TI DRV777 7- bit integrated motor and relay driver Datasheet

DRV777
www.ti.com
SLRS062 – DECEMBER 2012
7- bit Integrated Motor and Relay Driver
Check for Samples: DRV777
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
(1)
Supports up to 20V Output Pull-up Voltage
–40°C to 125°C Operating Temperature Range
Supports Wide Range of Stepper Motors, DC
Motors, Relays, and Inductive Coils
Low Output VOL of 0.4V (Typical) With
– 140mA Current Sink per Channel at 5.0V
Logic Input(1)
– 1A Current Output when all 7 Channels
Tied in Parallel(1)
Compatible to 1.8V, 3.3V and 5.0V Microcontrollers and Logic Interface
Internal Free-wheeling Diodes for Inductive
Kick-back Protection
Input Pull-down Resistors Allows Tri-stating
the Input Driver
Input RC-Snubber to Eliminate Spurious
Operation in Noisy Environment
Low Input and Output Leakage Currents
Easy to use Parallel Interface
ESD Protection Exceeds JESD 22
– 2kV HBM, 500V CDM
Available in 16-pin SOIC and TSSOP Packages
Total current sink may be limited by the internal junction
temperature, absolute maximum current levels etc - refer to
the Electrical Specifications section for details.
APPLICATIONS
•
•
•
•
•
•
Unipolar Stepper Motor Drivers
Relay and Inductive Load Drivers
Solenoid Drivers
Lamp and LED Displays
Logic Level Shifter
General Low-Side Switch Applications
Functional Diagram
IN1
1
16
OUT1
IN2
2
15
OUT2
IN3
3
14
OUT3
IN4
4
13
OUT4
OUT5
IN5
5
12
IN6
6
11
OUT6
IN7
7
10
OUT7
GND
8
9
COM
DRV777 TSSOP/SOIC
DESCRIPTION
DRV777 motor driver features 7 low output
impedance drivers that minimize on-chip power
dissipation. DRV777 supports 1.8V to 5V CMOS logic
input interface thus making it compatible to a wide
range of micro-controllers and other logic interfaces.
DRV777 features an improved input interface that
minimizes the input DC current drawn from the
external drivers. Device also features an input RC
snubber that greatly improves its performance in
noisy operating conditions. All channel inputs feature
an internal input pull-down resistor thus allowing input
logic to be tri-stated. DRV777 also supports other
logic input levels, e.g. TTL and 1.8V; see typical
characteristics section for details.
As shown in the Functional Diagram, each output of
the DRV777 features an internal free-wheeling diode
connected in a common-cathode configuration at the
COM pin.
Device provides flexibility of increasing current sink
capability through combining several adjacent
channels in parallel. Under typical conditions DRV777
can support up to 1.0A of load current when all 7channels are connected in parallel. DRV777 is
available in 16-pin SOIC and 16-pin TSSOP
packages.
Table 1. DRV777 Function Table(1)
INPUT (IN1 – IN7)
OUTPUT (OUT1–OUT7)
L
H+(2)
H
L
Z
+(2)
H
(1) L = Low-level (GND); H= High-level; Z= High-impedance;
(2) H+ = Pull-up-level
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV777
SLRS062 – DECEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
TJ
PART NUMBER
–40°C to 125°C
(1)
PACKAGE
TOP-SIDE MARKING
DRV777DR
16-Pin SOIC
Reel of 2500
DRV777
DRV777PWR
16-Pin TSSOP
Reel of 2000
DRV777
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DEVICE INFORMATION
IN1
1
16
OUT1
IN2
2
15
OUT2
IN3
3
14
OUT3
IN4
4
13
OUT4
16-Pin
SOIC/TSSOP
COM
OUTX
RC Filter/Snubber
RIN=3kQ
INX
IN5
5
IN6
6
11
OUT6
IN7
7
10
OUT7
GND
8
9
COM
12
OUT5
NFET
Pull-down
300kQ
ESD
Figure 1. DRV777 PINOUT
CIN= 9pF
ESD
Figure 2. Channel Block Diagram
DRV777 PIN DESCRIPTION
NAME
PIN NUMBER
IN1 – IN7
GND
COM
OUT7 – OUT1
2
DESCRIPTION
16-SOIC
16-TSSOP
1–7
1–7
8
8
Ground Reference Pin
9
9
Internal Free-Wheeling Diode Common Cathode Pin
10–16
10–16
Logic Input Pins IN1 through IN7
Channel Output Pins OUT7 through OUT1
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SLRS062 – DECEMBER 2012
ABSOLUTE MAXIMUM RATINGS (1)
Specified at TJ = –40°C to 125°C unless otherwise noted.
