STMicroelectronics M58BW16FB4ZA3T 16 or 32 mbit (x32, boot block, burst) 3.3v supply flash memory Datasheet

M58BW16F
M58BW32F
16 or 32 Mbit (x32, Boot Block, Burst)
3.3V supply Flash memories
Preliminary Data
Features
■
Supply voltage
– VDD = 2.7V to 3.6V (45ns) or
VDD = 2.5V to 3.3V (55ns)
– VDDQ = VDDQIN = 2.4V to 3.6V for I/O
Buffers
■
High performance
– Access times: 45 and 55ns
– Synchronous Burst Reads
– 75MHz Effective Zero Wait-State Burst
Read
– Asynchronous Page Reads
■
PQFP80 (T)
BGA
M58BW32F memory organization:
– Eight 64 Kbit small parameter blocks
– Four 128 Kbit large parameter blocks
– Sixty-two 512 Kbit main blocks
■
M58BW16F memory organization:
– Eight 64 Kbit parameter blocks
– Thirty-one 512 Kbit main blocks
■
Hardware block protection
– WP pin to protect any block combination
from Program and Erase operations
– PEN signal for Program/Erase Enable
■
Irreversible Modify protection (OTP like) on 128
Kbits:
– Block 1 (bottom device) or Block 72 (top
device) in the M58BW32F
– Blocks 2 & 3 (bottom device) or Blocks 36 &
35 (top device) in the M58BW16F
■
Security
– 64-bit Unique Device Identifier (UID)
■
Fast programming
– Write to Buffer and Program capability
■
Optimized for FDI drivers
– Common Flash Interface (CFI)
– Fast Program/Erase Suspend feature in
each block
November 2006
LBGA80 (ZA)
10 x 8 ball array
■
Low power consumption
– 100µA typical Standby current
■
Electronic signature
– Manufacturer Code: 0020h
– Top Device Codes:
M58BW32FT: 8838h
M58BW16FT: 883Ah
– Bottom Device Codes:
M58BW32FB: 8837h
M58BW16FB: 8839h
■
Automotive Device Grade 3:
– Temperature: –40 to 125°C
– Automotive grade certified
Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/81
www.st.com
1
Contents
M58BW16F, M58BW32F
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
2
3
Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.1
Address Inputs (A0-Amax) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.2
Data Inputs/Outputs (DQ0-DQ31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.3
Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.4
Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.5
Output Disable (GD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.6
Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.7
Reset/Power-Down (RP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.8
Program/Erase Enable (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.9
Latch Enable (L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.10
Burst Clock (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.11
Burst Address Advance (B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.12
Valid Data Ready (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.13
Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.14
Supply Voltage (VDD)
2.15
Output Supply Voltage (VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.16
Input Supply Voltage (VDDQIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.17
Ground (VSS and VSSQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.18
Don’t Use (DU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.19
Not Connected (NC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1
2/81
Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Asynchronous Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1.1
Asynchronous Bus Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1.2
Asynchronous Latch Controlled Bus Read . . . . . . . . . . . . . . . . . . . . . . 24
3.1.3
Asynchronous Page Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1.4
Asynchronous Bus Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1.5
Asynchronous Latch Controlled Bus Write . . . . . . . . . . . . . . . . . . . . . . 25
3.1.6
Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
M58BW16F, M58BW32F
Contents
3.1.7
Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1.8
Reset/Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.2
3.3
4
5
Synchronous bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2.1
Synchronous Burst Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2.2
Synchronous Burst Read Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Burst Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.3.1
Read Select Bit (M15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.3.2
Standby Disable Bit (M14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.3.3
X-Latency Bits (M13-M11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.3.4
Y-Latency Bit (M9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.3.5
Valid Data Ready Bit (M8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.3.6
Wrap Burst Bit (M3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.3.7
Burst Length Bit (M2-M0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.1
Read Memory Array command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.2
Read Electronic Signature command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.3
Read Query command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.4
Read Status Register command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.5
Clear Status Register command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.6
Block Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.7
Erase All Main Blocks command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.8
Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.9
Write to Buffer and Program command . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.10
Program/Erase Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.11
Program/Erase Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.12
Set Burst Configuration Register command . . . . . . . . . . . . . . . . . . . . . . . 37
4.13
Set Block Protection Configuration Register command . . . . . . . . . . . . . . 37
4.14
Clear Block Protection Configuration Register command . . . . . . . . . . . . 37
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.1
Program/Erase Controller Status (Bit 7) . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.2
Erase Suspend Status (Bit 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3
Erase Status (Bit 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.4
Program/ Write to Buffer and Program Status (Bit 4) . . . . . . . . . . . . . . . . 41
3/81
Contents
M58BW16F, M58BW32F
5.4.1
PEN Status (Bit 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.5
Program Suspend Status (Bit 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.6
Block Protection Status (Bit 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.7
Bit 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
9
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Appendix A Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Appendix B Common Flash Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
4/81
M58BW16F, M58BW32F
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
M58BW32F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
M58BW32F Bottom Boot Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
M58BW16F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
M58BW16F bottom boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Asynchronous bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Synchronous Burst Read bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Burst Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Burst type definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Read Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Program, Erase times and endurance cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Asynchronous Bus Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Asynchronous Page Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Asynchronous Write and Latch controlled Write AC characteristics . . . . . . . . . . . . . . . . . . 53
Synchronous Burst Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Reset, Power-Down and Power-up AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
LBGA80 10 × 12mm - 8 × 10 active ball array, 1mm pitch, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
PQFP80 - 80 lead Plastic Quad Flat Pack, package mechanical data . . . . . . . . . . . . . . . . 63
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Query structure overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
CFI - Query address and data output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
CFI - Device voltage and timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
M58BW16F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
M58BW16F extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
M58BW32F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
M58BW32F Extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
5/81
List of figures
M58BW16F, M58BW32F
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
6/81
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
LBGA connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PQFP connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Example burst configuration X-1-1-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
AC measurement input/output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Asynchronous Bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Asynchronous Latch controlled bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . 47
Asynchronous Chip Enable controlled bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . 48
Asynchronous Address controlled bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . 48
Asynchronous Page Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Asynchronous Write AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Asynchronous Latch controlled Write AC waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Synchronous Burst Read, Latch Enable controlled (data valid from ’n’ clock rising edge) . 54
Synchronous Burst Read, Chip Enable controlled (data valid from ’n’ clock rising edge) . 55
Synchronous Burst Read, Valid Address transition controlled (data valid
from ’n’ clock rising edge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Synchronous Burst Read (data valid from ’n’ clock rising edge). . . . . . . . . . . . . . . . . . . . . 57
Synchronous Burst Read - valid data ready output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Synchronous Burst Read - burst address advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Clock input AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Reset, Power-Down and Power-up AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
LBGA80 10 × 12mm - 8 × 10 ball array, 1mm pitch, bottom view package outline . . . . . . 61
PQFP80 - 80 lead Plastic Quad Flat Pack, package outline . . . . . . . . . . . . . . . . . . . . . . . 63
Program flowchart and pseudo code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Program Suspend & Resume flowchart and pseudo code . . . . . . . . . . . . . . . . . . . . . . . . . 66
Block Erase flowchart and pseudo code. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Erase Suspend & Resume flowchart and pseudo code . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Power-up sequence followed by Synchronous Burst Read . . . . . . . . . . . . . . . . . . . . . . . . 69
Command Interface and Program Erase Controller flowchart (a). . . . . . . . . . . . . . . . . . . . 70
Command Interface and Program Erase Controller flowchart (b). . . . . . . . . . . . . . . . . . . . 71
Command Interface and Program Erase Controller flowchart (c) . . . . . . . . . . . . . . . . . . . . 72
Command Interface and Program Erase Controller flowchart (d). . . . . . . . . . . . . . . . . . . . 73
Command Interface and Program Erase Controller flowchart (e). . . . . . . . . . . . . . . . . . . . 74
M58BW16F, M58BW32F
1
Description
Description
The M58BW16F and M58BW32F are 16 and 32 Mbit non-volatile Flash memories,
respectively. They can be erased electrically at block level and programmed in-system on a
Double-Word basis using a 2.7V to 3.6V or 2.5V to 3.3V VDD supply for the circuit and a
2.4V to 3.6V VDDQ supply voltage for the Input and Output buffers.
In the rest of the document the M58BW16F and M58BW32F will be referred to as
M58BWxxF unless otherwise specified.
The devices support Asynchronous (Latch Controlled and Page Read) and Synchronous
Bus operations. The Synchronous Burst Read Interface allows a high data transfer rate
controlled by the Burst Clock signal, K. It is capable of bursting fixed or unlimited lengths of
data. The burst type, latency and length are configurable and can be easily adapted to a
large variety of system clock frequencies and microprocessors. All Write operations are
Asynchronous. On power-up the memory defaults to Read mode with an Asynchronous
Bus.
The device features an asymmetrical block architecture:
●
The M58BW32F has an array of 62 main blocks of 512 Kbits each, plus 4 large
parameter blocks of 128Kbits each and 8 small parameter blocks of 64 Kbits each. The
large and small parameter blocks are located either at the top (M58BW32FT) or at the
bottom (M58BW32FB) of the address space. The first large parameter block is referred
to as Boot Block and can be used either to store a boot code or parameters. The
memory array organization is detailed in Table 2: M58BW32F top boot block addresses
and Table 3: M58BW32F Bottom Boot Block Addresses.
●
The M58BW16F has an array of 8 parameter blocks of 64Kb each and 31 main blocks
of 512Kb each. In the M58BW16FT the parameter blocks are located at the top of the
address space whereas in the M58BW16FB, they are located at the bottom. The
memory array organization is detailed in Table 4: M58BW16F top boot block addresses
and Table 5: M58BW16F bottom boot block addresses.
Program and Erase commands are written to the Command Interface of the memory. An onchip Program/Erase Controller simplifies the process of programming or erasing the
memory by taking care of all of the special operations that are required to update the
memory contents. The end of a Program or Erase operation can be detected and any error
conditions identified in the Status Register. The command set required to control the
memory is consistent with JEDEC standards.
Erase can be suspended in order to perform either Read or Program in any other block, and
then resumed. Program can be suspended to Read data in any other block, and then
resumed. Each block can be programmed and erased over 100,000 cycles.
7/81
Description
M58BW16F, M58BW32F
All blocks are protected during power-up. The M58BWxxF features five different levels of
hardware and software block protection to avoid unwanted program/erase operations:
●
Write/Protect Enable input, WP, hardware protects a combination of blocks from
program and erase operations. The blocks to be protected are configured individually
by issuing a Set Block Protection Configuration Register or a Clear Block Protection
Configuration Register command.
●
All Program or Erase operations are blocked when Reset, RP, is held Low.
●
A Program/Erase Enable input, PEN, is used to protect all blocks, preventing Program
and Erase operations from affecting their data.
●
A permanent user-enabled protection against Modify operations is available:
–
on one specific 128-Kbit parameter block in the M58BW32F – Block 1 for bottom
devices or Block 72 for top devices
–
on two specific 64-Kbit parameter blocks in the M58BW16F – Blocks 2 & 3 for
bottom devices or Blocks 36 & 35 for top devices.
A Reset/Power-down mode is entered when the RP input is Low. In this mode the power
consumption is reduced to the standby level, the device is write protected and both the
Status and Burst Configuration Registers are cleared. A recovery time is required when the
RP input goes High.
A manufacturer code and a device code are available. They can be read from the memory
allowing programming equipment or applications to automatically match their interface to
the characteristics of the memory.
Finally, the M58BWxxF features a 64-bit Unique Device Identifier (UID) which is
programmed by ST on the production line. It is unique for each die and can be used to
implement cryptographic algorithms to improve security. Information is available in the CFI
area (see Table 30: M58BW16F extended query information).
The memory is offered in PQFP80 (14 x 20mm) and LBGA80 (1.0mm pitch) packages and it
is supplied with all the bits erased (set to ’1’).
8/81
M58BW16F, M58BW32F
Figure 1.
Description
Logic diagram
VDD
VDDQ VDDQIN
DQ0-DQ31
A0-Amax(1)
E
K
PEN
L
RP
M58BW32F
M58BW16F
R
G
GD
W
WP
B
VSS
VSSQ
AI13224b
9/81
Description
M58BW16F, M58BW32F
Table 1.
A0-Amax
Signal names
(1)
Address inputs
DQ0-DQ7
Data Input/Output, Command Input
DQ8-DQ15
Data Input/Output, Burst Configuration Register
DQ16-DQ31
Data Input/Output
B
Burst Address Advance input
E
Chip Enable input
G
Output Enable input
K
Burst Clock input
L
Latch Enable input
R
Valid Data Ready output
RP
Reset /Power-Down input
W
Write Enable input
GD
Output Disable input
WP
Write Protect input
VDD
Supply Voltage
VDDQ
Power Supply for Output Buffers
VDDQIN
Power Supply for Input Buffers only
PEN
Program/Erase Enable
VSS
Ground
VSSQ
Input/Output Ground
NC
Not Connected Internally
DU
Don’t Use as Internally Connected
1. Amax is equal to A18 in the M58BW16F, and to A19 in the M58BW32F.
10/81
M58BW16F, M58BW32F
Figure 2.
