Datasheet Motor Drivers for Digital Still Cameras 6-Channel System Lens Driver for Digital Still Cameras BD6373GW General Description Key Specifications The BD6373GW is a motor driver that integrates 6 Full-ON type H-Bridges. The device is intended to drive a stepping motor for auto focus system, and another stepping motor for either zoom or iris. It can also be used to drive an actuator of the new system like a lens barrier. Power Supply Voltage Range: 2.5V to 5.5V Motor Power Supply Voltage Range: 2.5V to 5.5V Circuit Current(No Signal & No Load): 1.0mA(Typ) Control Input Voltage: 0V to VCCV H-Bridge Output Current: -0.5A/ch to +0.5A/ch Output ON-Resistance(Each Channel): 1.2Ω(Typ) Operating Temperature Range: -25°C to +85°C Features Low ON-Resistance Power CMOS Output Drive Mode Switch Function Under Voltage Locked Out Protection & Thermal Shut Down Circuit Package W(Typ) x D(Typ) x H(Max) UCSP75M2 2.60mm x 2.60mm x 0.85mm Applications Mobile system Home appliance Amusement system, etc UCSP75M2 Typical Application Circuit Bypass filter power supply Capacitor for 1µF to 100µF VCC F3 TSD & UVLO BandGap Motor control input Bypass filter power supply. Capacitor for Bypass filter power supply. Capacitor for Bypass filter power supply. Capacitor 1µF to 100µF F2 VM12 H bridge ENABLE12 C2 INPUT1 D2 Level Shift Logic12 OUT1A E1 M OUT1B & Pre Driver INPUT2 E3 Full ON E2 F1 Full ON D1 Full ON Full ON C1 H bridge B1 OUT2A OUT2B PGND12 1µF to 100µF Motor control input A2 VM34 H bridge ENABLE34 D3 INPUT3 B3 Level Shift Logic34 A3 OUT3A M OUT3B & Pre Driver INPUT4 B4 Full ON A1 B2 H bridge Full ON A4 OUT4A A6 B5 Motor control input A5 OUT4B for PGND34 1µF to 100µF Motor control input brake function H : Brake Motor control input F5 VM56 C6 H bridge INPUT5 C5 BRAKE5 D4 Logic5 Full ON D6 OUT5A OUT5B & INPUT6 E4 BRAKE6 D5 Level Shift Logic6 Pre Driver H bridge Full ON Motor control input brake function H : Brake E6 E5 F6 B6 OUT6A OUT6B PGND56 F4 GND ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/12 TSZ02201-0H3H0B601370-1-2 09.Dec.2015 Rev.001 BD6373GW Pin Configurations (TOP VIEW) 1 2 3 4 5 6 A OUT3A VM34 OUT3B OUT4A PGND34 OUT4B B PGND12 OUT3A INPUT3 INPUT4 OUT4B PGND56 C OUT2B ENABLE12 INPUT5 OUT5A INDEX POST D OUT2A INPUT1 ENABLE34 BRAKE5 BRAKE6 OUT5B E OUT1B OUT1A INPUT2 INPUT6 OUT6B OUT6A F OUT1A VM12 VCC GND VM56 OUT6B The pins of the same name, such as OUT3A, OUT4B, OUT1A, and OUT6B, must be shorted on printed circuit boards. Pin Descriptions Pin No. Pin Name A1 OUT3A A2 VM34 A3 Function Pin No. Pin Name H-bridge output 3A D1 OUT2A H-bridge output 2A Motor power supply ch.3 & ch.4 D2 INPUT1 Control logic input 1 OUT3B H-bridge output 3B D3 ENABLE34 A4 OUT4A H-bridge output 4A D4 BRAKE5 Control logic input ch.5 A5 PGND34 Motor ground ch.3 & ch.4 D5 BRAKE6 Control logic input ch.6 A6 OUT4B H-bridge output 4B D6 OUT5B H-bridge output 5B B1 PGND12 Motor ground ch.1 & ch.2 E1 OUT1B H-bridge output 1B B2 OUT3A H-bridge output 3A E2 OUT1A H-bridge output 1A B3 INPUT3 Control logic input 3 E3 INPUT2 Control logic input 2 B4 INPUT4 Control logic input 4 E4 INPUT6 Control logic input 6 B5 OUT4B H-bridge output 4B E5 OUT6B H-bridge output 6B B6 PGND56 Motor ground ch.5 & ch.6 E6 OUT6A H-bridge output 6A C1 OUT2B H-bridge output 2B F1 OUT1A H-bridge output 1A C2 ENABLE12 Control logic input ch.1 & ch.2 F2 VM12 Motor power supply ch.1 & ch.2 C3 INDEX POST F3 VCC Power supply F4 GND Ground Motor power supply ch.5 & ch.6 C4 - C5 INPUT5 Control logic input 5 F5 VM56 C6 OUT5A H-bridge output 5A F6 OUT6B www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/12 Function Control logic