AVAGO HSMA-A101-R8WJ1 Surface mount led indicator Datasheet

HSMx-A10x-xxxxx PLCC-2
Surface Mount LED Indicator
Data Sheet
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-2 package. These SMT LEDs have high
reliability performance and are designed to work under
a wide range of environmental conditions. This high
reliability feature makes them ideally suited to be used
under harsh interior automotive as well as interior signs
application conditions.
• Industry standard PLCC-2 package
To facilitate easy pick & place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel will
be shipped in single intensity and color bin, except red
color, to provide close uniformity.
• Available in 8 mm carrier tape on 7 inch reel (2000
pieces)
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
can also be mounted using through-the-wave soldering
process.
The super wide viewing angle at 120˚ makes these
LEDs ideally suited for panel, push button, or general
backlighting in automotive interior, office equipment,
industrial equipment, and home appliances. The flat
top emitting surface makes it easy for these LEDs
to mate with light pipes. With the built-in reflector
pushing up the intensity of the light output, these LEDs
are also suitable to be used as LED pixels in interior electronic signs.
• High reliability LED package
• High brightness using AlInGaP and InGaN dice technologies
• Available in full selection of colors
• Super wide viewing angle at 120˚
• Compatible with both IR and TTW soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
3.2 ± 0.2
1.9 ± 0.2
0.1 TYP.
0.8 ± 0.1
3.5 ± 0.2
0.8 ± 0.3
0.5 ± 0.1
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
2.8 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
5.2 ± 0.2
3.2 ± 0.2
0.1 TYP.
CATHODE MARKING
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
0.5 ± 0.1
Device Selection Guide
Red
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMS-A100-J00J1
4.0
15.0
-
20
GaP
HSMS-A100-L00J1
10.0
15.0
-
20
GaP
HSMS-A100-H70J23.0
-
8.0
10
GaP
HSMS-A100-J80J2
5.0
-
15.5
10
GaP
HSMH-A100-L00J1
10.0
15.0
-
20
AlGaAs
HSMH-A100-N00J1
25.0
50.0
-
20
AlGaAs
HSMH-A100-L70J2
12.5
-32.0
10
AlGaAs
HSMH-A100-M80J2
20.0
-
62.0
10
AlGaAs
HSMH-A100-P30J1
40.0
-
100.0
20
AlGaAs
HSMC-A100-J00J1
4.0
100.0
-
20
AlInGaP
HSMC-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMC-A100-R00J1
100.0
140.0
-
20
AlInGaP
HSMC-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSMZ-A100-T00J1
250.0350.0
-
20
AlInGaP
HSMC-A100-P30J1
40.0
-
100.0
20
AlInGaP
HSMC-A101-R80J1
125.0
-395.0
20
AlInGaP
HSMZ-A100-S80J1
200.0
-
620.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMJ-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMJ-A101-S00J1
160.0
200.0
-
20
AlInGaP
HSMV-A100-T00J1
250.0350.0
-
20
AlInGaP
HSMJ-A100-Q30J1
63.0
-
155.0
20
AlInGaP
HSMJ-A100-R40J1
100.0
-315.0
20
AlInGaP
HSMJ-A101-R80J1
125.0
-395.0
20
AlInGaP
HSMV-A100-S80J1
200.0
-
620.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMD-A100-J00J1
4.0
15.0
-
20
GaP
HSMD-A100-L00J1
10.0
15.0
