STMicroelectronics BAT46AZFILM Small signal schottky diode Datasheet

BAT46 Series
Small signal Schottky diodes
Main product characteristics
IF
150 mA
VRRM
100 V
C (typ)
6 pF
Tj (max)
150° C
BAT46ZFILM
(Single)
SOD-123
BAT46JFILM
(Single)
Features and benefits
■
Very small conduction losses
■
Negligible switching losses
■
Low forward voltage drop
■
Surface mount device
SOD-323
BAT46FILM
(Single)
Description
Diodes in the BAT46 series are high voltage,
small signal Schottky diodes suited for protection
and routing operations.
SOT-23
BAT46CFILM
(Common cathode)
Order codes
Part Number
Marking
BAT46ZFILM
Z46
BAT46FILM
S46
BAT46AFILM
A46
BAT46CFILM
C46
BAT46SFILM
B46
BAT46WFILM
D46
BAT46AWFILM
DB6
BAT46CWFILM
DB8
BAT46SWFILM
B46
BAT46JFILM
46
BAT46AFILM
(Common anode)
BAT46SFILM
(Series)
BAT46WFILM
(Single)
SOT-323
BAT46AWFILM
(Common anode)
BAT46CWFILM
(Common cathode)
BAT46SWFILM
(Series)
Configurations in top view
July 2006
Rev 4
1/11
www.st.com
Characteristics
BAT46 Series
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
100
V
Continuous forward current
150
mA
1
A
-65 to +150
°C
150
°C
260
°C
Value
Unit
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
TL
tp = 10 ms Sinusoidal
Maximum operating junction temperature
Maximum soldering
(1)
temperature(1)
1. Pulse test: tp = 380 µs, δ < 2 %
Table 2.
Thermal parameters
Symbol
Rth(j-a)
Parameter
Junction to ambient(1)
SOD-123, SOT-23
500
SOT-323, SOD-323,
550
°C/W
1. On epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Tj = 25° C
IR(1)
Reverse leakage current
Tj = 60° C
VF
(2)
Forward voltage drop
Tj = 25° C
Min.
Typ
Max.
VR = 1.5 V
0.5
VR = 10 V
0.8
VR = 50 V
2
VR = 75 V
5
VR = 1.5 V
5
VR = 10 V
7.5
VR = 50 V
15
VR = 75 V
20
Unit
µA
IF = 0.1 mA
0.25
IF =10 mA
0.45
IF =250 mA
1
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Table 4.
Dynamic characteristics
Symbol
Parameter
C
2/11
Diode capacitance
Test conditions
Min.
Typ
VR = 0 V, F = 1 MHz
10
VR = 1 V, F = 1 MHz
6
Max.
Unit
pF
BAT46 Series
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
P(W)
Average forward current versus
ambient temperature (δ = 1)
IF(AV)(A)
0.12
δ=0.05
δ=0.1
0.16
δ=1
δ=0.5
δ=0.2
0.14
0.10
0.12
0.08
0.10
0.08
0.06
0.06
0.04
T
T
0.04
0.02
δ=tp/T
IF(AV)(A)
0.02
tp
δ=tp/T
tp
T amb (°C)
0.00
0.00
0.00
0.02
Figure 3.
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0
0.18
Reverse leakage current versus
reverse applied voltage (typical
values)
25
Figure 4.
IR(µA)
50
75
100
125
150
Reverse leakage current versus
junction temperature
IR(µA)
1.E+04
1.E+03
VR=75 V
Tj=125 °C
1.E+03
1.E+02
Tj=100 °C
1.E+02
Tj=75 °C
1.E+01
1.E+01
Tj=50 °C
1.E+00
1.E+00
1.E-01
Tj=25 °C
Tj(°C)
VR(V)
1.E-01
10
Figure 5.
20
30
40
50
60
70
80
1.E-02
90
0
100
Junction capacitance versus
reverse applied voltage (typical
values)
Figure 6.
25
50
75
100
125
150
Forward voltage drop versus
forward current (typical values,
low-level)
IFM (mA)
C(pF)
12
20
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
10
18
16
14
8
Tj=125 °C
12
6
Tj=25 °C
10
8
4
6
4
2
2
VR(V)
VFM(V)
0
0
0
10
20
30
40
50
60
70
80
90
100
0.0
0.1
0.2
0.3
0.4
0.5
0.6
3/11
Characteristics
Figure 7.
BAT46 Series
Forward voltage drop versus
forward current (typical values,
high-level)
Figure 8.
IFM (A)
Relative variation of thermal
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
eCU = 35 µm (SOD-323)
Zth(j-a) /Rth(j-a)
1.00
1.E+00
Single pulse
SOD-323
Tj=125 °C
1.E-01
Tj=25 °C
0.10
VFM(V)
tP(s)
1.E-02
0.0
0.1
Figure 9.
