LIGITEK LURHSGM3363-R1 Bipolar round type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
BIPOLAR ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LURHSGM3363/R1
DATA SHEET
DOC. NO :
QW0905- LURHSGM3363/R1
REV.
:
A
DATE
:
08 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LURHSGM3363/R1
Package Dimensions
5.0 5.9
7.6 8.6
1.5
MAX
□0.5
TYP
SGM
25.0MIN
1
URH
2
1.0MIN
1
2
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60 °
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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Property of Ligitek Only
PART NO. LURHSGM3363/R1
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
URH
SGM
Forward Current
IF
50
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
100
mA
Power Dissipation
PD
130
100
mW
Ir
10
50
μA
Electrostatic Discharge( * )
ESD
2000
1000
V
Operating Temperature
Topr
-20~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Peak Dominant Spectral
wave halfwidth
wave
length length △λnm
λDnm λDnm
Luminous
intensity
Viewing
angle
@20mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min. Typ.
Lens
AlGaInP/GaP Red
Forward
voltage
@20mA(V)
---
630
20
1.7 --- 2.6 1100 1800
20
518
525
35
---
20
Water Clear
LURHSGM3363/R1
InGaN/SiC Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
3.5 4.2 700 1100
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PART NO. LURHSGM3363/R1
Page 3/6
Typical Electro-Optical Characteristics Curve
UR(H) CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
1.5
2.0
2.5
3.0
1
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
550
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
700
100
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Page 4/6
PART NO. LURHSGM3363/R1
Typical Electro-Optical Characteristics Curve
SGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Forward Current vs. Relative Intensity
2.5
Forward Current(mA)
Forward Current(mA)
30
20
10
2.0
1.5
1.0
0.5
0.0
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
10
60
50
40
30
20
10
0
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
500
550
Wavelength (nm)
50
2.0
1.5
1.0
0.5
0.0
20
30
40
50
Ambient Temperature( ℃)
Ambient Temperature( ℃)
0.0
450
40
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Current@20mA
Fig.3 Forward Current vs. Temperature
20
30
Relative Intensity
Normalize @20mA
Forward Voltage(V)
0
20
600
60
70
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Page 5/6
PART NO. LURHSGM3363/R1
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
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Page 6/6
PART NO. LURHSGM3363/R1
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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