/2.0 GSPS, typical. Differential input voltages below negative full-scale will cause the output word to consist of all zeroes. Differential input voltages above positive full-scale will cause the output word to consist of all ones. Either of these conditions at the I- or Q-input will cause the Out-of-Range I-channel or Q-channel output (ORI or ORQ), respectively, to output a logic-high signal. In ECM, an expanded feature set is available through the Serial Interface. The ADC12D1x00RF builds upon previous architectures, introducing a new DES Mode timing adjust feature, AutoSync feature for multi-chip synchronization and increasing to 15-bit for gain and 12-bit plus sign for offset the independent programmable adjustment for each channel. Each channel has a selectable output demultiplexer which feeds two LVDS buses. If the 1:2 Demux Mode is selected, the output data rate is reduced to half the input sample rate on each bus. When Non-Demux Mode is selected, the output data rate on each channel is at the same rate as the input sample clock and only one 12-bit bus per channel is active. 5.2 Functional Block Diagram Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 35 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 5.3 www.ti.com Feature Description The ADC12D1x00RF offers many features to make the device convenient to use in a wide variety of applications. Table 5-1 is a summary of the features available, as well as details for the control mode chosen. "N/A" means "Not Applicable." Table 5-1. Features and Modes NON-ECM CONTROL PIN ACTIVE IN ECM ECM DEFAULT ECM STATE AC/DC-coupled Mode Selection Selected through VCMO (Pin C2) Yes Not available N/A Input Full-scale Range Adjust Selected through FSR (Pin Y3) No Selected through the Config Reg (Addr: 3h and Bh) Mid FSR value Input Offset Adjust Setting Not available N/A Selected through the Config Reg (Addr: 2h and Ah) Offset = 0 mV DES / Non-DES Mode Selection Selected through DES (Pin V5) No Selected through the DES Bit (Addr: 0h; Bit: 7) Non-DES Mode DES Mode Input Selection Not available N/A Selected through the DEQ, DIQ Bits (Addr: 0h; Bits: 6:5) N/A DESCLKIQ Mode Not available N/A Selected through the DCK Bit (Addr: Eh; Bit: 6) N/A DES Timing Adjust Not available N/A Selected through the DES Timing Adjust Reg (Addr: 7h) Mid skew offset Sampling Clock Phase Adjust Not available N/A Selected through the Config Reg (Addr: Ch and Dh) tAD adjust disabled DDR Clock Phase Selection Selected through DDRPh (Pin W4) No Selected through the DPS Bit (Addr: 0h; Bit: 14) 0° Mode DDR / SDR DCLK Selection Not available N/A Selected through the SDR Bit (Addr: 0h; Bit: 2) DDR Mode SDR Rising / Falling DCLK Selection Not available N/A Selected through the DPS Bit (Addr: 0h; Bit: 14) N/A LVDS Differential Voltage Amplitude Selection Higher amplitude only N/A Selected through the OVS Bit (Addr: 0h; Bit: 13) Higher amplitude LVDS Common-Mode Voltage Amplitude Selection Selected through VBG (Pin B1) Yes Not available N/A Output Formatting Selection Offset Binary only N/A Selected through the 2SC Bit (Addr: 0h; Bit: 4) Offset Binary Test Pattern Mode at Output Selected through TPM (Pin A4) No Selected through the TPM Bit (Addr: 0h; Bit: 12) TPM disabled Demux/Non-Demux Mode Selection Selected through NDM (Pin A5) Yes Not available N/A AutoSync Not available N/A Selected through the Config Reg (Addr: Eh) Master Mode, RCOut1/2 disabled DCLK Reset Not available N/A Selected through the Config Reg (Addr: Eh; Bit: 0) DCLK Reset disabled Time Stamp Not available N/A Selected through the TSE Bit (Addr: 0h; Bit: 3) Time Stamp disabled FEATURE INPUT CONTROL AND ADJUST OUTPUT CONTROL AND ADJUST 36 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 5-1. Features and Modes (continued) NON-ECM CONTROL PIN ACTIVE IN ECM ECM DEFAULT ECM STATE On-command Calibration Selected through CAL (Pin D6) Yes Selected through the CAL Bit (Addr: 0h; Bit: 15) N/A (CAL = 0) Power-on Calibration Delay Selection Selected through CalDly (Pin V4) Yes Not available N/A Calibration Adjust Not available N/A Selected through the Config Reg (Addr: 4h) tCAL Read/Write Calibration Settings Not available N/A Selected through the SSC Bit (Addr: 4h; Bit: 7) R/W calibration values disabled Power-down I-channel Selected through PDI (Pin U3) Yes Selected through the PDI Bit (Addr: 0h; Bit: 11) I-channel operational Power-down Q-channel Selected through PDQ (Pin V3) Yes Selected through the PDQ Bit (Addr: 0h; Bit: 10) Q-channel operational FEATURE CALIBRATION POWER DOWN 5.3.1 Input Control and Adjust There are several features and configurations for the input of the ADC12D1x00RF so that it may be used in many different applications. This section covers AC/DC-coupled Mode, input full-scale range adjust, input offset adjust, DES/Non-DES Mode, and sampling clock phase adjust. 5.3.1.1 AC- and DC-coupled Mode The analog inputs may be AC- or DC-coupled. See AC/DC-Coupled Mode Pin (VCMO) for information on how to select the desired mode and DC-coupled Input Signals and AC-coupled Input Signals for applications information. 5.3.1.2 Input Full-Scale Range Adjust The input full-scale range for the ADC12D1x00RF may be adjusted through Non-ECM or ECM. In NonECM, a control pin selects a higher or lower value; see Full-Scale Input Range Pin (FSR). In ECM, the input full-scale range may be adjusted with 15-bits of precision. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for electrical specification details. The higher and lower full-scale input range settings in Non-ECM correspond to the mid and min full-scale input range settings in ECM. It is necessary to execute an on-command calibration following a change of the input full-scale range. See Memory for information about the registers. 5.3.1.3 Input Offset Adjust The input offset adjust for the ADC12D1x00RF may be adjusted with 12-bits of precision plus sign through ECM. See Memory for information about the registers. 5.3.1.4 DES Timing Adjust The performance of the ADC12D1x00RF in DES Mode depends on how well the two channels are interleaved, that is, that the clock samples either channel with precisely a 50% duty-cycle, each channel has the same offset (nominally code 2047/2048), and each channel has the same full-scale range. The ADC12D1x00RF includes an automatic clock phase background adjustment in DES Mode to automatically and continuously adjust the clock phase of the I- and Q-channels. In addition to this, the residual fixed Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 37 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com timing skew offset may be further manually adjusted, and further reduce timing spurs for specific applications. See the DES Timing Adjust (Addr: 7h). As the DES Timing Adjust is programmed from 0d to 127d, the magnitude of the Fs/2-Fin timing interleaving spur will decrease to a local minimum and then increase again. The default, nominal setting of 64d may or may not coincide with this local minimum. The user may manually skew the global timing to achieve the lowest possible timing interleaving spur. 5.3.1.5 Sampling Clock Phase Adjust The sampling clock (CLK) phase may be delayed internally to the ADC up to 825 ps in ECM. This feature is intended to help the system designer remove small imbalances in clock distribution traces at the board level when multiple ADCs are used, or to simplify complex system functions such as beam steering for phase array antennas. Additional delay in the clock path also creates additional jitter when using the sampling clock phase adjust. Because the sampling clock phase adjust delays all clocks, including the DCLKs and output data, the user is strongly advised to use the minimal amount of adjustment and verify the net benefit of this feature in his system before relying on it. 5.3.2 Output Control and Adjust There are several features and configurations for the output of the ADC12D1x00RF so that it may be used in many different applications. This section covers DDR clock phase, LVDS output differential and common-mode voltage, output formatting, Demux/Non-demux Mode, Test Pattern Mode, and Time Stamp. 5.3.2.1 SDR / DDR Clock The ADC12D1x00RF output data can be delivered in Double Data Rate (DDR) or Single Data Rate (SDR). For DDR, the DCLK frequency is half the data rate and data is sent to the outputs on both edges of DCLK; see Figure 5-1. The DCLK-to-Data phase relationship may be either 0° or 90°. For 0° Mode, the Data transitions on each edge of the DCLK. Any offset from this timing is tOSK; see Electrical Characteristics: AC for details. For 90° Mode, the DCLK transitions in the middle of each Data cell. Setup and hold times for this transition, tSU and tH, may also be found in Electrical Characteristics: AC. The DCLK-to-Data phase relationship may be selected through the DDRPh Pin in Non-ECM (see Dual Data Rate Phase Pin (DDRPh)) or the DPS bit in the Configuration Register (Addr: 0h; Bit: 14) in ECM. Data DCLK 0° Mode DCLK 90° Mode Figure 5-1. DDR DCLK-to-Data Phase Relationship For SDR, the DCLK frequency is the same as the data rate and data is sent to the outputs on a single edge of DCLK; see SDR DCLK-to-Data Phase Relationship. The Data may transition on either the rising or falling edge of DCLK. Any offset from this timing is tOSK; see Electrical Characteristics: AC for details. The DCLK rising / falling edge may be selected through the SDR bit in the Configuration Register (Addr: 0h; Bit: 2) in ECM only. 38 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Data DCLK SDR Rising DCLK SDR Falling Figure 5-2. SDR DCLK-to-Data Phase Relationship 5.3.2.2 LVDS Output Differential Voltage The ADC12D1x00RF is available with a selectable higher or lower LVDS output differential voltage. This parameter is VOD and may be found in Electrical Characteristics: Digital Control and Output Pin. The desired voltage may be selected through the OVS Bit (Addr: 0h, Bit 13). For many applications, in which the LVDS outputs are very close to an FPGA on the same board, for example, the lower setting is sufficient for good performance; this will also reduce the possibility for EMI from the LVDS outputs to other signals on the board. See Memory for more information. 5.3.2.3 LVDS Output Common-Mode Voltage The ADC12D1x00RF is available with a selectable higher or lower LVDS output common-mode voltage. This parameter is VOS and may be found in Electrical Characteristics: Digital Control and Output Pin. See LVDS Output Common-mode Pin (VBG) for information on how to select the desired voltage. 5.3.2.4 Output Formatting The formatting at the digital data outputs may be either offset binary or two's complement. The default formatting is offset binary, but two's complement may be selected through the 2SC Bit (Addr: 0h, Bit 4); see Memory for more information. 5.3.2.5 Test Pattern Mode The ADC12D1x00RF can provide a test pattern at the four output buses independently of the input signal to aid in system debug. In Test Pattern Mode, the ADC is disengaged and a test pattern generator is connected to the outputs, including ORI and ORQ. The test pattern output is the same in DES Mode or Non-DES Mode. Each port is given a unique 12-bit word, alternating between 1's and 0's. When the part is programmed into the Demux Mode, the test pattern’s order is described in Table 5-2. If the I- or Q-channel is powered down, the test pattern will not be output for that channel. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 39 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 5-2. Test Pattern by Output Port in Demux Mode TIME Qd Id Q I ORQ ORI T0 000h 004h 008h 010h 0b 0b T1 FFFh FFBh FF7h FEFh 1b 1b T2 000h 004h 008h 010h 0b 0b T3 FFFh FFBh FF7h FEFh 1b 1b T4 000h 004h 008h 010h 0b 0b T5 000h 004h 008h 010h 0b 0b T6 FFFh FFBh FF7h FEFh 1b 1b T7 000h 004h 008h 010h 0b 0b T8 FFFh FFBh FF7h FEFh 1b 1b T9 000h 004h 008h 010h 0b 0b T10 000h 004h 008h 010h 0b 0b T11 FFFh FFBh FF7h FEFh 1b 1b T12 000h 004h 008h 010h 0b 0b T13 ... ... ... ... ... ... COMMENTS Pattern Sequence n Pattern Sequence n+1 Pattern Sequence n+2 When the part is programmed into the Non-Demux Mode, the test pattern’s order is described in Table 53. Table 5-3. Test Pattern by Output Port in Non-Demux Mode 5.3.2.6 TIME Q I ORQ ORI T0 000h 004h 0b 0b T1 000h 004h 0b 0b T2 FFFh FFBh 1b 1b T3 FFFh FFBh 1b 1b T4 000h 004h 0b 0b T5 FFFh FFBh 1b 1b T6 000h 004h 0b 0b T7 FFFh FFBh 1b 1b T8 FFFh FFBh 1b 1b T9 FFFh FFBh 1b 1b T10 000h 004h 0b 0b T11 000h 004h 0b 0b T12 FFFh FFBh 1b 1b T13 FFFh FFBh 1b 1b T14 ... ... ... ... COMMENTS Pattern Sequence n Pattern Sequence n+1 Time Stamp The Time Stamp feature enables the user to capture the timing of an external trigger event, relative to the sampled signal. When enabled through the TSE Bit (Addr: 0h; Bit: 3), the LSB of the digital outputs (DQd, DQ, DId, DI) captures the trigger information. In effect, the 12-bit converter becomes an 11-bit converter and the LSB acts as a 1-bit converter with the same latency as the 11-bit converter. The trigger should be applied to the DCLK_RST input. It may be asynchronous to the ADC sampling clock. 