Burr-Brown ADS7807UBE4 Low-power, 16-bit, sampling cmos analog-to-digital converter Datasheet

ADS7807
AD S
780
7
ADS
780
7
SBAS022C – NOVEMBER 1992 – REVISED FEBRUARY 2006
Low-Power, 16-Bit, Sampling CMOS
ANALOG-to-DIGITAL CONVERTER
FEATURES
DESCRIPTION
● 35mW max POWER DISSIPATION
● 50µW POWER-DOWN MODE
● 25µs max ACQUISITION AND CONVERSION
● ±1.5LSB max INL
● DNL: 16 bits “No Missing Codes”
● 86dB min SINAD WITH 1kHz INPUT
● ±10V, 0V TO +5V, AND 0V TO +4V INPUT RANGES
● SINGLE +5V SUPPLY OPERATION
● PARALLEL AND SERIAL DATA OUTPUT
● PIN-COMPATIBLE WITH THE 12-BIT ADS7806
● USES INTERNAL OR EXTERNAL REFERENCE
● 0.3" DIP-28 AND SO-28
The ADS7807 is a low-power, 16-bit, sampling Analog-toDigital (A/D) converter using state-of-the-art CMOS structures. It contains a complete 16-bit, capacitor-based, Successive Approximation Register (SAR) A/D converter with
sample-and-hold, clock, reference, and microprocessor interface with parallel and serial output drivers.
Clock
The ADS7807 can acquire and convert 16 bits to within
±1.5LSB in 25µs max while consuming only 35mW max.
Laser trimmed scaling resistors provide standard industrial
input ranges of ±10V and 0V to +5V. In addition, a 0V to +4V
range allows development of complete single-supply systems.
The ADS7807 is available in a 0.3" DIP-28 and SO-28, both
fully specified for operation over the industrial –40°C to
+85°C temperature range.
R/C
CS
BYTE
Power
Down
Successive Approximation Register and Control Logic
40kΩ
CDAC
R1IN
BUSY
Parallel
20kΩ
40kΩ
Serial Data
Clock
and
10kΩ
Comparator
R2IN
Serial
Serial Data
Data
CAP
Out
Parallel Data
Buffer
6kΩ
REF
8
Internal
+2.5V Ref
Reference
Power-Down
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1992-2006, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS(1)
........................................................................... ±12V
.......................................................................... ±5.5V
.................................. VANA + 0.3V to AGND2 – 0.3V
......................................... Indefinite Short to AGND2,
Momentary Short to VANA
Ground Voltage Differences: DGND, AGND1, and AGND2 ............. ±0.3V
VANA ....................................................................................................... 7V
VDIG to VANA ...................................................................................... +0.3V
VDIG ........................................................................................................ 7V
Digital Inputs ............................................................. –0.3V to VDIG + 0.3V
Maximum Junction Temperature ................................................... +165°C
Internal Power Dissipation ............................................................. 825mW
Lead Temperature (soldering, 10s) ............................................... +300°C
Analog Inputs: R1IN
R2IN
CAP
REF
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PACKAGE/ORDERING INFORMATION
PRODUCT
MINIMUM
MAXIMUM
SPECIFIED
SIGNAL-TOINTEGRAL
NO MISSING
(NOISE +
SPECIFIED
LINEARITY CODE LEVEL DISTORTION)
PACKAGE
TEMPERATURE
ERROR (LSB)
(LSB)
RATIO (DB) PACKAGE-LEAD DESIGNATOR(1)
RANGE
ADS7807P
ADS7807PB
ADS7807U
"
ADS7807UB
"
±3
±1.5
±3
"
±1.5
"
15
16
15
"
16
"
83
86
83
"
86
"
Dip-28
NT
"
"
SO-28
"
DW
"
"
"
"
"
PACKAGE
MARKING
ORDERING
NUMBER
–40°C to +85°C
ADS7807P
ADS7807PB
–40°C to +85°C ADS7807U
"
"
"
ADS7807UB
"
"
TRANSPORT
MEDIA, QUANTITY
ADS7807P
Tubes, 13
ADS7807PB
Tubes, 13
ADS7807U
Tubes, 28
ADS7807U/1K Tape and Reel, 1000
ADS7807UB
Tubes, 28
ADS7807UB/1K Tape and Reel, 1000
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at
www.ti.com.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, fS = 40kHz, VDIG = VANA = +5V, and using internal reference and fixed resistors (see Figure 7b), unless otherwise specified.
ADS7807P, U
PARAMETER
CONDITIONS
MIN
TYP
RESOLUTION
DC ACCURACY
Integral Linearity Error
Differential Linearity Error
No Missing Codes
Transition Noise(2)
Gain Error
Full-Scale Error(3,4)
Full-Scale Error Drift
Full-Scale Error(3,4)
Full-Scale Error Drift
Bipolar Zero Error(3)
Bipolar Zero Error Drift
Unipolar Zero Error(3)
Unipolar Zero Error Drift
Recovery Time to Rated Accuracy
from Power-Down(5)
Power-Supply Sensitivity
(VDIG = VANA = VS)
2
MAX
MIN
TYP
16
ANALOG INPUT
Voltage Ranges
Impedance
Capacitance
THROUGHPUT SPEED
Conversion Time
Complete Cycle
Throughput Rate
ADS7807PB, UB
MAX
UNITS
✻
Bits
±10, 0 to +5, 0 to +4
(See Table I)
V
✻
35
20
25
Acquire and Convert
±3
+3, –2
15
µs
µs
kHz
±1.5
+1.5, –1
LSB(1)
LSB
Bits
LSB
%
%
ppm/°C
%
ppm/°C
mV
ppm/°C
mV
ppm/°C
ms
16
0.8
±0.2
±7
±0.5
±0.5
±0.5
1
±0.5
±0.5
✻
±0.1
±5
±0.25
±0.25
✻
±10
✻
✻
±3
✻
✻
✻
±8
+4.75V < VS < +5.25V
✻
✻
✻
40
Ext. 2.5000V Ref
Ext. 2.5000V Ref
±10V Range
±10V Range
0V to 5V, 0V to 4V Ranges
0V to 5V, 0V to 4V Ranges
2.2µF Capacitor to CAP
pF
✻
LSB
ADS7807
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SBAS022C
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = –40°C to +85°C, fS = 40kHz, VDIG = VANA = +5V, and using internal reference and fixed resistors (see Figure 7b), unless otherwise specified.
ADS7807P, U
PARAMETER
AC ACCURACY
Spurious-Free Dynamic Range
Total Harmonic Distortion
Signal-to-(Noise + Distortion)
Signal-to-Noise
Usable Bandwidth(7)
Full-Power Bandwidth (–3dB)
SAMPLING DYNAMICS
Aperture Delay
Aperture Jitter
Transient Response
Over-Voltage Recovery(8)
REFERENCE
Internal Reference Voltage
Internal Reference Source Current
(Must use external buffer.)