input ch.3 & ch.4 H-bridge output 6B TSZ02201-0H3H0B601370-1-2 09.Dec.2015 Rev.001 BD6373GW Block Diagram VCC F3 TSD & UVLO BandGap F2 VM12 H bridge ENABLE12 C2 INPUT1 D2 Level Shift Logic12 E1 OUT1B & Pre Driver INPUT2 E3 Full ON E2 F1 OUT1A Full ON D1 OUT2A Full ON Full ON C1 OUT2B H bridge B1 PGND12 A2 VM34 H bridge ENABLE34 D3 INPUT3 B3 Level Shift Logic34 A3 OUT3B & Pre Driver INPUT4 B4 Full ON A1 B2 OUT3A H bridge Full ON A4 OUT4A A6 B5 OUT4B A5 PGND34 F5 VM56 C6 OUT5A H bridge INPUT5 C5 BRAKE5 D4 Logic5 Full ON & INPUT6 E4 BRAKE6 D5 Level Shift Logic6 Pre Driver H bridge Full ON D6 OUT5B E6 OUT6A E5 F6 OUT6B B6 PGND56 F4 GND Description of Blocks 1. Motor Control Input (a) ENABLE12, ENABLE34, INPUT1 to INPUT6 Pins Logic level controls the output logic of H-Bridge. (See the Electrical Characteristics; p.4/12, and I/O Truth Table; p.5/12) (b) BRAKE5 & BRAKE6 Pins Logic high puts the device in short brake mode. (See the Electrical Characteristics; p.4/12 and I/O Truth Table; p.5/12) 2. H-Bridge Each H-bridge can be controlled independently. It is therefore possible to drive the H-bridges simultaneously, as long as the package thermal tolerances are not exceeded. Because the respective output transistors consist of power CMOS which consumes a motor power supply VM, the ON-Resistance value of high and low-side total is dependent on VM voltage. Further, the whole application must be designed so that the maximum current of each channel may be 500mA or below. (See the Recommended Operating Conditions; p.4/12) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/12 TSZ02201-0H3H0B601370-1-2 09.Dec.2015 Rev.001 BD6373GW Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limit Unit Power Supply Voltage VCC -0.5 to +6.5 V Motor Power Supply Voltage VM -0.5 to +6.5 V Control Input Voltage VIN -0.5 to +VCC+0.5 V Power Dissipation Pd 0.94 (Note 1) W H-bridge Output Current IOUT -0.8 to +0.8 (Note 2) A/ch Storage Temperature Range Tstg -55 to +150 °C Tjmax 150 °C Junction Temperature (Note 1) Reduced by 7.52mW/°C over 25°C, when mounted on a glass epoxy board (50mm x 58mm x 1.75mm; 8layers) (Note 2) Must not exceed Pd, ASO, or Tjmax of 150°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage VCC 2.5 - 5.5 V Motor Power Supply Voltage VM 2.5 - 5.5 V Control Input Voltage VIN 0 - VCC V H-bridge Output Current(Note 3) IOUT -0.5 - +0.5 A/ch Operating Temperature Range Topr -25 - +85 °C (Note 3) Must not exceed Pd, ASO, or Tjmax of 150°C Electrical Characteristics (Unless otherwise specified VCC=3.0V, VM=5.0V, Ta=25°C) Parameter Symbol Min Typ Max Unit ICC - 1.0 1.9 mA Conditions All Circuits Circuit Current No signal and no load Control Input (IN=ENABLE12, ENABLE34, INPUT1 to INPUT6, BRAKE5, BRAKE6) High-Level Input Voltage VINH 2.0 - VCC V Low-Level Input Voltage VINL 0 - 0.7 V High-Level Input Current IINH 15 30 60 μA VIN=3V Low-Level Input Current IINL -1 0 - μA VIN=0V 1.6 - 2.4 V Under Voltage Locked Out (UVLO) UVLO Voltage VUVLO Full ON Type H-Bridge Driver (Each Channel) Output ON-Resistance 1 RON1 - 1.2 1.5 Ω IOUT=±400mA, VM=5.0V, total Output ON-Resistance 2 RON2 - 1.5 2.0 Ω IOUT=±400mA, VM=3.0V, total Turn ON Time tON - 0.55 1.95 μs RL=20Ω Turn OFF Time tOFF - 0.08 0.5 μs RL=20Ω Rise Time tR 0.1 0.15 1.0 μs RL=20Ω Fall Time tF - 0.03 0.2 μs RL=20Ω www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/12 TSZ02201-0H3H0B601370-1-2 09.Dec.2015 Rev.001 BD6373GW Typical Performance Curves (Reference Data) 5.0 5.0 Circuit Current : ICC [mA] 4.0 Output On Resistance : R ON [Ω] Top 85°C Mid 25°C Low -25°C 3.0 Operating range (2.5V to 5.5V) 2.0 1.0 Top 85°C Mid 25°C