Description
LBGA connections (top view through package)
1
2
3
4
5
6
7
8
A
A15
A14
VDD
PEN
VSS
A6
A3
A2
B
A16
A13
A12
A9
A8
A5
A4
A1
C
A17
A18
A11
A10
NC
A7
NC
A0
D
DQ3
DQ0
A19/
NC(1)
NC
NC
DQ31
DQ30
DQ29
E
VDDQ
DQ4
DQ2
DQ1
DQ27
DQ28
DQ26
VDDQ
F
VSSQ
DQ7
DQ6
DQ5
NC
DQ25
DQ24
VSSQ
G
VDDQ
DQ8
DQ10
DQ9
DQ22
DQ21
DQ23
VDDQ
H
DQ13
DQ12
DQ11
WP
DQ17
DQ19
DQ18
DQ20
J
DQ15
DQ14
L
B
E
G
R
DQ16
K
VDDQIN
RP
K
VSS
VDD
W
GD
NC
AI12854b
1. Ball D3 is NC in the M58BW16F and A19 in the M58BW32F.
11/81
Description
M58BW16F, M58BW32F
PQFP connections (top view through package)
1
53
40
41
DQ15
DQ14
DQ13
DQ12
VSSQ
VDDQ
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
VSSQ
VDDQ
DQ3
DQ2
DQ1
DQ0
A19/NC(1)
A18
A17
A16
VSS
PEN
VDD
A9
A10
A11
A12
A13
A14
A15
25
32
M58BW16F
M58BW32F
12
24
65
64
A3
A4
A5
A6
A7
A8
DQ16
DQ17
DQ18
DQ19
VDDQ
VSSQ
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
VDDQ
VSSQ
DQ28
DQ29
DQ30
DQ31
DU
A0
A1
A2
73
80
DU
R
GD
WP
W
G
E
VDD
B
VSS
L
NC
NC
K
RP
VDDQIN
Figure 3.
AI13225b
12/81
M58BW16F, M58BW32F
1.1
Description
Block Protection
The M58BWxxF features four different levels of block protection.
●
Write Protect Pin, WP, - When WP is Low, VIL, the protection status that has been
configured in the Block Protection Configuration Register is activated. The Block
Protection Configuration Register is volatile. Any combination of blocks is possible. Any
attempt to program or erase a protected block will return an error in the Status Register
(see Table 13: Status Register Bits).
●
Reset/Power-Down Pin, RP, - If the device is held in reset mode (RP at VIL), no
program or erase operation can be performed on any block.
●
Program/Erase Enable, PEN, - The Program/Erase Enable input, PEN, protects all
blocks by preventing Program and Erase operations from modifying the data.
Prior to issuing a Program or Erase command, the Program/Erase Enable must be set
to High (VIH). If it is Low (VIL), the Program or Erase operation is not accepted and an
error is generated in the Status Register.
●
Permanent protection against Modify operations - specific OTP-like blocks can be
permanently protected against Modify operations (program/ erase):
–
in the M58BW32F, a unique 128-Kbit parameter block – Block 1 (01000h-01FFFh)
for bottom devices or Block 72 (FE000h-FEFFFh) for Top devices
–
in the M58BW16F, two 64-Kbit parameter blocks – Blocks 2 & 3 (01000h-01FFFh)
for bottom devices or Blocks 36 & 35 (7E000h-7EFFFh) for top devices
This protection is user-enabled. Details of how this protection is activated are provided
in a dedicated application note.
After a device reset the first two kinds of block protection (WP, RP) can be combined to give
a flexible block protection. All blocks are protected at power-up.
13/81
Description
M58BW16F, M58BW32F
Table 2.
14/81
M58BW32F top boot block addresses
#
Size (Kbit)
Address Range(1)
73
128
FF000h-FFFFFh
72
128
FE000h-FEFFFh(2)
71
128
FD000h-FDFFFh
70
128
FC000h-FCFFFh
69
64
FB800h-FBFFFh
68
64
FB000h-FB7FFh
67
64
FA800h-FAFFFh
66
64
FA000h-FA7FFh
65
64
F9800h-F9FFFh
64
64
F9000h-F97FFh
63
64
F8800h-F8FFFh
62
64
F8000h-F87FFh
61
512
F4000h-F7FFFh
60
512
F0000h-F3FFFh
59
512
EC000h-EFFFFh
58
512
E8000h-EBFFFh
57
512
E4000h-E7FFFh
56
512
E0000h-E3FFFh
55
512
DC000h-DFFFFh
54
512
D8000h-DBFFFh
53
512
D4000h-D7FFFh
52
512
D0000h-D3FFFh
51
512
CC000h-CFFFFh
50
512
C8000h-CBFFFh
49
512
C4000h-C7FFFh
48
512
C0000h-C3FFFh
47
512
BC000h-BFFFFh
46
512
B8000h-BBFFFh
45
512
B4000h-B7FFFh
44
512
B0000h-B3FFFh
43
512
AC000h-AFFFFh
42
512
A8000h-ABFFFh
41
512
A4000h-A7FFFh
40
512
A0000h-A3FFFh
39
512
9C000h-9FFFFh
38
512
98000h-9BFFFh
37
512
94000h-97FFFh
36
512
90000h-93FFFh
M58BW16F, M58BW32F
Table 2.
Description
M58BW32F top boot block addresses (continued)
#
Size (Kbit)
Address Range(1)
35
512
8C000h-8FFFFh
34
512
88000h-8BFFFh
33
512
84000h-87FFFh
32
512
80000h-83FFFh
31
512
7C000h-7FFFFh
30
512
78000h-7BFFFh
29
512
74000h-77FFFh
28
512
70000h-73FFFh
27
512
6C000h-6FFFFh
26
512
68000h-6BFFFh
25
512
64000h-67FFFh
24
512
60000h-63FFFh
23
512
5C000h-5FFFFh
22
512
58000h-5BFFFh
21
512
54000h-57FFFh
20
512
50000h-53FFFh
19
512
4C000h-4FFFFh
18
512
48000h-4BFFFh
17
512
44000h-47FFFh
16
512
40000h-43FFFh
15
512
3C000h-3FFFFh
14
512
38000h-3BFFFh
13
512
34000h-37FFFh
12
512
30000h-33FFFh
11
512
2C000h-2FFFFh
10
512
28000h-2BFFFh
9
512
24000h-27FFFh
8
512
20000h-23FFFh
7
512
1C000h-1FFFFh
6
512
18000h-1BFFFh
5
512
14000h-17FFFh
4
512
10000h-13FFFh
3
512
0C000h-0FFFFh
2
512
08000h-0BFFFh
1
512
04000h-07FFFh
0
512
00000h-03FFFh
1. Addresses are indicated in 32-bit addressing.
2. OTP Block.
15/81
Description
M58BW16F, M58BW32F
Table 3.
16/81
M58BW32F Bottom Boot Block Addresses
#
Size (Kbit)
Address Range(1)
73
512
FC000h-FFFFFh
72
512
F8000h-FBFFFh
71
512
F4000h-F7FFFh
70
512
F0000h-F3FFFh
69
512
EC000h-EFFFFh
68
512
E8000h-EBFFFh
67
512
E4000h-E7FFFh
66
512
E0000h-E3FFFh
65
512
DC000h-DFFFFh
64
512
D8000h-DBFFFh
63
512
D4000h-D7FFFh
62
512
D0000h-D3FFFh
61
512
CC000h-CFFFFh
60
512
C8000h-CBFFFh
59
512
C4000h-C7FFFh
58
512
C0000h-C3FFFh
57
512
BC000h-BFFFFh
56
512
B8000h-BBFFFh
55
512
B4000h-B7FFFh
54
512
B0000h-B3FFFh
53
512
AC000h-AFFFFh
52
512
A8000h-ABFFFh
51
512
A4000h-A7FFFh
50
512
A0000h-A3FFFh
49
512
9C000h-9FFFFh
48
512
98000h-9BFFFh
47
512
94000h-97FFFh
46
512
90000h-93FFFh
45
512
8C000h-8FFFFh
44
512
88000h-8BFFFh
43
512
84000h-87FFFh
42
512
80000h-83FFFh
41
512
7C000h-7FFFFh
40
512
78000h-7BFFFh
39
512
74000h-77FFFh
38
512
70000h-73FFFh
37
512
6C000h-6FFFFh
36
512
68000h-6BFFFh
M58BW16F, M58BW32F
Table 3.
Description
M58BW32F Bottom Boot Block Addresses (continued)
#
Size (Kbit)
Address Range(1)
35
512
64000h-67FFFh
34
512
60000h-63FFFh
33
512
5C000h-5FFFFh
32
512
58000h-5BFFFh
31
512
54000h-57FFFh
30
512
50000h-53FFFh
29
512
4C000h-4FFFFh
28
512
48000h-4BFFFh
27
512
44000h-47FFFh
26
512
40000h-43FFFh
25
512
3C000h-3FFFFh
24
512
38000h-3BFFFh
23
512
34000h-37FFFh
22
512
30000h-33FFFh
21
512
2C000h-2FFFFh
20
512
28000h-2BFFFh
19
512
24000h-27FFFh
18
512
20000h-23FFFh
17
512
1C000h-1FFFFh
16
512
18000h-1BFFFh
15
512
14000h-17FFFh
14
512
10000h-13FFFh
13
512
0C000h-0FFFFh
12
512
08000h-0BFFFh
11
64
07800h-07FFFh
10
64
07000h-077FFh
9
64
06800h-06FFFh
8
64
06000h-067FFh
7
64
05800h-05FFFh
6
64
05000h-057FFh
5
64
04800h-04FFFh
4
64
04000h-047FFh
3
128
03000h-03FFFh
2
128
02000h-02FFFh
1
128
01000h-01FFFh(2)
0
128
00000h-00FFFh
1. Addresses are indicated in 32-bit Word addressing.
2. OTP Block.
17/81
Description
M58BW16F, M58BW32F
Table 4.
#
Size (Kbit)
Address Range
38
64
7F800h-7FFFFh
37
64
7F000h-7F7FFh
36(1)
64
7E800h-7EFFFh
35(1)
64
7E000h-7E7FFh
34
64
7D800h-7DFFFh
33
64
7D000h-7D7FFh
32
64
7C800h-7CFFFh
31
64
7C000h-7C7FFh
30
512
78000h-7BFFFh
29
512
74000h-77FFFh
28
512
70000h-73FFFh
27
512
6C000h-6FFFFh
26
512
68000h-6BFFFh
25
512
64000h-67FFFh
24
512
60000h-63FFFh
23
512
5C000h-5FFFFh
22
512
58000h-5BFFFh
21
512
54000h-57FFFh
20
512
50000h-53FFFh
19
512
4C000h-4FFFFh
18
512
48000h-4BFFFh
17
512
44000h-47FFFh
16
512
40000h-43FFFh
15
512
3C000h-3FFFFh
14
512
38000h-3BFFFh
13
512
34000h-37FFFh
12
512
30000h-33FFFh
11
512
2C000h-2FFFFh
10
512
28000h-2BFFFh
9
512
24000h-27FFFh
8
512
20000h-23FFFh
7
512
1C000h-1FFFFh
6
512
18000h-1BFFFh
5
512
14000h-17FFFh
4
512
10000h-13FFFh
3
512
0C000h-0FFFFh
2
512
08000h-0BFFFh
1
512
04000h-07FFFh
0
512
00000h-03FFFh
1. OTP block.
18/81
M58BW16F top boot block addresses
M58BW16F, M58BW32F
Table 5.
Description
M58BW16F bottom boot block addresses
#
Size (Kbit)
Address Range
38
512
7C000h-7FFFFh
37
512
78000h-7BFFFh
36
512
74000h-77FFFh
35
512
70000h-73FFFh
34
512
6C000h-6FFFFh
33
512
68000h-6BFFFh
32
512
64000h-67FFFh
31
512
60000h-63FFFh
30
512
5C000h-5FFFFh
29
512
58000h-5BFFFh
28
512
54000h-57FFFh
27
512
50000h-53FFFh
26
512
4C000h-4FFFFh
25
512
48000h-4BFFFh
24
512
44000h-47FFFh
23
512
40000h-43FFFh
22
512
3C000h-3FFFFh
21
512
38000h-3BFFFh
20
512
34000h-37FFFh
19
512
30000h-33FFFh
18
512
2C000h-2FFFFh
17
512
28000h-2BFFFh
16
512
24000h-27FFFh
15
512
20000h-23FFFh
14
512
1C000h-1FFFFh
13
512
18000h-1BFFFh
12
512
14000h-17FFFh
11
512
10000h-13FFFh
10
512
0C000h-0FFFFh
9
512
08000h-0BFFFh
8
512
04000h-07FFFh
7
64
03800h-03FFFh
6
64
03000h-037FFh
5
64
02800h-02FFFh
4
64
02000h-027FFh
3(1)
64
01800h-01FFFh
2(1)
64
01000h-017FFh
1
64
00800h-00FFFh
0
64
00000h-007FFh
1. OTP block.
19/81
Signal descriptions
2
M58BW16F, M58BW32F
Signal descriptions
See Figure 1: Logic diagram and Table 1: Signal names, for a brief overview of the signals
connected to this device.
2.1
Address Inputs (A0-Amax)
Amax is equal to A18 in the M58BW16F, and to A19 in the M58BW32F.
The Address Inputs are used to select the cells to access in the memory array during Bus
operations. During Bus Write operations they control the commands sent to the Command
Interface of the Program/Erase Controller. Chip Enable must be Low when selecting the
addresses.
The address inputs are latched on the rising edge of Latch Enable L or Burst Clock K,
whichever occurs first, in a read operation.The address inputs are latched on the rising edge
of Chip Enable, Write Enable or Latch Enable, whichever occurs first in a Write operation.
The address latch is transparent when Latch Enable is Low, VIL. The address is internally
latched in an Erase or Program operation.
2.2
Data Inputs/Outputs (DQ0-DQ31)
The Data Inputs/Outputs output the data stored at the selected address during a Bus Read
operation, or are used to input the data during a program operation. During Bus Write
operations they represent the commands sent to the Command Interface of the
Program/Erase Controller. When used to input data or Write commands they are latched on
the rising edge of Write Enable or Chip Enable, whichever occurs first.
When Chip Enable and Output Enable are both Low, VIL, and Output Disable is at VIH, the
data bus outputs data from the memory array, the Electronic Signature, the Block Protection
Configuration Register, the CFI Information or the contents of Burst Configuration Register
or Status Register. The data bus is high impedance when the device is deselected with Chip
Enable at VIH, Output Enable at VIH, Output Disable at VIL or Reset/Power-Down at VIL. The
Status Register content is output on DQ0-DQ7 and DQ8-DQ31 are at VIL.