Internal Reference Drift
External Reference Voltage Range
for Specified Linearity
External Reference Current Drain
DIGITAL INPUTS
Logic Levels
VIL
VIH(9)
IIL
IIH
DIGITAL OUTPUTS
Data Format
Data Coding
VOL
VOH
Leakage Current
CONDITIONS
MIN
TYP
fIN = 1kHz, ±10V
fIN = 1kHz, ±10V
fIN = 1kHz, ±10V
–60dB Input
fIN = 1kHz, ±10V
90
100
–100
88
30
88
130
600
FS Step
MIN
TYP
96
✻
✻
✻
32
✻
✻
✻
–90
86
86
No Load
2.3
2.5
1
8
2.5
External 2.5000V Ref
✻
2.52
✻
2.7
✻
✻
✻
✻
✻
100
–0.3
+2.0
+0.8
VD + 0.3V
±10
±10
VIL = 0V
VIH = 5V
–96
✻
5
2.48
MAX
✻
✻
750
✻
✻
✻
UNITS
dB(6)
dB
dB
dB
dB
kHz
kHz
ns
ps
µs
ns
V
µA
✻
ppm/°C
V
✻
µA
✻
✻
✻
✻
V
V
µA
µA
✻
Parallel 16 bits in 2-bytes; Serial
Binary Two’s Complement or Straight Binary
Output Capacitance
DIGITAL TIMING
Bus Access Time
Bus Relinquish Time
RL = 3.3kΩ, CL = 50pF
RL = 3.3kΩ, CL = 10pF
TEMPERATURE RANGE
Specified Performance
Derated Performance
Storage
Thermal Resistance (θJA)
DIP
SO
83
MAX
40
20
ISINK = 1.6mA
ISOURCE = 500µA
High-Z State,
VOUT = 0V to VDIG
High-Z State
POWER SUPPLIES
Specified Performance
VDIG
VANA
IDIG
IANA
Power Dissipation
83
ADS7807PB, UB
Must be ≤ VANA
+0.4
±5
✻
V
V
µA
15
✻
pF
83
83
✻
✻
ns
ns
✻
✻
V
V
mA
mA
mW
mW
µW
✻
+4
+4.75
+4.75
VANA = VDIG = 5V, fS = 40kHz
REFD HIGH
PWRD and REFD HIGH
+5
+5
0.6
5.0
28
23
50
–40
–55
–65
+5.25
+5.25
35
+85
+125
+150
75
75
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
°C
°C
°C
°C/W
°C/W
✻ Same specifications as ADS7807P, U.
NOTES: (1) LSB means Least Significant Bit. One LSB for the ±10V input range is 305µV. (2) Typical rms noise at worst-case transition. (3) As measured with
fixed resistors, see Figure 7b. Adjustable to zero with external potentiometer. (4) Full-scale error is the worst case of –Full-Scale or +Full-Scale untrimmed deviation
from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the effect of offset error. (5) This is the
time delay after the ADS7807 is brought out of Power-Down mode until all internal settling occurs and the analog input is acquired to rated accuracy. A Convert
command after this delay will yield accurate results. (6) All specifications in dB are referred to a full-scale input. (7) Usable bandwidth defined as full-scale input
frequency at which Signal-to-(Noise + Distortion) degrades to 60dB. (8) Recovers to specified performance after 2 • FS input overvoltage. (9) The minimum VIH
level for the DATACLK signal is 3V.
ADS7807
SBAS022C
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3
PIN DESCRIPTIONS
DIGITAL
I/O
PIN #
NAME
1
2
3
4
5
6
7
8
9
R1IN
AGND1
R2IN
CAP
REF
AGND2
SB/BTC
EXT/INT
D7
10
11
12
13
14
15
16
17
18
19
20
21
22
D6
D5
D4
D3
DGND
D2
D1
D0
DATACLK
SDATA
TAG
BYTE
R/C
O
O
O
I/O
O
I
I
I
23
CS
I
24
BUSY
O
25
26
27
28
PWRD
REFD
VANA
VDIG
I
I
DESCRIPTION
Analog Input. See Figure 7.
Analog Sense Ground.
Analog Input. See Figure 7.
Reference Buffer Output. 2.2µF tantalum capacitor to ground.
Reference Input/Output. 2.2µF tantalum capacitor to ground.
Analog Ground
Selects Straight Binary or Binary Two’s Complement for Output Data Format.
External/Internal data clock select.
Data Bit 7 if BYTE is HIGH. Data bit 15 (MSB) if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW. Leave
unconnected when using serial output.
Data Bit 6 if BYTE is HIGH. Data bit 14 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Bit 5 if BYTE is HIGH. Data bit 13 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Bit 4 if BYTE is HIGH. Data bit 12 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Bit 3 if BYTE is HIGH. Data bit 11 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Digital Ground
Data Bit 2 if BYTE is HIGH. Data bit 10 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Bit 1 if BYTE is HIGH. Data bit 9 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Bit 0 (LSB) if BYTE is HIGH. Data bit 8 if BYTE is LOW. Hi-Z when CS is HIGH and/or R/C is LOW.
Data Clock Output when EXT/INT is LOW. Data clock input when EXT/INT is HIGH.
Serial Output Synchronized to DATACLK
Serial Input When Using an External Data Clock
Selects 8 most significant bits (LOW) or 8 least significant bits (HIGH) on parallel output pins.
With CS LOW and BUSY HIGH, a Falling Edge on R/C Initiates a New Conversion. With CS LOW, a rising edge on R/C
enables the parallel output.
Internally OR’d with R/C. If R/C is LOW, a falling edge on CS initiates a new conversion. If EXT/INT is LOW, this same
falling edge will start the transmission of serial data results from the previous conversion.
At the start of a conversion, BUSY goes LOW and stays LOW until the conversion is completed and the digital outputs
have been updated.
PWRD HIGH shuts down all analog circuitry except the reference. Digital circuitry remains active.
REFD HIGH shuts down the internal reference. External reference will be required for conversions.
Analog Supply. Nominally +5V. Decouple with 0.1µF ceramic and 10µF tantalum capacitors.
Digital Supply. Nominally +5V. Connect directly to pin 27. Must be ≤ VANA.
I
I
O
O
O
O
O
PIN CONFIGURATION
Top View
DIP, SO
R1IN
1
28 VDIG
AGND1
2
27 VANA
R2IN
3
26 REFD
CAP
4
25 PWRD
REF
5
24 BUSY
AGND2
6
23 CS
SB/BTC
7
ANALOG
INPUT
RANGE
CONNECT R1IN
VIA 200Ω
TO
CONNECT R2IN
VIA 100Ω
TO
IMPEDANCE
±10V
0V to 5V
0V to 4V
VIN
AGND
VIN
CAP
VIN
VIN
45.7kΩ
20.0kΩ
21.4kΩ
TABLE I. Input Range Connections. See Figure 7.
22 R/C
ADS7807
4
EXT/INT
8
21 BYTE
D7
9
20 TAG
D6 10
19 SDATA
D5 11
18 DATACLK
D4 12
17 D0
D3 13
16 D1
DGND 14
15 D2
ADS7807
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SBAS022C
TYPICAL CHARACTERISTICS
At TA = +25°C, fS = 40kHz, VDIG = VANA = +5V, and using internal reference and fixed resistors (see Figure 7b), unless otherwise specified.
