DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 Miniature, 1-W, 1500-Vrms Isolated Unregulated DC-DC Converters FEATURES DESCRIPTION • • • • • • • The DCV01 series is a family of 1-W, 1500-Vrms isolated, unregulated dc-dc converters. Requiring a minimum of external components and including onchip device protection, the DCV01 series provides extra features such as output disable and synchronization of switching frequencies. 1 23 Up To 85% Efficiency Thermal Protection Device-to-Device Synchronization Short-Circuit Protection EN55022 Class B EMC Performance UL1950 Recognized Component JEDEC PDIP-14 and Gull-Wing Packages APPLICATIONS • • • • • • The use of a highly integrated package design results in highly reliable products with a power density of 40 W/in3 (2.4 W/cm3). This combination of features, high isolation, and small size makes the DCV01 suitable for a wide range of applications. Industrial Control and Instrumentation Point-of-Use Power Conversion Ground Loop Elimination Data Acquisition Test Equipment Secondary Isolation Circuits SYNCOUT 800kHz Oscillator SYNCIN Divide-by-2 Reset VOUT Power Stage 0V Watchdog/ Start Up PSU Thermal Shutdown IBIAS VS Power Controller IC 0V 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Underwriters Laboratories, UL are trademarks of UL LLC. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the device product folder at www.ti.com. SUPPLEMENTAL ORDERING INFORMATION DCV01 05 05 (D) ( ) Basic Model Number: 1-W Product Voltage Input: 5-V In Voltage Output: 5-V Out Dual Output: Package Code: P = PDIP-14 P-U = SOP-14 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) Input voltage VALUE UNIT 5-V input models 7 V 15-V input models 18 V 24-V input models 29 V –60 to +125 °C +270 °C Storage temperature range Lead temperature (soldering, 10 s) 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 ELECTRICAL CHARACTERISTICS At TA = +25°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT Power 100% full load Ripple O/P capacitor = 1-μF, 50% load Voltage vs temperature 0.97 W 20 mVPP Room to cold 0.046 %/°C Room to hot 0.016 %/°C INPUT Voltage range on VS –10% 10% ISOLATION Voltage 1-s flash test 1.5 kVrms UL1950 (1) 1.5 kVrms LINE Regulation 1 %/1% of VS SWITCHING/SYNCHRONIZATION Oscillator frequency (fOSC) Sync input low Switching frequency = fOSC / 2 800 (2) Sync input current kHz 0 (2) 0.4 VSYNC = +2 V V μA 75 Disable time μs 2 Capacitance loading on SYNCIN pin External 3 pF 75 FITS RELIABILITY Demonstrated TA = +55°C THERMAL SHUTDOWN IC temperature at shutdown Shutdown current +150 °C 3 mA TEMPERATURE Operating range (1) (2) –40 +85 °C During UL1950 recognition test only. UL file # E199929. For more information on synchronization, refer to Application Report SBAA035., External Synchronization of the DCP01/02, DCR01/02, and DCV01 Series of DC/DC Converters. ELECTRICAL CHARACTERISTICS PER DEVICE At TA = +25°C, unless otherwise noted. INPUT VOLTAGE (V) OUTPUT VOLTAGE (V) VS VNOM LOAD REGULATION (%) NO LOAD CURRENT (mA) EFFICIENCY (%) IQ 10% TO 100% LOAD (2) 75% LOAD (1) BARRIER CAPACITANCE (pF) LEAKAGE CURRENT (μA) CISO 100% LOAD VISO = 750 Vrms VISO = 750 Vrms MAX TYP MAX TYP TYP TYP TYP 5 5.25 23 31 20 78 3.6 0.9 ±5 ±5.75 19 32 23 80 3.8 0.9 12 12.6 23 38 30 85 5.1 1.2 ±11.4 ±12 ±12.6 19 37 40 82 4.0 1.0 5.5 14.25 15 15.75 30 42 34 84 3.8 0.9 5 5.5 ±14.25 ±15 ±15.75 27 41 42 85 4.7 1.1 13.5 15 16.5 ±11.4 ±12 ±12.6 11 39 19 78 4.2 1.0 DCV011515D 13.5 15 16.5 ±14.25 ±15 ±15.75 12 39 20 79 4.2 1.0 DCV012405 21.6 24 26.4 4.75 5 5.25 13 23 14 77 3.8 0.9 DCV012415D 21.6 24 26.4 ±14.25 ±15 ±15.75 12 35 17 76 5.3 1.3 PRODUCT MIN TYP MAX DCV010505 4.5 5 5.5 4.75 DCV010505D 4.5 5 5.5 ±4.25 DCV010512 4.5 5 5.5 11.4 DCV010512D 4.5 5 5.5 DCV010515 4.5 5 DCV010515D 4.5 DCV011512D (1) (2) MIN TYP 0% LOAD 100% load current = 1 W/VNOM typical. Load regulation = (VOUT at 10% – VOUT at 100%)/VOUT at 75%. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com PIN CONFIGURATION: SINGLE OUTPUT NVA AND DUA PACKAGES PDIP-14 AND SOP-14 (TOP VIEW) VS 1 0V 2 14 SYNCIN DCV01 0V 5 +VOUT 6 NC 7 8 SYNCOUT Table 1. Pin Descriptions (Single Output) PIN NAME PIN NO. VS 1 DESCRIPTION Voltage input 0V 2 Input side common 0V 5 Output side common +VOUT 6 +Voltage out NC 7 Not connected SYNCOUT 8 Unrectified transformer output SYNCIN 14 Synchronization pin PIN CONFIGURATION: DUAL OUTPUT NVA AND DUA PACKAGES PDIP-14 AND SOP-14 (TOP VIEW) VS 1 0V 2 14 SYNCIN DCV01D 0V 5 +VOUT 6 -VOUT 7 8 SYNCOUT Table 2. Pin Descriptions (Dual Output) 4 PIN NAME PIN NO. VS 1 DESCRIPTION Voltage input 0V 2 Input side common 0V 5 Output side common +VOUT 6 +Voltage out –VOUT 7 –Voltage out SYNCOUT 8 Unrectified transformer output SYNCIN 14 Synchronization pin Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 TYPICAL CHARACTERISTICS At TA = +25°C, unless otherwise noted. 14.5 50 1-mF Ceramic 4.7-mF Ceramic 10-mF Ceramic 45 14.0 13.5 35 13.0 30 VOUT (V) Ripple (mVPP) 40 25 20 12.5 12.0 11.5 15 10 11.0 5 10.5 0 +VOUT -VOUT 10.00 10 20 30 40 50 60 70 80 90 10 100 20 30 40 50 60 70 80 90 100 Load (%) Load (%) Figure 1. DCV010505 OUTPUT RIPPLE vs LOAD (20-MHz BW) Figure 2. DCV010512D VOUT vs LOAD 85 18 80 17 VOUT (V) Efficiency (%) 75 70 65 60 16 15 +VOUT -VOUT 55 50 14 20 30 40 50 60 70 80 90 100 10 20 30 40 50 60 70 80 90 Load (%) Load (%) Figure 3. DCV010512D EFFICIENCY vs LOAD Figure 4. DCV010515D VOUT vs LOAD 90 5.60 85 5.50 80 5.40 75 5.30 VOUT (V) Efficiency (%) 10 70 65 100 5.20 5.10 60 5.00 55 4.90 50 4.80 10 20 30 40 50 60 70 80 90 Load (%) Figure 5. DCV010515D EFFICIENCY vs LOAD Copyright © 2000–2013, Texas Instruments Incorporated 100 10 20 30 40 50 60 70 80 100 Load (%) Figure 6. DCV012405 VOUT vs LOAD Submit Documentation Feedback 5 DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, unless otherwise noted. 60 80 50 Emission Level, Peak (dBmA) 90 Efficiency (%) 70 60 50 40 30 20 10 40 30 20 10 0 -10 0 10 20 30 40 50 60 70 80 90 -20 0.15 100 1 10 30 Load (%) Frequency (MHz) Figure 7. DCV012405 EFFICIENCY vs LOAD Figure 8. DCV010505 CONDUCTED EMISSIONS (125% Load) Emission Level, Peak (dBmA) 60 50 40 30 20 10 0 -10 -20 0.15 1 10 30 Frequency (MHz) Figure 9. DCV010505 CONDUCTED EMISSIONS (8% Load) 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 FUNCTIONAL DESCRIPTION OVERVIEW The DCV01 offers up to 1 W of unregulated output power with a typical efficiency of up to 85%. This is achieved through highly integrated packaging technology and the implementation of a custom power stage and control IC. The circuit design uses an advanced BiCMOS/DMOS process. Separate primary and secondary transformer windings give good isolation and low barrier capacitance. POWER STAGE This uses a push-pull, center-tapped topology switching at 400 kHz (divide-by-2 from 800-kHz oscillator). OSCILLATOR AND WATCHDOG The onboard 800-kHz oscillator generates the switching frequency via a divide-by-2 circuit. The oscillator can be synchronized to other DCV01 circuits or an external source, and is used to minimize system noise. A watchdog circuit checks the operation of the oscillator circuit. The oscillator can be stopped by pulling the SYNCIN pin low. The output pins will be tri-stated. This will occur in 2 μs. THERMAL SHUTDOWN The DCV01 is protected by a thermal-shutdown circuit. If the on-chip temperature exceeds 150°C, the device will shut down. Once the temperature falls below 150°C, normal operation will resume. SYNCHRONIZATION In the event that more than one dc-dc converter is needed onboard, beat frequencies and other electrical interference can be generated. This is due to the small variations in switching frequencies between the dc-dc converters. The DCV01 overcomes this by allowing devices to be synchronized to one another. Up to eight devices can be synchronized by connecting the SYNCIN pins together, taking care to minimize the capacitance of tracking. Stray capacitance (> 3 pF) will have the effect of reducing the switching frequency, or even stopping the oscillator circuit. It should be noted that if synchronized devices are used at start up, all devices will draw maximum current simultaneously. This can cause the input voltage to dip, and if it dips below the minimum input voltage (4.5 V), the devices may not start up. A 2.2-μF capacitor