2.3
Chip Enable (E)
The Chip Enable, E, input activates the memory control logic, input buffers, decoders and
sense amplifiers. Chip Enable, E, at VIH deselects the memory and reduces the power
consumption to the Standby level.
2.4
Output Enable (G)
The Output Enable, G, gates the outputs through the data output buffers during a read
operation, when Output Disable GD is at VIH. When Output Enable G is at VIH, the outputs
are high impedance independently of Output Disable.
20/81
M58BW16F, M58BW32F
2.5
Signal descriptions
Output Disable (GD)
The Output Disable, GD, deactivates the data output buffers. When Output Disable, GD, is at
VIH, the outputs are driven by the Output Enable. When Output Disable, GD, is at VIL, the
outputs are high impedance independently of Output Enable. The Output Disable pin must
be connected to an external pull-up resistor as there is no internal pull-up resistor to drive
the pin.
2.6
Write Enable (W)
The Write Enable, W, input controls writing to the Command Interface, Input Address and
Data latches. Both addresses and data can be latched on the rising edge of Write Enable
(also see Latch Enable, L).
2.7
Reset/Power-Down (RP)
The Reset/Power-Down, RP, is used to apply a hardware reset to the memory. A hardware
reset is achieved by holding Reset/Power-Down Low, VIL, for at least tPLPH. Writing is
inhibited to protect data, the Command Interface and the Program/Erase Controller are
reset. The Status Register information is cleared and power consumption is reduced to the
standby level (IDD1). The device acts as deselected, that is the data outputs are high
impedance.
After Reset/Power-Down goes High, VIH, the memory will be ready for Bus Read operations
after a delay of tPHEL or Bus Write operations after tPHWL.
If Reset/Power-Down goes Low, VIL, during a Block Erase or a Program operation, the
operation is aborted, in a time of tPLRH maximum, and data is altered and may be corrupted.
During Power-up power should be applied simultaneously to VDD and VDDQ(IN) with RP held
at VIL. When the supplies are stable RP is taken to VIH. Output Enable, G, Chip Enable, E,
and Write Enable, W, should be held at VIH during power-up.
In an application, it is recommended to associate the Reset/Power-Down pin, RP, with the
reset signal of the microprocessor. Otherwise, if a reset operation occurs while the memory
is performing an erase or program operation, the memory may output the Status Register
information instead of being initialized to the default Asynchronous Random Read mode.
See Table 22 and Figure 21: Reset, Power-Down and Power-up AC waveform, for more
details.
2.8
Program/Erase Enable (PEN)
The Program/Erase Enable input, PEN, protects all blocks by preventing Program and Erase
operations from modifying the data.
Prior to issuing a Program or Erase command, the Program/Erase Enable must be set to
High (VIH). If it is Low (VIL), the Program or Erase operation is not accepted and an error is
generated in the Status Register.
21/81
Signal descriptions
2.9
M58BW16F, M58BW32F
Latch Enable (L)
The Bus Interface can be configured to latch the Address Inputs on the rising edge of Latch
Enable, L, for Asynchronous Latch Enable Controlled Read or Write or Synchronous Burst
Read operations. In Synchronous Burst Read operations the address is latched on the
active edge of the Clock when Latch Enable is Low, VIL. Once latched, the addresses may
change without affecting the address used by the memory. When Latch Enable is Low, VIL,
the latch is transparent. Latch Enable, L, can remain at VIL for Asynchronous Random Read
and Write operations.
2.10
Burst Clock (K)
The Burst Clock, K, is used to synchronize the memory with the external bus during
Synchronous Burst Read operations. Bus signals are latched on the active edge of the
Clock. In Synchronous Burst Read mode the address is latched on the first rising clock edge
when Latch Enable is Low, VIL, or on the rising edge of Latch Enable, whichever occurs first.
During Asynchronous bus operations the Clock is not used.
2.11
Burst Address Advance (B)
The Burst Address Advance, B, controls the advancing of the address by the internal
address counter during Synchronous Burst Read operations.
Burst Address Advance, B, is only sampled on the active clock edge of the Clock when the
X-latency time has expired. If Burst Address Advance is Low, VIL, the internal address
counter advances. If Burst Address Advance is High, VIH, the internal address counter does
not change; the same data remains on the Data Inputs/Outputs and Burst Address Advance
is not sampled until the Y-latency expires.
The Burst Address Advance, B, may be tied to VIL.
2.12
Valid Data Ready (R)
The Valid Data Ready output, R, can be used during Synchronous Burst Read operations to
identify if the memory is ready to output data or not. The Valid Data Ready output can be
configured to be active on the clock edge of the invalid data read cycle or one cycle before.
Valid Data Ready, at VIH, indicates that new data is or will be available. When Valid Data
Ready is Low, VIL, the previous data outputs remain active.
2.13
Write Protect (WP)
The Write Protect, WP, provides protection against program or erase operations. When
Write Protect, WP, is at VIL, the protection status that has been configured in the Block
Protection Configuration Register is activated. Program and erase operations to protected
blocks are disabled. When Write Protect WP is at VIH all the blocks can be programmed or
erased, if no other protection is used.
22/81
M58BW16F, M58BW32F
2.14
Signal descriptions
Supply Voltage (VDD)
The Supply Voltage, VDD, is the core power supply. All internal circuits draw their current
from the VDD pin, including the Program/Erase Controller.
2.15
Output Supply Voltage (VDDQ)
The Output Supply Voltage, VDDQ, is the output buffer power supply for all operations (Read,
Program and Erase) used for DQ0-DQ31 when used as outputs.
2.16
Input Supply Voltage (VDDQIN)
The Input Supply Voltage, VDDIN, is the power supply for all input signal. Input signals are: K, B,
L, W, GD, G, E, A0-Amax and DQ0-DQ31, when used as inputs.
2.17
Ground (VSS and VSSQ)
The Ground VSS is the reference for the internal supply voltage VDD. The Ground VSSQ is
the reference for the output and input supplies VDDQ, and VDDQIN. It is essential to connect
VSS and VSSQ together.
Note:
A 0.1µF capacitor should be connected between the Supply Voltages, VDD, VDDQ and VDDIN
and the Grounds, VSS and VSSQ to decouple the current surges from the power supply. The
PCB track widths must be sufficient to carry the currents required during all operations of
the parts, see Table 17: DC characteristics, for maximum current supply requirements.
2.18
Don’t Use (DU)
This pin should not be used as it is internally connected. Its voltage level can be between
VSS and VDDQ or leave it unconnected.
2.19
Not Connected (NC)
This pin is not physically connected to the device.
23/81
Bus operations
3
M58BW16F, M58BW32F
Bus operations
Each bus operations that controls the memory is described in this section, see Tables 6 and
7 Bus Operations, for a summary. The bus operation is selected through the Burst
Configuration Register; the bits in this register are described at the end of this section.
On Power-up or after a Hardware Reset the memory defaults to Asynchronous Bus Read
and Asynchronous Bus Write. No synchronous operation can be performed until the Burst
Control Register has been configured.
The Electronic Signature, Block Protection Configuration, CFI or Status Register will be read
in asynchronous mode regardless of the Burst Control Register settings.
Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the
memory and do not affect bus operations.
3.1
Asynchronous Bus Operations
For asynchronous bus operations refer to Table 6 together with the following text. The read
access will start at whichever of the three following events occurs last: valid address
transition, Chip Enable, E, going Low, VIL or Latch Enable, L, going Low, VIL.
3.1.1
Asynchronous Bus Read
Asynchronous Bus Read operations read from the memory cells, or specific registers
(Electronic Signature, Block Protection Configuration Register, Status Register, CFI and
Burst Configuration Register) in the Command Interface. A valid bus operation involves
setting the desired address on the Address Inputs, applying a Low signal, VIL, to Chip
Enable and Output Enable and keeping Write Enable and Output Disable High, VIH. The
Data Inputs/Outputs will output the value, see Figure 7: Asynchronous Bus Read AC
waveforms, and Table 18: Asynchronous Bus Read AC characteristics, for details of when
the output becomes valid.
Asynchronous Read is the default read mode which the device enters on power-up or on
return from Reset/Power-Down.
3.1.2
Asynchronous Latch Controlled Bus Read
Asynchronous Latch Controlled Bus Read operations read from the memory cells or specific
registers in the Command Interface. The address is latched in the memory before the value
is output on the data bus, allowing the address to change during the cycle without affecting
the address that the memory uses.
A valid bus operation involves setting the desired address on the Address Inputs, setting
Chip Enable and Latch Enable Low, VIL and keeping Write Enable High, VIH; the address is
latched on the rising edge of Latch Enable. Once latched, the Address Inputs can change.
Set Output Enable Low, VIL, to read the data on the Data Inputs/Outputs; see Figure
Figure 8: Asynchronous Latch controlled bus Read AC waveforms and Table 18:
Asynchronous Bus Read AC characteristics, for details on when the output becomes valid.
Note that, since the Latch Enable input is transparent when set Low, VIL, Asynchronous Bus
Read operations can be performed when the memory is configured for Asynchronous Latch
Enable bus operations by holding Latch Enable Low, VIL throughout the bus operation.
24/81
M58BW16F, M58BW32F
3.1.3
Bus operations
Asynchronous Page Read
Asynchronous Page Read operations are used to read from several addresses within the
same memory page. Each memory page is 4 Double-Words and is addressed by the
address inputs A0 and A1.
Data is read internally and stored in the Page Buffer. Valid bus operations are the same as
Asynchronous Bus Read operations but with different timings. The first read operation within
the page has identical timings, subsequent reads within the same page have much shorter
access times. If the page changes then the normal, longer timings apply again. Page Read
does not support Latched Controlled Read.
See Figure 11: Asynchronous Page Read AC waveforms, and Table 19: Asynchronous
Page Read AC characteristics, for details on when the outputs become valid.
3.1.4
Asynchronous Bus Write
Asynchronous Bus Write operations write to the Command Interface in order to send
commands to the memory or to latch addresses and input data to program. Bus Write
operations are asynchronous, the clock, K, is don’t care during Bus Write operations.
A valid Asynchronous Bus Write operation begins by setting the desired address on the
Address Inputs, and setting Chip Enable, Write Enable and Latch Enable Low, VIL, and
Output Enable High, VIH, or Output Disable Low, VIL. The Address Inputs are latched by the
Command Interface on the rising edge of Chip Enable or Write Enable, whichever occurs
first. Commands and Input Data are latched on the rising edge of Chip Enable, E, or Write
Enable, W, whichever occurs first. Output Enable must remain High, and Output Disable
Low, during the whole Asynchronous Bus Write operation.
See Figure 12: Asynchronous Write AC waveform, and Table 20: Asynchronous Write and
Latch controlled Write AC characteristics, for details of the timing requirements.
3.1.5
Asynchronous Latch Controlled Bus Write
Asynchronous Latch Controlled Bus Write operations write to the Command Interface in
order to send commands to the memory or to latch addresses and input data to program.
Bus Write operations are asynchronous, the clock, K, is don’t care during Bus Write
operations.
A valid Asynchronous Latch Controlled Bus Write operation begins by setting the desired
address on the Address Inputs and pulsing Latch Enable Low, VIL. The Address Inputs are
latched by the Command Interface on the rising edge of Latch Enable, Write Enable or Chip
Enable, whichever occurs first. Commands and Input Data are latched on the rising edge of
Chip Enable, E, or Write Enable, W, whichever occurs first. Output Enable must remain
High, and Output Disable Low, during the whole Asynchronous Bus Write operation.
See Figure 13: Asynchronous Latch controlled Write AC waveform, and Table 20:
Asynchronous Write and Latch controlled Write AC characteristics, for details of the timing
requirements.
3.1.6
Output Disable
The data outputs are high impedance when the Output Enable, G, is at VIH or Output
Disable, GD, is at VIL.
25/81
Bus operations
3.1.7
M58BW16F, M58BW32F
Standby
When Chip Enable is High, VIH, and the Program/Erase Controller is idle, the memory
enters Standby mode, the power consumption is reduced to the standby level (IDD1) and the
Data Inputs/Outputs pins are placed in the high impedance state regardless of Output
Enable, Write Enable or Output Disable inputs.
The Standby mode can be disabled by setting the Standby Disable bit (M14) of the Burst
Configuration Register to ‘1’ (see Table 17: DC characteristics).
3.1.8
Reset/Power-Down
The memory is in Reset/ Power-Down mode when Reset/Power-Down, RP, is at VIL. The
power consumption is reduced to the standby level (IDD1) and the outputs are high
impedance, independent of the Chip Enable, E, Output Enable, G, Output Disable, GD, or
Write Enable, W, inputs. In this mode the device is write protected and both the Status and
the Burst Configuration Registers are cleared. A recovery time is required when the RP
input goes High.
Table 6.
Asynchronous bus operations(1)
Bus Operation
Step
E
G
GD
W
RP
L
A0-Amax
DQ0-DQ31
VIL
VIL
VIH
VIH
VIH
VIL
Address
Data Output
Address Latch
VIL
VIH
VIH
VIL
VIH
VIL
Address
High Z
Read
VIL
VIL
VIH
VIH
VIH
VIH
X
Data Output
Asynchronous Page Read
VIL
VIL
VIH
VIH
VIH
X
Address
Data Output
Asynchronous Bus Write
VIL
VIH
X
VIL
VIH
VIL
Address
Data Input
Address Latch
VIL
VIH
X
VIH
VIH
VIL
Address
High Z
Write
VIL
VIH
X
VIL
VIH
VIH
X
Data Input
Output Enable, G
VIL
VIH
VIH
VIH
VIH
X
X
High Z
Output Disable, GD
VIL
VIL
VIL
VIH
VIH
X
X
High Z
Standby
VIH
X
X
X
VIH
X
X
High Z
X
X
X
X
VIL
X
X
High Z
Asynchronous Bus Read(2)
Asynchronous Latch
Controlled Bus Read
Asynchronous Latch
Controlled Bus Write
Reset/Power-Down
1. X = Don’t Care.
2. Data, Manufacturer Code, Device Code, Burst Configuration Register, Standby Status and Block Protection Configuration
Register are read using the Asynchronous Bus Read command.