FREQUENCY SPECTRUM
(8192 Point FFT; fIN = 15kHz, 0dB)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
Amplitude (dB)
0
5
10
Frequency (kHz)
15
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
20
100
100
90
90
80
80
70
70
60
50
15
20
0dB
–20dB
60
50
40
40
30
30
20
20
–60dB
10
10
100
1k
10k
100k
0
1M
2
4
6
8
10
12
14
16
Input Signal Frequency (Hz)
Input Signal Frequency (kHz)
SIGNAL-TO-(NOISE + DISTORTION) vs TEMPERATURE
(fIN = 1kHz, 0dB; fS = 10kHz to 40kHz)
AC PARAMETERS vs TEMPERATURE
(fIN = 1kHz, 0dB)
100
18
10kHz
30kHz
20kHz
90
40kHz
85
80
SFDR, SINAD, and SNR (dB)
110
95
SINAD (dB)
10
Frequency (kHz)
SIGNAL-TO-(NOISE + DISTORTION)
vs INPUT FREQUENCY AND INPUT AMPLITUDE
SINAD (dB)
SINAD (dB)
SIGNAL-TO-(NOISE + DISTORTION)
vs INPUT FREQUENCY (fIN = 0dB)
5
20
–80
SFDR
105
–85
100
–90
95
–95
THD
SNR
90
THD (dB)
Amplitude (dB)
FREQUENCY SPECTRUM
(8192 Point FFT; fIN = 1kHz, 0dB)
–100
85
–105
SINAD
75
80
–75
–50
–25
0
25
50
75
100
125
150
–75
Temperature (°C)
–25
0
25
50
75
100
125
–110
150
Temperature (°C)
ADS7807
SBAS022C
–50
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5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, fS = 40kHz, VDIG = VANA = +5V, and using internal reference and fixed resistors (see Figure 7b), unless otherwise specified.
1
3
2
1
0
–1
–2
–3
3
2
1
0
–1
–2
–3
Linearity Degradation (LSB/LSB)
16-Bit (LSBs)
16-Bit (LSBs)
POWER-SUPPLY RIPPLE SENSITIVITY
INL/DNL DEGRADATION PER LSB OF P-P RIPPLE
All Codes INL
All Codes DNL
0
8192
10–1
10–2
INL
10–3
10–4
DNL
10–5
16384 24576 32768 40960 49152
57344 65535
101
102
mV From Ideal
Percent
From Ideal
0
+FS Error
–FS Error
Percent
From Ideal
mV From Ideal
Percent
From Ideal
Percent
From Ideal
BPZ Error
–0.20
0.20
0
–0.20
–75
–50
–25
0
25
50
104
105
106
107
ENDPOINT ERRORS (Unipolar Ranges)
ENDPOINT ERRORS (20V Bipolar Range)
3
2
1
0
–1
–2
0.20
103
Power-Supply Ripple Frequency (Hz)
Decimal Code
75
100
125
3
2
1
0
–1
–2
0.40
UPO Error
0.20
0
0.40
+FS Error (4V Range)
–FS Error (5V Range)
0.20
0
150
–75
–50
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
INTERNAL REFERENCE VOLTAGE vs TEMPERATURE
CONVERSION TIME vs TEMPERATURE
125
150
125
150
2.520
19.4
2.510
Conversion Time (µs)
Internal Reference (V)
2.515
2.505
2.500
2.495
2.490
2.485
19.2
19
18.8
18.6
2.480
–75
–50
–25
0
25
50
75
100
125
150
–75
Temperature (°C)
6
–50
–25
0
25
50
75
100
Temperature (°C)
ADS7807
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SBAS022C
BASIC OPERATION
PARALLEL OUTPUT
Figure 1a shows a basic circuit to operate the ADS7807 with
a ±10V input range and parallel output. Taking R/C (pin 22)
LOW for a minimum of 40ns (12µs max) will initiate a
conversion. BUSY (pin 24) will go LOW and stay LOW until
the conversion is completed and the output register is updated. If BYTE (pin 21) is LOW, the eight Most Significant
Bits (MSBs) will be valid when BUSY rises; if BYTE is HIGH,
the eight Least Significant Bits (LSBs) will be valid when
BUSY rises. Data will be output in Binary Two’s Complement
(BTC) format. BUSY going HIGH can be used to latch the
data. After the first byte has been read, BYTE can be toggled
allowing the remaining byte to be read. All convert commands will be ignored while BUSY is LOW.
The ADS7807 will begin tracking the input signal at the end
of the conversion. Allowing 25µs between convert commands assures accurate acquisition of a new signal.
The offset and gain are adjusted internally to allow external
trimming with a single supply. The external resistors compensate for this adjustment and can be left out if the offset and gain
will be corrected in software (refer to the Calibration section).
SERIAL OUTPUT
Figure 1b shows a basic circuit to operate the ADS7807 with
a ±10V input range and serial output. Taking R/C (pin 22)
LOW for 40ns (12µs max) will initiate a conversion and
output valid data from the previous conversion on SDATA
(pin 19) synchronized to 16 clock pulses output on DATACLK
(pin 18). BUSY (pin 24) will go LOW and stay LOW until the
conversion is completed and the serial data has been transmitted. Data will be output in BTC format, MSB first, and will
be valid on both the rising and falling edges of the data clock.
BUSY going HIGH can be used to latch the data. All convert
commands will be ignored while BUSY is LOW.
The ADS7807 will begin tracking the input signal at the end
of the conversion. Allowing 25µs between convert commands assures accurate acquisition of a new signal.
The offset and gain are adjusted internally to allow external
trimming with a single supply. The external resistors compensate for this adjustment and can be left out if the offset and
gain will be corrected in software (refer to the Calibration
section).
STARTING A CONVERSION
The combination of CS (pin 23) and R/C (pin 22) LOW for a
minimum of 40ns puts the sample-and-hold of the ADS7807
in the hold state and starts conversion ‘n’. BUSY (pin 24) will
go LOW and stay LOW until conversion ‘n’ is completed and
the internal output register has been updated. All new convert commands during BUSY LOW will be ignored. CS and/
or R/C must go HIGH before BUSY goes HIGH, or a new
conversion will be initiated without sufficient time to acquire
a new signal.
Parallel Output
Serial Output
200Ω
±10V
1
2
66.5kΩ
2.2µF
±10V
4
2.2µF
+ 5
66.5kΩ
+5V
25
100Ω
BUSY
24
6
Convert Pulse
23
R/C
7
9
20
19
11
18
12
17
40ns min
25
5
24
6
23
22
8
21
9
20
NC(1) 10
19
16
NC(1) 11
18
15
NC(1) 12
17 NC(1)
NC(1) 13
16 NC(1)
14
15 NC(1)
B2
B1
B0
(LSB)
+5V
BUSY
Convert Pulse
R/C
40ns min
SDATA
DATACLK
NOTE: (1) These pins should be left unconnected.
They will be active when R/C is HIGH.
NOTE: (1) SDATA (pin 19) is always active.
FIGURE 1a. Basic ±10V Operation, both Parallel and Serial
Output.
FIGURE 1b. Basic ±10V Operation with Serial Output.
ADS7807
SBAS022C
4
14
Pin 21
HIGH
B3
26
0.1µF 10µF
+
+
13
B8
B4
3
7
NC(1)
B9
B5
27
NC(1)
B10
B6
28
2
ADS7807
Pin 21 B15 B14 B13 B12 B11
LOW (MSB)
B7
+
2.2µF
+
BYTE
21
10
2.2µF
22
ADS7807
8
1
+5V
26
100Ω
+5V
0.1µF 10µF
+
+
27
3
+
200Ω
28
www.ti.com
7
The ADS7807 will begin tracking the input signal at the end
of the conversion. Allowing 25µs between convert commands assures accurate acquisition of a new signal. Refer to
Tables II and III for a summary of CS , R/C, and BUSY states,
and Figures 2 through 6 for timing diagrams.
CS
R/C
BUSY
OPERATION
1
X
X
None. Databus is in Hi-Z state.
↓
0
1
Initiates conversion ‘n’. Databus remains
in Hi-Z state.
0
↓
1
Initiates conversion ‘n’. Databus enters Hi-Z
state.
0
1
↑
Conversion ‘n’ completed. Valid data from
conversion ‘n’ on the databus.
↓
1
1
Enables databus with valid data from
conversion ‘n’.
↓
1
0
Enables databus with valid data from
conversion ‘n – 1’(1). Conversion n in progress.