40 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 5.3.3 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Calibration Feature The ADC12D1x00RF calibration must be run to achieve specified performance. The calibration procedure is exactly the same regardless of how it was initiated or when it is run. Calibration trims the analog input differential termination resistors, the CLK input resistor, and sets internal bias currents which affect the linearity of the converter. This minimizes full-scale error, offset error, DNL, and INL, which results in the maximum dynamic performance, as measured by: SNR, THD, SINAD (SNDR) and ENOB. 5.3.3.1 Calibration Control Pins and Bits Table 5-4 is a summary of the pins and bits used for calibration. See Ball Descriptions and Equivalent Circuits for complete pin information and Figure 4-6 for the timing diagram. Table 5-4. Calibration Pins 5.3.3.2 PIN (BIT) NAME FUNCTION D6 (Addr: 0h; Bit 15) CAL (Calibration) Initiate calibration V4 CalDly (Calibration Delay) Select power-on calibration delay (Addr: 4h) Calibration Adjust Adjust calibration sequence B5 CalRun (Calibration Running) Indicates while calibration is running C1/D2 Rtrim+/(Input termination trim resistor) External resistor used to calibrate analog and CLK inputs C3/D3 Rext+/(External Reference resistor) External resistor used to calibrate internal linearity How to Execute a Calibration Calibration may be initiated by holding the CAL pin low for at least tCAL_L clock cycles, and then holding it high for at least another tCAL_H clock cycles, as defined in Electrical Characteristics: Calibration. The minimum tCAL_L and tCAL_H input clock cycle sequences are required to ensure that random noise does not cause a calibration to begin when it is not desired. The time taken by the calibration procedure is specified as tCAL. The CAL Pin is active in both ECM and Non-ECM. However, in ECM, the CAL Pin is logically OR'd with the CAL Bit, so both the pin and bit are required to be set low before executing another calibration through either pin or bit. 5.3.3.3 Power-on Calibration For standard operation, power-on calibration begins after a time delay following the application of power, as determined by the setting of the CalDly Pin and measured by tCalDly (see Electrical Characteristics: Calibration). This delay allows the power supply to come up and stabilize before the power-on calibration takes place. The best setting (short or long) of the CalDly Pin depends upon the settling time of the power supply. TI strongly recommends setting CalDly Pin (to either logic-high or logic-low) before powering the device on because this pin affects the power-on calibration timing. This may be accomplished by setting CalDly through an external 1-kΩ resistor connected to GND or VA. If the CalDly Pin is toggled while the device is powered-on, it can execute a calibration even though the CAL Pin/Bit remains logic-low. The power-on calibration will be not be performed if the CAL pin is logic-high at power-on. In this case, the calibration cycle will not begin until the on-command calibration conditions are met. The ADC12D1x00RF will function with the CAL pin held high at power up, but no calibration will be done and performance will be impaired. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 41 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com If it is necessary to toggle the CalDly Pin before the system power-up sequence, then the CAL Pin/Bit must be set to logic-high during the toggling and afterwards for 109 Sampling Clock cycles. This will prevent the power-on calibration, so an on-command calibration must be executed or the performance will be impaired. 5.3.3.4 On-Command Calibration In addition to the power-on calibration, TI recommends executing an on-command calibration whenever the settings or conditions to the device are altered significantly, to obtain optimal parametric performance. Some examples include: changing the FSR through either ECM or Non-ECM, power-cycling either channel, and switching into or out of DES Mode. For best performance, TI also recommends that an oncommand calibration be run 20 seconds or more after application of power and whenever the operating temperature changes significantly, relative to the specific system performance requirements. Due to the nature of the calibration feature, TI recommends avoiding unnecessary activities on the device while the calibration is taking place. For example, do not read or write to the Serial Interface or use the DCLK Reset feature while calibrating the ADC. Doing so will impair the performance of the device until it is re-calibrated correctly. Also, TI recommends not applying a strong narrow-band signal to the analog inputs during calibration because this may impair the accuracy of the calibration; broad spectrum noise is acceptable. 5.3.3.5 Calibration Adjust The sequence of the calibration event itself may be adjusted. This feature can be used if a shorter calibration time than the default is required; see tCAL in Electrical Characteristics: Calibration. However, the performance of the device, when using this feature is not ensured. The calibration sequence may be adjusted through CSS (Addr: 4h, Bit 14). The default setting of CSS = 1b executes both RIN and RIN_CLK Calibration (using Rtrim) and internal linearity Calibration (using Rext). Executing a calibration with CSS = 0b executes only the internal linearity Calibration. The first time that Calibration is executed, it must be with CSS = 1b to trim RIN and RIN_CLK. However, once the device is at its operating temperature and RIN has been trimmed at least one time, it will not drift significantly. To save time in subsequent calibrations, trimming RIN and RIN_CLK may be skipped, that is, by setting CSS = 0b. 5.3.3.6 Read/Write Calibration Settings When the ADC performs a calibration, the calibration constants are stored in an array which is accessible through the Calibration Values register (Addr: 5h). To save the time which it takes to execute a calibration, tCAL, or to allow re-use of a previous calibration result, these values can be read from and written to the register at a later time. For example, if an application requires the same input impedance, RIN, this feature can be used to load a previously determined set of values. For the calibration values to be valid, the ADC must be operating under the same conditions, including temperature, at which the calibration values were originally determined by the ADC. To read calibration values from the SPI, do the following: 1. Set ADC to desired operating conditions. 2. Set SSC (Addr: 4h, Bit 7) to 1. 3. Read exactly 240 times the Calibration Values register (Addr: 5h). The register values are R0, R1, R2... R239 where R0 is a dummy value. The contents of R<239:1> should be stored. 4. Set SSC (Addr: 4h, Bit 7) to 0. 5. Continue with normal operation. 42 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 To write calibration values to the SPI, do the following: 1. Set ADC to operating conditions at which Calibration Values were previously read. 2. Set SSC (Addr: 4h, Bit 7) to 1. 3. Write exactly 239 times the Calibration Values register (Addr: 5h). The registers should be written with stored register values R1, R2... R239. 4. Make two additional dummy writes of 0000h. 5. Set SSC (Addr: 4h, Bit 7) to 0. 6. Continue with normal operation. 5.3.3.7 Calibration and Power Down If PDI and PDQ are simultaneously asserted during a calibration cycle, the ADC12D1x00RF will immediately power down. The calibration cycle will continue when either or both channels are powered back up, but the calibration will be compromised due to the incomplete settling of bias currents directly after power up. Therefore, a new calibration should be executed upon powering the ADC12D1x00RF back up. In general, the ADC12D1x00RF should be recalibrated when either or both channels are powered back up, or after one channel is powered down. For best results, this should be done after the device has stabilized to its operating temperature. 5.3.3.8 Calibration and the Digital Outputs During calibration, the digital outputs (including DI, DId, DQ, DQd, and OR) are set logic-low, to reduce noise. The DCLK runs continuously during calibration. After the calibration is completed and the CalRun signal is logic-low, it takes an additional 60 Sampling Clock cycles before the output of the ADC12D1x00RF is valid converted data from the analog inputs. This is the time it takes for the pipeline to flush, as well as for other internal processes. 5.3.4 Power Down On the ADC12D1x00RF, the I- and Q-channels may be powered down individually. This may be accomplished through the control pins, PDI and PDQ, or through ECM. In ECM, the PDI and PDQ pins are logically OR'd with the Control Register setting. See Power-Down I-channel Pin (PDI) and PowerDown Q-channel Pin (PDQ) for more information. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 43 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 5.4 5.4.1 www.ti.com Device Functional Modes DES and Non-DES Mode The ADC12D1x00RF can operate in Dual-Edge Sampling (DES) or Non-DES Mode. The DES Mode allows for a single analog input to be sampled by both I- and Q-channels. One channel samples the input on the rising edge of the sampling clock and the other samples the same input signal on the falling edge of the sampling clock. A single input is thus sampled twice per clock cycle, resulting in an overall sample rate of twice the sampling clock frequency, for example, 3.2/2.0 GSPS with a 1600/1000 MHz sampling clock. Because DES Mode uses both I- and Q-channels to process the input signal, both channels must be powered up for the DES Mode to function properly. In Non-ECM, only the I-input may be used for the DES Mode input. See Dual Edge Sampling Pin (DES) for information on how to select the DES Mode. In ECM, either the I- or Q-input may be selected by first using the DES bit (Addr: 0h, Bit 7) to select the DES Mode. The DEQ Bit (Addr: 0h, Bit: 6) is used to select the Q-input, but the I-input is used by default. Also, both I- and Q-inputs may be driven externally, that is, DESIQ Mode, by using the DIQ bit (Addr: 0h, Bit 5). See The Analog Inputs for more information about how to drive the ADC in DES Mode. In DESCLKIQ Mode, the I- and Q-channels sample their inputs 180° out-of-phase with respect to one another, similar to the other DES Modes. DESCLKIQ Mode is similar to the DESIQ Mode, except that the I- and Q-channels remain electrically separate internal to the ADC12D1x00RF. For this reason, both I- and Q-inputs must be externally driven for the DESCLKIQ Mode. The DCK Bit (Addr: Eh, Bit: 6) is used to select the 180° sampling clock mode. The DESCLKIQ Mode results in the best bandwidth for the interleaved modes. In general, the bandwidth decreases from Non-DES Mode to DES Mode (specifically, DESI or DESQ) because both channels are sampling off the same input signal and non-ideal effects introduced by interleaving the two channels lower the bandwidth. Driving both I- and Q-channels externally (DESIQ Mode and DESCLKIQ Mode) results in better bandwidth because each channel is being driven, which reduces routing losses. The DESCLKIQ Mode has better bandwidth than the DESIQ Mode because the routing internal to the ADC12D1600/1000 is simpler, which results in less insertion loss. In the DES Mode, the outputs must be carefully interleaved to reconstruct the sampled signal. If the device is programmed into the 1:4 Demux DES Mode, the data is effectively demultiplexed by 1:4. If the sampling clock is 1600/1000 MHz, the effective sampling rate is doubled to 3.2/2.0 GSPS and each of the 4 output buses has an output rate of 800/500 MSPS. All data is available in parallel. To properly reconstruct the sampled waveform, the four bytes of parallel data that are output with each DCLK must be correctly interleaved. The sampling order is as follows, from the earliest to the latest: DQd, DId, DQ, DI. See Figure 4-3. If the device is programmed into the Non-Demux DES Mode, two bytes of parallel data are output with each edge of the DCLK in the following sampling order, from the earliest to the latest: DQ, DI. See Figure 4-4. 5.4.2 Demux and Non-Demux Mode The ADC12D1x00RF may be in one of two demultiplex modes: Demux Mode or Non-Demux Mode (also sometimes referred to as 1:1 Demux Mode). In Non-Demux Mode, the data from the input is simply output at the sampling rate on one 12-bit bus. In Demux Mode, the data from the input is output at half the sampling rate, on twice the number of buses. Demux and Non-Demux Mode may only be selected by the NDM pin. In Non-DES Mode, the output data from each channel may be demultiplexed by a factor of 1:2 (1:2 Demux Non-DES Mode) or not demultiplexed (Non-Demux Non-DES Mode). In DES Mode, the output data from both channels interleaved may be demultiplexed (1:4 Demux DES Mode) or not demultiplexed (Non-Demux DES Mode). See Table 5-5 for a selection of available modes. 44 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 5-5. Supported Demux, Data Rate Modes 5.5 NON-DEMUX MODE 1:2 DEMUX MODE DDR 0° Mode only 0° Mode / 90° Mode SDR Not available Rising / Falling Mode Programming 5.5.1 Control Modes The ADC12D1x00RF may be operated in one of two control modes: Non-extended Control Mode (NonECM) or Extended Control Mode (ECM). In the simpler Non-ECM (also sometimes referred to as Pin Control Mode), the user affects available configuration and control of the device through the control pins. The ECM provides additional configuration and control options through a serial interface and a set of 16 registers, most of which are available to the customer. 