-
20
GaP
HSMD-A100-J7PJ2
5.0
-
12.5
10
GaP
HSMD-A100-K4PJ2
6.3
-
20.0
10
GaP
HSML-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSML-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSML-A100-Q7PJ1
80.0
-
200.0
20
AlInGaP
HSML-A100-R7PJ1
125.0
-315.0
20
AlInGaP
HSML-A101-R8WJ1
125.0
-395.0
20
AlInGaP
Red Orange
Orange
Device Selection Guide, continued
Yellow/Amber
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMY-A100-J00J1
4.0
12.0
-
20
GaP
HSMY-A100-L00J1
10.0
12.0
-
20
GaP
HSMY-A100-J35J2
4.0
-
10.0
10
GaP
HSMY-A100-K45J2
6.3
-
20.0
10
GaP
HSMA-A100-Q00J1
63.0
100.0
-
20
AlInGaP
HSMA-A101-S00J1
160.0
220.0
-
20
AlInGaP
HSMU-A100-S00J1
160.0320.0
-
20
AlInGaP
HSMA-A100-Q35J1
63.0
-
155.0
20
AlInGaP
HSMA-A100-R45J1
100.0
-315.0
20
AlInGaP
HSMA-A101-R8WJ1
125.0
-395.0
20
AlInGaP
HSMU-A100-S4WJ1
160.0
-
500.0
20
AlInGaP
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMG-A100-J02J1
4.0
18.0
-
20
GaP
HSMG-A100-K72J2
8.0
-
20.0
10
GaP
HSME-A100-M02J1
16.0
70.0
-
20
AlInGaP
-
100.0
20
AlInGaP
Yellow Green
HSME-A100-N82J130.0
Emerald Green
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMG-A100-H01J1
2.5
8.0
-
20
GaP
HSMG-A100-G31J2
1.6
-
4.0
10
GaP
HSMG-A100-H41J2
2.5
-
8.0
10
GaP
HSME-A100-L01J1
10.0
40.0
-
20
AlInGaP
HSME-A100-M3PJ1
16.0
-
40.0
20
AlInGaP
Green
Part Number
HSMM-A101-R00J1
HSMM-A100-S00J1
HSMM-A101-Q7PJ1
HSMM-A101-R7PJ1
HSMM-A101-R8PJ1
HSMM-A100-S8PJ1
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
100.0
200.0
160.0350.0
80.0
200.0
125.0
-315.0
125.0
-395.0
200.0
620.0
Test Current (mA)
20
20
20
20
20
20
Dice Technology
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
Device Selection Guide, continued
Cyan
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMK-A101-R00J1
100.0
170.0
-
20
InGaN
HSMK-A100-S00J1
160.0
280.0
-
20
InGaN
HSMK-A100-S8WJ1
200.0
-
620.0
20
InGaN
HSMK-A101-Q3WJ1
63.0
-
155.0
20
InGaN
HSMK-A101-R4WJ1
100.0
-315.0
20
InGaN
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
HSMB-A100-J00J1
4.0
15.0
-
20
GaN
HSMB-A100-J70J2
5.0
-
12.5
10
GaN
HSMB-A100-K80J2
8.0
-
25.0
10
GaN
HSMN-A101-N00J1
25.0
50.0
-
20
InGaN
HSMN-A100-P00J1
40.0
70.0
-
20
InGaN
HSMN-A101-N7YJ130.0
-
80.0
20
InGaN
HSMN-A100-P8YJ1
-
155.0
20
InGaN
Blue
50.0
Note:
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
Part Numbering System
HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMS/D/Y/G
HSMH
HSMC/J/L/A
HSME
HSMZ/V/U
HSMM/K/B/N
DC Forward Current[1]30 mA30 mA30 mA[3,4]
20 mA[4]30 mA[3,4]30 mA
Peak Forward Current[2] 100 mA
100 mA
100 mA
100 mA
100 mA
100 mA
Power Dissipation
60 mW
63 mW
48 mW
72 mW
114 mW
63 mW
Reverse Voltage
5V
Junction Temperature
110°C
Operating Temperature
–55°C to +100°C
Storage Temperature
–55°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 30 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
Optical Characteristics (TA = 25˚C)
Peak
Dominant
Wavelength
Wavelength[1]
Dice
λPEAK (nm)
λD (nm)
Color
Part Number
Technology
Typ.
Typ.
Viewing Angle
Luminous
2 θ1/2[2]
Efficacy ηv[3]
(Degrees) (lm/W)
Typ.
Typ.