0
↑
0
Enables databus with valid data from
conversion ‘n – 1’(1). Conversion ‘n’ in progress.
0
0
↑
New conversion initiated without acquisition
of a new signal. Data will be invalid. CS and/or
R/C must be HIGH when BUSY goes HIGH.
X
X
0
New convert commands ignored. Conversion
‘n’ in progress.
NOTE: (1) See Figures 2 and 3 for constraints on data valid from
conversion ‘n – 1’.
TABLE II. Control Functions When Using Parallel Output
(DATACLK tied LOW, EXT/INT tied HIGH).
CS and R/C are internally OR’ed and level triggered. There
is not a requirement which input goes LOW first when
initiating a conversion. If, however, it is critical that CS or R/C
initiates conversion ‘n’, be sure the less critical input is LOW
at least 10ns prior to the initiating input. If EXT/INT (pin 8) is
LOW when initiating conversion ‘n’, serial data from conversion ‘n – 1’ will be output on SDATA (pin 19) following the
start of conversion ‘n’. See Internal Data Clock in the Reading Data section.
To reduce the number of control pins, CS can be tied LOW
using R/C to control the read and convert modes. This will
have no effect when using the internal data clock in the serial
output mode. The parallel output and the serial output (only
when using an external data clock), however, will be affected
whenever R/C goes HIGH. Refer to the Reading Data
section.
READING DATA
The ADS7807 outputs serial or parallel data in Straight Binary
(SB) or Binary Two’s Complement data output format. If
SB/BTC (pin 7) is HIGH, the output will be in SB format, and
if LOW, the output will be in BTC format. Refer to Table IV for
ideal output codes.
The parallel output can be read without affecting the internal
output registers; however, reading the data through the serial
port will shift the internal output registers one bit per data
CS
R/C
BUSY
EXT/INT
DATACLK
↓
0
1
0
Output
OPERATION
Initiates conversion ‘n’. Valid data from conversion ‘n – 1’ clocked out on SDATA.
0
↓
1
0
Output
Initiates conversion ‘n’. Valid data from conversion ‘n – 1’ clocked out on SDATA.
↓
0
1
1
Input
Initiates conversion ‘n’. Internal clock still runs conversion process.
0
↓
1
1
Input
Initiates conversion ‘n’. Internal clock still runs conversion process.
↓
1
1
1
Input
Conversion ‘n’ completed. Valid data from conversion ‘n’ clocked out on SDATA synchronized
to external data clock.
↓
1
0
1
Input
Valid data from conversion ‘n – 1’ output on SDATA synchronized to external data clock.
Conversion ‘n’ in progress.
0
↑
0
1
Input
Valid data from conversion ‘n – 1’ output on SDATA synchronized to external data clock.
Conversion ‘n’ in progress.
0
0
↑
X
X
New conversion initiated without acquisition of a new signal. Data will be invalid. CS and/or R/C
must be HIGH when BUSY goes HIGH.
X
X
0
X
X
New convert commands ignored. Conversion ‘n’ in progress.
NOTE: (1) See Figures 4, 5, and 6 for constraints on data valid from conversion ‘n – 1’.
TABLE III. Control Functions When Using Serial Output.
DESCRIPTION
Full-Scale Range
Least Significant Bit (LSB)
ANALOG INPUT
±10
305µV
0V to 5V
76µV
0V to 4V
61µV
DIGITAL OUTPUT
BINARY TWO’S COMPLEMENT
STRAIGHT BINARY
(SB/BTC LOW)
(SB/BTC HIGH)
HEX
+Full-Scale (FS – 1LSB)
Midscale
One LSB Below Midscale
–Full-Scale
HEX
BINARY CODE
CODE
BINARY CODE
CODE
9.999695V
4.999924V
3.999939V
0111 1111 1111 1111
7FFF
1111 1111 1111 1111
FFFF
0V
2.5V
2V
0000 0000 0000 0000
0000
1000 0000 0000 0000
8000
–305µV
2.499924V
1.999939V
1111 1111 1111 1111
FFFF
0111 1111 1111 1111
7FFF
–10V
0V
0V
1000 0000 0000 0000
8000
0000 0000 0000 0000
0000
TABLE IV. Output Codes and Ideal Input Voltages.
8
ADS7807
www.ti.com
SBAS022C
clock pulse. As a result, data can be read on the parallel port
prior to reading the same data on the serial port, but data
cannot be read through the serial port prior to reading the
same data on the parallel port.
PARALLEL OUTPUT
To use the parallel output, tie EXT/INT (pin 8) HIGH and
DATACLK (pin 18) LOW. SDATA (pin 19) should be left
unconnected. The parallel output will be active when R/C (pin
22) is HIGH and CS (pin 23) is LOW. Any other combination
of CS and R/C will tri-state the parallel output. Valid conversion data can be read in two 8-bit bytes on D7-D0 (pins 9-13
and 15-17). When BYTE (pin 21) is LOW, the 8 most significant bits will be valid with the MSB on D7. When BYTE is
HIGH, the 8 least significant bits will be valid with the LSB on
D0. BYTE can be toggled to read both bytes within one
conversion cycle.
PARALLEL OUTPUT (AFTER A CONVERSION)
After conversion ‘n’ is completed and the output registers
have been updated, BUSY (pin 24) will go HIGH. Valid data
from conversion ‘n’ will be available on D7-D0 (pins 9-13 and
15-17). BUSY going high can be used to latch the data. Refer
to Table V and Figures 2 and 3 for timing constraints.
PARALLEL OUTPUT (DURING A CONVERSION)
After conversion ‘n’ has been initiated, valid data from conversion ‘n – 1’ can be read and will be valid up to 12µs after
the start of conversion ‘n’. Do not attempt to read data
beyond 12µs after the start of conversion ‘n’ until BUSY (pin
24) goes HIGH; this may result in reading invalid data. Refer
to Table V and Figures 2 and 3 for timing constraints.
Upon initial power up, the parallel output will contain indeterminate data.
t1
t1
R/C
t3
t3
t4
BUSY
t5
t6
t6
t7
Convert
Acquire
MODE
t8
Acquire
t12
t11
Parallel
Data Bus
Previous
High Byte Valid
t12
t10
Previous High
Byte Valid
Hi-Z
Convert
Previous Low
Byte Valid
Not Valid
Low Byte
Valid
High Byte
Valid
Hi-Z
t9
t2
t12
t12
t9
High Byte
Valid
t12
t12
BYTE
FIGURE 2. Conversion Timing with Parallel Output (CS and DATACLK tied LOW, EXT/INT tied HIGH).
t21
t21
t21
t21
t21
t21
t21
t21
t21
t21
R/C
t1
CS
t3
BUSY
t4
BYTE
DATA
BUS
Hi-Z State
High Byte
t12
Hi-Z State
t9
Low Byte
t12
Hi-Z State
t9
FIGURE 3. Using CS to Control Conversion and Read Timing with Parallel Outputs.