VALUE
MIN
MAX
–0.3
UNIT
VIN
Pins IN1- IN7 to GND voltage
5.5
V
VOUT
Pins OUT1 – OUT7 to GND voltage
20
V
VCOM
Pin COM to GND voltage
20
V
Max GND-pin continuous current (100ºC < TJ < +125°C)
700
mA
Max GND-pin continuous current (TJ < +100°C)
1.0
A
16 Pin - SOIC
0.86
W
16 Pin - TSSOP
IGND
PD
Total device power dissipation at TA = 85°C
ESD
0.68
W
ESD Rating – HBM
2
kV
ESD Rating – CDM
500
V
TJ
Operating virtual junction temperature
–55
150
°C
Tstg
Storage temperature range
–55
150
°C
(1)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
DISSIPATION RATINGS (1) (2)
PACKAGE
θJC
θJA (3)
DERATING
FACTOR
ABOVE TA =
25ºC
TA < 25°C
TA = 70°C
TA = 85°C
High-K
16-Pin SOIC
46°C/W
75°C/W
13.33 mW/ºC
1.66 W
1.06 W
0.86 W
0.59 W
High-K
16-Pin TSSOP
49°C/W
95°C/W
10.44 mW/ºC
1.31 W
0.84 W
0.68 W
0.47 W
BOARD
(1)
(2)
(3)
TA = 105°C
Maximum dissipation values for retaining device junction temperature of 150°C
Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance
Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
VOUT
Channel off-state output pull-up voltage
16
V
VCOM
COM pin voltage
16
V
IOUT(ON)
Per channel continuous sink current
TJ
Operating junction temperature
(1)
VINx = 3.3V
100 (1)
VINx = 5.0V
140 (1)
–40
125
mA
ºC
1) Refer to ABSOLUTE MAXIMUM RATINGS for TJ dependent absolute maximum GND-pin current
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DRV777
SLRS062 – DECEMBER 2012
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ELECTRICAL CHARACTERISTICS
Specified over the recommended junction temperature range TJ = –40°C to 125°C and over recommended operating
conditions unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUTS IN1 THROUGH IN7 PARAMETERS
VI(ON)
IN1–IN7 logic high input voltage
Vpull-up = 3.3 V, Rpull-up = 1 kΩ, IOUTX = 3.2 mA
VI(OFF)
IN1–IN7 logic low input voltage
Vpull-up = 3.3 V, Rpull-up = 1 kΩ,
(IOUTX < 20 µA)
1.65
V
0.4
II(ON)
IN1–IN7 ON state input current
Vpull-up = 3.3 V, VINx = 3.3 V
12
II(OFF)
IN1–IN7 OFF state input leakage
Vpull-up = 3.3 V, VINx = 0 V
0.6
V
25
uA
250
nA
OUTPUTS OUT1 THROUGH OUT7 PARAMETERS
VINX = 3.3 V, IOUTX = 100 mA
0.36
VINX = 5.0 V, IOUTX = 140 mA
0.40
VOL
OUT1–OUT7 low-level output voltage
IOUT(ON)
OUT1–OUT7 ON-state continuous
current (1) (2) at VOUTX = 0.4V
VINX = 3.3 V, VOUTX = 0.4 V
80
100
VINX = 5.0 V, VOUTX = 0.4 V
95
140
IOUT(OFF)(ICEX)
OUT1–OUT7 OFF-state leakage current
VINX = 0 V, VOUTX = VCOM = 16 V
0.49
V
mA
0.5
µA
SWITCHING PARAMETERS (3) (4)
tPHL
OUT1–OUT7 logic high propagation delay
VINX = 3.3V, Vpull-up = 12 V, Rpull-up = 1 kΩ
50
70
ns
tPLH
OUT1–OUT7 logic low propagation delay
VINX = 3.3V, Vpull-up = 12 V, Rpull-up = 1 kΩ
121
140
ns
t CHANNEL
Channel to Channel delay
Over recommended operating conditions and
with same test conditions on channels.