Luminous
Intensity/
Total Flux
Iv(mcd)/Φv(mlm)
Typ.
Red
HSMS-A100
GaP
635
626
120
120
0.45
HSMH-A100
AlGaAs
645
637
120
63
0.45
HSMC-A10x
AlInGaP
635
626
120
150
0.45
HSMZ-A100
AlInGaP
639
630
120
155
0.45
HSMJ-A10x
AlInGaP
621
615
120
240
0.45
HSMV-A100
AlInGaP
623
617
120
263
0.45
HSMD-A100
GaP
600
602
120380
0.45
HSML-A10x
AlInGaP
609
605
120320
0.45
HSMY-A100
GaP
583
585
120
520
0.45
HSMA-A10x
AlInGaP
592
590
120
480
0.45
HSMU-A100
AlInGaP
594
592
120
500
0.45
HSMG-A100
GaP
565
569
120
590
0.45
HSME-A100
AlInGaP
575
570
120
560
0.45
HSMG-A100
GaP
558
560
120
650
0.45
HSME-A100
AlInGaP
566
560
120
610
0.45
Green
HSMM-A10x
InGaN
523
525
120
500
0.45
Cyan
HSMK-A10x
InGaN
502
505
120300
0.45
Blue
HSMB-A100
HSMN-A10x
GaN
InGaN
428
468
462
470
120
120
0.45
0.45
Red
Orange
Orange
Amber
Yellow
Green
Emerald
Green
65
75
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25˚C)
Part Number
Forward Voltage Reverse Voltage Reverse Voltage
VF (Volts) @ IF = 20 mA
VR @ 100 µA
Typ.
Max.
Min.
Thermal
VR @ 10 µA
Min.
Resistance
RθJP (°C/W)
HSMS/D/Y/G
2.2
2.6
5
—
180
HSMH
1.9
2.6
5
—
180
HSMC/J/L/A/E
1.9
2.4
5
—
280
HSMZ/V/U
2.2
2.6
5
—
280
HSMB3.9
4.3
—
5
280
HSMM/K/N3.4
4.05
—
5
280
FORWARD CURRENT – mA
35
30
HSMS/D/Y/G
HSMZ/V/U
25
20
HSMH
15
HSMC/J/L/A/E
HSMM/K/N
10
HSMB
5
0
0
1
2
3
4
5
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
Figure 3. Relative intensity vs. forward current.
35
30
HSMS/D/G/
Y/H/Z/V/U
25
CURRENT - mA
CURRENT - mA
30
HSMC/J/L/A
20
HSME
15
HSMM/K/B/N
10
0
20
40
60
80
100
TEMPERATURE (°C)
120
Figure 4. Maximum forward current vs. ambient
temperature. Derated based on TJMAX = 110˚C,
RθJA = 500˚C/W.
HSMS/D/G/Y/H
25
HSMC/J/L/A
HSMZ/V/U
20
HSME
15
HSMM/K/N
HSMB
10
5
5
0
540
DOMINANT WAVELENGTH – nm
35
0
530
510
20
40
60
80
TEMPERATURE (°C)
100
120
Figure 4b. Maximum Forward Current Vs. Solder
Point Temperature. Derated based on TJMAX =
110°C, RθJP = 180°C/W or 280°C/W.
CYAN
500
490
480
BLUE
470
460
0
GREEN
520
0
5
10
15
20
25
30
CURRENT – mA
Figure 5. Dominant wavelength vs. forward
current – InGaN devices.
HSMx-A100 fig 5
35
DELTA VF (NORMALIZED AT 25°C)
0.5
0.4
0.3
0.2
0.1
GaP/AlGaAs/
AlInGaP
0
-0.1
-0.2
-0.3
-100
InGaN/GaN
-50
0
50
100
150
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
TEMPERATURE
10 to 30 SEC.