ADS7807
SBAS022C
www.ti.com
9
SYMBOL
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
t16
t17
t18
t19
t20
t21
t22
t7 + t8
DESCRIPTION
INTERNAL DATA CLOCK
(During a Conversion)
MIN TYP MAX UNITS
Convert Pulse Width
0.04
Data Valid Delay after R/C LOW
BUSY Delay from
Start of Conversion
BUSY LOW
BUSY Delay after
End of Conversion
Aperture Delay
Conversion Time
Acquisition Time
Bus Relinquish Time
10
BUSY Delay after Data Valid
20
Previous Data Valid
12
after Start of Conversion
Bus Access Time and BYTE Delay
Start of Conversion
to DATACLK Delay
DATACLK Period
Data Valid to DATACLK
20
HIGH Delay
Data Valid after DATACLK
400
LOW Delay
External DATACLK Period
100
External DATACLK LOW
40
External DATACLK HIGH
50
25
CS and R/C to External
DATACLK Setup Time
10
R/C to CS Setup Time
Valid Data after DATACLK HIGH
25
Throughput Time
19
19
90
40
19
12
20
85
µs
µs
ns
20
µs
ns
20
5
83
60
19
83
To use the internal data clock, tie EXT/INT (pin 8) LOW. The
combination of R/C (pin 22) and CS (pin 23) LOW will initiate
conversion ‘n’ and activate the internal data clock (typically
900kHz clock rate). The ADS7807 will output 16 bits of valid
data, MSB first, from conversion ‘n-1’ on SDATA (pin 19),
synchronized to 16 clock pulses output on DATACLK (pin 18).
The data will be valid on both the rising and falling edges of the
internal data clock. The rising edge of BUSY (pin 24) can be
used to latch the data. After the 16th clock pulse, DATACLK will
remain LOW until the next conversion is initiated, while SDATA
will go to whatever logic level was input on TAG (pin 20) during
the first clock pulse. Refer to Table VI and Figure 4.
ns
µs
µs
ns
ns
µs
1.4
ns
µs
1.1
75
µs
ns
600
ns
EXTERNAL DATA CLOCK
To use an external data clock, tie EXT/INT (pin 8) HIGH. The
external data clock is not a conversion clock; it can only be
used as a data clock. To enable the output mode of the
ADS7807, CS (pin 23) must be LOW and R/C (pin 22) must
be HIGH. DATACLK must be HIGH for 20% to 70% of the
total data clock period; the clock rate can be between DC and
10MHz. Serial data from conversion ‘n’ can be output on
SDATA (pin 19) after conversion ‘n’ is completed or during
conversion ‘n + 1’.
ns
ns
ns
ns
25
ns
ns
µs
An obvious way to simplify control of the converter is to tie
CS LOW and use R/C to initiate conversions.
TABLE VI. Conversion and Data Timing. TA = –40°C to +85°C.
While this is perfectly acceptable, there is a possible problem
when using an external data clock. At an indeterminate point
from 12µs after the start of conversion ‘n’ until BUSY rises,
the internal logic will shift the results of conversion ‘n’ into the
output register. If CS is LOW, R/C HIGH, and the external
clock is HIGH at this point, data will be lost. So, with CS
LOW, either R/C and/or DATACLK must be LOW during this
period to avoid losing valid data.
SERIAL OUTPUT
Data can be clocked out with the internal data clock or an
external data clock. When using serial output, be careful with
the parallel outputs, D7-D0 (pins 9-13 and 15-17), as these
pins will come out of Hi-Z state whenever CS (pin 23) is LOW
and R/C (pin 22) is HIGH. The serial output can not be tristated and is always active. Refer to the Applications Information section for specific serial interfaces.
t7 + t8
CS or R/C(1)
t14
DATACLK
t13
1
2
3
15
16
1
2
Bit 13 Valid
Bit 1 Valid
LSB Valid
MSB Valid
Bit 14 Valid
t16
t15
MSB Valid
Bit 14 Valid
SDATA
(Results from previous conversion.)
BUSY
NOTE: (1) If controlling with CS , tie R/C LOW. Data bus pins will remain Hi-Z at all times.
If controlling with R/C, tie CS LOW. Data bus pins will be active when R/C is HIGH, and should be left unconnected.
FIGURE 4. Serial Data Timing Using Internal Data Clock (TAG tied LOW).
10
ADS7807
www.ti.com
SBAS022C
FIGURE 5. Conversion and Read Timing with External Clock (EXT/INT Tied HIGH) Read after Conversion.
ADS7807
SBAS022C
www.ti.com
11
TAG
SDATA
BUSY
R/C
CS
EXTERNAL
DATACLK
t3
t21
t1
0
t18
t17
Tag 0
t19
t21
t22
Tag 1
Bit 15 (MSB)
t20
1
2
Tag 2
Bit 14
3
4
Tag 15
Bit 1
16
Tag 16
Bit 0 (LSB)
17
Tag 17
Tag 0
18
Tag 18
Tag 1
t20
t17
t18
t19
EXTERNAL
DATACLK
t20
t22
CS
t21
t20
R/C
t1
t11
BUSY
t3
DATA
TAG
Tag 0
Bit 15 (MSB)
Bit 0 (LSB)
Tag 0
Tag 1
Tag 1
Tag 16
Tag 17
Tag 18
FIGURE 6. Conversion and Read Timing with External Clock (EXT/INT tied HIGH) Read During a Conversion.
EXTERNAL DATA CLOCK
(After a Conversion)
TAG FEATURE
After conversion ‘n’ is completed and the output registers
have been updated, BUSY (pin 24) will go HIGH. With CS
LOW and R/C HIGH, valid data from conversion ‘n’ will be
output on SDATA (pin 19) synchronized to the external data
clock input on DATACLK (pin 18). The MSB will be valid on
the first falling edge and the second rising edge of the
external data clock. The LSB will be valid on the 16th falling
edge and 17th rising edge of the data clock. TAG (pin 20) will
input a bit of data for every external clock pulse. The first bit
input on TAG will be valid on SDATA on the 17th falling edge
and the 18th rising edge of DATACLK; the second input bit
will be valid on the 18th falling edge and the 19th rising edge,
etc. With a continuous data clock, TAG data will be output on
SDATA until the internal output registers are updated with
the results from the next conversion. Refer to Table VI and
Figure 5.
EXTERNAL DATA CLOCK
(During a Conversion)
After conversion ‘n’ has been initiated, valid data from conversion ‘n – 1’ can be read and will be valid up to 12µs after
the start of conversion ‘n’. Do not attempt to clock out data
from 12µs after the start of conversion ‘n’ until BUSY (pin 24)
rises; this will result in data loss. NOTE: For the best possible
performance when using an external data clock, data should
not be clocked out during a conversion. The switching noise
of the asynchronous data clock can cause digital feedthrough
degrading the converter’s performance. Refer to Table V and
Figure 6.
12
TAG (pin 20) inputs serial data synchronized to the external
or internal data clock.
When using an external data clock, the serial bit stream input
on TAG will follow the LSB output on SDATA until the internal
output register is updated with new conversion results. See
Table V and Figures 5 and 6.
The logic level input on TAG for the first rising edge of the
internal data clock will be valid on SDATA after all 16 bits of
valid data have been output.
INPUT RANGES
The ADS7807 offers three input ranges: standard ±10V and
0V-5V, and a 0V-4V range for complete, single-supply systems. See Figures 7a and 7b for the necessary circuit
connections for implementing each input range and optional
offset and gain adjust circuitry. Offset and full-scale error(1)
specifications are tested with the fixed resistors, see Figure
7b. Adjustments for offset and gain are described in the
Calibration section of this data sheet.
The offset and gain are adjusted internally to allow external
trimming with a single supply. The external resistors compensate for this adjustment and can be left out if the offset and
gain will be corrected in software (refer to the Calibration
section).
The input impedance, summarized in Table II, results from
the combination of the internal resistor network (see the front
page of this product data sheet) and the external resistors
NOTE: (1) Full-scale error includes offset and gain errors measured at both
+FS and –FS.
ADS7807
www.ti.com
SBAS022C
used for each input range (see Figure 8). The input resistor
divider network provides inherent over-voltage protection to
at least ±5.5V for R2IN and ±12V for R1IN.