should be connected close to the input pins. If more than eight devices are to be synchronized, it is recommended that the SYNCIN pins are driven by an external device. Details are contained in Application Report SBAA035, External Synchronization of the DCP01/02 Series of DC/DC Converters, available for download from www.ti.com. CONSTRUCTION The basic construction of the DCV01 is the same as standard ICs. There is no substrate within the molded package. The DCV01 is constructed using an IC, rectifier diodes, and a wound magnetic toroid on a leadframe. Since there is no solder within the package, the DCV01 does not require any special printed circuit board (PCB) assembly processing. This results in an isolated dc-dc converter with inherently high reliability. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 7 DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com ADDITIONAL FUNCTIONS DISABLE/ENABLE The DCV01 can be disabled or enabled by driving the SYNC pin using an open drain CMOS gate. If the SYNCIN pin is pulled low, the DCV01 will be disabled. The disable time depends upon the external loading; the internal disable function is implemented in 2 μs. Removal of the pull down will cause the DCV01 to be enabled. Capacitive loading on the SYNCIN pin should be minimized in order to prevent a reduction in the oscillator frequency. DECOUPLING Ripple Reduction The high switching frequency of 400 kHz allows simple filtering. To reduce ripple, it is recommended that at least a 1-μF ceramic capacitor is used on VOUT. Dual outputs should both be decoupled to pin 5. A 2.2-μF low-ESR ceramic capacitor on the input of the 5-V input versions, and a 0.47-μF low ESR cap on the 24-V input versions is recommended. Connecting the DCV01 in Series Multiple DCV01 isolated 1W dc-dc converters can be connected in series to provide nonstandard voltage rails. This is possible by using the floating outputs provided by the galvanic isolation of the DCV01. Connect the positive VOUT from one DCV01 to the negative VOUT (0 V) of another, as shown in Figure 10. If the SYNCIN pins are tied together, the self-synchronization feature of the DCV01 will prevent beat frequencies on the voltage rails. The SYNCIN feature of the DCV01 allows easy series connection without external filtering, thus minimizing cost. The outputs on the dual-output DCV01 versions can also be connected in series to provide two times the magnitude of VOUT, as shown in Figure 11. For example, a dual 15-V DCV01 could be connected to provide a 30-V rail. VSUPPLY VOUT1 VS SYNCIN DCV 01 0V 0V VOUT1 + VOUT2 VS VOUT2 SYNCIN DCV 01 0V 0V COM Figure 10. Connecting the DCV01 in Series VSUPPLY VS DCV 0V 01 +VOUT +VOUT -VOUT -VOUT 0V COM Figure 11. Connecting Dual Outputs in Series 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 Connecting the DCV01 in Parallel If the output power from one DCV01 is not sufficient, it is possible to parallel the outputs of multiple DCV01s, as shown in Figure 12. Again, the SYNCIN feature allows easy synchronization to prevent power-rail beat frequencies at no additional filtering cost. VSUPPLY VOUT VS SYNCIN DCV 01 0V 0V 2 x Power Out VS SYNCIN 0V VOUT DCV 01 0V COM Figure 12. Connecting Multiple DCV01s in Parallel Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com PCB LAYOUT RIPPLE AND NOISE Careful consideration should be given to the layout of the PCB in order that the best results can be obtained. The DCV01 is a switching power supply, and as such, can place high peak-current demands on the input supply. In order to avoid the supply falling momentarily during the fast switching pulses, ground and power planes should be used to track the power to the input of the DCV01. If this is not possible, then the supplies must be connected in a star formation with the tracks made as wide as possible. If the SYNCIN pin is being used, then the tracking between device SYNCIN pins should be short, in order to avoid stray capacitance. If the SYNCIN pin is not being used, it is advisable to place a guard ring, (connected to input ground) around this pin to avoid any noise pick up. The output should be taken