LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones Check for Samples: LMV1032 FEATURES DESCRIPTION • The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB. 1 2 • • • • • • • • • • • (Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted) Output Voltage Noise (A-weighted) −89 dBV Low Supply Current 60 μA Supply Voltage 1.7V to 5V PSRR 70 dB Signal to Noise Ratio 61 dB Input Capacitance 2 pF Input Impedance >100 MΩ Output Impedance <200Ω Max Input Signal 170 mVPP Temperature Range −40°C to 85°C Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology. APPLICATIONS • • • • • Mobile Communications - Bluetooth Automotive Accessories Cellular Phones PDAs Accessory Microphone Products Block Diagram The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature. The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria. Electret Microphone DIAPHRAGM VDD xx xxx x x ELECTRET VIN VOUT 1x GAIN CONNECTOR x x IC VDC x GND AIRGAP BACKPLATE LMV1032 VCC x VOUT GND These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2013, Texas Instruments Incorporated LMV1032 SNAS233G – DECEMBER 2003 – REVISED MAY 2013 www.ti.com Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model 2500V Machine Model Supply Voltage 250V VDD - GND 5.5V −65°C to 150°C Storage Temperature Range Junction Temperature (4) Mounting Temperature (1) (2) (3) (4) 150°C max Infrared or Convection (20 sec.) 235°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The Human Body Model (HBM) is 1.5 kΩ in series with 100 pF. The Machine Model is 0Ω in series with 200 pF. The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Supply Voltage 1.7V to 5V −40°C to +85°C Temperature Range (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. 1.7V and 5V Electrical Characteristics (1) Unless otherwise specified, all limits ensured for TJ = 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature extremes. Symbol Parameter Min (2) Conditions IDD Supply Current VIN = GND SNR Signal to Noise Ratio VDD = 1.7V VIN = 18 mVPP f = 1 kHz VDD = 5V VIN = 18 mVPP f = 1 kHz VIN Power Supply Rejection Ratio Max Input Signal 1.7V < VDD < 5V f = 1 kHz and THD+N < 1% fLOW Lower −3 dB Roll Off Frequency RSOURCE = 50Ω VIN = 18 mVPP fHIGH Upper −3 dB Roll Off Frequency RSOURCE = 50Ω VIN = 18 mVPP (1) (2) (3) 2 Max (2) Units 60 85 100 μA LMV1032-06 58 LMV1032-15 61 LMV1032-25 61 LMV1032-06 59 LMV1036-15 61 LMV1032-25 PSRR Typ (3) dB 62 LMV1032-06 65 60 75 LMV1032-15 60 55 70 LMV1032-25 55 50 65 LMV1032-06 300 LMV1032-15 170 LMV1032-25 60 70 LMV1032-06 120 LMV1032-15 75 LMV1032-25 21 dB mVPP Hz kHz Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. All limits are specified by design or statistical analysis. Typical values represent the most likely parametric norm. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 1.7V and 5V Electrical Characteristics(1) (continued) Unless otherwise specified, all limits ensured for TJ = 25°C and VDD = 1.7V and 5V. Boldface limits apply at the temperature extremes. Symbol en Parameter Output Noise VOUT Min (2) Conditions A-Weighted Output Voltage VIN = GND Typ (3) LMV1032-06 −97 LMV1032-15 −89 LMV1032-25 −80 100 300 500 LMV1032-15 250 500 750 LMV1032-25 300 600 1000 Output Impedance f = 1 kHz IO Output Current VDD = 1.7V, VOUT = 1.7V, Sinking 0.9 0.5 2.3 VDD = 1.7V, VOUT = 0V, Sourcing 0.3 0.2 0.64 VDD = 5V, VOUT = 1.7V, Sinking 0.9 0.5 2.4 VDD = 5V, VOUT = 0V, Sourcing 0.4 0.1 1.46 Total Harmonic Distortion CIN Input Capacitance ZIN Input Impedance AV Gain Units dBV LMV1032-06 RO THD Max (2) Ω <200 f = 1 kHz VIN = 18 mVPP LMV1032-06 0.11 LMV1032-15 0.13 LMV1032-25 0.35 mA % 2 pF >100 f = 1 kHz VIN = 18 mVPP mV MΩ LMV1032-06 5.5 4.5 6.2 6.7 7.7 LMV1032-15 14.8 14 15.4 16 17 LMV1032-25 24.8 24 25.5 26.2 27 dB Connection Diagram Large Dome 4-Bump DSBGA A2 OUTPUT X A1 GND B2 VCC B1 INPUT Figure 1. Top View • • Note: Pin numbers are referenced to package marking text orientation. The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 3 LMV1032 SNAS233G – DECEMBER 2003 