Analog inputs above or below the expected range will yield
either positive full-scale or negative full-scale digital outputs,
respectively. Wrapping or folding over for analog inputs
outside the nominal range will not occur.
GAIN ADJUST
RANGE (mV)
±10V
±15
±60
0 to 5V
±4
±30
0 to 4V
±3
±30
TABLE VI. Offset and Gain Adjust Ranges for Hardware
Calibration (see Figure 7a).
CALIBRATION
are necessary. See the No Calibration section for more
details on the external resistors. Refer to Table VIII for the
range of offset and gain errors with and without the external
resistors.
HARDWARE CALIBRATION
To calibrate the offset and gain of the ADS7807 in hardware,
install the resistors shown in Figure 7a. Table VI lists the
hardware trim ranges relative to the input for each input
range.
NO CALIBRATION
Figure 7b shows circuit connections. Note that the actual
voltage dropped across the external resistors is at least two
orders of magnitude lower than the voltage dropped across
the internal resistor divider network. This should be consid-
SOFTWARE CALIBRATION
To calibrate the offset and gain in software, no external
resistors are required. However, to get the data sheet specifications for offset and gain, the resistors shown in Figure 7b
±10V
OFFSET ADJUST
RANGE (mV)
INPUT RANGE
0V-5V
0V-4V
33.2kΩ
200Ω
200Ω
1
VIN
2
1
R1IN
2
33.2kΩ
AGND1
R1IN
1
2
VIN
3
3
VIN
R2IN
100Ω
+
2.2µF
+5V
50kΩ
4
CAP
+
2.2µF
5
50kΩ
50kΩ
1MΩ 2.2µF
50kΩ
6
+5V
5
REF
+
R2IN
3
100Ω
+5V
4
33.2kΩ
6
AGND1
R2IN
100Ω
+5V
CAP
4
2.2µF
+
CAP
50kΩ
REF
5
+
1MΩ 2.2µF
AGND2
R1IN
200Ω
AGND1
50kΩ
1MΩ 2.2µF
AGND2
REF
+
6
AGND2
FIGURE 7a. Circuit Diagrams (With Hardware Trim).
±10V
0V-5V
0V-4V
33.2kΩ
200Ω
1
VIN
2
200Ω
1
R1IN
2
33.2kΩ
AGND1
R1IN
AGND1
1
2
VIN
66.5kΩ
3
+5V
R2IN
3
VIN
R2IN
3
100Ω
100Ω
4
2.2µF
+
CAP
2.2µF
5
2.2µF
4
5
REF
+
2.2µF
6
+
AGND2
CAP
4
2.2µF
+
REF
AGND2
AGND1
R2IN
100Ω
5
+
6
R1IN
200Ω
2.2µF
CAP
REF
+
6
AGND2
FIGURE 7b. Circuit Diagrams (Without Hardware Trim).
ADS7807
SBAS022C
www.ti.com
13
ered when choosing the accuracy and drift specifications of
the external resistors. In most applications, 1% metal-film
resistors will be sufficient.
The external resistors, see Figure 7b, may not be necessary
in some applications. These resistors provide compensation
for an internal adjustment of the offset and gain which allows
calibration with a single supply. Not using the external
resistors will result in offset and gain errors in addition to
those listed in the electrical characteristics section. Offset
refers to the equivalent voltage of the digital output when
converting with the input grounded. A positive gain error
occurs when the equivalent output voltage of the digital
output is larger than the analog input. Refer to Table VII for
nominal ranges of gain and offset errors with and without the
external resistors. Refer to Figure 8 for typical shifts in the
transfer functions which occur when the external resistors
are removed.
To further analyze the effects of removing any combination of
the external resistors, consider Figure 9. The combination of
the external and the internal resistors form a voltage divider
which reduces the input signal to a 0.3125V to 2.8125V input
range at the Capacitor Digital-to-Analog Converter (CDAC).
The internal resistors are laser trimmed to high relative accuracy to meet full scale specifications. The actual input impedance of the internal resistor network looking into pin 1 or pin
3 however, is only accurate to ±20% due to process variations.
This should be taken into account when determining the
effects of removing the external resistors.
REFERENCE
The ADS7807 can operate with its internal 2.5V reference or
an external reference. By applying an external reference to
pin 5, the internal reference can be bypassed; REFD (pin 26)
OFFSET ERROR
INPUT
RANGE (V)
WITH RESISTORS
GAIN ERROR
WITHOUT RESISTORS
WITH RESISTORS
WITHOUT RESISTORS
RANGE (mV)
RANGE (mV)
TYP (mV)
RANGE (% FS)
RANGE (% FS)
TYP
–10 ≤ BPZ ≤ 10
0 ≤ BPZ ≤ 35
15
–0.4 ≤ G ≤ 0.4
0.15 ≤ G(1) ≤ 0.15
–0.3 ≤ G ≤ 0.5
–0.1 ≤ G(1) ≤ 0.2
+0.05
+0.05
0 to 5
–3 ≤ UPO ≤ 3
–12 ≤ UPO ≤ –3
–7.5
–0.4 ≤ G ≤ 0.4
0.15 ≤ G(1) ≤ 0.15
–1.0 ≤ G ≤ 0.1
–0.55 ≤ G(1) ≤ –0.05
–0.2
–0.2
0 to 4
–3 ≤ UPO ≤ 3
–10.5 ≤ UPO ≤ –1.5
–6
–0.4 ≤ G ≤ 0.4
–0.15 ≤ G(1) ≤ 0.15
–1.0 ≤ G ≤ 0.1
–0.55 ≤ G(1) ≤ –0.05
–0.2
–0.2
±10
NOTE: (1) High Grade.
TABLE VII. Range of Offset and Gain Errors With and Without External Resistors.
(a) Bipolar
(b) Unipolar
Digital Output
Digital Output
+Full-Scale
+Full-Scale
Analog Input
–Full-Scale
Analog Input
–Full-Scale
Typical Transfer Functions
With External Resistors
Typical Transfer Functions
Without External Resistors
FIGURE 8. Typical Transfer Functions With and Without External Resistors.
14
ADS7807
www.ti.com
SBAS022C
200Ω
39.8kΩ
VIN
CDAC
(0.3125V to 2.8125V)
40kΩ
20kΩ
9.9kΩ
66.5kΩ
+5V
100Ω
+2.5V
+2.5V
200Ω
39.8kΩ
CDAC
(0.3125V to 2.8125V)
33.2kΩ
20kΩ
9.9kΩ
100Ω
40kΩ
VIN
+2.5V
200Ω
+2.5V
39.8kΩ
VIN
CDAC
(0.3125V to 2.8125V)
33.2kΩ
40kΩ
20kΩ
9.9kΩ
100Ω
+2.5V
+2.5V
FIGURE 9. Circuit Diagrams Showing External and Internal Resistors.
tied HIGH will power-down the internal reference reducing
the overall power consumption of the ADS7807 by approximately 5mW.
ZCAP
The internal reference has approximately an 8ppm/°C drift
(typical) and accounts for approximately 20% of the full-scale
error (FSE = ±0.5% for low grade, ±0.25% for high grade).
CAP
(Pin 4)
The ADS7807 also has an internal buffer for the reference
voltage. Figure 10 shows characteristic impedances at the
input and output of the buffer with all combinations of powerdown and reference down.
CDAC
Buffer
Internal
Reference
REF
(Pin 5)
ZREF
REF
REF (pin 5) is an input for an external reference or the output
for the internal 2.5V reference. A 2.2µF tantalum capacitor
should be connected as close as possible to the REF pin
from ground. This capacitor and the output resistance of REF
create a low-pass filter to bandlimit noise on the reference.
