DS26C32AMQML www.ti.com SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 DS26C32AMQML Quad Differential Line Receiver Check for Samples: DS26C32AMQML FEATURES DESCRIPTION • • The DS26C32A is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS. 1 2 • • • • CMOS Design for Low Power ±0.2V Sensitivity Over Input Common Mode Voltage Range Input Fail-Safe Circuitry Inputs Won't Load Line When VCC = 0V Meets the Requirements of EIA Standard RS422 TRI-STATE Outputs for Connection to System Buses The DS26C32A has an input sensitivity of 200 mV over the common mode input voltage range of ±7V. The DS26C32A features internal pull-up and pulldown resistors which prevent output oscillation on unused channels. The DS26C32A provides an enable and disable function common to all four receivers, and features TRI-STATE outputs with 6 mA source and sink capability. This product is pin compatible with the DS26LS32A and the AM26LS32. CONNECTION DIAGRAMS Figure 1. CDIP and CLGA Packages-Top View See Package Numbers NFE0016A, NAC0016A, or NAD0016A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated DS26C32AMQML SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 www.ti.com Figure 2. 20-Lead LCCC Package-Top View See Package Number NAJ0020A Logic Diagram Truth Table ENABLE ENABLE Input L H X Z VID ≥ V Th (Max) H All Other Combinations of Enable Inputs (1) (1) Output VID ≤ V Th (Min) L Open H Z = TRI-STATE These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML DS26C32AMQML www.ti.com SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) Supply Voltage (VCC) 7V Common Mode Range (VCM) ±14V Differential Input Voltage (VDiff) ±14V Enable Input Voltage (V I) 7V −65°C ≤ TA ≤ +150°C Storage Temperature Range (T Stg) Lead Temperature (Soldering 4 sec.) (1) (2) 260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not verify specific performance limits. For verified specifications and test conditions, see the Electrical Characteristics. The verified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Unless otherwise specified, all voltages are referenced to ground. Recommended Operating Conditions Min Max Units Supply Voltage (VCC) 4.50 5.50 V Operating Temperature Range (TA) −55 +125 °C Quality Conformance Inspection Table 1. Mil-Std-883, Method 5005 - Group A Subgroup Description Temp °C 1 Static tests at +25 2 Static tests at +125 3 Static tests at -55 4 Dynamic tests at +25 5 Dynamic tests at +125 6 Dynamic tests at -55 7 Functional tests at +25 8A Functional tests at +125 8B Functional tests at -55 9 Switching tests at +25 10 Switching tests at +125 11 Switching tests at -55 12 Settling time at +25 13 Settling time at +125 14 Settling time at -55 DS26C32AM Electrical Characteristics DC Parameters Parameter Test Conditions Notes Min Max Unit Subgroups -200 +200 mV 1, 2, 3 4.5 11 KΩ 1, 2, 3 VTH Minimum Differential Input Voltage VCC = 5V, VO = VOH or VOL, -7 < VCM < +7 RI Input Resistance VCC = 5V, -7 < VCM < +7, One input AC Gnd II Input Current VCC = 5V, VI = +10V, Other Input = Gnd +1.8 mA 1, 2, 3 VCC = 5V, VI = -10V, Other Input = Gnd -2.7 mA 1, 2, 3 V 1, 2, 3 V 1, 2, 3 VOH Logical "1" Output Voltage VCC = 4.5V, VDiff = +1V, IO = -6.0mA VOL Logical "0" Output Voltage VCC = 5.5V, VCC = Max, VDiff = -1V, IO = 6.0mA 3.8 0.3 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML 3 DS26C32AMQML SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 www.ti.com DS26C32AM Electrical Characteristics DC Parameters (continued) Parameter Test Conditions Notes Min Unit Subgroups V 1, 2, 3 0.8 V 1, 2, 3 µA 1, 2, 3 Max VIH Minimum Enable High Level Voltage (1) VIL Maximum Enable Low Level Voltage (1) IOZ Maximum TRI-STATE Output Leakage Current VO = VCC or Gnd, Enable = VIL, Enable = VIH ±5.0 II Maximum Enable Input Current VI = VCC or Gnd ±1.0 µA 1, 2, 3 ICC Quiescent Power Supply Current VDiff = +1V, VCC = 5.5V 25 mA 1, 2, 3 Max Unit Subgroups (1) 2.0 Parameter tested Go-No-Go only. DS26C32AM Electrical Characteristics AC Parameters - Propagation Delay Time The following conditions apply, unless otherwise specified. Parameter