26/81
M58BW16F, M58BW32F
3.2
Bus operations
Synchronous bus operations
For synchronous bus operations refer to Table 7 together with the following text. The read
access will start at whichever of the three following events occurs last: valid address
transition, Chip Enable, E, going Low, VIL or Latch Enable, L, going Low, VIL.
3.2.1
Synchronous Burst Read
Synchronous Burst Read operations are used to read from the memory at specific times
synchronized to an external reference clock. The valid edge of the Clock signal is the rising
edge. Once the Flash memory is configured in Burst mode, it is mandatory to have an active
clock signal since the switching of the output buffer databus is synchronized to the rising
edge of the clock. In the absence of clock, no data is output.
The burst type, length and latency can be configured. The different configurations for
Synchronous Burst Read operations are described in the Burst Configuration Register
section. Refer to Figure 4 for examples of synchronous burst operations.
A valid Synchronous Burst Read operation begins when the Burst Clock is active and Chip
Enable and Latch Enable are Low, VIL. The burst start address is latched and loaded into
the internal Burst Address Counter on the valid Burst Clock K edge or on the rising edge of
Latch Enable, whichever occurs first.
After an initial memory latency time, the memory outputs data each clock cycle. The Burst
Address Advance B input controls the memory burst output. The second burst output is on
the next clock valid edge after the Burst Address Advance B has been pulled Low.
Valid Data Ready, R, monitors if the memory burst boundary is exceeded and the Burst
Controller of the microprocessor needs to insert wait states. When Valid Data Ready is Low
on the rising clock edge, no new data is available and the memory does not increment the
internal address counter at the active clock edge even if Burst Address Advance, B, is Low.
Valid Data Ready may be configured (by bit M8 of Burst Configuration Register) to be valid
immediately at the rising clock edge.
Synchronous Burst Read will be suspended if Burst Address Advance, B, goes High, VIH.
If Output Enable is at VIL and Output Disable is at VIH, the last data is still valid.
If Output Enable, G, is at VIH or Output Disable, GD, is at VIL, but the Burst Address
Advance, B, is at VIL the internal Burst Address Counter is incremented at each Burst Clock
K rising edge.
The Synchronous Burst Read timing diagrams and AC Characteristics are described in the
AC and DC Parameters section. See Figures 14, 17, 18 and 19, and Table 21.
27/81
Bus operations
3.2.2
M58BW16F, M58BW32F
Synchronous Burst Read Suspend
During a Synchronous Burst Read operation it is possible to suspend the operation, freeing
the data bus for other higher priority devices.
A valid Synchronous Burst Read operation is suspended when both Output Enable and
Burst Address Advance are High, VIH. The Burst Address Advance going High, VIH, stops
the burst counter and the Output Enable going High, VIH, inhibits the data outputs. The
Synchronous Burst Read operation can be resumed by setting Output Enable Low.
Table 7.
Synchronous Burst Read bus operations
Bus Operation
Step
Address Latch
Synchronous
Burst Read(2)
A0-Amax
E
G
GD
RP
K
L
B
VIL
VIH
X
VIH
R(3)
VIL
X
Address Input
VIH
VIL
Data Output
DQ0-DQ31
Read
VIL
VIL
VIH
VIH
R(3)
Read Suspend
VIL
VIH
X
VIH
X
VIH
VIH
High Z
VIH
VIL
Data Output
Read Resume
VIL
VIL
VIH
VIH
R(3)
Burst Address
Advance
VIL
VIH
X
VIH
R(3)
VIH
VIL
High Z
Read Abort, E
VIH
X
X
VIH
X
X
X
High Z
X
X
X
VIL
X
X
X
High Z
Read Abort, RP
1. X = Don't Care, VIL or VIH.
2. M15 = 0, Bit M15 is in the Burst Configuration Register.
3. R = Rising Edge.
3.3
Burst Configuration Register
The Burst Configuration Register is used to configure the type of bus access that the
memory will perform.
The Burst Configuration Register is set through the Command Interface and will retain its
information until it is re-configured, the device is reset, or the device goes into Reset/PowerDown mode. The Burst Configuration Register bits are described in Table 8. They specify
the selection of the burst length, burst type, burst X and Y latencies and the Read operation.
Refer to Figure 4 for examples of synchronous burst configurations.
3.3.1
Read Select Bit (M15)
The Read Select bit, M15, is used to switch between asynchronous and synchronous Bus
Read operations. When the Read Select bit is set to ’1’, Bus Read operations are
asynchronous; when the Read Select but is set to ’0’, Bus Read operations are
synchronous.
On reset or power-up the Read Select bit is set to’1’ for asynchronous accesses.
3.3.2
Standby Disable Bit (M14)
The Standby Disable Bit, M14, is used to disable the Standby mode. When the Standby bit
is ‘1’, the device will not enter Standby mode when Chip Enable goes High, VIH.
28/81
M58BW16F, M58BW32F
3.3.3
Bus operations
X-Latency Bits (M13-M11)
The X-Latency bits are used during Synchronous Bus Read operations to set the number of
clock cycles between the address being latched and the first data becoming available. For
correct operation the X-Latency bits can only assume the values in Table 8: Burst
Configuration Register.
3.3.4
Y-Latency Bit (M9)
The Y-Latency bit is used during Synchronous Bus Read operations to set the number of
clock cycles between consecutive reads. The Y-Latency value depends on both the XLatency value and the setting in M9.
When the Y-Latency is 1 the data changes each clock cycle.
3.3.5
Valid Data Ready Bit (M8)
The Valid Data Ready bit controls the timing of the Valid Data Ready output pin, R. When
the Valid Data Ready bit is ’0’ the Valid Data Ready output pin is driven Low for the rising
clock edge when invalid data is output on the bus.
3.3.6
Wrap Burst Bit (M3)
Burst read can be confined inside the 4 double-word boundary (wrap) or overcome the
boundary (no wrap). When the wrap burst bit is set to '1' the burst read does not wrap. The
wrap mode is not available (M3 is always ‘1’).
3.3.7
Burst Length Bit (M2-M0)
The Burst Length bits set the maximum number of Double-Words that can be output during
a Synchronous Burst Read operation. Burst lengths of 4 or 8 are available.
Table 8: Burst Configuration Register gives the valid combinations of the Burst Length bits
that the memory accepts.
If a Burst Read operation (no wrap) has been initiated the device will output data
synchronously. Depending on the starting address, the device activates the Valid Data
Ready output to indicate that a delay is necessary before the data is output. If the starting
address is aligned to a 4 double word boundary, the 8-double-word burst mode will run
without activating the Valid Data Ready output. If the starting address is not aligned to a 4
Double Word boundary, Valid Data Ready is activated to indicate that the device needs an
internal delay to read the successive words in the array.
M10, M7 to M4 are reserved for future use.
29/81
Bus operations
M58BW16F, M58BW32F
Table 8.
Bit
M15
M14
M13-M11
Description
Description
0
Synchronous Burst Read
1
Asynchronous Read (Default at power-up)
0
Standby Mode Enabled (Default at power-up)
1
Standby Mode Disabled
001
3
010
4
011
5
100
6
0
Reserved
1
One Burst Clock cycle (M9 is always at ‘1’)
0
R valid Low during valid Burst Clock edge. (M8 is
always at ‘0’)
1
Reserved
0
Reserved
1
No Wrap (M3 is always at ‘1’)
001
4 Double-Words
010
8 Double-Words
Standby Disable
X-Latency
Reserved
M9
Y-Latency
Valid Data Ready
M7-M4
Reserved
M3
Wrapping
M2-M0
Value
Read Select
M10
M8
30/81
Burst Configuration Register
Burst Length
M58BW16F, M58BW32F
Table 9.
Bus operations
Burst type definition
Start Address
×4 Sequential
×8 Sequential
0
0-1-2-3
0-1-2-3-4-5-6-7
1
1-2-3-4
1-2-3-4-5-6-7-8
2
2-3-4-5
2-3-4-5-6-7-8-9
3
3-4-5-6
3-4-5-6-7-8-9-10
4
4-5-6-7
4-5-6-7-8-9-10-11
5
5-6-7-8
5-6-7-8-9-10-11-12
6
6-7-8-9
6-7-8-9-10-11-12-13
7
7-8-9-10
7-8-9-10-11-12-13-14
8
8-9-10-11
8-9-10-11-12-13-14-15
Figure 4.
Example burst configuration X-1-1-1
0
1
2
3
4
5
6
7
8
9
K
ADD
VALID
L
DQ
3-1-1-1
DQ
4-1-1-1
DQ
DQ
DQ
DQ
5-1-1-1
6-1-1-1
7-1-1-1
8-1-1-1
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
AI03841b
31/81
Command interface
4
M58BW16F, M58BW32F
Command interface
All Bus Write operations to the memory are interpreted by the Command Interface.
Commands consist of one or more sequential Bus Write operations. The Commands are
summarized in Table 10: Commands. Refer to Table 10 in conjunction with the text
descriptions below.
4.1
Read Memory Array command
The Read Memory Array command returns the memory to Read mode. One Bus Write cycle
is required to issue the Read Memory Array command and return the memory to Read
mode. Subsequent read operations will output the addressed memory array data. Once the
command is issued the memory remains in Read mode until another command is issued.
From Read mode Bus Read commands will access the memory array.
4.2
Read Electronic Signature command
The Read Electronic Signature command is used to read the Manufacturer Code, the Device
Code, the Block Protection Configuration Register and the Burst Configuration Register.
One Bus Write cycle is required to issue the Read Electronic Signature command. Once the
command is issued, subsequent Bus Read operations, depending on the address specified,
read the Manufacturer Code, the Device Code, the Block Protection Configuration or the
Burst Configuration Register until another command is issued; see Table 11: Read
Electronic Signature.
4.3
Read Query command
The Read Query Command is used to read data from the Common Flash Interface (CFI)
Memory Area. One Bus Write cycle is required to issue the Read Query Command. Once
the command is issued subsequent Bus Read operations, depending on the address
specified, read from the Common Flash Interface Memory Area.
32/81
M58BW16F, M58BW32F
4.4
Command interface
Read Status Register command
The Read Status Register command is used to read the Status Register. One Bus Write
cycle is required to issue the Read Status Register command. Once the command is issued
subsequent Bus Read operations read the Status Register until another command is issued.
The Status Register information is present on the output data bus (DQ0-DQ7) when Chip
Enable E and Output Enable G are at VIL and Output Disable is at VIH.
An interactive update of the Status Register bits is possible by toggling Output Enable or
Output Disable. It is also possible during a Program or Erase operation, by de-activating the
device with Chip Enable at VIH and then reactivating it with Chip Enable and Output Enable
at VIL and Output Disable at VIH.
The content of the Status Register may also be read at the completion of a Program, Erase
or Suspend operation. During a Block Erase or Program command, DQ7 indicates the
Program/Erase Controller status. It is valid until the operation is completed or suspended.
See the section on the Status Register and Table 13 for details on the definitions of the
Status Register bits.
4.5
Clear Status Register command
The Clear Status Register command can be used to reset bits 1, 3, 4 and 5 in the Status
Register to ‘0’. One Bus Write is required to issue the Clear Status Register command.
Once the command is issued the memory returns to its previous mode, subsequent Bus
Read operations continue to output the same data.
The bits in the Status Register are sticky and do not automatically return to ‘0’ when a new
Program, Erase, Block Protect or Block Unprotect command is issued. If any error occurs
then it is essential to clear any error bits in the Status Register by issuing the Clear Status
Register command before attempting a new Program, Erase or Resume command.
4.6
Block Erase command
The Block Erase command can be used to erase a block. It sets all of the bits in the block to
‘1’. All previous data in the block is lost. If the block is protected then the Erase operation will
abort, the data in the block will not be changed and the Status Register will output the error.
Two Bus Write operations are required to issue the command; the first write cycle sets up
the Block Erase command, the second write cycle confirms the Block erase command and
latches the block address in the Program/Erase Controller and starts the Program/Erase
Controller. The sequence is aborted if the Confirm command is not given and the device will
output the Status Register Data with bits 4 and 5 set to '1'.
Once the command is issued subsequent Bus Read operations read the Status Register.
See the section on the Status Register for details on the definitions of the Status Register
bits. During the Erase operation the memory will only accept the Read Status Register
command and the Program/Erase Suspend command. All other commands will be ignored.
If PEN is at VIH, the operation can be performed. If PEN goes below VIH, the operation
aborts, the PEN Status bit in the Status Register is set to ‘1’ and the command must be reissued.
Typical Erase times are given in Table 12. See Appendix A, Figure 26: Block Erase flowchart
and pseudo code, for a suggested flowchart on using the Block Erase command.
33/81
Command interface
4.7
M58BW16F, M58BW32F
Erase All Main Blocks command
The Erase All Main Blocks command is used to erase all 63 Main Blocks, without affecting
the Parameter Blocks.
Issuing the Erase All Main Blocks command sets every bit in each Main Block to '1'. All data
previously stored in the Main Blocks are lost.
Two Bus Write cycles are required to issue the Erase All Main Blocks command. The first
cycle sets up the command, the second cycle confirms the command and starts the
Program/Erase Controller. If the Confirm Command is not given the sequence is aborted,
and Status Register bits 4 and 5 are set to '1'.