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Relative variation of thermal
impedance junction to ambient
versus pulse duration aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
0.01
1.E-02
1.E+00
1.E+01
1.E+02
Figure 10. Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, eCU = 35 µm (SOT-323)
Zth(j-a) /Rth(j-a)
Zth(j-a) (°C/W)
1.00
1000
Single pulse
SOT-23
Single pulse
SOT-323
0.10
100
Alumine substrate
10 x 8 x 0.5 mm
tP(s)
0.01
1.E-02
1.E-01
1.E+00
1.E+01
tP(s)
1.E+02
Figure 11. Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
eCU = 35 µm (SOD-323)
Rth(j-a) (°C/W)
600
550
500
450
400
350
SCU(mm²)
300
0
4/11
1.E-01
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
5
10
15
20
25
30
35
40
45
50
10
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
BAT46 Series
2
Ordering information scheme
Ordering information scheme
BAT46
xx
xx FILM
Signal Schottky diodes
Configuration
No letter = Single diode
A = Common anode
C = Common cathode
S = Series diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
Z = SOD-123
Package
FILM = Tape and reel
5/11
Package information
3
BAT46 Series
Package information
Epoxy meets UL94, V0
Table 5.
SOD-123 dimensions
Dimensions
Ref.
H
Millimeters
Inches
A2
A1
b
Min.
A
E
D
A
c
Max.
Min.
1.45
Max.
0.057
A1
0
0.1
0
0.004
A2
0.85
1.35
0.033
0.053
b
0.55 Typ.
0.022 Typ.
c
0.15 Typ.
0.039 Typ.
D
2.55
2.85
0.1
0.112
E
1.4
1.7
0.055
0.067
G
0.25
H
3.55
G
0.01
3.95
Figure 12. SOD-123 footprint (dimensions in mm)
4.45
0.65
0.97
6/11
2.51
0.97
0.14
0.156
BAT46 Series
Package information
Table 6.
SOD-323 dimensions
Dimensions
H
A1
Ref.
b
Millimeters
Min.
E
A
A
D
c
Q1
L
Max.
Inches
Min.
1.17
Max.
0.046
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.54
1.06
1.08
1.06
7/11
Package information
Table 7.
BAT46 Series
SOT-23 dimensions
Dimensions
Ref.
Millimeters
Inches
A
Min.
Max.
Min.
Max.
A
0.89
1.4
0.035
0.055
A1
0
0.1
0
0.004
B
0.3
0.51
0.012
0.02
c
0.085
0.18
0.003
0.007
D
2.75
3.04
0.108
0.12
e
0.85
1.05
0.033
0.041
e1
1.7
2.1
0.067
0.083
E
1.2
1.6
0.047
0.063
H
2.1
2.75
0.083
0.108
E
e
B
D
e1
S
A1
L
c
H
L
0.6 typ.
S
0.35
0.024 typ.
0.65
Figure 14. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
8/11
3.25
0.014
0.026
BAT46 Series
Package information
Table 8.
SOT-323 dimensions
Dimensions
Ref.
Millimeters
Inches
A
Min.
E
e
Typ.
Max.
Min.
Typ.
Max.
A
0.8
1.1
0.031
0.043
A1
0.0
0.1
0.0
0.004
b
0.25
0.4
0.010
0.016
c
0.1
0.26
0.004
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
D
b
A1
c
e
θ
0.65
0.026
L
H
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
30°
0
30°
Figure 15. SOT-323 footprint (dimensions in mm)
0.95
1.0
0.8
2.9
0.50
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
4
5
10/11
BAT46 Series
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
BAT46ZFILM
Z46
SOD-123 Single
10 mg
3000
Tape and reel
BAT46FILM
S46
SOT-23 Single
10 mg
3000
Tape and reel
BAT46AFILM
A46
SOT-23
Common anode
10 mg
3000
Tape and reel
BAT46CFILM
C46
SOT-23
Common cathode
10 mg
3000
Tape and reel
BAT46SFILM
B46
SOT-23 Series
10 mg
3000
Tape and reel
BAT46WFILM
D46
SOT-323 Single
6 mg
3000
Tape and reel
BAT46AWFILM
DB6
SOT-323
Common anode
6 mg
3000
Tape and reel
BAT46CWFILM
DB8
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAT46SWFILM
B46
SOT-323 Series
6 mg
3000
Tape and reel
BAT46JFILM
46
SOD-323
5 mg
3000
Tape and reel
Revision history
Date
Revision
Description of Changes
Jun-1999
3
Previous revision.
25-Jul-2006
4
BAT46Z, J, W datasheets merged. ECOPACK statement
added.
BAT46 Series
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11/11
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