AVAGO ACFM-2013 Single antenna Datasheet

ACFM-2013
Band 1/Band 3 Quadplexer
Product Brief
Description
High power rating
— +31 dBm maximum Tx power

The Avago Technologies' ACFM-2013 is a quadplexer that
combines Band 1 and Band 3 duplexers into a single, miniature
package.
Applications
The ACFM-2013 features a single antenna connection, which
eliminates the need for antenna switching. High isolation
between bands enables the use of carrier aggregation.
Smartphones, tablets, and mobile/portable communications
devices operating in Bands 1 and 3.
The ACFM-2013 is designed with Avago Technologies' film bulk
acoustic resonator (FBAR) technology. The ACFM-2013 also
uses Avago Technologies' innovative microcap bonded-wafer,
chip scale packaging technology. This process allows the filters
to be assembled in a module with a footprint of only 3.6 mm ×
2 mm with a maximum height of 0.80 mm.
Functional Block Diagram
Low Tx insertion loss of the ACFM-2013 reduces power
amplifier current, which extends battery life. The ACFM-2013
enhances receiver sensitivity and dynamic range with low Rx
insertion loss and high rejection of Tx signals at the Rx ports.
"OU
1PSU
1JO
#BOE
%VQMFYFS
#BOE
%VQMFYFS
The excellent power handling capability of Avago
Technologies' FBAR bulk-mode resonators supports the high
power levels used in mobile communications devices while
adding virtually no distortion.
Features





Single antenna
Band 1 and Band 3 carrier aggregation
High cross band isolation
— Enables carrier aggregation
Miniature size
— 3.6 x 2 mm footprint
— 0.80 mm maximum height
Environmental
— RoHS 6 compliant
— Halogen free
— TBBPA free
#BOE5Y #BOE3Y #BOE5Y #BOE3Y
1PSU
1PSU
1PSU
1PSU
1JO
1JO
1JO
1JO
Ordering Information
Part Number
Number of
Devices
Container
ACFM-2013-BLK
100
Tape strip or gel-pack
ACFM-2013-TR1
3000
178 mm (7-inch) reel
Avago Technologies
-1-
Package Dimensions and Marking Specification
0.750
±0.05
3.600
±0.075
11
ANT
13
0.400 X 0.250 (14X)
B3 TX
B1 RX
PIN 1
MARK
12
OXIDE LAYER OVER
GROUND METAL
(SEE NOTES)
14
1
VAGO
MFIYWW
DDXXXX
0.25 X 45° CHAMFER
1.500
2.000
±0.075
10
2
15
9
3
0.750
(REF) 0.500
B3 RX
1.600 x 0.750
B1 TX
8
0.750
6
7
5
4
1.500
(REF)
3.000
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Marking Code:
Notes:
1. Dimensions in millimeters
2. Tolerance, unless otherwise noted:
X.XX ± 0.05 mm
X.XXX ± 0.025 mm
3. Dimensions nominal unless otherwise noted
4. Angles 45° nominal
5. Contact areas are gold plated
6. Ground pads on bottom metal are solder mask
defined by means of a thin (< 1μm) oxide layer
AVAGO = Avago Technologies, Inc.
M = ACFM-2013
F = Avago FBAR Technology
I = Assembly Information
Y = Year
WW = Work Week
DD = Date Code
XXXX = Assembly Lot
Pin Description
Pin
Connection
1
Band 1 Rx
4
Band 3 Rx
8
Band 1 Tx
11
Band 3 Tx
13
Ant
2, 3, 5, 6, 7, 9, 10, 12, 14, 15
GND
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the
United States and other countries. All other brand and product names may be trademarks of
their respective companies.
Data subject to change. Copyright © 2015 Avago Technologies. All Rights Reserved.
AV02-4908EN – 2015-05-01
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