If the address given in the second cycle is located in a protected block, the Erase All Main
Blocks operation aborts. The data remains unchanged in all blocks and the Status Register
outputs the error.
Once the Erase All Main Blocks command has been issued, subsequent Bus Read
operations output the Status Register. See the Status Register section for details.
During an Erase All Main Blocks operation, only the Read Status Register command is
accepted by the memory; any other command are ignored. Erase All Main Blocks, once
started, cannot be suspended.
If PEN is at VIH, the operation will be performed. If PEN is lower than VIH the operation
aborts and the Status Register PEN bit (bit 3) is set to '1'.
4.8
Program command
The Program command is used to program the memory array. Two Bus Write operations are
required to issue the command; the first write cycle sets up the Program command, the
second write cycle latches the address and data to be programmed and starts the
Program/Erase Controller. A program operation can be aborted by writing FFFFFFFFh to
any address after the program set-up command has been given.
The Program command is also used to program the OTP block. Refer to Table 10:
Commands, for details of the address.
Once the command is issued subsequent Bus Read operations read the Status Register.
See the section on the Status Register for details on the definitions of the Status Register
bits. During the Program operation the memory will only accept the Read Status Register
command and the Program/Erase Suspend command. All other commands will be ignored.
If Reset/Power-down, RP, falls to VIL during programming the operation will be aborted.
If PEN is at VIH, the operation can be performed. If PEN goes below VIH, the operation
aborts, the PEN Status bit in the Status Register is set to ‘1’ and the command must be reissued.
See Appendix A, Figure 24: Program flowchart and pseudo code, for a suggested flowchart
on using the Program command.
34/81
M58BW16F, M58BW32F
4.9
Command interface
Write to Buffer and Program command
The Write to Buffer and Program Command makes use of the device’s double Word (32 bit)
Write Buffer to speed up programming.
Up to eight Double Words can be loaded into the Write Buffer and programmed into the
memory.
Four successive steps are required to issue the command.
1.
One Bus Write operation is required to set up the Write to Buffer and Program
Command. Any Bus Read operations will start to output the Status Register after the
1st cycle.
2.
Use one Bus Write operation to write the selected memory Block Address (any address
in the block where the values will be programmed can be used) along with the value N
on the Data Inputs/Outputs, where N+1 is the number of Words to be programmed. The
maximum value of N+1 is 8 Words.
3.
Use N+1 Bus Write operations to load the address and data for each Word into the
Write Buffer. The address must be between Start Address and Start Address plus N,
where Start Address is the first word address.
4.
Finally, use one Bus Write operation to issue the final cycle to confirm the command
and start the Program operation.
If any address is outside the block boundaries or if the correct sequence is not followed,
Status Register bits 4 and 5 are set to ‘1’ and the operation will abort without affecting the
data in the memory array. A protected block must be unprotected using the Blocks Unprotect
command.
During a Write to Buffer and Program operation the memory will only accept the Read
Status Register and the Program/Erase Suspend commands. All other commands are
ignored. If PEN is at VIH, the operation will be performed. If PEN is lower than VIH the
operation aborts and the Status Register PEN bit (bit 3) is set to '1'.
The Status Register should be cleared before re-issuing the command.
35/81
Command interface
4.10
M58BW16F, M58BW32F
Program/Erase Suspend command
The Program/Erase Suspend command is used to pause a Program or Erase operation. The
command will only be accepted during a Program or Erase operation. It can be issued at
any time during a program or erase operation. The command is ignored if the device is
already in suspend mode.
One Bus Write cycle is required to issue the Program/Erase Suspend command and pause
the Program/Erase Controller. Once the command is issued it is necessary to poll the
Program/Erase Controller Status bit (bit 7) to find out when the Program/Erase Controller
has paused; no other commands will be accepted until the Program/Erase Controller has
paused. After the Program/Erase Controller has paused, the memory will continue to output
the Status Register until another command is issued.
During the polling period between issuing the Program/Erase Suspend command and the
Program/Erase Controller pausing it is possible for the operation to complete. Once the
Program/Erase Controller Status bit (bit 7) indicates that the Program/Erase Controller is no
longer active, the Program Suspend Status bit (bit 2) or the Erase Suspend Status bit (bit 6)
can be used to determine if the operation has completed or is suspended. For timing on the
delay between issuing the Program/Erase Suspend command and the Program/Erase
Controller pausing see Note 12.
During Program/Erase Suspend the Read Memory Array, Read Status Register, Read
Electronic Signature, Read Query and Program/Erase Resume commands will be accepted
by the Command Interface. Additionally, if the suspended operation was Erase then the
Program, the Write to Buffer and Program, the Set/Clear Block Protection Configuration
Register and the Program Suspend commands will also be accepted. When a program
operation is completed inside a Block Erase Suspend the Read Memory Array command
must be issued to reset the device in Read mode, then the Erase Resume command can be
issued to complete the whole sequence. Only the blocks not being erased may be read or
programmed correctly.
Erase operations can be suspended in a systematic and periodical way, however, in order to
ensure the effectiveness of erase operations and avoid infinite erase times, it is imperative to
wait a minimum time between successive Erase Resume and Erase Suspend commands.
This time, called the Minimum effective erase time, is given in Table 12 on page 39.
See Appendix A, Figure 25: Program Suspend & Resume flowchart and pseudo code, and
Figure 27: Erase Suspend & Resume flowchart and pseudo code, for suggested flowcharts
on using the Program/Erase Suspend command.
4.11
Program/Erase Resume command
The Program/Erase Resume command can be used to restart the Program/Erase Controller
after a Program/Erase Suspend operation has paused it. One Bus Write cycle is required to
issue the Program/Erase Resume command.
See Appendix A, Figure 25: Program Suspend & Resume flowchart and pseudo code, and
Figure 27: Erase Suspend & Resume flowchart and pseudo code, for suggested flowcharts
on using the Program/Erase Suspend command.
36/81
M58BW16F, M58BW32F
4.12
Command interface
Set Burst Configuration Register command
The Set Burst Configuration Register command is used to write a new value to the Burst
Configuration Register which defines the burst length, type, X and Y latencies,
Synchronous/Asynchronous Read mode.
Two Bus Write cycles are required to issue the Set Burst Configuration Register command.
The first cycle writes the setup command. The second cycle writes the address where the
new Burst Configuration Register content is to be written, and confirms the command. If the
command is not confirmed, the sequence is aborted and the device outputs the Status
Register with bits 4 and 5 set to ‘1’. Once the command is issued the memory returns to
Read mode as if a Read Memory Array command had been issued.
The value for the Burst Configuration Register is always presented on A0-A15. M0 is on A0,
M1 on A1, etc.; the other address bits are ignored.
4.13
Set Block Protection Configuration Register command
The Set Block Protection Configuration Register command is used to configure the Block
Protection Configuration Register to ‘Protected’, for a specific block. Protected blocks are
fully protected from program or erase when WP pin is Low, VIL. The status of a protected
block can be changed to ‘Unprotected’ by using the Clear Block Protection Configuration
Register command. At power-up, all block are configured as ‘Protected’.
Two bus operations are required to issue a Set Block Protection Configuration Register
command:
●
The first cycle writes the setup command
●
The second write cycle specifies the address of the block to protect and confirms the
command. If the command is not confirmed, the sequence is aborted and the device
outputs the Status Register with bits 4 and 5 set to ‘1’.
To protect multiple blocks, the Set Block Protection Configuration Register command must
be repeated for each block.
Any attempt to re-protect a block already protected does not change its status.
4.14
Clear Block Protection Configuration Register command
The Clear Block Protection Configuration Register command is used to configure the Block
Protection Configuration Register to ‘Unprotected’, for a specific block thus allowing
program/erase operations to this block, regardless of the WP pin status.
Two bus operations are required to issue a Clear Block Protection Configuration Register
command:
●
The first cycle writes the setup command
●
The second write cycle specifies the address of the block to unprotect and confirms the
command. If the command is not confirmed, the sequence is aborted and the device
outputs the Status Register with bits 4 and 5 set to ‘1’.
To unprotect multiple blocks, the Clear Block Protection Configuration Register command
must be repeated for each block.
Any attempt to unprotect a block already unprotected does not affect its status.
37/81
Command interface
M58BW16F, M58BW32F
Commands(1)
Table 10.
Command
Cycles
Bus operations
1st Cycle
Op. Addr. Data
2nd Cycle
Op.
3rd Cycle
Addr.
Data
≥ 2 Write
X
FFh Read
RA
RD
Read Electronic Signature(2) ≥ 2 Write
X
90h Read
IDA
IDD
Read Status Register
Write
X
70h
≥ 2 Write
X
98h Read
RA
RD
X
50h
Read Memory Array
Read Query
1
Clear Status Register
1
Write
Block Erase
2
Write 55h
20h Write
BA
D0h
Erase All Main Blocks
2
Write 55h
80h Write
AAh
D0h
any block
2
Write AAh
40h
Write
10h
PA
PD
OTP Block
2
Write AAh
40h Write
PA
PD
Write to Buffer and Program N+4 Write AAh E8h Write
BA
N
Program
Program/Erase Suspend
1
Write
X
B0h
Program/Erase Resume
1
Write
X
D0h
Š3 Write
X
60h Write BCRh
03h
Set Burst Configuration
Register
Set Block Protection
Configuration Register
2
Write
X
60h Write
BA
01h
Clear Block Protection
Configuration Register
2
Write
X
60h Write
BA
D0h
4th Cycle
Op. Addr. Data Op. Addr. Data
Write
PA
Read RA
PD Write
X
D0h
RD
1. X Don’t Care; RA Read Address, RD Read Data, ID Device Code, IDA Identifier Address, IDD Identifier Data, SRD Status
Register Data, PA Program Address; PD Program Data, QA Query Address, QD Query Data, BA Any address in the Block,
BCR Burst Configuration Register value, N+1 number of Words to program, BA Block address.
2. The Manufacturer Code, the Device Code, the Burst Configuration Register, and the Block Protection Configuration
Register of each block are read using the Read Electronic Signature command.
38/81
M58BW16F, M58BW32F
Table 11.
Command interface
Read Electronic Signature
Code
Device
Amax-A0
DQ31-DQ0
Manufacturer
All
00000h
00000020h
M58BW16FT
00001h
0000883Ah
M58BW16FB
00001h
00008839h
M58BW32FT
00001h
00008838h
M58BW32FB
00001h
00008837h
00005h
BCR(1)
Device
Burst Configuration
Register
Block Protection
Configuration Register
00000000h (Unprotected)
SBA+02h(2)
All
00000001h (Protected)
1. BCR = Burst Configuration Register.
2. SBA is the start address of each block.
Table 12.
Program, Erase times and endurance cycles(1)
M58BWxxF
Parameters
Unit
Min
Typ
Max
Full Chip Program
15
20
s
Double Word Program
15
35
µs
512 Kbit Block Erase
1
2
s
256 Kbit Block Erase
0.8
1.6
s
64 Kbit Block Erase
0.6
1.2
s
Program Suspend Latency Time
10
µs
Erase Suspend Latency Time
30
µs
30
µs
100,000
cycles
(2)
Minimum effective erase time
Program/Erase Cycles (per Block)
1. TA = –40 to 125°C, VDD = 2.7V to 3.6V, VDDQ = 2.6V to VDD
2. The minimum effective erase time is defined as the minimum time required between the last Erase
Resume command and the next Erase Suspend command for the internal Flash memory Program/Erase
Controller to be able to execute its algorithm.
39/81
Status Register
5
M58BW16F, M58BW32F
Status Register
The Status Register provides information on the current or previous Program, Erase or
Block Protect operation. The various bits in the Status Register convey information and
errors on the operation. They are output on DQ7-DQ0.
To read the Status Register the Read Status Register command can be issued. The Status
Register is automatically read after Program, Erase, Block Protect, Program/Erase Resume
commands. The Status Register can be read from any address.
The contents of the Status Register can be updated during an erase or program operation
by toggling the Output Enable or Output Disable pins or by de-activating (Chip Enable, VIH)
and then reactivating (Chip Enable and Output Enable, VIL, and Output Disable, VIH.) the
device.
The Status Register bits are summarized in Table 13: Status Register Bits. Refer to Table 13
in conjunction with the following text descriptions.
5.1
Program/Erase Controller Status (Bit 7)
The Program/Erase Controller Status bit indicates whether the Program/Erase Controller is
active or inactive. When the Program/Erase Controller Status bit is set to ‘0’, the
Program/Erase Controller is active; when bit7 is set to ‘1’, the Program/Erase Controller is
inactive.
The Program/Erase Controller Status is set to ‘0’ immediately after a Program/Erase
Suspend command is issued until the Program/Erase Controller pauses. After the
Program/Erase Controller pauses the bit is set to ‘1’.
During Program and Erase operations the Program/Erase Controller Status bit can be polled
to find the end of the operation. The other bits in the Status Register should not be tested
until the Program/Erase Controller completes the operation and the bit is set to ‘1’.
After the Program/Erase Controller completes its operation the Erase Status (bit5), Program
Status (bit4) bits should be tested for errors.
5.2
Erase Suspend Status (Bit 6)
The Erase Suspend Status bit indicates that an Erase operation has been suspended and is
waiting to be resumed. The Erase Suspend Status should only be considered valid when the
Program/Erase Controller Status bit is set to ‘1’ (Program/Erase Controller inactive); after a
Program/Erase Suspend command is issued the memory may still complete the operation
rather than entering the Suspend mode.
When the Erase Suspend Status bit is set to ‘0’, the Program/Erase Controller is active or
has completed its operation; when the bit is set to ‘1’, a Program/Erase Suspend command
has been issued and the memory is waiting for a Program/Erase Resume command.
When a Program/Erase Resume command is issued the Erase Suspend Status bit returns
to ‘0’.