5.5.1.1 Non-Extended Control Mode In Non-extended Control Mode (Non-ECM), the Serial Interface is not active and all available functions are controlled through various pin settings. Non-ECM is selected by setting the ECE Pin to logic-high. For the control pins, "logic-high" and "logic-low" refer to VA and GND, respectively. Nine dedicated control pins provide a wide range of control for the ADC12D1x00RF and facilitate its operation. These control pins provide DES Mode selection, Demux Mode selection, DDR Phase selection, execute Calibration, Calibration Delay setting, Power-down I-channel, Power-down Q-channel, Test Pattern Mode selection, and Full-Scale Input Range selection. In addition to this, two dual-purpose control pins provide for AC/DCcoupled Mode selection and LVDS output common-mode voltage selection. See Table 5-6 for a summary. Table 5-6. Non-ECM Pin Summary PIN NAME LOGIC-LOW LOGIC-HIGH FLOATING DES Non-DES Mode DES Mode Not valid NDM Demux Mode Non-Demux Mode Not valid DDRPh 0° Mode / Falling Mode 90° Mode / Rising Mode Not valid DEDICATED CONTROL PINS CAL See Calibration Pin (CAL) Not valid CalDly Shorter delay Longer delay Not valid PDI I-channel active Power Down I-channel Power Down I-channel PDQ Q-channel active Power Down Q-channel Power Down Q-channel TPM Non-Test Pattern Mode Test Pattern Mode Not valid FSR Lower FS input Range Higher FS input Range Not valid DUAL-PURPOSE CONTROL PINS VCMO VBG AC-coupled operation Not allowed DC-coupled operation Not allowed Higher LVDS common-mode voltage Lower LVDS common-mode voltage Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 45 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 5.5.1.1.1 Dual Edge Sampling Pin (DES) The Dual Edge Sampling (DES) Pin selects whether the ADC12D1x00RF is in DES Mode (logic-high) or Non-DES Mode (logic-low). DES Mode means that a single analog input is sampled by both I- and Qchannels in a time-interleaved manner. One of the ADCs samples the input signal on the rising sampling clock edge (duty cycle corrected); the other ADC samples the input signal on the falling sampling clock edge (duty cycle corrected). In Non-ECM, only the I-input may be used for DES Mode, a.k.a. DESI Mode. In ECM, the Q-input may be selected through the DEQ Bit (Addr: 0h, Bit: 6), a.k.a. DESQ Mode. In ECM, both the I- and Q-inputs may be selected, a.k.a. DESIQ or DESCLKIQ Mode. To use this feature in ECM, use the DES bit in the Configuration Register (Addr: 0h; Bit: 7). See DES/Non-DES Mode for more information. 5.5.1.1.2 Non-Demultiplexed Mode Pin (NDM) The Non-Demultiplexed Mode (NDM) Pin selects whether the ADC12D1x00RF is in Demux Mode (logiclow) or Non-Demux Mode (logic-high). In Non-Demux Mode, the data from the input is produced at the sampled rate at a single 12-bit output bus. In Demux Mode, the data from the input is produced at half the sampled rate at twice the number of output buses. For Non-DES Mode, each I- or Q-channel will produce its data on one or two buses for Non-Demux or Demux Mode, respectively. For DES Mode, the selected channel will produce its data on two or four buses for Non-Demux or Demux Mode, respectively. This feature is pin-controlled only and remains active during both Non-ECM and ECM. See Demux/Nondemux Mode for more information. 5.5.1.1.3 Dual Data Rate Phase Pin (DDRPh) The Dual Data Rate Phase (DDRPh) Pin selects whether the ADC12D1x00RF is in 0° Mode (logic-low) or 90° Mode (logic-high) for DDR Mode. If the device is in SDR Mode, then the DDRPh Pin selects whether the ADC12D1x00RF is in Falling Mode (logic-low) or Rising Mode (logic-high). For DDR Mode, the Data may transition either with the DCLK transition (0° Mode) or halfway between DCLK transitions (90° Mode). The DDRPh Pin selects the mode for both the I-channel: DI- and DId-to-DCLKI phase relationship and for the Q-channel: DQ- and DQd-to-DCLKQ phase relationship. To use this feature in ECM, use the DPS bit in the Configuration Register (Addr: 0h; Bit: 14). See SDR / DDR Clock for more information. 5.5.1.1.4 Calibration Pin (CAL) The Calibration (CAL) Pin may be used to execute an on-command calibration or to disable the power-on calibration. The effect of calibration is to maximize the dynamic performance. To initiate an on-command calibration through the CAL pin, bring the CAL pin high for a minimum of tCAL_H input clock cycles after it has been low for a minimum of tCAL_L input clock cycles. Holding the CAL pin high upon power on will prevent execution of the power-on calibration. In ECM, this pin remains active and is logically OR'd with the CAL bit. To use this feature in ECM, use the CAL bit in the Configuration Register (Addr: 0h; Bit: 15). See Calibration Feature for more information. 5.5.1.1.5 Calibration Delay Pin (CalDly) The Calibration Delay (CalDly) Pin selects whether a shorter or longer delay time is present, after the application of power, until the start of the power-on calibration. The actual delay time is specified as tCalDly and may be found in Electrical Characteristics: Calibration. This feature is pin-controlled only and remains active in ECM. TI recommends selecting the desired delay time before power-on and not dynamically alter this selection. See Calibration Feature for more information. 46 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 5.5.1.1.6 Power-Down I-channel Pin (PDI) The Power-down I-channel (PDI) Pin selects whether the I-channel is powered down (logic-high) or active (logic-low). The digital data output pins, DI and DId, (both positive and negative) are put into a high impedance state when the I-channel is powered down. Upon return to the active state, the pipeline will contain meaningless information and must be flushed. The supply currents (typicals and limits) are available for the I-channel powered down or active and may be found in Electrical Characteristics: Power Supply. The device should be recalibrated following a power-cycle of PDI (or PDQ). This pin remains active in ECM. In ECM, either this pin or the PDI bit (Addr: 0h; Bit: 11) in the Control Register may be used to power down the I-channel. See Power Down for more information. 5.5.1.1.7 Power-Down Q-channel Pin (PDQ) The Power-down Q-channel (PDQ) Pin selects whether the Q-channel is powered down (logic-high) or active (logic-low). This pin functions similarly to the PDI pin, except that it applies to the Q-channel. The PDI and PDQ pins function independently of each other to control whether each I- or Q-channel is powered down or active. This pin remains active in ECM. In ECM, either this pin or the PDQ bit (Addr: 0h; Bit: 10) in the Control Register may be used to power down the Q-channel. See Power Down for more information. 5.5.1.1.8 Test Pattern Mode Pin (TPM) The Test Pattern Mode (TPM) Pin selects whether the output of the ADC12D1x00RF is a test pattern (logic-high) or the converted analog input (logic-low). The ADC12D1x00RF can provide a test pattern at the four output buses independently of the input signal to aid in system debug. In TPM, the ADC is disengaged and a test pattern generator is connected to the outputs, including ORI and ORQ. See Test Pattern Mode for more information. 5.5.1.1.9 Full-Scale Input Range Pin (FSR) The Full-Scale Input Range (FSR) Pin selects whether the full-scale input range for both the I- and Qchannel is higher (logic-high) or lower (logic-low). The input full-scale range is specified as VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference. In Non-ECM, the full-scale input range for each I- and Q-channel may not be set independently, but it is possible to do so in ECM. The device must be calibrated following a change in FSR to obtain optimal performance. To use this feature in ECM, use the Configuration Registers (Addr: 3h and Bh). See Input Control and Adjust for more information. 5.5.1.1.10 AC- and DC-Coupled Mode Pin (VCMO) The VCMO Pin serves a dual purpose. When functioning as an output, it provides the optimal commonmode voltage for the DC-coupled analog inputs. When functioning as an input, it selects whether the device is AC-coupled (logic-low) or DC-coupled (floating). This pin is always active, in both ECM and NonECM. 5.5.1.1.11 LVDS Output Common-mode Pin (VBG) The VBG Pin serves a dual purpose. When functioning as an output, it provides the bandgap reference. When functioning as an input, it selects whether the LVDS output common-mode voltage is higher (logichigh) or lower (floating). The LVDS output common-mode voltage is specified as VOS and may be found in Electrical Characteristics: Digital Control and Output Pin. This pin is always active, in both ECM and NonECM. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 47 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 5.5.1.2 www.ti.com Extended Control Mode In Extended Control Mode (ECM), most functions are controlled through the Serial Interface. In addition to this, several of the control pins remain active. See Table 5-1 for details. ECM is selected by setting the ECE Pin to logic-low. If the ECE Pin is set to logic-high (Non-ECM), then the registers are reset to their default values. So, a simple way to reset the registers is by toggling the ECE pin. Four pins on the ADC12D1x00RF control the Serial Interface: SCS, SCLK, SDI and SDO. This section covers the Serial Interface. The Register Definitions are located at the end of the data sheet so that they are easy to find, see Memory. 5.5.1.2.1 The Serial Interface The ADC12D1x00RF offers a Serial Interface that allows access to the sixteen control registers within the device. The Serial Interface is a generic 4-wire (optionally 3-wire) synchronous interface that is compatible with SPI type interfaces that are used on many micro-controllers and DSP controllers. Each serial interface access cycle is exactly 24 bits long. A register-read or register-write can be accomplished in one cycle. The signals are defined in such a way that the user can opt to simply join SDI and SDO signals in his system to accomplish a single, bidirectional SDI/O signal. A summary of the pins for this interface may be found in Table 5-7. See Figure 4-7 for the timing diagram and Electrical Characteristics: Serial Port Interface for timing specification details. Control register contents are retained when the device is put into power-down mode. If this feature is unused, the SCLK, SDI, and SCS pins may be left floating because they each have an internal pullup. Table 5-7. Serial Interface Pins PIN NAME C4 SCS (Serial Chip Select bar) C5 SCLK (Serial Clock) B4 SDI (Serial Data In) A3 SDO (Serial Data Out) SCS: Each assertion (logic-low) of this signal starts a new register access, that is, the SDI command field must be ready on the following SCLK rising edge. The user is required to deassert this signal after the 24th clock. If the SCS is deasserted before the 24th clock, no data read/write will occur. For a read operation, if the SCS is asserted longer than 24 clocks, the SDO output will hold the D0 bit until SCS is deasserted. For a write operation, if the SCS is asserted longer than 24 clocks, data write will occur normally through the SDI input upon the 24th clock. Setup and hold times, tSCS and tHCS, with respect to the SCLK must be observed. SCS must be toggled in between register access cycles. SCLK: This signal is used to register the input data (SDI) on the rising edge; and to source the output data (SDO) on the falling edge. The user may disable the clock and hold it at logic-low. There is no minimum frequency requirement for SCLK; see fSCLK in Electrical Characteristics: Serial Port Interface for more details. SDI: Each register access requires a specific 24-bit pattern at this input, consisting of a command field and a data field. If the SDI and SDO wires are shared (3-wire mode), then during read operations, it is necessary to tri-state the master which is driving SDI while the data field is being output by the ADC on SDO. The master must be tri-stated before the falling edge of the 8th clock. If SDI and SDO are not shared (4-wire mode), then this is not necessary. Setup and hold times, tSH and tSSU, with respect to the SCLK must be observed. SDO: This output is normally tri-stated and is driven only when SCS is asserted, the first 8 bits of command data have been received and it is a READ operation. The data is shifted out, MSB first, starting with the 8th clock's falling edge. At the end of the access, when SCS is deasserted, this output is tri-stated once again. If an invalid address is accessed, the data sourced will consist of all zeroes. If it is a read operation, there will be a bus turnaround time, tBSU, from when the last bit of the command field was read in until the first bit of the data field is written out. 48 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 5-8 shows the Serial Interface bit definitions. Table 5-8. Command and Data Field Definitions BIT NO. NAME COMMENTS 1 Read/Write (R/W) 1b indicates a read operation 0b indicates a write operation 2-3 Reserved Bits must be set to 10b 4-7 A<3:0> 16 registers may be addressed. The order is MSB first 8 X This is a "don't care" bit 9-24 D<15:0> Data written to or read from addressed register The serial data protocol is shown for a read and write operation in Figure 5-3 and Figure 5-4, respectively. 