AVAGO HLMP-3651 Tâ 13/4 (5 mm), t-1 (3 mm), 5 volt, 12 volt, integrated resistor led lamp Datasheet

HLMP-1600
T‑13/4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt,
Integrated Resistor LED Lamps
Data Sheet
HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621
HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601
HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681
Description
Features
The 5 volt and 12 volt series lamps contain an integral
cur­rent limiting resistor in series with the LED. This allows
the lamp to be driven from a 5 volt/12 volt source without
an external current limiter. The red LEDs are made from
GaAsP on a GaAs substrate. The High Efficiency Red and
Yellow devices use GaAsP on a GaP substrate.
• Integral current limiting resistor
The green devices use GaP on a GaP substrate. The diffused
lamps provide a wide off-axis viewing angle.
The T-13/4 lamps are provided with sturdy leads suitable
for wire wrap applications. The T‑13/4 lamps may be front
panel mounted by using the HLMP-0103 clip and ring.
• TTL compatible
Requires no external current Limiter with 5 volt/12 volt
supply
• Cost effective
Saves space and resistor cost
• Wide viewing angle
• Available in all colors
Red, High Efficiency Red, Yellow, and High Performance
Green in T-1 and T‑13/4 packages
Package Dimensions
1.14 (.045)
0.51 (.020)
3.43 (.135)
2.92 (.115)
Ø
24.1(.95) MIN.
0.65 (0.026) max.
5.08 (0.200)
4.57 (0.180)
2.79 (.110)
2.29 (.090)
1.52 (.060)
1.02 (.040)
11.56 (0.455)
10.80 (0.425)
3.17 (.125)
2.67 (.105)
4.70 (.185)
4.19 (.165)
0.89 (0.035)
0.64 (0.025)
9.19 (0.362)
8.43 (0.332)
(0.022) 0.55 SQ. TYP.
(0.016) 0.40
1.32 (0.052)
1.02 (0.040)
6.35 (.250)
5.58 (.220)
Figure A. T-1 package.
23.0
(0.90) MIN.
0.64 (0.025)
SQUARE NOMINAL
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
1.27 (0.050)
NOM.
6.1 (0.240)
5.6 (0.220)
CATHODE
2.54 (0.100)
NOM.
Figure B. T-13/4 package.
Selection Guide
Color
Package Description
Package
Outline
2q1/2[1]
Operating
Voltage (V)
Part Number
HLMP-
Red
T-1 Tinted Diffused
A
60
5
60
T-1 3/4 Tinted Diffused
B
60
60
Yellow
T-1 Tinted Diffused
A
60
60
T-1 3/4 Tinted Diffused
B
60
60
Green
T-1 Tinted Diffused
A
60
60
T-1 3/4 Tinted Diffused
B
12
5
12
5
12
5
12
5
12
60
5
60
12
Note:
1. q1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity.
2
Luminous Intensity
Iv (mcd)
Min.
Max.