40/81
M58BW16F, M58BW32F
5.3
Status Register
Erase Status (Bit 5)
The Erase Status bit can be used to identify if the memory has failed to verify that the block
has erased correctly. The Erase Status bit should be read once the Program/Erase
Controller Status bit is High (Program/Erase Controller inactive).
When the Erase Status bit is set to ‘0’, the memory has successfully verified that the block
has erased correctly. When the Erase Status bit is set to ‘1’, the Program/Erase Controller
has applied the maximum number of pulses to the block and still failed to verify that the
block has erased correctly.
Once set to ‘1’, the Erase Status bit can only be reset to ‘0’ by a Clear Status Register
command or a hardware reset. If set to ‘1’ it should be reset before a new Program or Erase
command is issued, otherwise the new command will appear to fail.
5.4
Program/ Write to Buffer and Program Status (Bit 4)
The Program/Write to Buffer and Program Status bit is used to identify a Program failure or
a Write to Buffer and Program failure. Bit4 should be read once the Program/Erase
Controller Status bit is High (Program/Erase Controller inactive).
When bit 4 is set to ‘0’ the memory has successfully verified that the device has
programmed correctly. When bit 4 is set to ‘1’ the device has failed to verify that the data has
been programmed correctly.
Once set to 1’, the Program Status bit can only be reset to ‘0’ by a Clear Status Register
command or a hardware reset. If set to ‘1’ it should be reset before a new Program or Erase
command is issued, otherwise the new command will appear to fail.
5.4.1
PEN Status (Bit 3)
The PEN Status bit can be used to identify if a program or erase operation has been
attempted when PEN is Low, VIL.
When Bit 3 is set to ‘0’ no program or erase operations have been attempted with PEN Low,
VIL, since the last Clear Status Register command, or hardware reset.
When Bit 3 is set to ‘1’ a program or erase operation has been attempted with PEN Low, VIL.
Once set to ‘1’, Bit 3 can only be reset by an Clear Status Register command or a hardware
reset. If set to ‘1’ it should be reset before a new program or erase command is issued,
otherwise the new command will appear to fail.
41/81
Status Register
5.5
M58BW16F, M58BW32F
Program Suspend Status (Bit 2)
The Program Suspend Status bit indicates that a Program operation has been suspended
and is waiting to be resumed. The Program Suspend Status should only be considered valid
when the Program/Erase Controller Status bit is set to ‘1’ (Program/Erase Controller
inactive); after a Program/Erase Suspend command is issued the memory may still
complete the operation rather than entering the Suspend mode.
When the Program Suspend Status bit is set to ‘0’, the Program/Erase Controller is active or
has completed its operation; when the bit is set to ‘1’, a Program/Erase Suspend command
has been issued and the memory is waiting for a Program/Erase Resume command.
When a Program/Erase Resume command is issued the Program Suspend Status bit
returns to ‘0’.
5.6
Block Protection Status (Bit 1)
The Block Protection Status bit can be used to identify if a Program or Erase operation has
tried to modify the contents of a protected block.
When the Block Protection Status bit is set to ‘0’, no Program or Erase operations have been
attempted to protected blocks since the last Clear Status Register command or hardware
reset; when the Block Protection Status bit is set to ‘1’, a Program or Erase operation has
been attempted on a protected block.
Once set to ‘1’, the Block Protection Status bit can only be reset Low by a Clear Status
Register command or a hardware reset. If set to ‘1’ it should be reset before a new Program
or Erase command is issued, otherwise the new command will appear to fail.
5.7
Bit 0
Reserved bit (set to ‘1’).
42/81
M58BW16F, M58BW32F
Table 13.
Status Register
Status Register Bits
Bit
7
6
5
4
3
2
1
0
Name
Logic Level
Definition
’1’
Ready
’0’
Busy
’1’
Suspended
’0’
In Progress or Completed
’1’
Erase Error
’0’
Erase Success
’1’
Program Error
’0’
Program Success
‘0’
no program or erase attempted
‘1’
program or erase attempted
’1’
Suspended
’0’
In Progress or Completed
’1’
program/erase on protected block,
abort
’0’
No operations to protected blocks
’1’
Reserved
Program/Erase Controller Status
Erase Suspend Status
Erase Status
Program Status,
PEN Status bit
Program Suspend Status
Erase/Program in a Protected
Block
Reserved
43/81
Maximum rating
6
M58BW16F, M58BW32F
Maximum rating
Stressing the device above the ratings listed in Table 14: Absolute maximum ratings, may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 14.
Absolute maximum ratings
Value
Symbol
Parameter
Max
TBIAS
Temperature Under Bias
–40
125
°C
TSTG
Storage Temperature
–55
155
°C
Input or Output Voltage
–0.6
VDDQ +0.6
VDDQIN +0.6
V
–0.6
4.2
V
VIO
VDD, VDDQ, VDDQIN Supply Voltage
44/81
Unit
Min
M58BW16F, M58BW32F
7
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics Tables that
follow, are derived from tests performed under the Measurement Conditions summarized in
Table 15: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the measurement conditions when relying on the
quoted parameters.
Table 15.
Operating and AC measurement conditions
M58BW16F, M58BW32F
Parameter
45ns
55ns
Units
Min
Max
Min
Max
Supply Voltage (VDD)
2.7
3.6
2.5
3.3
V
Input/Output Supply Voltage (VDDQ)
2.4
3.6
2.4
3.6
V
–40
125
–40
125
°C
Ambient Temperature (TA)
Grade 3
Load Capacitance (CL)
30
30
pF
Clock Rise and Fall Times
3
3
ns
Input Rise and Fall Times
3
3
ns
Input Pulses Voltages
Input and Output Timing Ref. Voltages
Figure 5.
0 to VDDQ
0 to VDDQ
V
VDDQ/2
VDDQ/2
V
AC measurement input/output waveform
VDDQ
VDDQIN
VDDQ/2
VDDQIN/2
0V
AI04153
1. VDD = VDDQ.
Figure 6.
AC measurement load circuit
DEVICE
UNDER
TEST
OUT
CL
CL includes JIG capacitance
AI04154b
45/81
DC and AC parameters
Table 16.
M58BW16F, M58BW32F
Device capacitance(1)(2)
Symbol
CIN
COUT
Parameter
Input Capacitance
Output Capacitance
Test Condition
Typ
Max
Unit
VIN = 0V
6
8
pF
VOUT = 0V
8
12
pF
1. TA = 25°C, f = 1 MHz
2. Sampled only, not 100% tested.
Table 17.
DC characteristics
Symbol
Parameter
Test Condition
Min
Typ
Max
Unit
ILI
Input Leakage Current
0V≤VIN ≤VDDQ
±1
µA
ILO
Output Leakage Current
0V≤ VOUT ≤VDDQ
±5
µA
IDD(1)
Supply Current (Random
Read)
E = VIL, G = VIH,
fadd = 6MHz
25
mA
20
mA
IDDP-UP(2) Supply Current (Power-up)
IDDB(1)
Supply Current (Burst
Read)
E = VIL, G = VIH,
fclock = 75MHz
50
mA
IDD1(1)
Supply Current (Standby)
E = RP = VDD ±
0.2V
150
µA
IDD2(1)
Supply Current (Program
or Erase)
Program, Erase in
progress
30
mA
IDD3(1)
Supply Current
(Erase/Program Suspend)
E = VIH
150
µA
IDD4(1)
Supply Current (Standby
Disable)
10
mA
–0.5
0.2VDDQIN
V
5
VIL
Input Low Voltage
VIH
Input High Voltage (for DQ
lines)
0.8VDDQIN
VDDQ +0.3
V
VIH
Input High Voltage (for
Input only lines)
0.8VDDQIN
3.6
V
VOL
Output Low Voltage
IOL = 100µA
0.1
V
VOH
Output High Voltage
CMOS
IOH = –100µA
VLKO
VDD Supply Voltage (Erase
and Program lockout)
VDDQ –0.1
V
2.2
V
1. The Standby mode can be disabled by setting the Standby Disable bit (M14) of the Burst Configuration
Register to ‘1’.
2. IDDP-UP is defined only during the power-up phase, from the moment current is applied with RP Low to the
moment when the supply voltage has become stable and RP is brought to High.
46/81
M58BW16F, M58BW32F
Figure 7.
DC and AC parameters
Asynchronous Bus Read AC waveforms
tAVAV
A0-A19
VALID
tEHLX
tAVQV
L
tELQX
tELQV
tAXQX
E
tGLQX
tGLQV
tEHQX
tEHQZ
G
GD
tGHQX
tGHQZ
DQ0-DQ31
OUTPUT
See also Page Read
AI08921b
Figure 8.
Asynchronous Latch controlled bus Read AC waveforms
A0-A19
VALID
tLHAX
L
tLHLL
tLLLH
tEHLX
E
tGLQX
tGLQV
tEHQX
tEHQZ
G
tLLQV
tLLQX
DQ0-DQ31
tGHQX
GHQZ
OUTPUT
See also Page Read
AI08922b
47/81
DC and AC parameters
Figure 9.
A0-A19
M58BW16F, M58BW32F
Asynchronous Chip Enable controlled bus Read AC waveforms
VALID
tLHAX
L
tEHLX
E
tGLQX
tGLQV
tEHQX
tEHQZ
G
tELQX
tELQV
DQ0-DQ31
tGHQX
GHQZ
OUTPUT
See also Page Read
AI13434
Figure 10. Asynchronous Address controlled bus Read AC waveforms
A0-A19
VALID
tLHAX
L
tEHLX
E
tGLQX
tGLQV
tEHQX
tEHQZ
G
tGHQX
GHQZ
tAVQV
DQ0-DQ31
OUTPUT
See also Page Read
AI13435
48/81
M58BW16F, M58BW32F
Table 18.
DC and AC parameters
Asynchronous Bus Read AC characteristics
M58BWxxF
Symbol
Parameter
Test Condition
Unit
45
55
tAVAV
Address Valid to Address Valid
E = VIL, G = VIL
Min
45
55
ns
tAVQV
Address Valid to Output Valid
E = VIL, G = VIL
Max
45
55
ns
tAXQX
Address Transition to Output Transition
L = VIL, G = VIL
Min
0
0
ns
tEHLX
Chip Enable High to Latch Enable
Transition
Min
0
0
ns
tEHQX
Chip Enable High to Output Transition
G = VIL
Min
0
0
ns
tEHQZ
Chip Enable High to Output Hi-Z
G = VIL
Max
20
20
ns
tELQV(1) Chip Enable Low to Output Valid
G = VIL
Max
45
55
ns
tGHQX
Output Enable High to Output Transition
E = VIL
Min
0
0
ns
tGHQZ
Output Enable High to Output Hi-Z
E = VIL
Max
15
15
ns
tGLQV
Output Enable Low to Output Valid
E = VIL
Max
15
15
ns
tGLQX
Output Enable Low to Output Transition
E = VIL
Min
0
0
ns
tLHAX
Latch Enable High to Address Transition
E = VIL
Min
5
5
ns
tLHLL
Latch Enable High to Latch Enable Low
Min
10
10
ns
tLLLH
Latch Enable Low to Latch Enable High
E = VIL
Min
10
10
ns
tLLQV
Latch Enable Low to Output Valid
Chip Enable Low to Output Valid
E = VIL, G = VIL
Max
45
55
ns
tLLQX
Latch Enable Low to Output Transition
E = VIL, G = VIL
Min
0
0
ns
tELQX
Chip Enable Low to Output Transition
L = VIL, G = VIL
Min
0
0
ns
1. Output Enable G may be delayed up to tELQV - tGLQV after the falling edge of Chip Enable E without
increasing tELQV.
49/81
DC and AC parameters
M58BW16F, M58BW32F
Figure 11. Asynchronous Page Read AC waveforms
A0-A1
A0 and/or A1
tAVQV1
tAXQX
OUTPUT + 1
OUTPUT
DQ0-DQ31
AI03646
Table 19.
Asynchronous Page Read AC characteristics(1)
M58BWxxF
Symbol
Parameter
Test Condition
Unit
45
55
tAVQV1
Address Valid to Output Valid
E = VIL, G = VIL
Max
25
25
ns
tAXQX
Address Transition to Output Transition
E = VIL, G = VIL
Min
0
0
ns
1. For other timings see Table 18: Asynchronous Bus Read AC characteristics.
50/81
RP
PEN
DQ0-DQ31
W
G
E=L
A0-A19
tAVLL
tWHEH
INPUT
tDVWH
tWHDX
tWHWL
tWHAX
tWLWH
Write Cycle
tELWL
tAVWH
tAVAV
VALID
INPUT
RP = VHH
Write Cycle
tPHWH
tVPHWH
VALID
tWHQV
tWHGL
VALID
Read Status Register
RP = VDD
tQVPL
tQVVPL
VALID SR
AI13223b
M58BW16F, M58BW32F
DC and AC parameters
Figure 12. Asynchronous Write AC waveform
51/81
52/81
RP
PEN
DQ0-DQ31
W
G
E
L
A0-A19
tAVLL
tLLLH
tWHDX
Write Cycle
tWLWH
tELWL
tAVWH
tLHAX
INPUT
tLLWH
tELLL
tAVLH
tAVAV
VALID
tDVWH
tVPHWH
tWHWL
tWHEH
tWHAX
VALID
Write Cycle
RP = VHH
INPUT
tWHQV
tWHGL
VALID
Read Status Register
AI13222b
RP = VDD
tQVPL
tQVVPL
VALID SR
DC and AC parameters
M58BW16F, M58BW32F
Figure 13. Asynchronous Latch controlled Write AC waveform
M58BW16F, M58BW32F
Table 20.