Low -25°C 4.0 Operating range (2.5V to 5.5V) 3.0 2.0 1.0 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Power Supply Voltage : VCC [V] 0.0 7.0 Figure 1. Circuit Current vs Supply Voltage 1.0 2.0 3.0 4.0 5.0 6.0 Motor Power Supply Voltage : VM [V] 7.0 Figure 2. Output ON-Resistance vs Motor Power Supply Voltage Timing Chart Table 1. I/O Truth Table (Channel 1 & Channel 2) INPUT Input Mode ENABLE12 INPUTx OUTxB Output Mode(Note 4) X Z Z Open H L H L CW H H L H CCW L EN/IN OUTPUT OUTxA L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 4) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=1, 2) Table 2. I/O Truth Table (Channel 3 & Channel 4) INPUT Input Mode ENABLE34 INPUTx OUTxB Output Mode(Note 5) X Z Z Open H L H L CW H H L H CCW L EN/IN OUTPUT OUTxA L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 5) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=3, 4) Table 3. I/O Truth Table (Channel 5 & Channel 6) INPUT Input Mode INPUTx BRAKEx OUTxB Output Mode(Note 6) L H L CW H L L H CCW X H L L Short Brake L IN/IN OUTPUT OUTxA L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 6) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=5, 6) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Application Example Bypass filter power supply Capacitor for 1µF to 100µF VCC F3 TSD & UVLO BandGap Motor control input Bypass filter power supply Capacitor for Bypass filter power supply Capacitor for Bypass filter power supply Capacitor 1µF to 100µF F2 VM12 E2 F1 H bridge ENABLE12 C2 INPUT1 D2 Level Shift Logic12 Full ON E1 OUT1A M OUT1B & Pre Driver INPUT2 E3 Full ON D1 Full ON Full ON C1 H bridge B1 OUT2A OUT2B PGND12 1µF to 100µF Motor control input A2 VM34 H bridge ENABLE34 D3 INPUT3 B3 Level Shift Logic34 Full ON A1 B2 A3 OUT3A M OUT3B & Pre Driver INPUT4 B4 H bridge Full ON A4 OUT4A A6 B5 Motor control input A5 OUT4B for PGND34 1µF to 100µF Motor control input brake function H : Brake Motor control input F5 VM56 C6 H bridge INPUT5 C5 BRAKE5 D4 Logic5 Level Shift D6 OUT5A OUT5B & INPUT6 E4 BRAKE6 D5 Full ON Logic6 Pre Driver H bridge Full ON Motor control input brake function H : Brake E6 E5 F6 B6 OUT6A OUT6B PGND56 F4 GND Selection of Components Externally Connected When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Power Dissipation 1.0 0.94W Power Dissipation : Pd [W] 0.8 0.6 0.48W 0.4 0.2 85°C 0.0 0 25 50 75 100 125 Ambient Temperature : Ta [°C] 150 Figure 3. Power Dissipation vs Ambient Temperature I/O Equivalent Circuits ENABLE12, ENABLE34, INPUT1 to INPUT6, BRAKE5, BRAKE6 VCC VMx, PGNDx, OUTxA, OUTxB VCC VMx 140kΩ 10kΩ OUTxA OUTxB 100kΩ PGNDx www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal(GND) and large-current ground(PGND) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 4. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Ordering Information B D 6 3 7 3 G W - Package Part Number GW : UCSP75M2 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram UCSP75M2 (TOP VIEW) D6373 1PIN MARK Part Number Marking LOT Number Part Number Marking D6373 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Package UCSP75M2 Orderable Part Number BD6373GW-E2 10/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Physical Dimension, Tape and Reel Information Package Name UCSP75M2 (Unit:mm) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 BD6373GW Revision History Date Revision 09.Dec.2015 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/12 TSZ02201-0H3H0B601370-1-1 09.Dec.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD6373GW - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD6373GW UCSP75M2 3000 3000 Taping inquiry Yes