1600
2.1
-
1600-D00xx
2.1
-
1601
2.1
-
1601-D00xx
2.1
-
1601-GH0xx
8.6
27.6
3600
2.1
-
3600-D00xx
2.1
-
3601
2.1
-
3601-D00xx
2.1
-
1620
2.2
-
1620-C00xx
2.2
-
1620-C0Bxx
2.2
-
1620-EFBxx
3.4
10.8
1621
2.2
-
1621-C00xx
2.2
-
3650
2.2
-
3650-C00xx
2.2
-
3651
2.2
-
3651-C00xx
2.2
-
1640
1.6
-
1640-B00xx
1.6
-
1640-B0Dxx
1.6
-
1640-DE0xx
4.2
13.4
1641
1.6
-
1641-B00xx
1.6
3680
1.6
-
3680-B00xx
1.6
-
3681
1.6
-
3681-B00xx
1.6
-
Part Numbering System
HLMX-X   6 X X
X
X X
XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1,B1: Right Angle Housing, Uneven Leads
A2,B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2&3 only
D: Color bin 4&5 only
Maximum Iv Bin Options
0: Open (No. max. limit)
Others: Please refer to the Iv bin Table
Minimum Iv Bin Options
Please refer to the Iv bin Table
Operating Voltage
0: 5 V
1: 12 V
Color Options
0: GaP HER
2,5: GaP Yellow
4,8: GaP Green
Package Options
3: T-13/4 (5 mm)
1: T-1 (3 mm)
Absolute Maximum Ratings at TA = 25°C
Red/HER/Yellow
5 Volt Lamps
Red/HER/Yellow
12 Volt Lamps
Green
5 Volt Lamps
Green
12 Volt Lamps
DC Forward Voltage (TA = 25°C)
7.5 Volts[2]
15 Volts[3]
7.5 Volts[2]
15 Volts[3]
Reverse Voltage (IR = 100 μA)
5 Volts
5 Volts
5 Volts
5 Volts
Operating Temperature Range
-40°C to 85°C
-40°C to 85°C
-20°C to 85°C
-20°C to 85°C
Storage Temperature Range
-40°C to 100°C
-40°C to 100°C
-40°C to 100°C
-40°C to 100°C
Notes:
2. Derate from TA = 50°C at 0.071 V/°C, see Figure 3.
3. Derate from TA = 50°C at 0.086 V/°C, see Figure 4.
3
Electrical/Optical Characteristics at TA = 25°C
High Efficiency Red
Min.
Max.
Min.
Typ.
Green
Symbol
Description
lP
Peak
Wavelength
635
583
565
nm
ld
Dominant
Wavelength
626
585
569
nm
Dl1/2
Spectral Line
Halfwidth
40
36
28
nm
RqJ-PIN
Thermal
Resistance
290
290
290
°C/W
Junction to
Cathode Lead
(Note 6)
RqJ-PIN
Thermal
Resistance
210
210
210
°C/W
Junction to
Cathode Lead
(Note 7)
IF
Forward Current
12 V Devices
13
20
13
20
13
20
mA
VF = 12 V
IF
Forward Current
5 V Devices
10
15
10
15
10
15
mA
VF = 5 V
hV
Luminous
Efficacy
145
lumen
/Watt
Note 2
VR
Reverse
Breakdown
Voltage
V
IR = 100 μA
5.0
Typ.
Yellow
Max.
Min.
500
5.0
Typ.
595
5.0
Max.
Unit
Test Condition
Note 4
Notes:
4. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
5. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lV/hV, where lV is the luminous intensity in candelas and hV is the
luminous efficacy in lumens/Watt.
6. For Figure A package type.
7. For Figure B package type.
4
24
20
20
IF – FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA
24
16
12
8
4
2
4
8
4
0
6
8
10 12 14 16
7.5
15
VCC – APPLIED FORWARD VOLTAGE – V
0
2
4
6
8
10 12 14 16
7.5
15
VCC – APPLIED FORWARD VOLTAGE – V
Figure 1. Forward current vs. applied forward voltage. 5 volt devices.
Figure 2. Forward current vs. applied forward voltage. 12 volt devices.
VCC – APPLIED FORWARD VOLTAGE – V
0
12
VCC – APPLIED FORWARD VOLTAGE – V
0
16
8
7.5
6
4
2
0
0
20
40
60
16
15
12
8
4
0
80 85
0
20
TA – AMBIENT TEMPERATURE – °C
Figure 3. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 5 volt devices.
20°
30°
40°
50°
10°
80°
90°
80 85
Figure 4. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 12 volt devices.
0°
20°
1.0
10°
0°
1.0
30°
0.8
40°
50°
0.6
0.8
0.6
60°
0.4
0.2
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 5. Relative luminous intensity vs. angular displacement for T-1
package.
5
60
TA – AMBIENT TEMPERATURE – °C
60°
70°
40
70°
80°
90°
0.4
0.2
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 6. Relative luminous intensity vs. angular displacement for T-13/4
package.