VCC = 5V ±10%, CCL = 50pF, VDiff = 2.5V Test Conditions Notes Min tPLH Input to Output Prop Delay VCM = 0V 35 ns 9, 10, 11 tPHL Input to Output Prop Delay VCM = 0V 35 ns 9, 10, 11 tRise Output Rise Time VCM = 0V 9 ns 9, 10, 11 tFall Output Fall Time VCM = 0V 9 ns 9, 10, 11 tPLZ Output Disable Time RL = 1000Ω 29 ns 9, 10, 11 tPZL Output Enable Time RL = 1000Ω 29 ns 9, 10, 11 tPHZ Output Disable Time RL = 1000Ω 29 ns 9, 10, 11 tPZH Output Enable Time RL = 1000Ω 29 ns 9, 10, 11 4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML DS26C32AMQML www.ti.com SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 Typical Performance Characteristics Differential Propagation Delay vs Temperature Differential Propagation Delay vs Power Supply Voltage Figure 3. Figure 4. Differential Skew vs Temperature Differential Skew vs Power Supply Voltage Figure 5. Figure 6. Output High Voltage vs Output High Current Output High Voltage vs Output High Current Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML 5 DS26C32AMQML SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Output Low Voltage vs Output Low Current Output Low Voltage vs Output Low Current Figure 9. Figure 10. Input Resistance vs Input Voltage Input Current vs Power Supply Voltage Figure 11. Figure 12. Hysteresis & Differential Transition Voltage vs Temperature Hysteresis & Differential Transition Voltage vs Power Supply Voltage Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML DS26C32AMQML www.ti.com SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Supply Current vs Temperature Disabled Supply Current vs Power Supply Voltage Figure 15. Figure 16. Supply Current vs Data Rate Figure 17. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML 7 DS26C32AMQML SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 www.ti.com AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS CL includes load and test jig capacitance. S1 = VCC for tPZL, and tPLZ measurements. S1 = Gnd for tPZH, and tPHZ measurements. Figure 18. Test Circuit for TRI-STATE Output Tests Figure 19. Propagation Delay Figure 20. TRI-STATE Output Enable and Disable Waveforms TYPICAL APPLICATIONS Figure 21. Two-Wire Balanced Systems, RS-422 8 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML DS26C32AMQML www.ti.com SNOSAS3A – OCTOBER 2010 – REVISED APRIL 2013 REVISION HISTORY Released Revision 10/26/2010 * 4/15/2013 A Section New Release, Corporate format Changes MDS data sheets converted into one Corp. data sheet format. MNDS26C32AM-X Rev 0B0 will be archived. Changed layout of National Data Sheet to TI format Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS26C32AMQML 9 PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9164001M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS26C32AME /883 Q 5962-91640 01M2A ACO 01M2A >T 5962-9164001MEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26C32AMJ/883 5962-9164001MEA Q 5962-9164001MFA ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26C32AMW /883 Q 5962-91640 01MFA ACO 01MFA >T 5962-9164001MXA ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 DS26C32AMWG /883 Q 5962-91640 01MXA ACO 01MXA >T DS26C32A MD8 ACTIVE DIESALE Y 0 100 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 DS26C32AME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS26C32AME /883 Q 5962-91640 01M2A ACO 01M2A >T DS26C32AMJ/883 ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26C32AMJ/883 5962-9164001MEA Q DS26C32AMW/883 ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26C32AMW /883 Q 5962-91640 01MFA ACO 01MFA >T DS26C32AMWG/883 ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 DS26C32AMWG /883 Q 5962-91640 01MXA ACO 01MXA >T Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2016 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 MECHANICAL DATA NFE0016A J0016A J16A (REV L) www.ti.com MECHANICAL DATA NAJ0020A E20A (Rev F) www.ti.com MECHANICAL DATA NAD0016A W16A (Rev T) www.ti.com MECHANICAL DATA NAC0016A WG16A (RevG) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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