CT Micro CT851MT3 4-pin high power photodarlington optocoupler Datasheet

CT852
4-Pin High Power Photodarlington Optocoupler
Features
•
High isolation 5000 VRMS
•
CTR : Min 1000%
•
High BVCEO = 350V
•
Operating temperature range - 55 °C to 110 °C
Description
The CT852 series consists of high voltage
photodarlington optically coupled to a gallium
arsenide Infrared-emitting diode in a 4-lead DIP
package with bending options.
Applications
•
Switch mode power supplies
•
Computer peripheral interface
•
Microprocessor system interface
•
Controller for SSR, DC Motor
•
Telephone Line Interface
Package Outline
Schematic
Note: Different lead forming options available. See package
dimension.
CT Micro
Proprietary & Confidential
Page 1
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Absolute Maximum Rating at 25oC
Symbol
Parameters
Ratings
Units
5000
VRMS
VISO
Isolation voltage
TOPR
Operating temperature
-55 ~ +100
oC
TSTG
Storage temperature
-55 ~ +150
oC
TSOL
Soldering temperature
260
oC
Forward current
80
mA
1
A
6
V
Notes
Emitter
IF
IF(TRANS)
Peak transient current
(≤1µs P.W,300pps)
VR
Reverse voltage
PD
Power dissipation
150
mW
Power dissipation
300
mW
BVCEO
Collector-Emitter Breakdown Voltage
350
V
BVECO
Emitter-Collector Breakdown Voltage
0.1
V
Collector Current
150
mA
Detector
PD
IC
CT Micro
Proprietary & Confidential
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Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Electrical Characteristics
TA = 25°C (unless otherwise specified)
Emitter Characteristics
Symbol
Parameters
Test Conditions
Min
Typ
Max
Units
1.2
1.4
V
VF
Forward voltage
IF=10mA
IR
Reverse Current
VR = 5V
-
-
5
µA
Input Capacitance
f= 1MHz
-
45
-
pF
Test Conditions
Min
Typ
Max
Units
CIN
Notes
Detector Characteristics
Symbol
Parameters
BVCEO
Collector-Emitter Breakdown
IC= 100µA
350
-
-
V
BVECO
Emitter-Collector Breakdown
IE= 100µA
0.1
-
-
V
Collector-Emitter Dark Current
VCE= 200V, IF=0mA
-
-
100
nA
Min
Typ
Max
Units
15000
%
1.2
V
ICEO
Notes
Transfer Characteristics
Symbol
CTR
Parameters
Current Transfer Ratio
Test Conditions
IF= 1mA, VCE= 2V
1000
Notes
Collector-Emitter Saturation
VCE(SAT)
IF= 20mA, IC= 100mA
-
-
Voltage
RIO
Isolation Resistance
VIO= 500VDC
CIO
Isolation Capacitance
f= 1MHz
5x1010
Ω
0.6
pF
Switching Characteristics
Symbol
Parameters
tr
Rise Time
tf
Fall Time
Test Conditions
Min
Typ
Max
-
-
250
-
-
95
IC=2mA, VCE= 2V, RL= 100Ω
CT Micro
Proprietary & Confidential
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Units
Notes
µs
Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Typical Characteristic Curves
CT Micro
Proprietary & Confidential
Page 4
Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
CT Micro
Proprietary & Confidential
Page 5
Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Test Circuit
IC
Input
Pulse
RL
IF
Input
Output
Output
Pulse
RIN
tr
ton
tf
toff
Figure 13: Switching Time Test Circuits
CT Micro
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Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Package Dimension Dimensions in mm unless otherwise stated
Standard DIP – Through Hole
Gullwing (400mil) Lead Forming – Through Hole
CT Micro
Proprietary & Confidential
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Surface Mount Lead Forming
Surface Mount (Low Profile) Lead Forming
CT Micro
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Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Recommended Solder Mask Dimensions in mm unless otherwise stated
Marking Information
CT
852
YWWD
Note:
CT
852
R
Y
: Denotes “CT Micro”
: Product Number
: CTR Rank
: Fiscal Year
WW
D
: Work Week
: Production Code
CT Micro
Proprietary & Confidential
Page 9
Rev 1
Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Ordering Information
CT852(Y)(Z)-G
Y = Lead form option (S, SL, M or none)
Z = Tape and reel option (T1, T2 or none)
G= Material option (G: Green, None: Non-green)
Option
Description
Quantity
None
Standard 4 Pin Dip
100 Units/Tube
M
Gullwing (400mil) Lead Forming
100 Units/Tube
S(T1)
Surface Mount Lead Forming – With Option 1 Taping
1000 Units/Reel
S(T2)
Surface Mount Lead Forming – With Option 2 Taping
1000 Units/Reel
S(T3)
Surface Mount Lead Forming – With Option 3 Taping
1000 Units/Reel
S(T4)
Surface Mount Lead Forming – With Option 4 Taping
1000 Units/Reel
SL(T1)
Surface Mount (Low Profile) Lead Forming– With Option 1 Taping
1000 Units/Reel
SL(T2)
Surface Mount (Low Profile) Lead Forming – With Option 2 Taping
1000 Units/Reel
SL(T3)
Surface Mount (Low Profile) Lead Forming– With Option 3 Taping
1000 Units/Reel
SL(T4)
Surface Mount (Low Profile) Lead Forming – With Option 4 Taping
1000 Units/Reel
CT Micro
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Carrier Tape Specifications Dimensions in mm unless otherwise stated
Option S(T1) & SL(T1)
Option S(T2) & SL(T2)
CT Micro
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Option S(T3) & SL(T3)
Option S(T4) & SL(T4)
CT Micro
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Page 12
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
Reflow Profile
Profile Feature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150°C
Temperature Max. (Tsmax)
200°C
Time (ts) from (Tsmin to Tsmax)
60-120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60 – 150 seconds
Peak Body Package Temperature
260°C +0°C / -5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max
Time 25°C to Peak Temperature
8 minutes max.
CT Micro
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Aug, 2013
CT852
4-Pin High Power Photodarlington Optocoupler
DISCLAIMER
CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
______________________________________________________________________________________
DISCOLORATION MIGHT OCCUR ON THE PACKAGE SURFACE AFTER SOLDERING, REFLOW OR LONG
TERM USE. THIS DOES NOT IMPACT THE PRODUCT PERFORMANCE NOR THE PRODUCT RELIABILITY.
CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION.
1. Life support devices or systems are devices or
2. A critical component is any component of a life
systems which, (a) are intended for surgical
support device or system whose failure to perform
implant into the body, or (b) support or sustain life,
can be reasonably expected to cause the failure of
or (c) whose failure to perform when properly used
the life support device or system, or to affect its
in accordance with instruction for use provided in
safety or effectiveness.
the labelling, can be reasonably expected to result
in significant injury to the user.
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Page 14
Rev 1
Aug, 2013
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