15
50
ns
RPD
IN1–IN7 input pull-down Resistance
300k
390k
ζ
IN1–IN7 Input filter time constant
COUT
OUT1–OUT7 output capacitance
210k
VINX = 3.3 V, VOUTX = 0.4 V
Ω
9
ns
15
pF
FREE-WHEELING DIODE PARAMETERS (5) (4)
VF
Forward voltage drop
IF-peak
Diode peak forward current
(1)
(2)
(3)
(4)
(5)
4
IF-peak = 140 mA, VF = VOUTx – VCOM
1.2
V
140
mA
The typical continuous current rating is limited by VOL= 0.4V. Whereas, absolute maximum operating continuous current may be limited
by the Thermal Performance parameters listed in the Dissipation Rating Table and other Reliability parameters listed in the
Recommended Operating Conditions Table.
Refer to the Absolute Maximum Ratings Table for TJ dependent absolute maximum GND-pin current.
Rise and Fall propagation delays, tPHL and tPLH, are measured between 50% values of the input and the corresponding output signal
amplitude transition.
Guaranteed by design only. Validated during qualification. Not measured in production testing.
Not rated for continuous current operation – for higher reliability use an external freewheeling diode for inductive loads resulting in more
than specified maximum free-wheeling. diode peak current across various temperature conditions
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DRV777
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SLRS062 – DECEMBER 2012
APPLICATION INFORMATION
TTL and other Logic Inputs
DRV777 input interface is specified for standard 1.8V, 3V and 5V CMOS logic interface. Refer to Figure 8 and
Figure 9 to establish VOL and the corresponding typical load current levels for various input voltage ranges.
Application Information section shows an implementation to drive 1.8V relays using DRV777.
Input RC Snubber
DRV777 features an input RC snubber that helps prevent spurious switching in noisy environment. Connect an
external 1kΩ to 5kΩ resistor in series with the input to further enhance DRV777’s noise tolerance.
High-impedance Input Drivers
DRV777 features a 300kΩ input pull-down resistor. The presence of this resistor allows the input drivers to be tristated. When a high-impedance driver is connected to a channel input the DRV777 detects the channel input as
a low level input and remains in the OFF position. The input RC snubber helps improve noise tolerance when
input drivers are in the high-impedance state.
On-chip Power Dissipation
Use the below equation to calculate DRV777 on-chip power dissipation PD:
N
PD = å VOLi ´ ILi
i=1
Where:
N is the number of channels active together.
VOLi is the OUTi pin voltage for the load current ILi.
(1)
Thermal Reliability
It is recommended to limit DRV777 IC’s die junction temperature to less than 125°C. The IC junction temperature
is directly proportional to the on-chip power dissipation. Use the following equation to calculate the maximum
allowable on-chip power dissipation for a target IC junction temperature:
PD(MAX) =
(T
J(MAX)
- TA )
qJA
Where:
TJ(MAX) is the target maximum junction temperature.
TA is the operating ambient temperature.
θJA is the package junction to ambient thermal resistance.