217 °C
200 °C
255 - 260 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
(Acc. to J-STD-020C)
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
4.50
1.50
2.60
200
150
FLUXING
100
BOTTOM SIDE
OF PC BOARD
50
30
TOP SIDE OF
PC BOARD
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
Figure 11. Tape leader and trailer dimensions.
Figure 12. Tape dimensions.
10
Figure 13. Reel dimensions.
Figure 14. Reeling orientation.
11
Intensity Bin Select (X5X6)
Individual reel will contain parts
from one half bin only.
X5
Min Iv Bin
X6
0
Full Distribution
33 half bins starting from X51
4
4 half bins starting from X51
5
5 half bins starting from X51
73 half bins starting from X52
8
4 half bins starting from X52
9
5 half bins starting from X52
Intensity Bin Limits
Bin ID
Min. (mcd)
Max. (mcd)
G1
1.80
2.24
G2
2.24
2.80
H1
2.803.55
H23.55
4.50
J1
4.50
5.60
J2
5.60
7.20
K1
7.20
9.00
K2
9.00
11.20
L1
11.20
14.00
L2
14.00
18.00
M1
18.00
22.40
M2
22.40
28.50
N1
28.5035.50
N235.50
45.00
P1
45.00
56.00
P2
56.00
71.50
Q1
71.50
90.00
Q2
90.00
112.50
R1
112.50
140.00
R2
140.00
180.00
S1
180.00
224.00
S2
224.00
285.00
T1
285.00355.00
T2355.00
450.00
U1
450.00
560.00
U2
560.00
715.00
V1
715.00
900.00
V2
900.00
1125.00
Tolerance of each bin limit = ± 12%.
12
Color Bin Select (X7)
Individual reel will contain parts
from one full bin only.
X7
0
Full Distribution
Z
A and B only
Y
B and C only
W
C and D only
V
D and E only
U
E and F only
T
F and G only
S
G and H only
Q
A, B, and C only
P
B, C, and D only
N
C, D, and E only
M
D, E, and F only
L
E, F, and G only
K
F, G, and H only
1
A, B, C, and D only
2
E, F, G, and H only
3
B, C, D, and E only
4
C, D, E, and F only
5
A, B, C, D, and E only
6
B, C, D, E, and F only
Color Bin Limits
Blue
Min. (nm)
A
460.0
B
465.0
C
470.0
D
475.0
Cyan
A
B
C
D
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
465.0
470.0
475.0
480.0
Max. (nm)
495.0
500.0
505.0
510.0
Color Bin Limits
Emerald
Green
Min. (nm)
Max. (nm)
A
552.5
555.5
B
555.5
558.5
C
558.5
561.5
D
561.5
564.5
Yellow
Green
Min. (nm)
Max. (nm)
E
564.5
567.5
F
567.5
570.5
G
570.5
573.5
H
573.5
576.5
Amber
A
B
C
D
E
F
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
Orange
A
B
C
D
E
Min. (nm)
597.0
600.0
603.0
606.0
609.0
Max. (nm)
600.0
603.0
606.0
609.0
612.0
Red Orange
A
B
Min. (nm)
611.0
616.0
Red
Min. (nm)
Full Distribution
Max. (nm)
616.0
620.0
Max. (nm)
Tolerance of each bin limit = ± 1 nm.
Green
Min. (nm)
Max. (nm)
A
B
C
D
515.0
520.0
525.0
530.0
520.0
525.0
530.0
535.0
Packaging Option (X8X9)
Option Test Current
J1
20 mA
J4
20 mA
H1
20 mA
H4
20 mA
J2
10 mA
J5
10 mA
H2
10 mA
H5
10 mA
Moisture Sensitivity
Package Type
Top Mount
Top Mount
Reverse Mount
Reverse Mount
Top Mount
Top Mount
Reverse Mount
Reverse Mount
Reel Size
7 inch
13 inch
7 inch
13 inch
7 inch
13 inch
7 inch
13 inch
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored
in sealed MBB with desiccant or desiccator at
<5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need
to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C / 60%
RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0040EN
AV02-0198EN - May 30, 2007
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