DC and AC parameters
Asynchronous Write and Latch controlled Write AC characteristics
M58BWxxF
Symbol
Parameter
Test Condition
Unit
45
55
tAVAV
Address Valid toAddress Valid
Min
45
55
tAVLH
Address Valid to Latch Enable High
Min
8
8
ns
tAVLL
Address Valid to Latch Enable Low
Min
0
0
ns
tAVWH
Address Valid to Write Enable High
E = VIL
Min
25
25
ns
tDVWH
Data Input Valid to Write Enable High
E = VIL
Min
25
25
ns
tELLL
Chip Enable Low to Latch Enable Low
Min
0
0
ns
tELWL
Chip Enable Low to Write Enable Low
Min
0
0
ns
tLHAX
Latch Enable High to Address Transition
Min
5
5
ns
tLLLH
Latch Enable Low to Latch Enable High
Min
10
10
ns
tLLWH
latch Enable Low to Write Enable High
Min
25
25
ns
tQVVPL
Output Valid to PEN Low
Min
0
0
ns
tVPHWH
PEN High to Write Enable High
Min
0
0
ns
tWHAX
Write Enable High to Address Transition
E = VIL
Min
0
0
ns
tWHDX
Write Enable High to Input Transition
E = VIL
Min
0
0
ns
tWHEH
Write Enable High to Chip Enable High
Min
0
0
ns
tWHGL
Write Enable High to Output Enable Low
Min
150
150
ns
tWHQV
Write Enable High to Output Valid
Min
165
165
ns
tWHWL
Write Enable High to Write Enable Low
Min
20
20
ns
tWLWH
Write Enable Low to Write Enable High
Min
25
25
ns
tQVPL
Output Valid to Reset/Power-down Low
Min
0
0
ns
E = VIL
E = VIL
53/81
54/81
DQ0-DQ31
G
E
L
A0-A19
K
VALID
tELLL
tAVLL
1
Note: n depends on Burst X-Latency.
tLLKH
tKHLL
0
tKHLH
tKHAX
Setup
tKHQV
tGLQV
n
OUTPUT
n+1
n+2
AI08925c
tGHQX
tGHQZ
tEHQX
tEHQZ
DC and AC parameters
M58BW16F, M58BW32F
Figure 14. Synchronous Burst Read, Latch Enable controlled (data valid from ’n’
clock rising edge)
DQ0-DQ31
G
E
L
A0-A19
B
K
VALID
1
Note: n depends on Burst X-Latency.
tELKH
tKHEL
0
tKHLH
tKHAX
Setup
tKHQV
tGLQV
n+1
OUTPUT
tBLKH
n
n+2
AI13284
tGHQX
tGHQZ
tEHQX
tEHQZ
M58BW16F, M58BW32F
DC and AC parameters
Figure 15. Synchronous Burst Read, Chip Enable controlled (data valid from ’n’
clock rising edge)
55/81
DC and AC parameters
M58BW16F, M58BW32F
AI13285
tKHQV
56/81
tKHLH
Note: n depends on Burst X-Latency.
DQ0-DQ31
G
E
L
A0-A19
B
K
tAVKH
0
1
VALID
Setup
tKHAX
tGLQV
n
tBLKH
OUTPUT
n+1
n+2
tEHQX
tEHQZ
tGHQX
tGHQZ
Figure 16. Synchronous Burst Read, Valid Address transition controlled (data valid
from ’n’ clock rising edge)
M58BW16F, M58BW32F
DC and AC parameters
Figure 17. Synchronous Burst Read (data valid from ’n’ clock rising edge)
n
n+1
n+2
n+4
n+3
n+5
K
tKHQV
Q0
DQ0-DQ31
Q1
Q2
Q3
Q4
Q5
tKHQX
SETUP
Burst Read
Q0 to Q3
Note: n depends on Burst X-Latency
AI04408c
1. For set up signals and timings see Synchronous Burst Read.
Figure 18. Synchronous Burst Read - valid data ready output
K
Output (1)
V
V
V
V
V
tRLKH
R
(2)
AI03649b
1. Valid Data Ready = Valid Low during valid clock edge
2. V= Valid output.
3. The internal timing of R follows DQ.
57/81
DC and AC parameters
M58BW16F, M58BW32F
Figure 19. Synchronous Burst Read - burst address advance
K
A0-A19
VALID
L
DQ0-DQ31
Q0
Q1
Q2
tGLQV
G
tBLKH
tBHKH
B
AI03650
Figure 20. Clock input AC waveform
tKHKL
K
tKLKH
ai13286
58/81
M58BW16F, M58BW32F
Table 21.
DC and AC parameters
Synchronous Burst Read AC characteristics(1) (2)
M58BWxxF
Symbol
f
tAVKH
Parameter
Clock frequency
Test Condition
Unit
45
55
X-Latency = 3
Max
40
33
MHz
X-Latency = 4
Max
56
40
MHz
X-Latency = 5 or 6
Max
75
56
MHz
E = VIL, L = VIL
X-Latency = 3
Min
9
6
ns
E = VIL, L = VIL
X-Latency = 4, 5 or 6
Min
6
6
ns
Address Valid to Valid Clock Edge,
tKHKL
Clock High Time
Min
6
6
ns
tKLKH
Clock Low Time
Min
6
6
ns
tBHKH
Burst Address Advance High to Valid
Clock Edge
E = VIL, G = VIL, L = VIH
Min
8
8
ns
tBLKH
Burst Address Advance Low to Valid
Clock Edge
E = VIL, G = VIL, L = VIH
Min
8
8
ns
L = VIL
X-Latency = 3
Min
9
6
ns
L = VIL
X-Latency = 4, 5 or 6
Min
6
6
ns
E = VIL, L = VIH
Max
15
15
ns
tELKH
Chip Enable Low to Valid Clock Edge
tGLQV
Output Enable Low to Output Valid
tKHAX
Valid Clock Edge to Address Transition
E = VIL
Min
5
5
ns
tKHEL
Valid Clock Edge to Chip Enable Low
L = VIL
Min
0
0
ns
tKHLL
Valid Clock Edge to Latch Enable Low
E = VIL
Min
0
0
ns
tKHLH
Valid Clock Edge to Latch Enable High
E = VIL
Min
0
0
ns
tKHQX
Valid Clock Edge to Output Transition
E = VIL, G = VIL, L = VIH
Min
2
2
ns
E = VIL
X-Latency = 3
Min
9
6
ns
E = VIL
X-Latency = 4, 5 or 6
Min
6
6
ns
tLLKH
Latch Enable Low to Valid Clock Edge,
tRLKH
Valid Data Ready Low to Valid Clock
Edge
E = VIL, G = VIL, L = VIH
Min
6
6
ns
tKHQV
Valid Clock Edge to Output Valid
E = VIL, G = VIL, L = VIH
Max
8
8
ns
1. Data output should be read on the valid clock edge.
2. For other timings see Table 18: Asynchronous Bus Read AC characteristics.
59/81
DC and AC parameters
M58BW16F, M58BW32F
Figure 21. Reset, Power-Down and Power-up AC waveform
W, E, G
tPHWL
tPHEL
tPHGL
tPLRH
R
tPHWL
tPHEL
tPHGL
RP
tVDHPH
tPLPH
VDD, VDDQ
Power-Up
Reset
AI03849b
Table 22.
Reset, Power-Down and Power-up AC characteristics
Symbol
tPHEL
tPHQV
(1)
Parameter
Reset/Power-down High to Chip Enable Low
Min
Max
50
Reset/Power-down High to Output Valid
Unit
ns
130
ns
tPHWL
Reset/Power-down High to Write Enable Low
50
ns
tPHGL
Reset/Power-down High to Output Enable Low
50
ns
tPLPH
Reset/Power-down Low to Reset/Power-down High
100
ns
tPLRH
Reset/Power-down Low to Valid Data Ready High
2
tVDHPH
Supply Voltages High to Reset/Power-down High
50
1. This time is tPHEL + tAVQV or tPHEL + tELQV.
60/81
30
µs
µs
M58BW16F, M58BW32F
8
Package mechanical
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 22. LBGA80 10 × 12mm - 8 × 10 ball array, 1mm pitch, bottom view package
outline
D
D1
FD
FE
SD
SE
E
E1
BALL "A1"
ddd
e
e
b
A
A2
A1
BGA-Z05
1. Drawing is not to scale.
61/81
Package mechanical
Table 23.
M58BW16F, M58BW32F
LBGA80 10 × 12mm - 8 × 10 active ball array, 1mm pitch, package
mechanical data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
1.700
A1
Max
0.0669
0.350
0.0138
A2
1.100
0.0433
b
0.500
0.0197
D
10.000
–
–
0.3937
–
–
D1
7.000
–
–
0.2756
–
–
ddd
62/81
Max
0.120
0.0047
E
12.000
–
–
0.4724
–
–
E1
9.000
–
–
0.3543
–
–
e
1.000
–
–
0.0394
–
–
FD
1.500
–
–
0.0591
–
–
FE
1.500
–
–
0.0591
–
–
SD
0.500
–
–
0.0197
–
–
SE
0.500
–
–
0.0197
–
–
M58BW16F, M58BW32F
Package mechanical
Figure 23. PQFP80 - 80 lead Plastic Quad Flat Pack, package outline
Ne
A2
N
1
e
D2 D1 D
Nd
b
E2
A
E1
CP
L1
E
c
A1
QFP-B
α
L
1. Drawing is not to scale.
Table 24.
PQFP80 - 80 lead Plastic Quad Flat Pack, package mechanical data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
3.400
A1
A2
Max
0.1339
0.250
2.800
b
0.0098
2.550
3.050
0.300
0.450
CP
0.1102
0.1004
0.1201
0.0118
0.0177
0.100
c
Max
0.130
0.230
0.0039
0.0051
0.0091
D
23.200
22.950
23.450
0.9134
0.9035
0.9232
D1
20.000
19.900
20.100
0.7874
0.7835
0.7913
D2
18.400
–
–
0.7244
–
–
e
0.800
–
–
0.0315
–
–
E
17.200
16.950
17.450
0.6772
0.6673
0.6870
E1
14.000
13.900
14.100
0.5512
0.5472
0.5551
E2
12.000
–
–
0.4724
–
–
L
0.800
0.650
0.950
0.0315
0.0256
0.0374
L1
1.600
–
–
0.0630
–
–
α
0°
7°
0°
7°
N
80
80
Nd
24
24
Ne
16
16
63/81
Part numbering
9
M58BW16F, M58BW32F
Part numbering
Table 25.
Ordering information scheme
Example:
M58BW32F
T 4
T 3
T
Device Type
M58
Architecture
B = Burst Mode
Operating Voltage
W = [2.7 V to 3.6 V] VDD range for 45 ns speed class
[2.5 V to 3.3 V] VDD range for 55 ns speed class
[2.4 V to VDD] VDDQ range for 45 ns and 55 ns speed classes
Device Function
32F = 32 Mbit (x32), Boot Block, Burst, 0.11µm technology
16F = 16 Mbit (x32), Boot Block, Burst, 0.11µm technology
Array Matrix
T = Top Boot
B = Bottom Boot
Speed
4 = 45 ns
5 = 55 ns
Package
T = PQFP80
ZA = LBGA80: 1.0mm pitch
Device Grade
3 = Automotive grade certified(1), –40 to 125 °C
Option
Blank = Standard packing
T = Tape & Reel Packing
F = ECOPACK® Package, Tape & Reel 24mm Packing
1. Qualified & characterized according to AEC Q100 & Q003 or equivalent, advanced screening
according to AEC Q001 & Q002 or equivalent.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc) or for further information on any aspect
of this device, please contact the ST Sales Office nearest to you.
64/81
M58BW16F, M58BW32F
Appendix A
Flowcharts
Flowcharts
Figure 24. Program flowchart and pseudo code
Start
Program Command:
– write 40h, Address AAh
– write Address & Data
(memory enters read status
state after the Program command)
Write 40h
Write Address
& Data
Read Status
Register
b7 = 1
do:
– read status register
(E or G must be toggled)
NO
while b7 = 1
YES
b3 = 0
NO
PEN Invalid
Error (1)
NO
Program
Error (1)
NO
Program to Protect
Block Error
If b3 = 1, PEN invalid error:
– error handler
YES
b4 = 0
If b4 = 1, Program error:
– error handler
YES
b1 = 0
If b1 = 1, Program to Protected Block Error:
– error handler
YES
End
AI03850e
1. If an error is found, the Status Register must be cleared before further P/E operations.
65/81
Flowcharts
M58BW16F, M58BW32F
Figure 25. Program Suspend & Resume flowchart and pseudo code
Start
Write B0h
Program/Erase Suspend Command:
– write B0h
– write 70h
Write 70h
do:
– read status register
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b2 = 1
NO
Program Complete
If b2 = 0, Program completed
YES
Read Memory Array Command:
– write FFh
– one or more data reads
from other blocks
Write FFh
Read data from
another block
Write D0h
Write FFh
Program Continues
Read Data
Program Erase Resume Command:
– write D0h
to resume programming
– if the program operation completed
then this is not necessary. The device
returns to Read Array as normal
(as if the Program/Erase Suspend
command was not issued).
AI00612b
66/81
M58BW16F, M58BW32F
Flowcharts
Figure 26. Block Erase flowchart and pseudo code
Start
Erase Command:
– write 20h, Address 55h
– write Block Address
(A11-A19) & D0h
(memory enters read status
state after the Erase command)
Write 20h
Write Block Address
& D0h
NO
Read Status
Register
Suspend
b7 = 1
YES
NO
Suspend
Loop
do:
– read status register
(E or G must be toggled)
if Erase command given execute
suspend erase loop
while b7 = 1
YES
b3 = 0
NO
PEN Invalid
Error (1)
YES
Command
Sequence Error
NO
Erase
Error (1)
NO
Erase to Protected
Block Error
If b3 = 1, PEN invalid error:
– error handler
YES
b4 and b5
=1
If b4, b5 = 1, Command Sequence error:
– error handler
NO
b5 = 0
If b5 = 1, Erase error:
– error handler
YES
b1 = 0
If b1 = 1, Erase to Protected Block Error:
– error handler
YES
End
AI08623d
1. If an error is found, the Status Register must be cleared before further P/E operations.
67/81
Flowcharts
M58BW16F, M58BW32F
Figure 27. Erase Suspend & Resume flowchart and pseudo code
Erase cycle in progress
Write B0h
Program/Erase Suspend Command
Write 70h
Read Status
Register
Do:
– Read status register while b7 = 1
(b7 = Program/Erase status bit)
b7 = 1
NO
YES
b6 = 1
NO
Erase Complete
If b6 = 0, Erase is completed
(b6 = Erase Suspend status bit)
The device returns to Read mode as normal
(as if the Program/Erase Suspend was not issued).
