ON MBR340G Axial lead rectifier Datasheet

MBR340
Preferred Device
Axial Lead Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low−voltage,
high−frequency inverters, free wheeling diodes, and polarity
protection diodes.
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERES, 40 VOLTS
Features
•
•
•
•
•
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Extremely Low VF
Low Power Loss/High Efficiency
Highly Stable Oxide Passivated Junction
Low Stored Charge, Majority Carrier Conduction
Pb−Free Packages are Available*
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
AXIAL LEAD
CASE 267−05
(DO−201AD)
STYLE 1
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Cathode indicated by Polarity Band
MARKING DIAGRAM
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
VRRM
VRWM
VR
40
V
Average Rectified Forward Current TA = 65°C
(RqJA = 28°C/W, P.C. Board Mounting)
IO
3.0
A
Non−Repetitive Peak Surge Current (Note 1)
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz, TL = 75°C)
IFSM
80
A
Operating and Storage Junction Temperature
Range (Reverse Voltage Applied) (Note 2)
TJ, Tstg
−65 to
+175
°C
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
A
MBR
340
YYWWG
G
A
= Assembly Location
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
THERMAL CHARACTERISTICS
Rating
Thermal Resistance, Junction−to−Ambient
(see Note 5, Mounting Method 3)
Symbol
Max
Unit
RqJA
28
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Lead Temperature reference is cathode lead 1/32 in from case.
2. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 7
1
Package
Shipping †
MBR340
Axial Lead
500 Units / Bag
MBR340G
Axial Lead
(Pb−Free)
500 Units / Bag
MBR340RL
Axial Lead
1500/Tape & Reel
MBR340RLG
Axial Lead
(Pb−Free)
1500/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MBR340/D
MBR340
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted) (Note 3)
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 4)
(iF = 1.0 Amp)
(iF = 3.0 Amp)
(iF = 9.4 Amp)
vF
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 4)
TL = 25°C
TL = 100°C
iR
Max
Unit
V
0.500
0.600
0.850
mA
0.60
20
3. Lead Temperature reference is cathode lead 1/32in from case.
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.
I , REVERSE CURRENT (mA)
R
20
10
7.0
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
5.0
3.0
2.0
TJ = 150°C
25°C
100
40
20
10
4.0
2.0
1.0
0.4
0.2
0.1
100°C
100°C
1000
75°C
100
0.04
0.02
0.01
0.004
0.002
0.001
1.0
150°C
10
25°C
10
0
10
0.7
20
30
VR REVERSE VOLTAGE (VOLTS)
40
Figure 2. Typical Reverse Current*
0.5
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently
below rated VR.
, AVERAGE FORWARD CURRENT (AMPS)
0.3
0.2
0.1
0.07
0.05
0.03
F (AV)
0.02
I
0.01
0.1
0.2
0.3 0.4 0.5
0.6 0.7
0.8
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
10
8.0
6.0
4.0
SQUARE
WAVE
2.0
0
Figure 1. Typical Forward Voltage
20
40
dc
60
80 100 120 140 160
TA, AMBIENT TEMPERATURE (C°)
Figure 3. Current Derating
(Mounting Method #3 per Note 5)
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2
180
200
2.5
SQUARE
WAVE
RESISTIVE LOAD
I PK
+p
(CAPACITIVE LOAD) I AV
2.0
1.5
500
dc
400
I PK + 5.0
I AV
10
1.0
TJ = 150°C
20
0.5
0
TJ = 25°C
300
C, CAPACITANCE (pF)
P
, AVERAGE POWER DISSIPATION (WATTS)
F (AV)
MBR340
1.0
2.0
3.0
4.0
IF (AV), AVERAGE FORWARD CURRENT (AMPS)
5.0
200
100
90
80
70
60
50
0
10
Figure 4. Power Dissipation
20
30
40
VR REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
NOTE 5 — MOUNTING DATA
Data shown for thermal resistance junction−to−ambient
(RqJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering, or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR RqJA IN STILL AIR
Mounting
Method
Lead Length, L (in)
1/8
1/4
1/2
3/4
RqJA
1
50
51
53
55
°C/W
2
58
59
61
63
°C/W
3
°C/W
28
Mounting Method 1
Mounting Method 2
P.C. Board where available
copper surface is small.
Vector Push−In
Terminals T−28
L
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
L
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
L
Mounting Method 3
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
P.C. Board with
2−1/2″ X 2−1/2″
copper surface.
L = 1/2’’
Board Ground Plane
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3
L
50
MBR340
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
K
D
A
1
2
B
K
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 267−04 OBSOLETE, NEW STANDARD 267−05.
DIM
A
B
D
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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MBR340/D
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