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C Supply Current vs. Supply Voltage (LMV1032-06) Supply Current vs. Supply Voltage (LMV1032-15) 75 70 70 SUPPLY CURRENT (PA) SUPPLY CURRENT (PA) 85°C 65 25°C 60 -40°C 55 50 1.5 2 2.5 3 3.5 4 4.5 5 60 25°C 55 -40°C 50 45 1.5 5.5 85°C 65 2 2.5 SUPPLY VOLTAGE (V) 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE (V) Figure 2. Figure 3. ' Supply Current vs. Supply Voltage (LMV1032-25) Closed Loop Gain and Phase vs. Frequency (LMV1032-06) 10.00 70 180 GAIN 5.00 135 0.00 90 -5.00 45 25°C 60 0 -10.00 PHASE -15.00 -45 -20.00 -90 -25.00 -135 -40°C 55 50 1.5 -180 -30.00 2 2.5 3 3.5 4 4.5 5 10 5.5 1k 100 10k 100k 1M FREQUENCY (Hz) SUPPLY VOLTAGE (V) Figure 4. Figure 5. Closed Loop Gain and Phase vs. Frequency (LMV1032-15) 20 Closed Loop Gain and Phase vs. Frequency (LMV1032-25) 30 450 450 GAIN GAIN 25 400 400 10 20 350 250 -5 GAIN (dB) 300 0 15 PHASE (°) PHASE 5 350 PHASE 10 300 5 0 PHASE (°) 15 GAIN (dB) PHASE (°) 65 GAIN (dB) SUPPLY CURRENT (PA) 85°C 250 -5 200 -10 150 -15 10 100 1k 10k 100k 1M 200 -10 -15 150 10 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 6. 4 100 Figure 7. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 Typical Performance Characteristics (continued) Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C Power Supply Rejection Ratio vs. Frequency (LMV1032-15) 120 120 100 100 80 80 PSRR (dB) PSRR (dB) Power Supply Rejection Ratio vs. Frequency (LMV1032-06) 60 60 40 40 20 20 0 10 0 100 1k 10k 100k 10 FREQUENCY (Hz) 100 1k 10k 100k FREQUENCY (Hz) Figure 8. \ Figure 9. Power Supply Rejection Ratio vs. Frequency (LMV1032-25) Total Harmonic Distortion vs. Frequency (LMV1032-06) 120 0.7 100 0.6 VIN = 18 mVPP 0.5 THD+N (%) PSRR (dB) 80 60 40 0.4 0.3 0.2 20 0.1 0.0 0 10 100 1k 10k 10 100k 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 10. Figure 11. Total Harmonic Distortion vs. Frequency (LMV1032-15) Total Harmonic Distortion vs. Frequency (LMV1032-25) 0.7 0.6 VIN = 18 mVPP VIN = 18 mVPP 0.6 0.5 0.4 THD+N (%) THD + N (%) 0.5 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0.0 0.0 10 100 1k 10k 100k FREQUENCY (Hz) 10 100 1k 10k 100k FREQUENCY (Hz) Figure 12. Figure 13. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 5 LMV1032 SNAS233G – DECEMBER 2003 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = 1.7V, single supply, TA = 25°C Total Harmonic Distortion vs. Input Voltage (LMV1032-15) 1.6 1.6 1.4 1.4 1.2 1.2 1.0 1.0 THD+N (%) THD+N (%) Total Harmonic Distortion vs.Input Voltage (LMV1032-06) 0.8 0.6 0.4 0.8 0.6 0.4 0.2 0.2 f = 1 kHz f = 1 kHz 0.0 0.0 0 50 100 150 200 250 300 350 400 0 50 INPUT VOLTAGE (mVPP) 100 150 200 INPUT VOLTAGE (mVPP) Figure 14. Figure 15. Total Harmonic Distortion vs. Input Voltage (LMV1032-25) Output Voltage Noise vs. Frequency (LMV1032-06) 1.6 -100 1.4 -105 -110 NOISE (dBV/ Hz) THD+N (%) 1.2 1.0 0.8 0.6 0.4 -115 -120 -125 -130 -135 -140 0.2 -145 f = 1 kHz -150 0.0 0 20 40 60 10 80 100 10k 100k Figure 17. Output Voltage Noise vs. Frequency (LMV1032-15) Output Voltage Noise vs. Frequency (LMV1032-25) -80 -80 -90 -90 -100 -100 NOISE (dBV/ Hz) NOISE (dBV/ Hz) Figure 16. -110 -120 -130 -140 -110 -120 -130 -140 -150 -150 10 100 1k 10k 100k FREQUENCY (Hz) 10 100 1k 10k 100k FREQUENCY (Hz) Figure 18. 6 1k FREQUENCY (Hz) INPUT VOLTAGE (mVPP) Figure 19. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 APPLICATION SECTION LOW CURRENT The LMV1032 has a low supply current which allows for a longer battery life. The low supply current of 60µA makes this amplifier optimal for microphone applications which need to be always on. BUILT-IN GAIN The LMV1032 is offered in the space saving small DSBGA package which fits perfectly into the metal can of a microphone. This allows the LMV1032 to be placed on the PCB inside the microphone. The bottom side of the PCB has the pins that connect the supply voltage to the amplifier and make the output available. The input of the amplifier is connected to the microphone via the PCB. DIAPHRAGM xx xxx x x ELECTRET AIRGAP BACKPLATE CONNECTOR