Using a smaller value capacitor will introduce more noise to
the reference, degrading the SNR and SINAD. The REF pin
should not be used to drive external AC or DC loads, as
shown in Figure 10.
The range for the external reference is 2.3V to 2.7V and
determines the actual LSB size. Increasing the reference
voltage will increase the full-scale range and the LSB size of
the converter which can improve the SNR.
PWRD 0
REFD 0
PWRD 1
REFD 0
PWRD 1
REFD 1
ZCAP (Ω)
1
1
200
200
ZREF (Ω)
6k
100M
6k
100M
FIGURE 10. Characteristic Impedances of Internal Buffer.
CAP
CAP (pin 4) is the output of the internal reference buffer. A
2.2µF tantalum capacitor should be placed as close as
possible to the CAP pin from ground to provide optimum
switching currents for the CDAC throughout the conversion
ADS7807
SBAS022C
PWRD 0
REFD 1
www.ti.com
15
cycle. This capacitor also provides compensation for the
output of the buffer. Using a capacitor any smaller than 1µF
can cause the output buffer to oscillate and may not have
sufficient charge for the CDAC. Capacitor values larger than
2.2µF will have little affect on improving performance. See
Figures 10 and 11.
7000
REFD
REFD HIGH will power-down the internal 2.5V reference. All
other analog circuitry, including the reference buffer, will be
active. REFD should be HIGH when using an external
reference to minimize power consumption and the loading
effects on the external reference. See Figure 10 for the
characteristic impedance of the reference buffer’s input for
both REFD HIGH and LOW. The internal reference consumes approximately 5mW.
6000
LAYOUT
5000
POWER
3000
For optimum performance, tie the analog and digital power
pins to the same +5V power supply and tie the analog and
digital grounds together. As noted in the electrical characteristics, the ADS7807 uses 90% of its power for the analog
circuitry. The ADS7807 should be considered as an analog
component.
µs
4000
2000
1000
0
0.1
1
10
100
“CAP” Pin Value (µF)
FIGURE 11. Power-Down to Power-Up Time vs Capacitor
Value on CAP.
The output of the buffer is capable of driving up to 1mA of
current to a DC load. Using an external buffer will allow the
internal reference to be used for larger DC loads and AC
loads. Do not attempt to directly drive an AC load with the
output voltage on CAP. This will cause performance degradation of the converter.
REFERENCE
AND POWER-DOWN
GROUNDING
The ADS7807 has analog power-down and reference power
down capabilities via PWRD (pin 25) and REFD (pin 26),
respectively. PWRD and REFD HIGH will power-down all
analog circuitry maintaining data from the previous conversion in the internal registers, provided that the data has not
already been shifted out through the serial port. Typical
power consumption in this mode is 50µW. Power recovery is
typically 1ms, using a 2.2µF capacitor connected to CAP.
Figure 11 shows power-down to power-up recovery time
relative to the capacitor value on CAP. With +5V applied to
VDIG, the digital circuitry of the ADS7807 remains active at all
times, regardless of PWRD and REFD states.
PWRD
PWRD HIGH will power-down all of the analog circuitry
except for the reference. Data from the previous conversion
will be maintained in the internal registers and can still be
read. With PWRD HIGH, a convert command yields meaningless data.
16
The +5V power for the A/D converter should be separate
from the +5V used for the system’s digital logic. Connecting
VDIG (pin 28) directly to a digital supply can reduce converter
performance due to switching noise from the digital logic. For
best performance, the +5V supply can be produced from
whatever analog supply is used for the rest of the analog
signal conditioning. If +12V or +15V supplies are present, a
simple +5V regulator can be used. Although it is not suggested, if the digital supply must be used to power the
converter, be sure to properly filter the supply. Either using a
filtered digital supply or a regulated analog supply, both VDIG
and VANA should be tied to the same +5V source.
Three ground pins are present on the ADS7807. DGND is the
digital supply ground. AGND2 is the analog supply ground.
AGND1 is the ground to which all analog signals internal to the
A/D converter are referenced. AGND1 is more susceptible to
current induced voltage drops and must have the path of
least resistance back to the power supply.
All the ground pins of the A/D converter should be tied to an
analog ground plane, separated from the system’s digital
logic ground, to achieve optimum performance. Both analog
and digital ground planes should be tied to the “system”
ground as near to the power supplies as possible. This helps
to prevent dynamic digital ground currents from modulating
the analog ground through a common impedance to power
ground.
SIGNAL CONDITIONING
The FET switches used for the sample hold on many CMOS
A/D converters release a significant amount of charge injection which can cause the driving op amp to oscillate. The
ADS7807
www.ti.com
SBAS022C
amount of charge injection due to the sampling FET switch
on the ADS7807 is approximately 5% to 10% of the amount
on similar A/D converters with the charge redistribution
Digital-to-Analog Converter (DAC) CDAC architecture. There
is also a resistive front end which attenuates any charge
which is released. The end result is a minimal requirement for
the drive capability on the signal conditioning preceding the
A/D converter. Any op amp sufficient for the signal in an
application will be sufficient to drive the ADS7807.
581
The resistive front end of the ADS7807 also provides a specified ±25V over-voltage protection. In most cases, this eliminates the need for external over-voltage protection circuitry.
176
173
INTERMEDIATE LATCHES
The ADS7807 does have tri-state outputs for the parallel
port, but intermediate latches should be used if the bus will
be active during conversions. If the bus is not active during
conversion, the tri-state outputs can be used to isolate the
A/D converter from other peripherals on the same bus.
Intermediate latches are beneficial on any monolithic A/D
converter. The ADS7807 has an internal LSB size of 38µV.
Transients from fast switching signals on the parallel port,
even when the A/D converter is tri-stated, can be coupled
through the substrate to the analog circuitry causing degradation of converter performance.
52
0
FFFDH
FFFEH
FFFFH
0000H
0001H
18
0
0002H
0003H
FIGURE 12. Histogram of 1000 Conversions with Input Grounded.
5671
APPLICATIONS INFORMATION
TRANSITION NOISE
Apply a DC input to the ADS7807 and initiate 1000 conversions. The digital output of the converter will vary in output
codes due to the internal noise of the ADS7807. This is true
for all 16-bit SAR converters. The transition noise specification found in the electrical characteristics section is a statistical figure which represents the one sigma limit or rms value
of these output codes.
Using a histogram to plot the output codes, the distribution
should appear bell-shaped with the peak of the bell curve
representing the nominal output code for the input voltage
value. The ±1σ, ±2σ, and ±3σ distributions will represent
68.3%, 95.5%, and 99.7% of all codes. Multiplying TN by 6
will yield the ±3σ distribution or 99.7% of all codes. Statistically, up to 3 codes could fall outside the 5 code distribution
when executing 1000 conversions. The ADS7807 has a TN
of 0.8LSBs which yields 5 output codes for a ±3σ distribution.
Figures 12 and 13 show 1000 and 10000 conversion histogram results.
AVERAGING
The noise of the converter can be compensated by averaging the digital codes. By averaging conversion results, transition noise will be reduced by a factor of 1/√Hz where n is
2010
1681
438
18
FFFDH
FFFEH
FFFFH
0000H
0001H
182
0
0002H
0003H
FIGURE 13. Histogram of 10000 Conversions with Input Grounded.
the number of averages. For example, averaging four conversion results will reduce the TN by 1/2 to 0.4LSBs. Averaging should only be used for input signals with frequencies
near DC.