(2)
Improving Package Thermal Performance
The package θJA value under standard conditions on a High-K board is listed in the DISSIPATION RATINGS. θJA
value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can
help reduce θJA and thus improve device thermal capabilities. Refer to TI’s design support web page at
www.ti.com/thermal for a general guidance on improving device thermal performance.
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DRV777
SLRS062 – DECEMBER 2012
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Application Examples
One Amp Unipolar DC Motor Driver
An implementation of DRV777 for driving a uniploar DC motor is shown in Figure 3. With all of the channels tied
together and the input being driven at 5V, the driver can sink 1A of current. With a VOL of 0.4V this creates a
driver with 400mΩ. The input snubber circuitry is great for PWM applications that need high noise immunity.
These two features make DRV777 an ideal choice for power efficient high duty cycle motor driving applications.
Logic Input
(5V)
DRV777
IN1
VSUP
OUT1
+
IN2
OUT2
IN3
OUT3
IN4
OUT4
IN5
OUT5
IN6
OUT6
IN7
OUT7
M
_
GND
VSUP
COM
Figure 3. DRV777 as a DC Motor Driver
6
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SLRS062 – DECEMBER 2012
Unipolar Stepper Motor Driver
Figure 4 shows an implementation of DRV777 for driving a uniploar stepper motor. The unconnected input
channels can be used for other functions. When an input pin is left open the internal 300kΩ pull down resistor
pulls the respective input pin to GND potential. For higher noise immunity use an external short across an
unconnected input and GND pins.
Motor
Motor Supply (Up to 8V)
VSUP
Motor Control Pulses
(3V to 5V)
DRV777
IN1
OUT1
Phase_A
IN2
OUT2
Phase_C
IN3
OUT3
Phase_B
IN4
OUT4
Phase_D
IN5
OUT5
IN6
OUT6
IN7
OUT7
GND
VSUP
COM
Figure 4. DRV777 as a Stepper Motor Driver
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DRV777
SLRS062 – DECEMBER 2012
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Multi-Purpose Sink Driver
When configured as per Figure 5 DRV777 can be used as a multi-purpose driver. The output channels can be
tied together to sink more current. DRV777 can easily drive motors, relays & LEDs with little power dissipation.
The COM pin must be tied to the supply of whichever inductive load is to be protected by the free-wheeling
diode.
VSUP
Logic Inputs
(1.8V to 5V)
+
DRV777
VSUP
IN1
OUT1
IN2
OUT2
IN3
OUT3
IN4
OUT4
IN5
OUT5
IN6
OUT6
IN7
OUT7
M
_
IN1 NOR IN2 NOR IN3
GND
VSUP
COM
Figure 5. DRV777 Multi-Purpose Sink Driver Application
8
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DRV777
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SLRS062 – DECEMBER 2012
1.8V Relay Driver
To drive lower voltage relays, like 1.8V, connect two or more adjacent channels in parallel as shown in Figure 6.
Connecting several channels in parallel lowers the channel output resistance and thus minimizes VOL for a fixed
current. DRV777 can be used for driving 3V, 5V and 12V relays with similar implementation.
VSUP
1.8V Relays
DRV777
1.8V Logic
1.8V Logic
1.8V Logic
IN1
OUT1
IN2
OUT2
IN3
OUT3
IN4
OUT4
IN5
OUT5
IN6
OUT6
IN7
OUT7
GND
VSUP
COM
Figure 6. DRV777 Driving 1.8V Relays
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SLRS062 – DECEMBER 2012
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TYPICAL CHARACTERISTICS
TA = +25ºC
Figure 7. Load Current 1-Channel; VOL=0.4V
Figure 8. Load Current 7-Channels in parallel; VOL=0.4V
Figure 9. Freewheeling Diode VF versus IF
10
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DRV777DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
DRV777PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DRV777PWR
Package Package Pins
Type Drawing
TSSOP
PW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
7.0
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV777PWR
TSSOP
PW
16
2000
364.0
364.0
27.0
Pack Materials-Page 2
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