x x IC x LMV1032 VCC x VOUT GND Figure 20. Built-in Gain A-WEIGHTED FILTER The human ear has a frequency range from 20 Hz to about 20 kHz. Within this range the sensitivity of the human ear is not equal for each frequency. To approach the hearing response weighting filters are introduced. One of those filters is the A-weighted filter. The A-weighted filter is usually used in signal-to-noise ratio measurements, where sound is compared to device noise. It improves the correlation of the measured data to the signal-to-noise ratio perceived by the human ear. 10 0 -10 dBV -20 -30 -40 -50 -60 -70 10 100 1k 10k 100k FREQUENCY (Hz) Figure 21. A-Weighted Filter Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 7 LMV1032 SNAS233G – DECEMBER 2003 – REVISED MAY 2013 www.ti.com MEASURING NOISE AND SNR The overall noise of the LMV1032 is measured within the frequency band from 10 Hz to 22 kHz using an Aweighted filter. The input of the LMV1032 is connected to ground with a 5 pF capacitor. A-WEIGHTED FILTER 5pF Figure 22. Noise Measurement Setup The signal-to-noise ratio (SNR) is measured with a 1 kHz input signal of 18 mVPP using an A-weighted filter. This represents a sound pressure level of 94 dB SPL. No input capacitor is connected. SOUND PRESSURE LEVEL The volume of sound applied to a microphone is usually stated as the pressure level with respect to the threshold of hearing of the human ear. The sound pressure level (SPL) in decibels is defined by: Sound pressure level (dB) = 20 log Pm/PO Where, Pm is the measured sound pressure PO is the threshold of hearing (20μPa) In order to be able to calculate the resulting output voltage of the microphone for a given SPL, the sound pressure in dB SPL needs to be converted to the absolute sound pressure in dBPa. This is the sound pressure level in decibels which is referred to as 1 Pascal (Pa). The conversion is given by: dBPa = dB SPL + 20*log 20 μPa dBPa = dB SPL - 94 dB Translation from absolute sound pressure level to a voltage is specified by the sensitivity of the microphone. A conventional microphone has a sensitivity of −44 dBV/Pa. ABSOLUTE SOUND PRESSURE [dBPa] -94dB SENSITIVITY [dBV/Pa] SOUND PRESSURE [dB SPL] VOLTAGE [dBV] Figure 23. dB SPL to dBV Conversion 8 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 Example: Busy traffic is 70 dB SPL VOUT = 70 −94 −44 = −68 dBV This is equivalent to 1.13 mVPP Since the LMV1032-15 has a gain of 5.6 (15 dB) over the JFET, the output voltage of the microphone is 6.35 mVPP. By replacing the JFET with the LMV1032-15, the sensitivity of the microphone is −29 dBV/Pa (−44 + 15). LOW FREQUENCY CUT OFF FILTER To reduce noise on the output of the microphone a low cut filter has been implemented in the LMV1032. This filter reduces the effect of wind and handling noise. It's also helpful to reduce the proximity effect in directional microphones. This effect occurs when the sound source is very close to the microphone. The lower frequencies are amplified which gives a bass sound. This amplification can cause an overload, which results in a distortion of the signal. 20 450 GAIN 15 400 350 PHASE 5 300 0 PHASE (°) GAIN (dB) 10 250 -5 200 -10 150 -15 10 1k 100 10k 100k 1M FREQUENCY (Hz) Figure 24. Gain vs. Frequency The LMV1032 is optimized to be used in audio band applications. The LMV1032 provides a flat gain response within the audio band and offers linearity and excellent temperature stability. ADVANTAGE OF THREE PINS The LMV1032 ECM solution has three pins instead of the two pins provided in the case of a JFET solution. The third pin provides the advantage of a low supply current, high PSRR and eliminates the need for additional components. Noise pick-up by a microphone in a cell phone is a well-known problem. A conventional JFET circuit is sensitive for noise pick-up because of its high output impedance. The output impedance is usually around 2.2 kΩ. By providing separate output and supply pins a much lower output impedance is achieved and therefore is less sensitive to noise