1 2 3 4 5 6 7 8 R/W 1 0 A3 A2 A1 A0 X 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 D5 D4 D3 D2 D1 D0 25 SCSb SCLK SDI SDO *Only required to be tri-stated in 3-wire mode. D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 Figure 5-3. Serial Data Protocol - Read Operation 1 2 3 4 5 6 7 8 R/W 1 0 A3 A2 A1 A0 X 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 25 SCSb SCLK SDI SDO Figure 5-4. Serial Data Protocol - Write Operation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 49 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 5.6 www.ti.com Register Maps Eleven read/write registers provide several control and configuration options in the Extended Control Mode. These registers have no effect when the device is in the Non-extended Control Mode. Each register description below also shows the Power-On Reset (POR) state of each control bit. See Table 5-9 for a summary. Table 5-9. Register Addresses A3 A2 A1 A0 HEX REGISTER ADDRESSED 0 0 0 0 0h Configuration Register 1 0 0 0 1 1h Reserved 0 0 1 0 2h I-channel Offset Adjust 0 0 1 1 3h I-channel Full-Scale Range Adjust 0 1 0 0 4h Calibration Adjust 0 1 0 1 5h Calibration Values 0 1 1 0 6h Reserved 0 1 1 1 7h DES Timing Adjust 1 0 0 0 8h Reserved 1 0 0 1 9h Reserved 1 0 1 0 Ah Q-channel Offset Adjust 1 0 1 1 Bh Q-channel Full-Scale Range Adjust 1 1 0 0 Ch Aperture Delay Coarse Adjust 1 1 0 1 Dh Aperture Delay Fine Adjust 1 1 1 0 Eh AutoSync 1 1 1 1 Fh Reserved Table 5-10. Configuration Register 1 Addr: 0h (0000b) POR state: 2000h Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 Name CAL DPS OVS TPM PDI PDQ Res LFS DES DEQ DIQ 2SC TSE SDR POR 0 0 1 0 0 0 0 0 0 0 0 0 0 0 1 0 Res 0 0 Bit 15 CAL: Calibration Enable. When this bit is set to 1b, an on-command calibration is initiated. This bit is not reset automatically upon completion of the calibration. Therefore, the user must reset this bit to 0b and then set it to 1b again to execute another calibration. This bit is logically OR'd with the CAL Pin; both bit and pin must be set to 0b before either is used to execute a calibration. Bit 14 DPS: DCLK Phase Select. In DDR, set this bit to 0b to select the 0° Mode DDR Data-to-DCLK phase relationship and to 1b to select the 90° Mode. In SDR, set this bit to 0b to transition the data on the Rising edge of DCLK; set this bit to 1b to transition the data on the Falling edge of DCLK. (1) Bit 13 OVS: Output Voltage Select. This bit sets the differential voltage level for the LVDS outputs including Data, OR, and DCLK. 0b selects the lower level and 1b selects the higher level. See VOD in Electrical Characteristics: Digital Control and Output Pin for details. Bit 12 TPM: Test Pattern Mode. When this bit is set to 1b, the device will continually output a fixed digital pattern at the digital Data and OR outputs. When set to 0b, the device will continually output the converted signal, which was present at the analog inputs. See Test Pattern Mode for details about the TPM pattern. Bit 11 PDI: Power-down I-channel. When this bit is set to 0b, the I-channel is fully operational; when it is set to 1b, the I-channel is powered-down. The I-channel may be powered-down through this bit or the PDI Pin, which is active, even in ECM. Bit 10 PDQ: Power-down Q-channel. When this bit is set to 0b, the Q-channel is fully operational; when it is set to 1b, the Q-channel is powered down. The Q-channel may be powered down through this bit or the PDQ Pin, which is active, even in ECM. Bit 9 Reserved. Must be set as shown. Bit 8 LFS: Low-Frequency Select. If the sampling clock (CLK) is at or below 300 MHz, set this bit to 1b for improved performance. Bit 7 DES: Dual-Edge Sampling Mode select. When this bit is set to 0b, the device will operate in the Non-DES Mode; when it is set to 1b, the device will operate in the DES Mode. See DES/Non-DES Mode for more information. (1) 50 This pin and bit functionality is not tested in production test; performance is tested in the specified and default mode only. Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Bit 6 DEQ: DES Q-input select, a.k.a. DESQ Mode. When the device is in DES Mode, this bit selects the input that the device will operate on. The default setting of 0b selects the I-input and 1b selects the Q-input. Bit 5 DIQ: DES I- and Q-input, a.k.a. DESIQ Mode. When in DES Mode, setting this bit to 1b shorts the I- and Q-inputs internally to the device. If the bit is left at its default 0b, the I- and Q-inputs remain electrically separate. In this mode, both the I- and Qinputs must be externally driven; see DES/Non-DES Mode for more information. (2) The allowed DES Modes settings are shown below. For DESCLKIQ Mode, see Addr Eh. Mode Addr 0h, Bit<7:5> Addr Eh, Bit<6> Non-DES Mode 000b 0b DESI Mode 100b 0b DESQ Mode 110b 0b DESIQ Mode 101b 0b DESCLKIQ Mode 000b 1b Bit 4 2SC: Two's Complement output. For the default setting of 0b, the data is output in Offset Binary format; when set to 1b, the data is output in Two's Complement format. (1) Bit 3 TSE: Time Stamp Enable. For the default setting of 0b, the Time Stamp feature is not enabled; when set to 1b, the feature is enabled. See Output Control and Adjust for more information about this feature. Bit 2 SDR: Single Data Rate. For the default setting of 0b, the data is clocked in Dual Data Rate; when set to 1b, the data is clocked in Single Data Rate. See Output Control and Adjust for more information about this feature. See Table 5-5 for a selection of available modes. Bits 1:0 Reserved. Must be set as shown. (2) This feature functionality is not tested in production test; performance is tested in the specified/default mode only. Table 5-11. Reserved Addr: 1h (0001b) Bit POR state: 2907h 15 14 13 12 11 10 9 8 Name POR 7 6 5 4 3 2 1 0 0 0 0 0 0 1 1 1 5 4 3 2 1 0 0 0 0 0 0 Res 0 Bits 15:0 0 1 0 1 0 0 1 Reserved. Must be set as shown. Table 5-12. I-channel Offset Adjust Addr: 2h (0010b) Bit Name POR POR state: 0000h 15 14 13 Res 0 0 12 11 10 9 8 7 6 0 0 0 0 0 0 OS 0 OM(11:0) 0 0 Bits 15:13 Reserved. Must be set to 0b. Bit 12 OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting this bet to 1b incurs a negative offset of the set magnitude. Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of approximately 11 µV. Monotonicity is specified by design only for the 9 MSBs. Code Offset [mV] 0000 0000 0000 (default) 0 1000 0000 0000 22.5 1111 1111 1111 45 Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 51 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 5-13. I-channel Full Scale Range Adjust Addr: 3h (0011b) Bit 15 Name Res POR 0 POR state: 4000h 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 FM(14:0) 1 0 0 0 0 0 0 0 Bit 15 Reserved. Must be set to 0b. Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The range is from 600 mV (0d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low) setting in Non-ECM. A greater range of FSR values is available in ECM, that is, FSR values greater than 800 mV. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for characterization details. Code FSR [mV] 000 0000 0000 0000 600 100 0000 0000 0000 (default) 800 111 1111 1111 1111 1000 Table 5-14. Calibration Adjust Addr: 4h (0100b) POR state: DB4Bh Bit 15 14 Name Res CSS POR 1 1 13 12 11 0 1 1 10 9 8 0 1 1 Res 7 6 5 4 1 0 0 SSC 0 3 2 1 0 0 1 1 Res 1 Bit 15 Reserved. Must be set as shown. Bit 14 CSS: Calibration Sequence Select. The default 1b selects the following calibration sequence: reset all previously calibrated elements to nominal values, do RIN Calibration, do internal linearity Calibration. Setting CSS = 0b selects the following calibration sequence: do not reset RIN to its nominal value, skip RIN calibration, do internal linearity Calibration. The calibration must be completed at least one time with CSS = 1b to calibrate RIN. Subsequent calibrations may be run with CSS = 0b (skip RIN calibration) or 1b (full RIN and internal linearity Calibration). Bits 13:8 Reserved. Must be set as shown. Bit 7 SSC: SPI Scan Control. Setting this control bit to 1b allows the calibration values, stored in Addr: 5h, to be read/written. When not reading/writing the calibration values, this control bit should left at its default 0b setting. See Calibration Feature for more information. Bits 6:0 Reserved. Must be set as shown. Table 5-15. Calibration Values Addr: 5h (0101b) Bit POR state: XXXXh 15 14 13 12 11 10 9 8 X X X X X X X X Name 7 6 5 4 3 2 1 0 X X X X X X X SS(15:0) POR Bits 15:0 X SS(15:0): SPI Scan. When the ADC performs a self-calibration, the values for the calibration are stored in this register and may be read from/ written to it. Set SSC (Addr: 4h, Bit 7) to read/write. See Calibration Feature for more information. Table 5-16. Reserved Addr: 6h (0110b) Bit 15 POR state: 1C2Eh 14 13 12 11 10 9 8 Name POR 0 Bits 15:0 52 7 6 5 4 3 2 1 0 0 0 1 0 1 1 1 0 Res 0 0 1 1 1 0 0 Reserved. Must be set as shown. Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 5-17. DES Timing Adjust Addr: 7h (0111b) Bit POR state: 8142h 15 14 13 Name POR 12 11 10 9 8 7 6 5 DTA(6:0) 1 0 0 4 3 2 1 0 0 0 1 0 Res 0 0 0 0 1 0 1 0 0 Bits 15:9 DTA(6:0): DES Mode Timing Adjust. In the DES Mode, the time at which the falling edge sampling clock samples relative to the rising edge of the sampling clock may be adjusted; the automatic duty cycle correction continues to function. See Input Control and Adjust for more information. The nominal step size is 30fs. Bits 8:0 Reserved. Must be set as shown. Table 5-18. Reserved Addr: 8h (1000b) Bit POR state: 0F0Fh 15 14 13 12 11 10 9 8 Name POR 7 6 5 4 3 2 1 0 0 0 0 0 1 1 1 1 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 5 4 3 2 1 0 0 0 0 0 0 Res 0 Bits 15:0 0 0 0 1 1 1 1 Reserved. Must be set as shown. Table 5-19. Reserved Addr: 9h (1001b) Bit POR state: 0000h 15 14 13 12 11 10 9 8 Name POR Res 0 Bits 15:0 0 0 0 0 0 0 0 Reserved. Must be set as shown. Table 5-20. Q-channel Offset Adjust Addr: Ah (1010b) Bit Name POR POR state: 0000h 15 14 13 Res 0 0 12 11 10 9 8 7 OS 0 6 OM(11:0) 0 0 0 0 0 0 0 0 Bits 15:13 Reserved. Must be set to 0b. Bit 12 OS: Offset Sign. The default setting of 0b incurs a positive offset of a magnitude set by Bits 11:0 to the ADC output. Setting this bet to 1b incurs a negative offset of the set magnitude. Bits 11:0 OM(11:0): Offset Magnitude. These bits determine the magnitude of the offset set at the ADC output (straight binary coding). The range is from 0 mV for OM(11:0) = 0d to 45 mV for OM(11:0) = 4095d in steps of approximately 11 µV. Monotonicity is specified by design only for the 9 MSBs. Code Offset [mV] 0000 0000 0000 (default) 0 1000 0000 0000 22.5 1111 1111 1111 45 Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 53 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 5-21. Q-channel Full-Scale Range Adjust Addr: Bh (1011b) Bit 15 Name Res POR 0 POR state: 4000h 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 FM(14:0) 1 0 0 0 0 0 0 0 Bit 15 Reserved. Must be set to 0b. Bits 14:0 FM(14:0): FSR Magnitude. These bits increase the ADC full-scale range magnitude (straight binary coding.) The range is from 600 mV (0d) to 1000 mV (32767d) with the default setting at 800 mV (16384d). Monotonicity is specified by design only for the 9 MSBs. The mid-range (low) setting in ECM corresponds to the nominal (low) setting in Non-ECM. A greater range of FSR values is available in ECM, that is, FSR values greater than 800 mV. See VIN_FSR in Electrical Characteristics: Analog Input/Output and Reference for characterization details. Code FSR [mV] 000 0000 0000 0000 600 100 0000 0000 0000 (default) 800 111 1111 1111 1111 1000 Table 5-22. Aperture Delay Coarse Adjust Addr: Ch (1100b) Bit POR state: 0004h 15 14 13 12 11 0 0 0 0 0 Name 10 9 8 7 6 5 4 0 0 0 0 0 CAM(11:0) POR 0 0 3 2 1 STA DCC 0 1 0 Res 0 0 Bits 15:4 CAM(11:0): Coarse Adjust Magnitude. This 12-bit value determines the amount of delay that will be applied to the input CLK signal. The range is 0 ps delay for CAM(11:0) = 0d to a maximum delay of 825 ps for CAM(11:0) = 2431d (±95 ps due to PVT variation) in steps of approximately 340 fs. For code CAM(11:0) = 2432d and above, the delay saturates and the maximum delay applies. Additional, finer delay steps are available in register Dh. The STA (Bit 3) must be selected to enable this function. Bit 3 STA: Select tAD Adjust. Set this bit to 1b to enable the tAD adjust feature, which will make both coarse and fine adjustment settings, that is, CAM(11:0) and FAM(5:0), available. Bit 2 DCC: Duty Cycle Correct. This bit can be set to 0b to disable the automatic duty-cycle stabilizer feature of the chip. This feature is enabled by default. Bits 1:0 Reserved. Must be set to 0b. Table 5-23. Aperture Delay Fine Adjust Addr: Dh (1101b) Bit 15 POR state: 0000h 14 13 Name 12 11 10 9 FAM(5:0) POR 0 0 0 0 8 7 6 5 4 Res 0 0 0 3 2 1 0 0 0 0 0 Res 0 0 0 0 0 Bits 15:10 FAM(5:0): Fine Aperture Adjust Magnitude. This 6-bit value determines the amount of additional delay that will be applied to the input CLK when the Clock Phase Adjust feature is enabled through STA (Addr: Ch, Bit 3). The range is straight binary from 0 ps delay for FAM(5:0) = 0d to 2.3 ps delay for FAM(5:0) = 63d (±300 fs due to PVT variation) in steps of approximately 36 fs. Bits 9:0 Reserved. Must be set as shown. 54 Detailed Description Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Table 5-24. AutoSync (1) Addr: Eh (1110b) Bit 15 POR state: 0003h 14 13 12 Name POR 11 10 9 8 7 DRC(8:0) 0 0 0 0 0 0 0 0 0 6 5 DCK Res 0 0 4 3 SP(1:0) 0 0 2 1 0 ES DOC DR 0 1 1 (1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only. Bits 15:7 DRC(8:0): Delay Reference Clock (8:0). These bits may be used to increase the delay on the input reference clock when synchronizing multiple ADCs. The delay may be set from a minimum of 0s (0d) to a maximum of 1200 ps (319d). The delay remains the maximum of 1200 ps for any codes above or equal to 319d. See Synchronizing Multiple ADC12D1600/1000RFS in a System for more information. Bit 6 DCK: DESCLKIQ Mode. Set this bit to 1b to enable Dual-Edge Sampling, in which the Sampling Clock samples the I- and Qchannels 180º out of phase with respect to one another, that is, the DESCLKIQ Mode. To select the DESCLKIQ Mode, Addr: 0h, Bits <7:5> must also be set to 000b. See Input Control and Adjust for more information. (1) Bit 5 Reserved. Must be set as shown. Bits 4:3 SP(1:0): Select Phase. These bits select the phase of the reference clock which is latched. The codes correspond to the following phase shift: 00 = 0° 01 = 90° 10 = 180° 11 = 270° Bit 2 ES: Enable Slave. Set this bit to 1b to enable the Slave Mode of operation. In this mode, the internal divided clocks are synchronized with the reference clock coming from the master ADC. The master clock is applied on the input pins RCLK. If this bit is set to 0b, then the device is in Master Mode. Bit 1 DOC: Disable Output reference Clocks. Setting this bit to 0b sends a CLK/4 signal on RCOut1 and RCOut2. The default setting of 1b disables these output drivers. This bit functions as described, regardless of whether the device is operating in Master or Slave Mode, as determined by ES (Bit 2). Bit 0 DR: Disable Reset. The default setting of 1b leaves the DCLK_RST functionality disabled. Set this bit to 0b to enable DCLK_RST functionality. (1) This feature functionality is not tested in production test; performance is tested in the specified/default mode only. Table 5-25. Reserved Addr: Fh (1111b) Bit 15 POR state: 001Dh 14 13 12 11 10 9 8 Name POR Bits 15:0 7 6 5 4 3 2 1 0 0 0 0 1 1 1 0 1 Res 0 0 0 0 0 0 0 0 Reserved. This address is read only. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Detailed Description 55 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 6 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 6.1 Application Information 6.1.1 The Analog Inputs The ADC12D1x00RF will continuously convert any signal which is present at the analog inputs, as long as a CLK signal is also provided to the device. This section covers important aspects related to the analog inputs including: acquiring the input, driving the ADC in DES Mode, the reference voltage and FSR, out-ofrange indication, AC- and DC-coupled signals, and single-ended input signals. 6.1.1.1 Acquiring the Input The Aperture Delay, tAD, is the amount of delay, measured from the sampling edge of the clock input, after which signal present at the input pin is sampled inside the device. Data is acquired at the rising edge of CLK+ in Non-DES Mode and both the falling and rising edges of CLK+ in DES Mode. In Non-DES Mode, the I- and Q-channels always sample data on the rising edge of CLK+. In DES Mode, that is, DESI, DESQ, DESIQ, and DESCLKIQ, the I-channel samples data on the rising edge of CLK+ and the Qchannel samples data on the falling edge of CLK+. The digital equivalent of that data is available at the digital outputs a constant number of sampling clock cycles later for the DI, DQ, DId and DQd output buses, a.k.a. Latency, depending on the demultiplex mode which is selected. In addition to the Latency, there is a constant output delay, tOD, before the data is available at the outputs. See tOD in the timing diagrams. See tLAT, tAD, and tODin Electrical Characteristics: AC. 6.1.1.2 Driving the ADC in DES Mode The ADC12D1x00RF can be configured as either a 2-channel, 1600/1000 GSPS device (Non-DES Mode) or a 1-channel 3.2/2.0 GSPS device (DES Mode). When the device is configured in DES Mode, there is a choice for with which input to drive the single-channel ADC. These are the 3 options: DES – externally driving the I-channel input only. This is the default selection when the ADC is configured in DES Mode. It may also be referred to as “DESI” for added clarity. DESQ – externally driving the Q-channel input only. DESIQ, DESCLKIQ – externally driving both the I- and Q-channel inputs. VinI+ and VinQ+ should be driven with the exact same signal. VinI- and VinQ- should be driven with the exact same signal, which is the differential compliment to the one driving VinI+ and VinQ+. The input impedance for each I- and Q-input is 100-Ω differential (or 50-Ω single-ended), so the trace to each VinI+, VinI-, VinQ+, and VinQ- should always be 50-Ω single-ended. If a single I- or Q-input is being driven, then that input will present a 100-Ω differential load. For example, if a 50-Ω single-ended source is driving the ADC, then a 1:2 balun will transform the impedance to 100-Ω differential. However, if the ADC is being driven in DESIQ Mode, then the 100-Ω differential impedance from the I-input will appear in parallel with the Q-input for a composite load of 50-Ω differential and a 1:1 balun would be appropriate. See Figure 6-1 for an example circuit driving the ADC in DESIQ Mode. A recommended part selection is using the Mini-Circuits TC1-1-13MA+ balun with Ccouple = 0.22 µF. 56 Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Ccouple 50: Source VINI+ 100: 1:1 Balun Ccouple Ccouple VINIVINQ+ 100: Ccouple VINQADC12D1600/1000RF Figure 6-1. Driving DESIQ Mode In the case that only one channel is used in Non-DES Mode or that the ADC is driven in DESI or DESQ Mode, the unused analog input should be terminated to reduce any noise coupling into the ADC. See Table 6-1 for details.* The timing for these figures is shown for the one input only (I or Q). However, both I- and Q-inputs may be used. For this case, the I-channel functions precisely the same as the Q-channel, with VinI, DCLKI, DId, and DI instead of VinQ, DCLKQ, DQd, and DQ. Both I- and Q-channel use the same CLK. Table 6-1. Unused Analog Input Recommended Termination 6.1.1.3 MODE POWER DOWN COUPLING RECOMMENDED TERMINATION Non-DES Yes AC/DC Tie Unused+ and Unused- to Vbg DES/NonDES No DC Tie Unused+ and Unused- to Vbg DES/NonDES No AC Tie Unused+ to Unused- FSR and the Reference Voltage The full-scale analog differential input range (VIN_FSR) of the ADC12D1x00RF is derived from an internal bandgap reference. In Non-ECM, this full-scale range has two settings controlled by the FSR Pin; see Full-Scale Input Range Pin (FSR). The FSR Pin operates on both I- and Q-channels. In ECM, the fullscale range may be independently set for each channel through Addr:3h and Bh with 15 bits of precision; see Memory. The best SNR is obtained with a higher full-scale input range, but better distortion and SFDR are obtained with a lower full-scale input range. It is not possible to use an external analog reference voltage to modify the full-scale range, and this adjustment should only be done digitally, as described. A buffered version of the internal bandgap reference voltage is made available at the VBG Pin for the user. The VBG pin can drive a load of up to 80 pF and source or sink up to 100 μA. It should be buffered if more current than this is required. This pin remains as a constant reference voltage regardless of what full-scale range is selected and may be used for a system reference. VBG is a dual-purpose pin and it may also be used to select a higher LVDS output common-mode voltage; see LVDS Output Common-mode Pin (VBG). Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 57 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 6.1.1.4 www.ti.com Out-Of-Range Indication Differential input signals are digitized to 12 bits, based on the full-scale range. Signal excursions beyond the full-scale range, that is, greater than +VIN_FSR/2 or less than -VIN_FSR/2, will be clipped at the output. An input signal which is above the FSR will result in all 1's at the output and an input signal which is below the FSR will result in all 0's at the output. When the conversion result is clipped for the I-channel input, the Out-of-Range I-channel (ORI) output is activated such that ORI+ goes high and ORI- goes low while the signal is out of range. This output is active as long as accurate data on either or both of the buses would be outside the range of 000h to FFFh. The Q-channel has a separate ORQ which functions similarly. 6.1.1.5 Maximum Input Range The recommended operating and absolute maximum input range may be found in Recommended Operating Condtions and Absolute Maximum Ratings, respectively. Under the stated allowed operating conditions, each Vin+ and Vin- input pin may be operated in the range from 0 V to 2.15 V if the input is a continuous 100% duty cycle signal and from 0 V to 2.5 V if the input is a 10% duty cycle signal. The absolute maximum input range for Vin+ and Vin- is from –0.15 V to 2.5 V. These limits apply only for input signals for which the input common-mode voltage is properly maintained. 6.1.1.6 AC-Coupled Input Signals The ADC12D1x00RF analog inputs require a precise common-mode voltage. This voltage is generated on-chip when AC-coupling Mode is selected. See AC/DC-Coupled Mode Pin (VCMO) for more information about how to select AC-coupled Mode. In AC-coupled Mode, the analog inputs must of course be AC-coupled. For an ADC12D1x00RF used in a typical application, this may be accomplished by on-board capacitors, as shown in Figure 6-2. For the ADC12D1600RFRB, the SMA inputs on the Reference Board are directly connected to the analog inputs on the ADC12D1600RF, so this may be accomplished by DC blocks (included with the hardware kit). When the AC-coupled Mode is selected, an analog input channel that is not used (for example, in DES Mode) should be connected to AC ground, for example, through capacitors to ground. Do not connect an unused analog input directly to ground. Ccouple VIN+ Ccouple VINVCMO ADC12D1600/1000RF Figure 6-2. AC-Coupled Differential Input The analog inputs for the ADC12D1x00RF are internally buffered, which simplifies the task of driving these inputs and the RC pole which is generally used at sampling ADC inputs is not required. If the user desires to place an amplifier circuit before the ADC, care should be taken to choose an amplifier with adequate noise and distortion performance, and adequate gain at the frequencies used for the application. 58 Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 6.1.1.7 SNAS519H – JULY 2011 – REVISED AUGUST 2015 DC-Coupled Input Signals In DC-coupled Mode, the ADC12D1x00RF differential inputs must have the correct common-mode voltage. This voltage is provided by the device itself at the VCMO output pin. TI recommends using this voltage because the VCMO output potential will change with temperature and the common-mode voltage of the driving device should track this change. Full-scale distortion performance falls off as the input common-mode voltage deviates from VCMO. Therefore, TI recommends keeping the input common-mode voltage within 100 mV of VCMO (typical), although this range may be extended to ±150 mV (maximum). See VCMI in Electrical Characteristics: Analog Input/Output and Reference and ENOB vs. VCMI in Typical Characteristics . Performance in AC- and DC-coupled Mode are similar, provided that the input commonmode voltage at both analog inputs remains within 100 mV of VCMO. 6.1.1.8 Single-Ended Input Signals The analog inputs of the ADC12D1x00RF are not designed to accept single-ended signals. The best way to handle single-ended signals is to first convert them to differential signals before presenting them to the ADC. The easiest way to accomplish single-ended to differential signal conversion is with an appropriate balun-transformer, as shown in Figure 6-3. Ccouple 50: Source VIN+ 100: 1:2 Balun Ccouple VINADC12D1600/1000RF Figure 6-3. Single-Ended to Differential Conversion Using a Balun When selecting a balun, it is important to understand the input architecture of the ADC. The impedance of the analog source should be matched to the ADC12D1x00RF's ON-chip 100-Ω differential input termination resistor. The range of this termination resistor is specified as RIN in Electrical Characteristics: Analog Input/Output and Reference. 6.1.2 The Clock Inputs The ADC12D1x00RF has a differential clock input, CLK+ and CLK-, which must be driven with an ACcoupled, differential clock signal. This provides the level shifting necessary to allow for the clock to be driven with LVDS, PECL, LVPECL, or CML levels. The clock inputs are internally terminated to 100-Ω differential and self-biased. This section covers coupling, frequency range, level, duty-cycle, jitter, and layout considerations. 6.1.2.1 CLK Coupling The clock inputs of the ADC12D1x00RF must be capacitively coupled to the clock pins as indicated in Figure 6-4. Ccouple CLK+ Ccouple CLK- ADC12D1600/1000RF Figure 6-4. Differential Input Clock Connection The choice of capacitor value will depend on the clock frequency, capacitor component characteristics and other system economic factors. For example, on the ADC12D1600RFRB, the capacitors have the value Ccouple = 4.7 nF which yields a highpass cutoff frequency, fc = 677.2 kHz. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 59 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 6.1.2.2 www.ti.com CLK Frequency Although the ADC12D1x00RF is tested and its performance is ensured with a differential 1- or 1.6-GHz sampling clock, it will typically function well over the input clock frequency range; see fCLK(min) and fCLK(max) in Electrical Characteristics: AC. Operation up to fCLK(max) is possible if the maximum ambient temperatures indicated are not exceeded. Operating at sample rates above fCLK(max) for the maximum ambient temperature may result in reduced device reliability and product lifetime. This is due to the fact that higher sample rates results in higher power consumption and die temperatures. If fCLK < 300 MHz, enable LFS in the Control Register (Addr: 0h, Bit 8). 6.1.2.3 CLK Level The input clock amplitude is specified as VIN_CLK in Electrical Characteristics: Sampling Clock. Input clock amplitudes above the max VIN_CLK may result in increased input offset voltage. This would cause the converter to produce an output code other than the expected 2047/2048 when both input pins are at the same potential. Insufficient input clock levels will result in poor dynamic performance. Both of these results may be avoided by keeping the clock input amplitude within the specified limits of VIN_CLK. 6.1.2.4 CLK Duty Cycle The duty cycle of the input clock signal can affect the performance of any A/D converter. The ADC12D1x00RF features a duty cycle clock correction circuit which can maintain performance over the 20%-to-80% specified clock duty-cycle range. This feature is enabled by default and provides improved ADC clocking, especially in the Dual-Edge Sampling (DES) Mode. 6.1.2.5 CLK Jitter High speed, high performance ADCs such as the ADC12D1x00RF require a very stable input clock signal with minimum phase noise or jitter. ADC jitter requirements are defined by the ADC resolution (number of bits), maximum ADC input frequency and the input signal amplitude relative to the ADC input full scale range. The maximum jitter (the sum of the jitter from all sources) allowed to prevent a jitter-induced reduction in SNR is found to be tJ(MAX) = ( VIN(P-P)/ VFSR) × (1/(2(N+1) × π × fIN)) where • • • • tJ(MAX) is the rms total of all jitter sources in seconds VIN(P-P) is the peak-to-peak analog input signal VFSR is the full-scale range of the ADC "N" is the ADC resolution in bits and fIN is the maximum input frequency, in Hertz, at the ADC analog input. (1) tJ(MAX) is the square root of the sum of the squares (RSS) of the jitter from all sources, including: the ADC input clock, system, input signals and the ADC itself. Because the effective jitter added by the ADC is beyond user control, TI recommends keeping the sum of all other externally added jitter to a minimum. 