YES
Write FFh
Write FFh
Read data from
another block
or Program
Write D0h
Read Memory Array command:
– Write FFh
– One or more data reads
from other blocks
Read Data
Program/Erase Resume command:
– Write D0h to resume the Erase
operation
Erase Continues
AI00615c
68/81
M58BW16F, M58BW32F
Flowcharts
Figure 28. Power-up sequence followed by Synchronous Burst Read
Power-up
or Reset
Asynchronous Read
Write 60h command
BCR bit 15 = '1'
Set Burst Configuration Register Command:
– write 60h
– write 03h
and BCR on A15-A0
Write 03h with A15-A0
BCR inputs
Synchronous Read
BCR bit 15 = '0'
BCR bit 14-bit 0 = '1'
AI03834
69/81
Flowcharts
M58BW16F, M58BW32F
Figure 29. Command Interface and Program Erase Controller flowchart (a)
WAIT FOR
COMMAND
WRITE
90h
READ
ARRAY
NO
YES
READ ELEC.
SIGNATURE
98h
NO
D
YES
READ CFI
70h
NO
YES
READ
STATUS
20h
NO
YES
ERASE
SET-UP
40h
NO
YES
ERASE
COMMAND
ERROR
NO
D0h
PROGRAM
SET-UP
50h
YES
A
YES
C
NO
E
CLEAR
STATUS
D
READ
STATUS
B
AI03835
70/81
M58BW16F, M58BW32F
Flowcharts
Figure 30. Command Interface and Program Erase Controller flowchart (b)
E
48h
NO
YES
TP
PROGRAM
SET_UP
78h
NO
YES
F
TP
UNLOCK
SET_UP
60h
NO
YES
FFh
G
SET BCR
SET_UP
03h
NO
YES
NO
YES
D
AI03836
71/81
Flowcharts
M58BW16F, M58BW32F
Figure 31. Command Interface and Program Erase Controller flowchart (c)
A
B
ERASE
YES
READY
NO
NO
B0h
READ
STATUS
YES
ERASE
SUSPEND
YES
READY
NO
NO
ERASE
SUSPENDED
READ
STATUS
YES
READ
STATUS
YES
70h
NO
40h
YES
PROGRAM
SET_UP
NO
READ
ARRAY
NO
D0h
C
YES
READ
STATUS
AI03837
72/81
M58BW16F, M58BW32F
Flowcharts
Figure 32. Command Interface and Program Erase Controller flowchart (d)
C
B
PROGRAM
YES
READY
NO
B0h
NO
READ
STATUS
YES
PROGRAM
SUSPEND
YES
READY
NO
NO
PROGRAM
SUSPENDED
READ
STATUS
YES
READ
STATUS
YES
70h
NO
READ
ARRAY
NO
D0h
YES
READ
STATUS
AI03838
73/81
Flowcharts
M58BW16F, M58BW32F
Figure 33. Command Interface and Program Erase Controller flowchart (e)
F
B
TP
PROGRAM
YES
READY
NO
READ
STATUS
NO
READ
STATUS
G
B
TP
UNLOCK
YES
READY
AI03839
74/81
M58BW16F, M58BW32F
Appendix B
Common Flash Interface (CFI)
Common Flash Interface (CFI)
The Common Flash Interface is a JEDEC approved, standardized data structure that can be
read from the Flash memory device. It allows a system software to query the device to
determine various electrical and timing parameters, density information and functions
supported by the memory. The system can interface easily with the device, enabling the
software to upgrade itself when necessary.
When the CFI Query Command (RCFI) is issued the device enters CFI Query mode and the
data structure is read from the memory. Table 26, Table 27, Table 28, Table 31 and Table 30
show the addresses used to retrieve the data.
Table 26.
Query structure overview
Offset
Sub-section Name
Description
00h
0020h
Manufacturer Code ST
01h
883A
8839
8838
8837
Device Code
10h
CFI Query Identification String
Command set ID and algorithm data offset
1Bh
System Interface Information
Device timing and voltage information
27h
Device Geometry Definition
Flash memory layout
P(h)(1)
Primary Algorithm-specific Extended Query
Table
Additional information specific to the
Primary Algorithm (optional)
A(h)(2)
Alternate Algorithm-specific Extended Query
Table
Additional information specific to the
Alternate Algorithm (optional)
M58BW16FT (top)
M58BW16FB (bottom)
M58BW32FT (top)
M58BW32FB (bottm)
1. Offset 15h defines P which points to the Primary Algorithm Extended Query Address Table.
2. Offset 19h defines A which points to the Alternate Algorithm Extended Query Address Table.
75/81
Common Flash Interface (CFI)
M58BW16F, M58BW32F
CFI - Query address and data output(1) (2)
Table 27.
Address A0-Amax
Data
Instruction
10h
51h
"Q"
11h
52h
"R"
12h
59h
"Y"
13h
03h
14h
00h
15h
35h (M58BW16F)
39h (M58BW32F)
16h
00h
17h
00h
18h
00h
19h
00h
1Ah
00h
51h; "Q"
Query ASCII String 52h; "R"
59h; "Y"
Primary Vendor:
Command Set and Control Interface ID Code
Primary algorithm extended Query Address Table:
P(h)
Alternate Vendor:
Command Set and Control Interface ID Code
Alternate Algorithm Extended Query address Table
1. The x8 or Byte Address and the x16 or Word Address mode are not available.
2. Query Data are always presented on DQ7-DQ0. DQ31-DQ8 are set to '0'.
Table 28.
CFI - Device voltage and timing specification
Address
A0-Amax
Data
1Bh
27h(1)
VDD min
2.7 V
1Ch
36h(1)
VDD max
3.6 V
1Dh
xxxx xxxxh
Reserved
1Eh
xxxx xxxxh
Reserved
1Fh
04h
20h
xxxx xxxxh
21h
0Ah
22h
xxxx xxxxh
Reserved
23h
xxxx xxxxh
Reserved
24h
xxxx xxxxh
Reserved
25h
xxxx xxxxh
Reserved
26h
xxxx xxxxh
Reserved
Description
2n µs typical for Word, DWord prog
Reserved
2n ms, typical time-out for Erase Block
1. Bits are coded in Binary Code Decimal, bit7 to bit4 are scaled in Volts and bit3 to bit0 in mV.
76/81
Value
1s
M58BW16F, M58BW32F
Table 29.
Common Flash Interface (CFI)
M58BW16F device geometry definition
Address A0-Amax
Data
Description
27h
15h
2n number of bytes memory size
2 MBytes
28h
03h
Device Interface Sync./Async.
x32
29h
00h
Organization Sync./Async.
Async.
2Ah
00h
2Bh
00h
2Ch
02h
2Dh
1Eh
2Eh
00h
2Fh
00h
30h
01h
31h
07h
32h
00h
33h
20h
34h
00h
Maximum number of Byte in multi-Byte program = 2n 32 Bytes
Bit7-0 = number of Erase Block Regions in device
2
Number (n-1) of erase blocks of identical size; n=31
31 blocks
Erase Block region information x 256 bytes per Erase
512 Kbits
Block (64 Kbytes)
Number (n-1) of erase blocks of identical size; n=8
Table 30.
Value
8 blocks
Erase Block region information x 256 bytes per Erase
64 Kbits
Block (8 Kbytes)
M58BW16F extended query information
Address offset
Address
Amax-A0
(P)h
35h
50
P
(P+1)h
36h
52
R
(P+2)h
37h
49
Y
(P+3)h
38h
31h
Major revision number
(P+4)h
39h
31h
Minor revision number
Optional Feature: (1=yes, 0=no)
bit0, Chip Erase Supported (0= no)
bit1, Suspend Erase Supported (1=yes)
bit2, Suspend Program Supported (1=yes)
bit3, Lock/Unlock Supported (0=no)
bit4, Queue Erase Supported (0=no)
bit5, Instant individual block locking (0=no)
bit6, Protection bits supported (0=no)
bit7, Page read supported (1=yes)
bit8, Synchronous read supported (1=yes)
Bit 9 reserved
Data (Hex)
(P+5)h
3Ah
86h
(P+6)h
3Bh
01h
(P+7)h
3Ch
00h
(P+8)h
3Dh
00h
Description
Query ASCII string - Extended Table
Synchronous read supported
77/81
Common Flash Interface (CFI)
Table 30.
M58BW16F, M58BW32F
M58BW16F extended query information (continued)
Address offset
Address
Amax-A0
Data (Hex)
(P+9)h
3Eh
01h
(P+A)h-(P+40)h
3Fh-7Fh
(P+41)h
80h
xxxx xxxxh
Unique Device ID - 1 (16 bits)
(P+42)h
81h
xxxx xxxxh
Unique Device ID - 2 (16 bits)
(P+43)h
82h
xxxx xxxxh
Unique Device ID - 3 (16 bits)
(P+44)h
83h
xxxx xxxxh
Unique Device ID - 4 (16 bits)
Table 31.
Description
Function allowed after Suspend:
Program allowed after Erase Suspend (1=yes)
Bit 7-1 reserved for future use
Reserved
M58BW32F device geometry definition
Address A0-Amax
Data
Description
27h
16h
2n number of bytes memory size
4 MBytes
28h
03h
Device Interface Sync./Async.
x32
29h
00h
Organization Sync./Async.
Async.
2Ah
05h
Page size in bytes, 2n
32 Bytes
2Bh
00h
2Ch
03h
Bit7-0 = number of Erase Block Regions in device
3
2Dh
3Dh
62
2Eh
00h
Number (n-1) of Erase Block Regions of identical
size; n = 62
2Fh
00h
30h
01h
31h
07h
32h
00h
33h
20h
34h
00h
35h
03h
36h
00h
37h
40h
38h
00h
Erase Block region information x 256 bytes per Erase
512 Kbits
Block (64 Kbytes)
Number (n-1) of Erase blocks of identical size; n = 8
78/81
Value
8 blocks
Erase Block region information x 256 bytes per Erase
64 Kbits
Block (8 Kbytes)
Number (n-1) of Erase Block of identical size; n = 4
4 blocks
Erase Block Region Information x 256 bytes per
Erase block (16 Kbytes)
128 Kbits
M58BW16F, M58BW32F
Table 32.
Common Flash Interface (CFI)
M58BW32F Extended query information
Address offset
Address
Amax-A0
(P)h
39h
50
P
(P+1)h
3Ah
52
R
(P+2)h
3Bh
49
Y
(P+3)h
3Ch
31h
Major revision number
(P+4)h
3Dh
31h
Minor revision number
Optional Feature: (1=yes, 0=no)
bit0, Chip Erase Supported (0= no)
bit1, Suspend Erase Supported (1=yes)
bit2, Suspend Program Supported (1=yes)
bit3, Lock/Unlock Supported (0=no)
bit4, Queue Erase Supported (0=no)
bit5, Instant individual block locking (0=no)
bit6, Protection bits supported (0=no)
bit7, Page read supported (1=yes)
bit8, Synchronous read supported (1=yes)
Bit 9 reserved
Data (Hex)
(P+5)h
3Eh
86h
(P+6)h
3Fh
01h
(P+7)h
40h
00h
(P+8)h
41h
00h
01h
Description
Query ASCII string - Extended Table
Synchronous read supported
Function allowed after Suspend:
Program allowed after Erase Suspend (1=yes)
Bit 7-1 reserved for future use
(P+9)h
42h
(P+A)h-(P+40)h
43h-7Fh
(P+41)h
80h
xxxx xxxxh
Unique Device ID - 1 (16 bits)
(P+42)h
81h
xxxx xxxxh
Unique Device ID - 2 (16 bits)
(P+43)h
82h
xxxx xxxxh
Unique Device ID - 3 (16 bits)
(P+44)h
83h
xxxx xxxxh
Unique Device ID - 4 (16 bits)
Reserved
79/81
Revision history
M58BW16F, M58BW32F
Revision history
Table 33.
Document revision history
Date
Revision
09-Jun-2006
1
Initial release.
2
VPEN signal renamed as PEN and Program/Erase Enable (PEN)
modified.
Continuous burst and wrap options are not available, X-Latencies 7
and 8 removed (see Table 8: Burst Configuration Register and
Table 9: Burst type definition). Notes removed below Table 8.
tWHQV timing modified in Table 20: Asynchronous Write and Latch
controlled Write AC characteristics.
IDD max modified and IDD4 added to Table 17: DC characteristics.
tAXQX modified in Table 19: Asynchronous Page Read AC
characteristics.
Read access specified in Asynchronous Bus Read and
Synchronous Burst Read.
tAVKH and tALKH added and tKHQV for 55 ns modified in Table 21:
Synchronous Burst Read AC characteristics. Figure 9, Figure 10,
Figure 18 and Figure 19 added. Double Word Program max
modified and Minimum effective erase time added to Table 12:
Program, Erase times and endurance cycles.
All Asynchronous Bus Read AC characteristics brought together in
Table 18: Asynchronous Bus Read AC characteristics. tLLEL
removed from Table 18 and Figure 7. Appendix B: Common Flash
Interface (CFI) modified.
23-Nov-2006
80/81
Changes
M58BW16F, M58BW32F
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