pick-up. RF noise is among other caused by non-linear behavior. The non-linear behavior of the amplifier at high frequencies, well above the usable bandwidth of the device, causes AM demodulation of high frequency signals. The AM modulation contained in such signals folds back into the audio band, thereby disturbing the intended microphone signal. The GSM signal of a cell phone is such an AM-modulated signal. The modulation frequency of 216 Hz and its harmonics can be observed in the audio band. This type of noise is called bumblebee noise. EXTERNAL PRE-AMPLIFIER APPLICATION The LMV1032 can also be used outside of an ECM as a space saving external pre-amplifier. In this application, the LMV1032 follows a phantom biased JFET microphone in the circuit. This is shown in Figure 25. The input of the LMV1032 is connected to the microphone via the 2.2 µF capacitor. The advantage of this circuit over one with only a JFET microphone are the additional gain and the high pass filter supplied by the LMV1032. The high pass filter makes the output signal more robust and less sensitive to low frequency disturbances. In this configuration the LMV1032 should be placed as close as possible to the microphone. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 9 LMV1032 SNAS233G – DECEMBER 2003 – REVISED MAY 2013 www.ti.com VDD VDD 2.2 k: VDD VIN 2.2 PF JFET Microphone VOUT VOUT GND LMV1032 GND Figure 25. LMV1032 as External Pre-Amplifier 10 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 LMV1032 www.ti.com SNAS233G – DECEMBER 2003 – REVISED MAY 2013 REVISION HISTORY Changes from Revision F (May 2013) to Revision G • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: LMV1032 11 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) LMV1032UP-06/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LMV1032UP-15/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LMV1032UP-25/NOPB ACTIVE DSBGA YPC 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LMV1032UPX-06/NOPB ACTIVE DSBGA YPC 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UPX-25/NOPB ACTIVE DSBGA YPC 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UR-15/NOPB ACTIVE DSBGA YPD 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LMV1032UR-25/NOPB ACTIVE DSBGA YPD 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LMV1032URX-15/NOPB ACTIVE DSBGA YPD 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032URX-25/NOPB ACTIVE DSBGA YPD 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV1032UP-06/NOPB DSBGA YPC 4 250 178.0 8.4 LMV1032UP-15/NOPB DSBGA YPC 4 250 178.0 LMV1032UP-25/NOPB DSBGA YPC 4 250 178.0 LMV1032UPX-06/NOPB DSBGA YPC 4 3000 LMV1032UPX-25/NOPB DSBGA YPC 4 LMV1032UR-15/NOPB DSBGA YPD LMV1032UR-25/NOPB DSBGA YPD LMV1032URX-15/NOPB DSBGA LMV1032URX-25/NOPB DSBGA 1.22 1.22 0.56 4.0 8.0 Q1 8.4 1.22 1.22 0.56 4.0 8.0 Q1 8.4 1.22 1.22 0.56 4.0 8.0 Q1 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 4 250 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 YPD 4 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 YPD 4 3000 178.0 8.4 1.22 1.22 0.56 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV1032UP-06/NOPB DSBGA YPC 4 250 210.0 185.0 35.0 LMV1032UP-15/NOPB DSBGA YPC 4 250 210.0 185.0 35.0 LMV1032UP-25/NOPB DSBGA YPC 4 250 210.0 185.0 35.0 LMV1032UPX-06/NOPB DSBGA YPC 4 3000 210.0 185.0 35.0 LMV1032UPX-25/NOPB DSBGA YPC 4 3000 210.0 185.0 35.0 LMV1032UR-15/NOPB DSBGA YPD 4 250 210.0 185.0 35.0 LMV1032UR-25/NOPB DSBGA YPD 4 250 210.0 185.0 35.0 LMV1032URX-15/NOPB DSBGA YPD 4 3000 210.0 185.0 35.0 LMV1032URX-25/NOPB DSBGA YPD 4 3000 210.0 185.0 35.0 Pack Materials-Page 2 MECHANICAL DATA YPC0004 D 0.350±0.045 E UPA04XXX (Rev C) D: Max = 1.184 mm, Min =1.123 mm E: Max = 1.184 mm, Min =1.123 mm 4215139/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 MECHANICAL DATA YPD0004 D 0.350±0.045 E URA04XXX (Rev D) D: Max = 1.184 mm, Min =1.123 mm E: Max = 1.184 mm, Min =1.123 mm 4215141/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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