6.1.2.6 CLK Layout The ADC12D1x00RF clock input is internally terminated with a trimmed 100-Ω resistor. The differential input clock line pair should have a characteristic impedance of 100 Ω and (when using a balun), be terminated at the clock source in that (100 Ω) characteristic impedance. It is a good practice to keep the ADC input clock line as short as possible, tightly coupled, keep it well away from any other signals, and treat it as a transmission line. Otherwise, other signals can introduce jitter into the input clock signal. Also, the clock signal can introduce noise into the analog path if it is not properly isolated. 60 Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 6.1.3 SNAS519H – JULY 2011 – REVISED AUGUST 2015 The LVDS Outputs The Data, ORI, ORQ, DCLKI and DCLKQ outputs are LVDS. The electrical specifications of the LVDS outputs are compatible with typical LVDS receivers available on ASIC and FPGA chips; but they are not IEEE or ANSI communications standards compliant due to the low 1.9-V supply used on this chip. These outputs should be terminated with a 100-Ω differential resistor placed as closely to the receiver as possible. If the 100-Ω differential resistance is built in to the receiver, then an externally placed resistor is not necessary. This section covers common-mode and differential voltage, and data rate. 6.1.3.1 Common-Mode and Differential Voltage The LVDS outputs have selectable common-mode and differential voltage, VOS and VOD; see Electrical Characteristics: Digital Control and Output Pin. See Output Control and Adjust for more information. Selecting the higher VOS will also increase VOD slightly. The differential voltage, VOD, may be selected for the higher or lower value. For short LVDS lines and low noise systems, satisfactory performance may be realized with the lower VOD. This will also result in lower power consumption. If the LVDS lines are long and/or the system in which the ADC12D1x00RF is used is noisy, it may be necessary to select the higher VOD. 6.1.3.2 Output Data Rate The data is produced at the output at the same rate it is sampled at the input. The minimum recommended input clock rate for this device is fCLK(MIN); see Electrical Characteristics: AC. However, it is possible to operate the device in 1:2 Demux Mode and capture data from just one 12-bit bus, for example, just DI (or DId) although both DI and DId are fully operational. This will decimate the data by two and effectively halve the data rate. 6.1.3.3 Terminating Unused LVDS Output Pins If the ADC is used in Non-Demux Mode, then only the DI and DQ data outputs will have valid data present on them. The DId and DQd data outputs may be left not connected; if unused, they are internally tristated. Similarly, if the Q-channel is powered-down (that is, PDQ is logic-high), the DQ data output pins, DCLKQ and ORQ may be left not connected. 6.1.4 Synchronizing Multiple ADC12D1x00RFS in a System The ADC12D1x00RF has two features to assist the user with synchronizing multiple ADCs in a system; AutoSync and DCLK Reset. The AutoSync feature is new and designates one ADC12D1x00RF as the Master ADC and other ADC12D1x00RFs in the system as Slave ADCs. The DCLK Reset feature performs the same function as the AutoSync feature, but is the first generation solution to synchronizing multiple ADCs in a system; it is disabled by default. For the application in which there are multiple Master and Slave ADC12D1x00RFs in a system, AutoSync may be used to synchronize the Slave ADC12D1x00RFs to each respective Master ADC12D1x00RF and the DCLK Reset may be used to synchronize the Master ADC12D1x00RFs to each other. If the AutoSync or DCLK Reset feature is not used, see Table 6-2 for recommendations about terminating unused pins. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 61 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Table 6-2. Unused AutoSync and DCLK Reset Pin Recommendation 6.1.4.1 PINS UNUSED TERMINATION RCLK+/- Do not connect. RCOUT1+/- Do not connect. RCOUT2+/- Do not connect. DCLK_RST+ Connect to GND through 1-kΩ resistor. DCLK_RST- Connect to VA through 1-kΩ resistor. AutoSync Feature AutoSync is a new feature which continuously synchronizes the outputs of multiple ADC12D1x00RFs in a system. The feature may be used to synchronize the DCLK and data outputs of one or more Slave ADC12D1x00RFs to one Master ADC12D1x00RF. Several advantages of this feature include: no special synchronization pulse required, any upset in synchronization is recovered upon the next DCLK cycle, and the Master/Slave ADC12D1x00RFs may be arranged as a binary tree so that any upset will quickly propagate out of the system. An example system is shown below in Figure 6-5 which consists of one Master ADC and two Slave ADCs. For simplicity, only one DCLK is shown; in reality, there is DCLKI and DCLKQ, but they are always in phase with one another. RCLK Slave 2 RCOut1 ADC12D1600/1000RF RCOut2 DCLK CLK RCLK CLK Slave 1 RCOut1 ADC12D1600/1000RF RCOut2 DCLK CLK RCLK Master RCOut1 ADC12D1600/1000RF RCOut2 DCLK CLK Figure 6-5. AutoSync Example To synchronize the DCLK (and Data) outputs of multiple ADCs, the DCLKs must transition at the same time, as well as be in phase with one another. The DCLK at each ADC is generated from the CLK after some latency, plus tOD minus tAD. Therefore, in order for the DCLKs to transition at the same time, the CLK signal must reach each ADC at the same time. To tune out any differences in the CLK path to each ADC, the tAD adjust feature may be used. However, using the tAD adjust feature will also affect when the DCLK is produced at the output. If the device is in Demux Mode, then there are four possible phases which each DCLK may be generated on because the typical CLK = 1GHz and DCLK = 250 MHz for this case. The RCLK signal controls the phase of the DCLK, so that each Slave DCLK is on the same phase as the Master DCLK. The AutoSync feature may only be used through the Control Registers. For more information, see AN2132 Synchronizing Multiple GSPS ADCs in a System: The AutoSync Feature (SNAA073). 6.1.4.2 DCLK Reset Feature The DCLK reset feature is available through ECM, but it is disabled by default. DCLKI and DCLKQ are always synchronized, by design, and do not require a pulse from DCLK_RST to become synchronized. 62 Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 The DCLK_RST signal must observe certain timing requirements, which are shown in Figure 4-5 of the Timing Diagrams. The DCLK_RST pulse must be of a minimum width and its deassertion edge must observe setup and hold times with respect to the CLK input rising edge. These timing specifications are listed as tPWR, tSR and tHR and may be found in Electrical Characteristics: AC. The DCLK_RST signal can be asserted asynchronously to the input clock. If DCLK_RST is asserted, the DCLK output is held in a designated state (logic-high) in Demux Mode; in Non-Demux Mode, the DCLK continues to function normally. Depending upon when the DCLK_RST signal is asserted, there may be a narrow pulse on the DCLK line during this reset event. When the DCLK_RST signal is deasserted, there are tSYNC_DLY CLK cycles of systematic delay and the next CLK rising edge synchronizes the DCLK output with those of other ADC12D1x00RFs in the system. For 90° Mode (DDRPh = logic-high), the synchronizing edge occurs on the rising edge of CLK, 4 cycles after the first rising edge of CLK after DCLK_RST is released. For 0° Mode (DDRPh = logic-low), this is 5 cycles instead. The DCLK output is enabled again after a constant delay of tOD. For both Demux and Non-Demux Modes, there is some uncertainty about how DCLK comes out of the reset state for the first DCLK_RST pulse. For the second (and subsequent) DCLK_RST pulses, the DCLK will come out of the reset state in a known way. Therefore, if using the DCLK Reset feature, TI recommends applying one "dummy" DCLK_RST pulse before using the second DCLK_RST pulse to synchronize the outputs. This recommendation applies each time the device or channel is powered-on. When using DCLK_RST to synchronize multiple ADC12D1x00RFs, it is required that the Select Phase bits in the Control Register (Addr: Eh, Bits 3,4) be the same for each Master ADC12D1x00RF. 6.1.5 Recommended System Chips TI recommends these other chips including temperature sensors, clocking devices, and amplifiers to support the ADC12D1x00RF in a system design. 6.1.5.1 Temperature Sensor The ADC12D1x00RF has an on-die temperature diode connected to pins Tdiode+/- which may be used to monitor the die temperature. TI also provides a family of temperature sensors for this application which monitor different numbers of external devices, see Table 6-3. Table 6-3. Temperature Sensor Recommendation NUMBER OF EXTERNAL DEVICES MONITORED RECOMMENDED TEMPERATURE SENSOR 1 LM95235 2 LM95213 4 LM95214 The temperature sensor (LM95235/13/14) is an 11-bit digital temperature sensor with a 2-wire System Management Bus (SMBus) interface that can monitor the temperature of one, two, or four remote diodes as well as its own temperature. It can be used to accurately monitor the temperature of up to one, two, or four external devices such as the ADC12D1x00RF, a FPGA, other system components, and the ambient temperature. The temperature sensor reports temperature in two different formats for 127.875°C/–128°C range and 0°/255°C range. It has a Sigma-Delta ADC core which provides the first level of noise immunity. For improved performance in a noisy environment, the temperature sensor includes programmable digital filters for Remote Diode temperature readings. When the digital filters are invoked, the resolution for the Remote Diode readings increases to 0.03125°C. For maximum flexibility and best accuracy, the temperature sensor includes offset registers that allow calibration for other types of diodes. Diode fault detection circuitry in the temperature sensor can detect the absence or fault state of a remote diode: whether D+ is shorted to the power supply, D- or ground, or floating. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 63 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com In the following typical application, the LM95213 is used to monitor the temperature of an ADC12D1x00RF as well as an FPGA, see Figure 6-6. If this feature is unused, the Tdiode+/- pins may be left floating. 7 ADC12D1600/1000RF IE = IF D1+ 100 pF IR 5 IE = IF FPGA D- 100 pF 6 D2+ IR LM95213 Figure 6-6. Typical Temperature Sensor Application 6.1.5.2 Clocking Device The clock source can be a PLL/VCO device such as the LMX2531LQxxxx family of products. The specific device should be selected according to the desired ADC sampling clock frequency. The ADC12D1600RFRB uses the LMX2531LQ1570E, with the ADC clock source provided by the Aux PLL output. Other devices which may be considered based on clock source, jitter cleaning, and distribution purposes are the LMK01XXX, LMK02XXX, LMK03XXX, and LMK04XXX product families. 6.1.5.3 Amplifiers for the Analog Input The following amplifiers can be used for ADC12D1x00RF applications which require DC coupled input or signal gain, neither of which can be provided with a transformer coupled input circuit: Table 6-4. Amplifier Recommendations 64 AMPLIFIER BANDWIDTH BRIEF FEATURES LMH3401 7 GHz Fixed gain, single-ended to differential conversion LMH5401 8 GHz Configurable gain, single-ended to differential conversion LMH6401 4.5 GHz Digital variable controlled gain LMH6554 2.8 GHz Configurable gain LMH6555 1.2 GHz Fixed gain Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 6.1.5.4 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Balun Recommendations for Analog Input The following baluns are recommended for the ADC12D1x00RF for applications which require no gain. When evaluating a balun for the application of driving an ADC, some important qualities to consider are phase error and magnitude error. Table 6-5. Balun Recommendations 6.2 BALUN BANDWIDTH Mini Circuits TC1-113MA+ 4.5 - 3000 MHz Anaren B0430J50100A00 400 - 3000 MHz Mini Circuits ADTL218 30 - 1800 MHz Typical Application The ADC12D1600RF can be used to directly sample a signal in the RF frequency range for downstream processing. The wide input bandwidth, buffered input, high sampling rate and make ADC12D1600RF ideal for RF sampling applications. Power Management Memory 1:2 Balun BPF LVDS outputs GSPS ADC I-Channel 1:2 Balun . . . FPGA USB Port BPF GSPS ADC Q-Channel 10-MHz Reference Clocking Solution Figure 6-7. Simplified Schematic Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 65 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 6.2.1 www.ti.com Design Requirements In this example ADC12D1600RF will be used to sample signals in DES mode and Non-Des mode. The design parameters are listed Table 6-6. Table 6-6. Design Parameters PARAMETER EXAMPLE VALUE (Non-DESI mode) EXAMPLE VALUE (DESI mode) Signal center frequency 1800 MHz 1000 MHz Signal bandwidth 100 MHz 75 MHz ADC sampling Rate 1600 MSPS 3200 MSPS Signal nominal amplitude –7 dBm –7 dBm Signal maximum amplitude 6 dBm 6 dBm Minimum SNR (in BW of interest) 48 dBc 45 dBc Minimum THD (in BW of interest) –54 dBc –58 dBc Minimum SFDR (in BW of interest) 52 dBc 46 dBc 6.2.2 Detailed Design Procedure Use the step described below to design the RF receiver: • Select the appropriate mode of operation (DES mode or Non-DES mode). • Use the input signal frequency to select an appropriate sampling rate. • Select the sampling rate so that the input signal is within the Nyquist zone and away from any harmonics and interleaving tones. • Select the system components such as clocking device, amplifier for analog input and Balun according to sampling frequency and input signal frequency. • See Clocking Device for the recommended clock sources. • See Amplifiers for the Analog Input for recommended analog amplifiers. • See Balun Recommendations for Analog Input for recommended Balun components. • Select the bandpass filters and limiter components based on the requirement to attenuate the unwanted input signals. 