HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6768 Issued Date : 1994.07.29 Revised Date : 2002.02.20 Page No. : 1/3 HTIP29C NPN EPITAXIAL PLANAR TRANSISTOR Description The HTIP29C is designed for use in general purpose amplifier and switching applications. Absolute Maximum Ratings (Ta=25°C) TO-220 • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Tc=25°C) ..................................................................................... 30 W Total Power Dissipation (Ta=25°C) ....................................................................................... 2 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 100 V BVCEO Collector to Emitter Voltage.................................................................................. 100 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current............................................................................................................... 1 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO ICES ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 fT Min. 100 100 40 15 3 Typ. - Max. 200 300 1 0.7 1.3 75 - Unit V V uA uA mA V V MHz Test Conditions IC=1mA, IE=0 IC=30mA, IB=0 VCE=100V, IB=0 VCE=60V, IB=0 VEB=5V IC=1A, IB=125mA IC=1A, VCE=4V IC=0.2A, VCE=4V IC=1A, VCE=4V IC=0.2A, VCE=10V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HTIP29C HSMC Product Specification HI-SINCERITY Spec. No. : HE6768 Issued Date : 1994.07.29 Revised Date : 2002.02.20 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 1000 hFE @ VCE=4V Saturation Voltage (mV) VCE(sat) @ IC=8IB hFE o 125 C 100 o 25 C o o 75 C 100 o 25 C o 125 C 75 C 10 10 1 10 100 1000 1 10 Collector Current IC (mA) 100 1000 Collector Current-IC (mA) ON Voltage & Collector Current Switching Time & Collector Current 1000 10.0 VCC=30V, IC=10IB1=-10IB2 o Switching Times (us)... ON Voltage (mV) 25 C o 75 C o 125 C VBE(ON) @ VCE=4V 1.0 Tstg Ton Tf 100 0.1 1 10 100 1000 0.1 1.0 Collector Current-IC (mA) 10.0 Collector Current (A) Capacitance & Reverse-Biased Voltage Safe Operating Area 1000 100000 Collector Current-IC (mA) Capacitance (pF) PT=1ms 100 PT=100ms 10000 PT=1s 1000 100 Cob 10 10 0.1 1 10 Reverse-Biased Voltage (V) HTIP29C 100 1 10 100 1000 Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6768 Issued Date : 1994.07.29 Revised Date : 2002.02.20 Page No. : 3/3 MICROELECTRONICS CORP. TO-220AB Dimension Marking: B A D E H T I P 2 9 C C Control Code Date Code H K M I Style: Pin 1.Base 2.Collector 3.Emitter 3 G N 2 1 4 P O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 DIM A B C D E G H Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead : 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTIP29C HSMC Product Specification