2.5
1.5
RELATIVE IV
RELATIVE IV
2.0
1.5
1.0
1.0
0.5
GaAsP
0.5
0
GaAsP
HIGH EFFICIENCY
RED, YELLOW, GREEN
0
2
4
6
8
0
10
0
2
HIGH EFFICIENCY
RED, YELLOW, GREEN
4
6
5 VOLT DEVICES
8
10 12 14 16 18 20
12 VOLT DEVICES
Figure 7. Relative luminous intensity vs. applied forward voltage. 5 volt
devices.
Figure 8. Relative luminous intensity vs. applied forward voltage. 12 volt
devices.
Intensity Bin Limit
Intensity Bin Limit (Con't)
Color
Bin
Red
Intensity Range (mcd)
Min.
Max.
D
2.4
3.8
E
3.8
F
Bin
Yellow
Intensity Range (mcd)
Min.
Max.
C
2.5
4.0
6.1
D
4.0
6.5
6.1
9.7
E
6.5
10.3
G
9.7
15.5
F
10.3
16.6
H
15.5
24.8
G
16.6
26.5
I
24.8
39.6
H
26.5
42.3
J
39.6
63.4
I
42.3
67.7
K
63.4
101.5
J
67.7
108.2
L
101.5
162.4
K
108.2
173.2
M
162.4
234.6
L
173.2
250.0
N
234.6
340.0
M
250.0
360.0
O
340.0
540.0
N
360.0
510.0
P
540.0
850.0
O
510.0
800.0
Q
850.0
1200.0
P
800.0
1250.0
R
1200.0
1700.0
Q
1250.0
1800.0
S
1700.0
2400.0
R
1800.0
2900.0
T
2400.0
3400.0
S
2900.0
4700.0
U
3400.0
4900.0
T
4700.0
7200.0
V
4900.0
7100.0
U
7200.0
11700.0
W
7100.0
10200.0
V
11700.0
18000.0
X
10200.0
14800.0
W
18000.0
27000.0
Y
14800.0
21400.0
Y
14800.0
21400.0
Z
21400.0
30900.0
Z
21400.0
30900.0
Maximum tolerance for each bin limit is ±18%.
6
Color
Intensity Bin Limit (Con't)
Color
Bin
Green
Color Categories
Lambda (nm)
Intensity Range (mcd)
Min.
Max.
Color
Cat #
Min.
Max.
B
1.8
2.9
Green
6
561.5
564.5
C
2.9
4.7
5
564.5
567.5
D
4.7
7.6
4
567.5
570.5
E
7.6
12.0
3
570.5
573.5
F
12.0
19.1
2
573.5
576.5
G
19.1
30.7
1
582.0
584.5
H
30.7
49.1
3
584.5
587.0
I
49.1
78.5
2
587.0
589.5
J
78.5
125.7
4
589.5
592.0
K
125.7
201.1
5
592.0
593.0
L
201.1
289.0
M
289.0
417.0
N
417.0
680.0
O
680.0
1100.0
P
1100.0
1800.0
Q
1800.0
2700.0
R
2700.0
4300.0
S
4300.0
6800.0
T
6800.0
10800.0
U
10800.0
16000.0
V
16000.0
25000.0
W
25000.0
40000.0
Z
21400.0
30900.0
Yellow
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
01
Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02
Tape & Reel, straight leads, minimum increment 1300 pcs/bag
A1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2
T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1
T-13/4 Angle Housing, uneven lead, minimum increment 500 pcs/bag
B2
T-13/4 Angle Housing, even leads, minimum increment 500 pcs/bag
Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
7
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
• Recommended soldering conditions:
Diagonal
Plated ThroughHole Diameter
0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave Soldering
Manual Solder
Dipping
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
Pre-heat Temperature
105°C Max.
–
Pre-heat Time
30 sec Max.
–
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Peak Temperature
250°C Max.
260°C Max.
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
Dwell Time
3 sec Max.
5 sec Max.
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 9. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-0379EN - June 7, 2013
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