66 Application and Implementation Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 6.2.3 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Application Curves 0 0 ±10 ±10 ±20 ±20 ±30 ±30 Magnitude (dBFS) Magnitude (dBFS) Figure 6-8 and Figure 6-9 show an RF signal at 1797.97 MHz captured at a sample rate of 1600 MSPS in Non-DES mode and an RF signal at 997.97 MHz sample at an effective sample rate of 3200 MSPS in DES mode. ±40 ±50 ±60 ±70 ±80 ±40 ±50 ±60 ±70 ±80 ±90 ±90 ±100 ±100 ±110 ±110 0 100 200 300 400 500 600 Frequency (MHz) NON - DES MODE Fin = 1797.97 MHz at -7 dBFS 700 800 0 200 400 600 800 1000 1200 1400 Frequendy (MHz) C002 DES MODE Fin = 997.97 MHz at -7 dBFS Fs = 1600 MHz Figure 6-8. Spectrum - Non-DES Mode 1600 C001 Fs = 3200 MHz Figure 6-9. Spectrum - DES Mode Table 6-7. ADC12D1600RF Performance for Single Tone Signal at 1797.97 MHz in Non-DES Mode PARAMETER VALUE SNR 49.7 dBc SFDR 54 dBc THD –65.5 dBc SINAD 49.7 dBc ENOB 7.9 bits Table 6-8. ADC12D1600RF Performance for Single Tone Signal at 997.97 MHz in DES Mode PARAMETER VALUE SNR 47.5 dBc SFDR 50 dBc THD –61.4 dBc SINAD 47.3 dBc ENOB 7.5 bits Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Application and Implementation 67 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com 7 Power Supply Recommendations 7.1 System Power-on Considerations Data-converter-based systems draw sufficient transient current to corrupt their own power supplies if not adequately bypassed. A 10-μF capacitor must be placed within one inch (2.5 cm) of the device power pins for each supply voltage. A 0.1-μF capacitor must be placed as close as possible to each supply pin, preferably within 0.5 cm. Leadless chip capacitors are preferred due to their low-lead inductance. As is the case with all high-speed converters, the ADC12D1600RF device must be assumed to have little power supply noise-rejection. Any power supply used for digital circuitry in a system where a large amount of digital power is consumed must not be used to supply power to the ADC12D1600RF device. If not a dedicated supply, the ADC supplies must be the same supply used for other analog circuitry. There are a couple important topics to consider associated with the system power-on event including configuration and calibration, and the Data Clock. 7.1.1 Power-on, Configuration, and Calibration Following the application of power to the ADC12D1x00RF, several events must take place before the output from the ADC12D1x00RF is valid and at full performance; at least one full calibration must be executed with the device configured in the desired mode. Following the application of power to the ADC12D1x00RF, there is a delay of tCalDly and then the Poweron Calibration is executed. This is why TI recommends setting the CalDly Pin through an external pullup or pulldown resistor. This ensures that the state of that input will be properly set at the same time that power is applied to the ADC and tCalDly will be a known quantity. For the purpose of this section, it is assumed that CalDly is set as recommended. The Control Bits or Pins must be set or written to configure the ADC12D1x00RF in the desired mode. This must take place through either Extended Control Mode or Non-ECM (Pin Control Mode) before subsequent calibrations will yield an output at full performance in that mode. Some examples of modes include DES and Non-DES Mode, Demux and Non-demux Mode, and Full-Scale Range. The simplest case is when device is in Non-ECM and the Control Pins are set by pullup and pulldown resistors, see Figure 7-1. For this case, the settings to the Control Pins ramp concurrently to the ADC voltage. Following the delay of tCalDly and the calibration execution time, tCAL, the output of the ADC12D1x00RF is valid and at full performance. If it takes longer than tCalDly for the system to stabilize at its operating temperature, TI recommends executing an on-command calibration at that time. Another case is when the FPGA configures the Control Pins (Non-ECM) or writes to the SPI (ECM), see Figure 7-2. It is always necessary to comply with the Operating Ratings and Absolute Maximum ratings, that is, the Control Pins may not be driven below the ground or above the supply, regardless of what the voltage currently applied to the supply is. Therefore, it is not recommended to write to the Control Pins or SPI before power is applied to the ADC12D1x00RF. As long as the FPGA has completed writing to the Control Pins or SPI, the Power-on Calibration will result in a valid output at full performance. Once again, if it takes longer than tCalDly for the system to stabilize at its operating temperature, TI recommends executing an on-command calibration at that time. Due to system requirements, it may not be possible for the FPGA to write to the Control Pins or SPI before the Power-on Calibration takes place, see Figure 7-3. It is not critical to configure the device before the Power-on Calibration, but it is critical to realize that the output for such a case is not at its full performance. Following an On-command Calibration, the device will be at its full performance. 68 Power Supply Recommendations Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 Pull-up/down resistors set Control Pins Power to ADC CalDly ADC output valid Calibration Power-on Calibration On-command Calibration Figure 7-1. Power-On With Control Pins Set by Pullup and Pulldown Resistors FPGA writes Control Pins Power to ADC ADC output valid CalDly Calibration Power-on Calibration On-command Calibration Figure 7-2. Power-On With Control Pins Set by FPGA Pre-Power-On Cal FPGA writes Control Pins Power to ADC CalDly Calibration Power-on Calibration On-command Calibration Figure 7-3. Power-On With Control Pins Set by FPGA Post-Power-On Cal Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Power Supply Recommendations 69 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 7.1.2 www.ti.com Power-on and Data Clock (DCLK) mV Many applications use the DCLK output for a system clock. For the ADC12D1x00RF, each I- and Qchannel has its own DCLKI and DCLKQ, respectively. The DCLK output is always active, unless that channel is powered-down or the DCLK Reset feature is used while the device is in Demux Mode. As the supply to the ADC12D1x00RF ramps, the DCLK also comes up, see this example from the ADC12D1600RFRB: Figure 7-4. While the supply is too low, there is no output at DCLK. As the supply continues to ramp, DCLK functions intermittently with irregular frequency, but the amplitude continues to track with the supply. Much below the low end of operating supply range of the ADC12D1x00RF, the DCLK is already fully operational. Slope = 1.22V/ms 1900 1710 VA 1490 1210 660 635 520 DCLK 300 time Figure 7-4. Supply and DCLK Ramping 7.2 Supply Voltage The ADC12D1600RF device is specified to operate with nominal supply voltages of 1.9 V (VA, VTC, VE and VDR). For detailed information regarding the operating voltage minimums and maximums see Section 4.3. The voltage on a pin (except VinI+/- and VinQ+/-), including a transient basis, must not have a voltage that is in excess of the supply voltage or below ground by more than 150 mV. A pin voltage that is higher than the supply or that is below ground can be a problem during start-up and shutdown of power. Ensure that the supplies to circuits driving any of the input pins, analog or digital, do not rise faster than the voltage at the ADC12D1600RF power pins. The values in Section 4.1 must be strictly observed including during power up and power down. A power supply that produces a voltage spike at power turnon, turnoff, or both can destroy the ADC12D1600RF device. Many linear regulators produce output spiking at power on unless there is a minimum load provided. Active devices draw very little current until the supply voltages reach a few hundred millivolts. The result can be a turnon spike that destroys the ADC12D1600RF device, unless a minimum load is provided for the supply. A 100-Ω resistor at the regulator output provides a minimum output current during power up to ensure that no turnon spiking occurs. Whether a linear or switching regulator is used, TI recommends using a soft-start circuit to prevent overshoot of the supply. 70 Power Supply Recommendations Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 8 Layout 8.1 8.1.1 Layout Guidelines Power Planes All supply buses for the ADC should be sourced from a common linear voltage regulator. This ensures that all power buses to the ADC are turned on and off simultaneously. This single source will be split into individual sections of the power plane, with individual decoupling and connection to the different power supply buses of the ADC. Due to the low voltage but relatively high supply current requirement, the optimal solution may be to use a switching regulator to provide an intermediate low voltage, which is then regulated down to the final ADC supply voltage by a linear regulator. See the documentation provided for the ADC12D1600RFRB for additional details on specific regulators that are recommended for this configuration. Power for the ADC should be provided through a broad plane which is located on one layer adjacent to the ground planes. Placing the power and ground planes on adjacent layers will provide low impedance decoupling of the ADC supplies, especially at higher frequencies. The output of a linear regulator should feed into the power plane through a low impedance multi-via connection. The power plane should be split into individual power peninsulas near the ADC. Each peninsula should feed a particular power bus on the ADC, with decoupling for that power bus connecting the peninsula to the ground plane near each power/ground pin pair. Using this technique can be difficult on many printed circuit CAD tools. To work around this, 0-Ω resistors can be used to connect the power source net to the individual nets for the different ADC power buses. As a final step, the 0-Ω resistors can be removed and the plane and peninsulas can be connected manually after all other error checking is completed. 8.1.2 Bypass Capacitors The general recommendation is to have one 100-nF capacitor for each power/ground pin pair. The capacitors should be surface mount multi-layer ceramic chip capacitors similar to Panasonic part number ECJ-0EB1A104K. 8.1.3 Ground Planes Grounding should be done using continuous full ground planes to minimize the impedance for all ground return paths, and provide the shortest possible image/return path for all signal traces. 8.1.4 Power System Example The ADC12D1600RFRB uses continuous ground planes (except where clear areas are needed to provide appropriate impedance management for specific signals), see Figure 8-1. Power is provided on one plane, with the 1.9-V ADC supply being split into multiple zones or peninsulas for the specific power buses of the ADC. Decoupling capacitors are connected between these power bus peninsulas and the adjacent ground planes using vias. The capacitors are located as close to the individual power/ground pin pairs of the ADC as possible. In most cases, this means the capacitors are located on the opposite side of the PCB to the ADC. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Layout 71 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Linear Regulator Cross Section Line Switching Regulator HV or Unreg Voltage Intermediate Voltage 1.9V ADC Main VTC VA VE VDR ADC Top Layer ± Signal 1 Dielectric 1 Ground 1 Dielectric 2 Signal 2 Dielectric 3 Ground 2 Dielectric 4 Signal 3 Dielectric 5 Power 1 Dielectric 6 Ground 3 Dielectric 7 Bottom Layer ± Signal X Figure 8-1. Power and Grounding Example 72 Layout Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 8.2 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Layout Example Figure 8-2 and Figure 8-3 show layout example plots. Figure 8-4 show a typical stack up for a 10 layer board. Balun transformer to convert the SE CLK signal to differential signal CLK path with minimal adjacent circuit To provide best grounding and thermal performance all the ground pins on internal pad should be connected to all the ground layers with vias. Analog input path with minimal adjacent circuit High speed data paths and DCLK signals should be of same length Figure 8-2. ADC12D1600RF Layout Example 1 – Top Side and Inner Layers Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Layout 73 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com All high speed signal routing should use impedance controlled traces, either 50-Ω single ended or 100-Ω differential Decoupling capacitors near the device Decoupling Capacitors near VIN The four holes highlighted with black squares were for the socket version of the board and are not required for end application. Figure 8-3. ADC12D1600RF Layout Example 1 – Bottom Side and Inner Layers L1 – SIG 0.0036'' L2 – GND 0.0060'' L3 – SIG 0.0070'' L4 – PWR 0.0030'' L5 –GND 0.0070'' 0.0580'' L6 – SIG 0.0060'' L7 – PWR 0.0070'' L8 – SIG 0.0060'' L9 – GND 0.0036'' L10 – SIG 1/2 oz. Copper on L1, L3, L6, L8, L10 1 oz. Copper on L2, L4, L5, L7, L9 100 W, Differential Signaling and 50 W Single ended on SIG Layers Low loss dielectric adjacent very high speed trace layers Finished thickness 0.0620" including plating and solder mask Figure 8-4. ADC12D1600RF Typical Stackup – 10-Layer Board 74 Layout Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com 8.3 SNAS519H – JULY 2011 – REVISED AUGUST 2015 Thermal Management The Heat Slug Ball Grid Array (HSBGA) package is a modified version of the industry standard plastic BGA (Ball Grid Array) package. Inside the package, a copper heat spreader cap is attached to the substrate top with exposed metal in the center top area of the package. This results in a 20% improvement (typical) in thermal performance over the standard plastic BGA package. 