Diodes DMG6968U N-channel enhancement mode mosfet Datasheet

DMG6968U
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Mechanical Data

Low On-Resistance
 25mΩ @ VGS = 4.5V
 29mΩ @ VGS = 2.5V
 36mΩ @ VGS = 1.8V










Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 2kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)




Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish — Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e3
Terminals Connections: See Diagram Below
Weight: 0.008 grams (Approximate)
D
D
G
Gate Protection
Diode
S
G
S
ESD PROTECTED TO 2kV
Internal Schematic
Top View
Top View
Ordering Information (Note 5)
Part Number
Compliance
Case
Packaging
DMG6968U-7
Standard
Automotive
SOT23
3000/Tape & Reel
SOT23
3000/Tape & Reel
DMG6968UQ-7
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified. For more information, please refer to https://www.diodes.com/quality/product-compliance-definitions/.
5. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
2N4
Date Code Key
Year
Code
Month
Code
YM
Marking Information
2N4 = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
2009
W
….
…..
2017
E
2018
F
2019
G
2020
H
2021
I
2022
J
2023
K
2024
L
2025
M
2026
N
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
DMG6968U
Document number: DS31738 Rev. 7 - 2
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November 2017
© Diodes Incorporated
DMG6968U
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
20
V
Gate-Source Voltage
VGSS
±12
V
ID
6.5
5.2
A
IDM
30
A
Symbol
Value
Unit
PD
1.3
W
RθJA
157
°C/W
TJ, TSTG
-55 to +150
°C
Steady
State
Continuous Drain Current (Note 6)
TA = +25°C
TA = +70°C
Pulsed Drain Current
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient @ TA = +25°C
Operating and Storage Temperature Range
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Gate-Source Breakdown Voltage
TJ = +25°C
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
20


V
VGS = 0V, ID = 250µA
IDSS


1.0
µA
VDS = 20V, VGS = 0V
IGSS


±10
µA
VGS = 10V, VDS = 0V
BVSGS
±12
—
—
V
VDS = 0V, IG = 250µA
VGS(TH)
0.5
V
VDS = VGS, ID = 250µA
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS(ON)


0.9
21
25
23
29
28
36
VGS = 4.5V, ID = 6.5A
mΩ
VGS = 1.8V, ID = 3.5A
|Yfs|

8

S
Input Capacitance
Ciss

151

pF
Output Capacitance
Coss

91

pF
Reverse Transfer Capacitance
Crss

32

pF
Total Gate Charge
Qg

8.5

nC
Gate-Source Charge
Qgs

1.6

nC
Gate-Drain Charge
Qgd

2.8

nC
tD(ON)

54

ns
Turn-On Rise Time
tR

66

ns
Turn-Off Delay Time
tD(OFF)

613

ns
tF

205

ns
Forward Transfer Admittance
VGS = 2.5V, ID = 5.5A
VDS = 10V, ID = 5A
DYNAMIC CHARACTERISTICS (Note 8)
Turn-On Delay Time
Turn-Off Fall Time
Notes:
VDS = 10V, VGS = 0V
f = 1.0MHz
VGS = 4.5V, VDS = 10V, ID = 6.5A
VDD = 10V, VGS = 4.5V,
RL = 10, RG = 6, ID = 1A
6. Device mounted on FR-4 substrate PC board, 2oz. copper, with thermal vias to bottom layer 1 inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMG6968U
Document number: DS31738 Rev. 7 - 2
2 of 6
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November 2017
© Diodes Incorporated
DMG6968U
20
20
VGS = 10V
VGS = 4.5V
16
16
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = 5V
VGS = 3.0V
)A
(
T
N
E 12
R
R
U
C
N 8
IA
R
D
,D
I
4
VGS = 2.5V
VGS = 2.0V
12
VGS = 1.5V
8
4
TA = 150°C
T A = 125°C
TA = 85°C
TA = 25°C
0.5
1 1.5 2 2.5 3 3.5 4 4.5
V DS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
5
0.04
)

