BAT46 Series Small signal Schottky diodes Main product characteristics IF 150 mA VRRM 100 V C (typ) 6 pF Tj (max) 150° C BAT46ZFILM (Single) SOD-123 BAT46JFILM (Single) Features and benefits ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount device SOD-323 BAT46FILM (Single) Description Diodes in the BAT46 series are high voltage, small signal Schottky diodes suited for protection and routing operations. SOT-23 BAT46CFILM (Common cathode) Order codes Part Number Marking BAT46ZFILM Z46 BAT46FILM S46 BAT46AFILM A46 BAT46CFILM C46 BAT46SFILM B46 BAT46WFILM D46 BAT46AWFILM DB6 BAT46CWFILM DB8 BAT46SWFILM B46 BAT46JFILM 46 BAT46AFILM (Common anode) BAT46SFILM (Series) BAT46WFILM (Single) SOT-323 BAT46AWFILM (Common anode) BAT46CWFILM (Common cathode) BAT46SWFILM (Series) Configurations in top view July 2006 Rev 4 1/11 www.st.com Characteristics BAT46 Series 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 100 V Continuous forward current 150 mA 1 A -65 to +150 °C 150 °C 260 °C Value Unit IFSM Surge non repetitive forward current Tstg Storage temperature range Tj TL tp = 10 ms Sinusoidal Maximum operating junction temperature Maximum soldering (1) temperature(1) 1. Pulse test: tp = 380 µs, δ < 2 % Table 2. Thermal parameters Symbol Rth(j-a) Parameter Junction to ambient(1) SOD-123, SOT-23 500 SOT-323, SOD-323, 550 °C/W 1. On epoxy printed circuit board with recommended pad layout Table 3. Symbol Static electrical characteristics Parameter Test conditions Tj = 25° C IR(1) Reverse leakage current Tj = 60° C VF (2) Forward voltage drop Tj = 25° C Min. Typ Max. VR = 1.5 V 0.5 VR = 10 V 0.8 VR = 50 V 2 VR = 75 V 5 VR = 1.5 V 5 VR = 10 V 7.5 VR = 50 V 15 VR = 75 V 20 Unit µA IF = 0.1 mA 0.25 IF =10 mA 0.45 IF =250 mA 1 V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % Table 4. Dynamic characteristics Symbol Parameter C 2/11 Diode capacitance Test conditions Min. Typ VR = 0 V, F = 1 MHz 10 VR = 1 V, F = 1 MHz 6 Max. Unit pF BAT46 Series Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current P(W) Average forward current versus ambient temperature (δ = 1) IF(AV)(A) 0.12 δ=0.05 δ=0.1 0.16 δ=1 δ=0.5 δ=0.2 0.14 0.10 0.12 0.08 0.10 0.08 0.06 0.06 0.04 T T 0.04 0.02 δ=tp/T IF(AV)(A) 0.02 tp δ=tp/T tp T amb (°C) 0.00 0.00 0.00 0.02 Figure 3. 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0 0.18 Reverse leakage current versus reverse applied voltage (typical values) 25 Figure 4. IR(µA) 50 75 100 125 150 Reverse leakage current versus junction temperature IR(µA) 1.E+04 1.E+03 VR=75 V Tj=125 °C 1.E+03 1.E+02 Tj=100 °C 1.E+02 Tj=75 °C 1.E+01 1.E+01 Tj=50 °C 1.E+00 1.E+00 1.E-01 Tj=25 °C Tj(°C) VR(V) 1.E-01 10 Figure 5. 20 30 40 50 60 70 80 1.E-02 90 0 100 Junction capacitance versus reverse applied voltage (typical values) Figure 6. 25 50 75 100 125 150 Forward voltage drop versus forward current (typical values, low-level) IFM (mA) C(pF) 12 20 F=1 MHz VOSC=30 mVRMS Tj=25 °C 10 18 16 14 8 Tj=125 °C 12 6 Tj=25 °C 10 8 4 6 4 2 2 VR(V) VFM(V) 0 0 0 10 20 30 40 50 60 70 80 90 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 3/11 Characteristics Figure 7. BAT46 Series Forward voltage drop versus forward current (typical values, high-level) Figure 8. IFM (A) Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Zth(j-a) /Rth(j-a) 1.00 1.E+00 Single pulse SOD-323 Tj=125 °C 1.E-01 Tj=25 °C 0.10 VFM(V) tP(s) 1.E-02 0.0 0.1 Figure 9. 