from the device using ground and power planes; this will ensure minimum losses. A good quality low-ESR capacitor placed as close as practicable across the input will reduce reflected ripple and ensure a smooth start up. A good quality low-ESR capacitor placed as close as practicable across the rectifier output terminal and output ground will give the best ripple and noise performance. THERMAL MANAGEMENT Due to the high power density of this device, it is advisable to provide ground planes on the input and output. ISOLATION Underwriters Laboratories, UL™ defines several classes of isolation that are used in modern power supplies. Safety Extra Low Voltage (SELV) is defined by UL (UL1950 E199929) as a secondary circuit which is so designated and protected that under normal and single fault conditions the voltage between any two accessible parts, or between an accessible part and the equipment earthing terminal for operational isolation does not exceed steady state 42V peak or 60VDC for more than 1 second. DCH, DCP, DCR, and DCV Series DC-DC Converters TI’s DCH, DCP, DCR, and DCV (DCx) series dc-dc converters are specified for operational isolation only. Operation or Functional Isolation Operational or functional isolation is defined by the use of a hipot test only. Typically, this isolation is defined as the use of insulated wire in the construction of the transformer as the primary isolation barrier. The hipot onesecond duration test (dielectric voltage, withstand test) is a production test used to verify that the isolation barrier is functioning. Products with operational isolation should never be used as an element in a safety-isolation system. Basic or Enhanced Isolation Basic or enhanced isolation is defined by specified creepage and clearance limits between the primary and secondary circuits of the power supply. Basic isolation is the use of an isolation barrier in addition to the insulated wire in the construction of the transformer. Input and output circuits must also be physically separated by specified distances. Continuous Voltage For a device that has no specific safety agency approvals (operational isolation), the continuous voltage that can be applied across the part in normal operation is less than 42.4 V peak, or 60 VDC; that is, both input and output should normally be maintained within SELV limits. The isolation test voltage represents a measure of immunity to transient voltages; do not use the device as an element of a safety isolation system when SELV is exceeded. If the device is expected to function correctly with more than 42.4 V peak or 60 VDC applied continuously across the isolation barrier, then the circuitry on both sides of the barrier must be regarded as operating at an unsafe voltage, and further isolation or insulation systems must form a barrier between these circuits and any useraccessible circuitry according to safety standard requirements. 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated DCV01 Series www.ti.com SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 Isolation Voltage Hipot test, flash-tested, withstand voltage, proof voltage, dielectric withstand voltage, and isolation test voltage are all terms that relate to the same thing: a test voltage applied for a specified time across a component designed to provide electrical isolation to verify the integrity of that isolation. TI’s DCx series of dc-dc converters are all 100% production tested at their stated isolation voltage. For the DCP and DCR series, this voltage is 1.0 kVDC for one second. For the DCV series, this voltage is 1.5 kVDC for one second. For the DCH series, this voltage is 3.5 kVDC for one second. Repeated High-Voltage Isolation Testing Repeated high-voltage isolation testing of a barrier component can degrade the isolation capability, depending on materials, construction, and environment. The DCx series of dc-dc converters have toroidal, enameled, wire isolation transformers with no additional insulation between the primary and secondary windings. While a device can be expected to withstand several times the stated test voltage, the isolation capability depends on the wire insulation. Any material, including this enamel (typically polyurethane), is susceptible to eventual chemical degradation when subject to very-high applied voltages. Therefore, strictly limit the number of high-voltage tests and repeated high-voltage isolation testing. However, if it is absolutely required, reduce the voltage by 20% from specified test voltage with a duration limit of one second per test. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 DCV01 Series SBVS014A – AUGUST 2000 – REVISED DECEMBER 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (August 2000) to Revision A Page • Changed data sheet format to latest standard look .............................................................................................................. 1 • Added note to Sync Input parameters in the Electrical Characteristics ................................................................................ 3 • Deleted note 4 ...................................................................................................................................................................... 3 • Changed DCV010505D min output voltage from ±4.75 tp ±4.25 ......................................................................................... 3 • Changed DCV010505D max output voltage from ±5.25 tp ±5.75 ........................................................................................ 3 • Changed Table 1 title text from "Single-Dip" to "Single Output" ........................................................................................... 4 • Changed Table 2 title text from "Dual-Dip" to "Dual Output" ................................................................................................ 4 • Added Isolation section and subsections. ........................................................................................................................... 10 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) DCV010505DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010505DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010505P ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010505P-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010505P-U DCV010505P-U/700 ACTIVE SOP DUA 7 700 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010505P-U DCV010505P-U/700E4 ACTIVE SOP DUA 7 700 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010505P-U DCV010512DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010512DP DCV010512DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV10512DPU DCV010512P ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010512P-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010512P-U DCV010515DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010515DP DCV010515DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010515P ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV010515P-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV010515P-U DCV011512DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV011512DP DCV011512DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV011515DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 1 DCV010505DP DCV010505DP-U DCV010505P DCV010512P DCV010515DP-U DCV010515P DCV011512DP-U DCV011515DP Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) DCV011515DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV011515DP-U DCV011515DP-U/700 ACTIVE SOP DUA 7 700 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV011515DP-U DCV012405P ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV012405P-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV012405P-U DCV012405P-U/700 OBSOLETE SOP DUA 7 TBD Call TI Call TI DCV012405P-U DCV012415DP ACTIVE PDIP NVA 7 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type DCV012415DP DCV012415DP-U ACTIVE SOP DUA 7 25 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV012415DP-U DCV012415DP-U/700 ACTIVE SOP DUA 7 700 Pb-Free (RoHS) CU NIPDAU Level-3-260C-168 HR DCV012415DP-U DCV012405P (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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