(
E
C
N
A
T
S
IS
E
R
-N
O
E
C
R
U
O
S
-N
IA
R
D
, )N
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0
VGS = 1.8V
0.03
VGS = 2.5V
VGS = 4.5V
0.02
1
1.5
VGS , GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
2
0.06
VGS = 4.5V
0.05
0.04
TA = 150°C
TA = 125°C
0.03
TA = 85°C
TA = 25°C
0.02
TA = -55°C
0.01
O
(S
D
R
0.01
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
0
0
30
4
8
12
16
ID, DRAIN CURRENT (A)
20
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
1.6
0.06
VGS = 2.5V
ID = 5.5A
1.4
0.05
R
, DRAIN-SOURCE
RDSON
, DRAIN-SOURCE
DS(ON)
()
ON-RESISTANCE(
ON-RESISTANCE
)
RDSON, DRAIN-SOURCE
ON-RESISTANCE
RDS(ON), DRAIN-SOURCE
(NORMALIZED)
ON-RESISTANCE
(NORMALIZED)
TA = -55°C
0
0.5
0
VGS = 4.5V
ID = 6.5A
1.2
1.0
0.8
0.04
VGS = 2.5V
ID = 5.5A
0.03
VGS = 4.5V
ID = 6.5A
0.02
0.01
0.6
-50
-25
0
25
50
75 100 125 150
(°C))
TA, AMBIENT TEMPERATURE (癈
Fig. 5 On-Resistance Variation with Temperature
DMG6968U
Document number: DS31738 Rev. 7 - 2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°
(癈
C))
Fig. 6 On-Resistance Variation with Temperature
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DMG6968U
1.4
T
(
S
G
20
1.2
16
)A
(
T
N
E
R 12
R
U
C
E
C
R 8
U
O
S
,S
I
4
1.0
ID = 250µA
0.8
0.6
0.4
TA = 25°C
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
)V
(
E
G
A
T
L
O
V
D
L
O
H
S
E
R
H
T
E
T
A
G
, )H
ID = 1mA
0.2
V
0
-50 -25
0
25
50
75 100 125 150
TA , AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0
0
500
0.2
0.4
0.6
0.8
1
1.2
VSD , SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
100,000
450
f = 1MHz
C, CAPACITANCE (pF)
350
300
250
200
Ciss
150
100
I
Coss
IDSS, LEAKAGE CURRENT (nA)
)A 10,000
n
(
T
N
E
R
R
1,000
U
C
E
G
A
K
100
A
E
L
,S
400
S
D
TA = 150°C
TA = 125°C
TA = 85°C
10
TA = -55°C
50
Crss
0
0
TA = 25°C
1
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Total Capacitance
20
0
2
4
6
8 10 12 14 16 18 20
VDS , DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Leakage Current vs. Drain-Source Voltage
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RJA(t) = r(t) * RJA
RJA = 162°
162癈C/W
/W
D = 0.02
0.01
D = 0.01
P(pk)
D = 0.005
t2
TJ - TA = P * RJA(t)
Duty Cycle, D = t 1/t2
D = Single Pulse
0.001
0.000001 0.00001
DMG6968U
Document number: DS31738 Rev. 7 - 2
t1
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 11 Transient Thermal Response
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10
100
1,000
November 2017
© Diodes Incorporated
DMG6968U
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
All 7°
H
K1
GAUGE PLANE
0.25
J
K
a
M
A
L
C
L1
B
D
G
F
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085 0.150 0.110
a
0°
8°
-All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT23
Y
C
Y1
X
DMG6968U
Document number: DS31738 Rev. 7 - 2
Dimensions
C
X
X1
Y
Y1
Value (in mm)
2.0
0.8
1.35
0.9
2.9
X1
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DMG6968U
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
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Copyright © 2017, Diodes Incorporated
www.diodes.com
DMG6968U
Document number: DS31738 Rev. 7 - 2
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November 2017
© Diodes Incorporated
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