4JC_1 Copper Heat Slug Mold Compound Not to Scale Cross Section Line IC Die Substrate 4JC_2 Figure 8-5. HSBGA Conceptual Drawing The center balls are connected to the bottom of the die by vias in the package substrate, Figure 8-5. This gives a low thermal resistance between the die and these balls. Connecting these balls to the PCB ground planes with a low thermal resistance path is the best way dissipate the heat from the ADC. These pins should also be connected to the ground plane through a low impedance path for electrical purposes. The direct connection to the ground planes is an easy method to spread heat away from the ADC. Along with the ground plane, the parallel power planes will provide additional thermal dissipation. The center ground balls should be soldered down to the recommended ball pads (see AN-1126 (SNOA021)). These balls will have wide traces which in turn have vias which connect to the internal ground planes, and a bottom ground pad/pour if possible. This ensures a good ground is provided for these balls, and that the optimal heat transfer will occur between these balls and the PCB ground planes. In spite of these package enhancements, analysis using the standard JEDEC JESD51-7 four-layer PCB thermal model shows that ambient temperatures must be limited to 70/77°C to ensure a safe operating junction temperature for the ADC12D1x00RF. However, most applications using the ADC12D1x00RF will have a printed-circuit-board (PCB) which is more complex than that used in JESD51-7. Typical circuit boards will have more layers than the JESD51-7 (eight or more), several of which will be used for ground and power planes. In those applications, the thermal resistance parameters of the ADC12D1x00RF and the circuit board can be used to determine the actual safe ambient operating temperature up to a maximum of 85°C. Three key parameters are provided to allow for modeling and calculations. Because there are two main thermal paths between the ADC die and external environment, the thermal resistance for each of these paths is provided. θJC1 represents the thermal resistance between the die and the exposed metal area on the top of the HSBGA package. θJC2 represents the thermal resistance between the die and the center group of balls on the bottom of the HSBGA package. The final parameter is the allowed maximum junction temperature, TJ. In other applications, a heat sink or other thermally conductive path can be added to the top of the HSBGA package to remove heat. In those cases, θJC1 can be used along with the thermal parameters for the heat sink or other thermal coupling added. Representative heat sinks which might be used with the ADC12D1x00RF include the Cool Innovations p/n 3-1212XXG and similar products from other vendors. In many applications, the PCB will provide the primary thermal path conducting heat away from the ADC package. In those cases, θJC2 can be used in conjunction with PCB thermal modeling software to determine the allowed operating conditions that will maintain the die temperature below the maximum allowable limit. Additional dissipation can be achieved by coupling a heat sink to the copper pour area on the bottom side of the PCB. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Layout 75 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com Typically, dissipation will occur through one predominant thermal path. In these cases, the following calculations can be used to determine the maximum safe ambient operating temperature for the ADC12D1000RF, for example: TJ = TA + PD × (θJC+θCA) TJ = TA + PC(MAX) × (θJC+θCA) (2) (3) For θJC, the value for the primary thermal path in the given application environment should be used (θJC1 or θJC2). θCA is the thermal resistance from the case to ambient, which would typically be that of the heat sink used. Using this relationship and the desired ambient temperature, the required heat sink thermal resistance can be found. Alternately, the heat sink thermal resistance can be used to find the maximum ambient temperature. For more complex systems, thermal modeling software can be used to evaluate the PCB system and determine the expected junction temperature given the total system dissipation and ambient temperature. 76 Layout Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 9 Device and Documentation Support 9.1 Device Support 9.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 9.1.2 Device Nomenclature 9.1.2.1 Specification Definitions APERTURE (SAMPLING) DELAY is the amount of delay, measured from the sampling edge of the CLK input, after which the signal present at the input pin is sampled inside the device. APERTURE JITTER (tAJ) is the variation in aperture delay from sample-to-sample. Aperture jitter can be effectively considered as noise at the input. CODE ERROR RATE (CER) is the probability of error and is defined as the probable number of word errors on the ADC output per unit of time divided by the number of words seen in that amount of time. A CER of 10-18 corresponds to a statistical error in one word about every 31.7 years for the ADC12D1600RF. CLOCK DUTY CYCLE is the ratio of the time that the clock waveform is at a logic high to the total time of one clock period. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. It is measured at the relevant sample rate, fCLK, with fIN = 1MHz sine wave. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-toNoise and Distortion Ratio, or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and states that the converter is equivalent to a perfect ADC of this many (ENOB) number of bits. GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Offset and Full-Scale Errors. The Positive Gain Error is the Offset Error minus the Positive Full-Scale Error. The Negative Gain Error is the Negative Full-Scale Error minus the Offset Error. The Gain Error is the Negative Full-Scale Error minus the Positive Full-Scale Error; it is also equal to the Positive Gain Error plus the Negative Gain Error. GAIN FLATNESS is the measure of the variation in gain over the specified bandwidth. For example, for the ADC12D1600RF, from D.C. to Fs/2 is to 800 MHz for the Non- DES Mode and from D.C. to Fs/2 is 1600 MHz for the DES Mode. INTEGRAL NON-LINEARITY (INL) is a measure of worst case deviation of the ADC transfer function from an ideal straight line drawn through the ADC transfer function. The deviation of any given code from this straight line is measured from the center of that code value step. The best fit method is used. INSERTION LOSS is the loss in power of a signal due to the insertion of a device, for example, the ADC12D1x00RF, expressed in dB. INTERMODULATION DISTORTION (IMD) is a measure of the near-in 3rd order distortion products (2f2 f1, 2f1 - f2) which occur when two tones which are close in frequency (f1, f2) are applied to the ADC input. It is measured from the input tone's level to the higher of the two distortion products (dBc) or simply the level of the higher of the two distortion products (dBFS). LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is VFS / 2N (4) Device and Documentation Support Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Copyright © 2011–2015, Texas Instruments Incorporated 77 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 www.ti.com where VFS is the differential full-scale amplitude VIN_FSR as set by the FSR input and "N" is the ADC resolution in bits, which is 12 for the ADC12D1x00RF. LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS) DIFFERENTIAL OUTPUT VOLTAGE (V ID and VOD) is two times the absolute value of the difference between the VD+ and VD- signals; each signal measured with respect to Ground. VOD peak is VOD,P= (VD+ - VD-) and VOD peak-to-peak is VOD,P-P= 2*(VD+ - VD-); for this product, the VOD is measured peak-to-peak. VD+ VDVOS ½×VOD VD+ VD - GND ½×VOD = | VD+ - VD- | Figure 9-1. LVDS Output Signal Levels LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint between the D+ and D- pins output voltage with respect to ground; that is, [(VD+) +( VD-)]/2. See Figure 9-1. MISSING CODES are those output codes that are skipped and will never appear at the ADC outputs. These codes cannot be reached with any input value. MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale. NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of how far the first code transition is from the ideal 1/2 LSB above a differential −VIN/2 with the FSR pin low. For the ADC12D1x00RF the reference voltage is assumed to be ideal, so this error is a combination of full-scale error and reference voltage error. NOISE FLOOR DENSITY is a measure of the power density of the noise floor, expressed in dBFS/Hz and dBm/Hz. '0 dBFS' is defined as the power of a sinusoid which precisely uses the full-scale range of the ADC. NOISE POWER RATIO (NPR) is the ratio of the sum of the power inside the notched bins to the sum of the power in an equal number of bins outside the notch, expressed in dB. OFFSET ERROR (VOFF) is a measure of how far the mid-scale point is from the ideal zero voltage differential input. Offset Error = Actual Input causing average of 8k samples to result in an average code of 2047.5. OUTPUT DELAY (tOD) is the time delay (in addition to Latency) after the rising edge of CLK+ before the data update is present at the output pins. OVER-RANGE RECOVERY TIME is the time required after the differential input voltages goes from ±1.2V to 0V for the converter to recover and make a conversion with its rated accuracy. PIPELINE DELAY (LATENCY) is the number of input clock cycles between initiation of conversion and when that data is presented to the output driver stage. The data lags the conversion by the Latency plus the tOD. POSITIVE FULL-SCALE ERROR (PFSE) is a measure of how far the last code transition is from the ideal 1-1/2 LSB below a differential +VIN/2. For the ADC12D1x00RF the reference voltage is assumed to be ideal, so this error is a combination of full-scale error and reference voltage error. SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the fundamental for a single-tone to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or DC. 78 Device and Documentation Support Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF ADC12D1000RF, ADC12D1600RF www.ti.com SNAS519H – JULY 2011 – REVISED AUGUST 2015 SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms value of the fundamental for a single-tone to the rms value of all of the other spectral components below half the input clock frequency, including harmonics but excluding DC. SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal at the output and the peak spurious signal, where a spurious signal is any signal present in the output spectrum that is not present at the input, excluding DC. θJA is the thermal resistance between the junction to ambient. θJC1 represents the thermal resistance between the die and the exposed metal area on the top of the HSBGA package. θJC2 represents the thermal resistance between the die and the center group of balls on the bottom of the HSBGA package. TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic levels at the output to the level of the fundamental at the output. THD is calculated as THD = 20 x log A 2 +... +A 2 f2 f10 A f12 (5) where Af1 is the RMS power of the fundamental (output) frequency and Af2 through Af10 are the RMS power of the first 9 harmonic frequencies in the output spectrum. – Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the input frequency seen at the output and the power in its 2nd harmonic level at the output. – Third Harmonic Distortion (3rd Harm) is the difference expressed in dB between the RMS power in the input frequency seen at the output and the power in its 3rd harmonic level at the output. 9.2 9.2.1 Documentation Support Related Documentation For related documentation, see the following: • AN-1126 BGA (Ball Grid Array), SNOA021 • AN-2132 Synchronizing Multiple GSPS ADCs in a System: The AutoSync Feature, SNAA073 Device and Documentation Support Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF Copyright © 2011–2015, Texas Instruments Incorporated 79 ADC12D1000RF, ADC12D1600RF SNAS519H – JULY 2011 – REVISED AUGUST 2015 9.3 www.ti.com Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 9-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY ADC12D1000RF Click here Click here Click here Click here Click here ADC12D1600RF Click here Click here Click here Click here Click here 9.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 9.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 9.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 9.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 80 Mechanical, Packaging, and Orderable Information Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC12D1000RF ADC12D1600RF PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADC12D1000RFIUT/NOPB ACTIVE BGA NXA 292 40 Green (RoHS & no Sb/Br) SNAG Level-3-250C-168 HR -40 to 85 ADC12D1000RFIUT ADC12D1600RFIUT ACTIVE BGA NXA 292 40 TBD Call TI Call TI -40 to 85 ADC12D1600RFIUT ADC12D1600RFIUT/NOPB ACTIVE BGA NXA 292 40 Green (RoHS & no Sb/Br) SNAG Level-3-250C-168 HR -40 to 85 ADC12D1600RFIUT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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