For AC signals, a digital filter can be used to low-pass filter
and decimate the output codes. This works in a similar
manner to averaging: for every decimation by 2, the signalto-noise ratio will improve 3dB.
ADS7807
SBAS022C
176
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17
QSPI™ INTERFACING
QSPI™
Figure 14 shows a simple interface between the ADS7807
and any QSPI equipped microcontroller. This interface assumes that the convert pulse does not originate from the
microcontroller and that the ADS7807 is the only serial
peripheral.
Before enabling the QSPI interface, the microcontroller must
be configured to monitor the slave select line. When a
transition from LOW to HIGH occurs on Slave Select (SS)
from BUSY (indicating the end of the current conversion), the
port can be enabled. If this is not done, the microcontroller
and the A/D converter may be “out-of-sync”.
ADS7807
PCS0
R/C
PCS1
CS
EXT/INT
SCK
DATACLK
MISO
D7 (MSB)
CPOL = 0
CPHA = 0
+5V
BYTE
QSPI is a registered trademark of Motorola.
Convert Pulse
FIGURE 15. QSPI Interface to the ADS7807. Processor
Initiates Conversions.
QSPI™
ADS7807
For both transfers, the DT register (delay after transfer) is
used to cause a 19µs delay. The interface is also set up to
wrap to the beginning of the queue. In this manner, the QSPI
is a state machine which generates the appropriate timing for
the ADS7807. This timing is thus locked to the crystal-based
timing of the microcontroller and not interrupt driven. So, this
interface is appropriate for both AC and DC measurements.
R/C
PCS0/SS
MOSI
SCK
BUSY
SDATA
DATACLK
CS
For the fastest conversion rate, the baud rate should be set
to 2 (4.19MHz SCK), DT set to 10, the first serial transfer set
to 8 bits, the second set to 16 bits, and DSCK disabled (in the
command control byte). This will allow for a 23kHz maximum
conversion rate. For slower rates, DT should be increased.
Do not slow SCK as this may increase the chance of
affecting the conversion results or accidently initiating a
second conversion during the first 8-bit transfer.
EXT/INT
CPOL = 0 (Inactive State is LOW)
CPHA = 1 (Data valid on falling edge)
QSPI port is in slave mode.
BYTE
QSPI is a registered trademark of Motorola.
FIGURE 14. QSPI Interface to the ADS7807.
Figure 15 shows another interface between the ADS7807
and a QSPI equipped microcontroller which allows the
microcontroller to give the convert pulses while also allowing
multiple peripherals to be connected to the serial bus. This
interface and the following discussion assume a master clock
for the QSPI interface of 16.78MHz. Notice that the serial
data input of the microcontroller is tied to the MSB (D7) of the
ADS7807 instead of the serial output (SDATA). Using D7
instead of the serial port offers tri-state capability which
allows other peripherals to be connected to the MISO pin.
When communication is desired with those peripherals, PCS0
and PCS1 should be left HIGH; that will keep D7 tri-stated.
In this configuration, the QSPI interface is actually set to do
two different serial transfers. The first, an 8-bit transfer, causes
PCS0 (R/C) and PCS1 (CS ) to go LOW, starting a conversion. The second, a 16-bit transfer, causes only PCS1 (CS ) to
go LOW. This is when the valid data will be transferred.
QSPI is a registered trademark of Motorola.
In addition, CPOL and CPHA should be set to zero (SCK
normally LOW and data captured on the rising edge). The
command control byte for the 8-bit transfer should be set to
20H and for the 16-bit transfer to 61H.
SPI™ INTERFACE
The SPI interface is generally only capable of 8-bit data
transfers. For some microcontrollers with SPI interfaces, it
might be possible to receive data in a similar manner as
shown for the QSPI interface in Figure 14. The microcontroller
will need to fetch the 8 most significant bits before the
contents are overwritten by the least significant bits.
A modified version of the QSPI interface shown in Figure 15
might be possible. For most microcontrollers with SPI interface, the automatic generation of the start-of-conversion
pulse will be impossible and will have to be done with
software. This will limit the interface to ‘DC’ applications due
to the insufficient jitter performance of the convert pulse
itself.
SPI is a registered trademark of Motorola.
18
ADS7807
www.ti.com
SBAS022C
DSP56000 INTERFACING
The DSP56000 serial interface has SPI compatibility mode
with some enhancements. Figure 16 shows an interface
between the ADS7807 and the DSP56000 which is very
The DSP56000 can also provide the convert pulse by including a monostable multi-vibrator, as seen in Figure 17. The
receive and transmit sections of the interface are decoupled
(asynchronous mode) and the transmit section is set to
generate a word length frame sync every other transmit
frame (frame rate divider set to 2). The prescale modulus
should be set to 3.
Convert Pulse
DSP56000
ADS7807
R/C
SC1
BUSY
SRD
SDATA
SCO
DATACLK
similar to the QSPI interface seen in Figure 14. As mentioned
in the QSPI section, the DSP56000 must be programmed to
enable the interface when a LOW to HIGH transition on SC1
is observed (BUSY going HIGH at the end of conversion).
The monostable multi-vibrator in this circuit will provide
varying pulse widths for the convert pulse. The pulse width
will be determined by the external R and C values used with
the multi-vibrator. The 74HCT123N data sheet shows that
the pulse width is (0.7) RC. Choosing a pulse width as close
to the minimum value specified in this data sheet will offer the
best performance. See the Starting A Conversion section of
this data sheet for details on the conversion pulse width.
CS
EXT/INT
BYTE
The maximum conversion rate for a 20.48MHz DSP56000 is
exactly 40kHz. Note that this will not be the case for the
ADS7806. See the ADS7806 data sheet (SBAS021B) for
more information.
SYN = 0 (Asychronous)
GCK = 1 (Gated clock)
SCD1 = 0 (SC1 is an input)
SHFD = 0 (Shift MSB first)
WL1 = 1 WL0 = 0 (Word length = 16 bits)
FIGURE 16. DSP56000 Interface to the ADS7807.
DSP56000
74HCT123N
+5V
+5V
R
B1
REXT1
CLR1
CEXT1
C
SC2
Q1
A1
ADS7807
R/C
SC0
DATACLK
SRD
SDATA
CS
EXT/INT
BYTE
SYN = 0 (Asychronous)
GCK = 1 (Gated clock)
SCD2 = 1 (SC2 is an output)
SHFD = 0 (Shift MSB first)
WL1 = 1 WL0 = 0 (Word length = 16 bits)
FIGURE 17. DSP56000 Interface to the ADS7807. Processor Initiates Conversions.
ADS7807
SBAS022C
www.ti.com
19
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS7807P
ACTIVE
PDIP
NT
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ADS7807PB
ACTIVE
PDIP
NT
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ADS7807PBG4
ACTIVE
PDIP
NT
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ADS7807PG4
ACTIVE
PDIP
NT
28
13
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ADS7807U
ACTIVE
SOIC
DW
28
28
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
ADS7807U/1K
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
ADS7807U/1KE4
ACTIVE
SOIC
DW
28
1000
CU NIPDAU
Level-3-260C-168 HR
ADS7807U/1KG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UB
ACTIVE
SOIC
DW
28
28
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UB/1K
ACTIVE
SOIC
DW
28
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UB/1KE4
ACTIVE
SOIC
DW
28
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UBE4
ACTIVE
SOIC
DW
28
28
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UBG4
ACTIVE
SOIC
DW
28
28
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
ADS7807UE4
ACTIVE
SOIC
DW
28
28
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
Pb-Free
(RoHS)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2007
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
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