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Relative variation of thermal impedance junction to ambient versus pulse duration aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) 0.01 1.E-02 1.E+00 1.E+01 1.E+02 Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Zth(j-a) /Rth(j-a) Zth(j-a) (°C/W) 1.00 1000 Single pulse SOT-23 Single pulse SOT-323 0.10 100 Alumine substrate 10 x 8 x 0.5 mm tP(s) 0.01 1.E-02 1.E-01 1.E+00 1.E+01 tP(s) 1.E+02 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) Rth(j-a) (°C/W) 600 550 500 450 400 350 SCU(mm²) 300 0 4/11 1.E-01 Epoxy FR4 SCU=2.25 mm² eCU=35 µm 5 10 15 20 25 30 35 40 45 50 10 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 BAT46 Series 2 Ordering information scheme Ordering information scheme BAT46 xx xx FILM Signal Schottky diodes Configuration No letter = Single diode A = Common anode C = Common cathode S = Series diodes Package Blank = SOT-23 J = SOD-323 W = SOT-323 Z = SOD-123 Package FILM = Tape and reel 5/11 Package information 3 BAT46 Series Package information Epoxy meets UL94, V0 Table 5. SOD-123 dimensions Dimensions Ref. H Millimeters Inches A2 A1 b Min. A E D A c Max. Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 G 0.01 3.95 Figure 12. SOD-123 footprint (dimensions in mm) 4.45 0.65 0.97 6/11 2.51 0.97 0.14 0.156 BAT46 Series Package information Table 6. SOD-323 dimensions Dimensions H A1 Ref. b Millimeters Min. E A A D c Q1 L Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06 7/11 Package information Table 7. BAT46 Series SOT-23 dimensions Dimensions Ref. Millimeters Inches A Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 E e B D e1 S A1 L c H L 0.6 typ. S 0.35 0.024 typ. 0.65 Figure 14. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 8/11 3.25 0.014 0.026 BAT46 Series Package information Table 8. SOT-323 dimensions Dimensions Ref. Millimeters Inches A Min. E e Typ. Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 D b A1 c e θ 0.65 0.026 L H H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 q 0 30° 0 30° Figure 15. SOT-323 footprint (dimensions in mm) 0.95 1.0 0.8 2.9 0.50 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 4 5 10/11 BAT46 Series Ordering information Part Number Marking Package Weight Base qty Delivery mode BAT46ZFILM Z46 SOD-123 Single 10 mg 3000 Tape and reel BAT46FILM S46 SOT-23 Single 10 mg 3000 Tape and reel BAT46AFILM A46 SOT-23 Common anode 10 mg 3000 Tape and reel BAT46CFILM C46 SOT-23 Common cathode 10 mg 3000 Tape and reel BAT46SFILM B46 SOT-23 Series 10 mg 3000 Tape and reel BAT46WFILM D46 SOT-323 Single 6 mg 3000 Tape and reel BAT46AWFILM DB6 SOT-323 Common anode 6 mg 3000 Tape and reel BAT46CWFILM DB8 SOT-323 Common cathode 6 mg 3000 Tape and reel BAT46SWFILM B46 SOT-323 Series 6 mg 3000 Tape and reel BAT46JFILM 46 SOD-323 5 mg 3000 Tape and reel Revision history Date Revision Description of Changes Jun-1999 3 Previous revision. 25-Jul-2006 4 BAT46Z, J, W datasheets merged. ECOPACK statement added. 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